A copper plating tank device

Abstract

This utility model discloses a copper electroplating tank device, relating to the field of electroplating technology. It includes: an electroplating tank body, with an inlet pipe and a drain pipe fixedly connected to one side of the tank body; lifting components are provided on both the front and rear sides of the tank body; a protective component is provided on the upper part of the lifting components; each lifting component includes a support plate fixedly installed on the electroplating tank body; an electric push rod is fixedly installed on the support plate; the output end of the electric push rod passes through the support plate and is fixedly connected to a placement seat; a limit rod is fixedly connected to the lower part of the placement seat. The lifting components provide a placement position for the electroplated parts and ensure that the parts do not contact each other, thereby improving the electroplating quality; the protective components provide protection and dust prevention for the electroplating tank body, improving the safety of the processing.

Description

Technical Field

[0001] This utility model relates to the field of electroplating technology, and in particular to an electroplating copper tank device. Background Technology

[0002] When processing parts, a layer of copper needs to be electroplated on its surface, which requires the use of a copper plating tank.

[0003] During electroplating, the parts need to be placed inside the electroplating solution. However, if the parts are not placed properly during the electroplating process, adjacent parts may collide and come into contact, which will affect the quality of the electroplating and make it inconvenient to use. Summary of the Invention

[0004] To overcome the shortcomings of the existing technology, one of the objectives of this utility model is to provide a copper plating tank device. The lifting components can provide a placement position for the electroplated parts and ensure that the electroplated parts do not come into contact with each other, thereby improving the quality of electroplating. The protective components can provide a certain degree of protection and dust prevention for the electroplating tank, thereby improving the safety of the processing.

[0005] One of the objectives of this utility model is achieved through the following technical solution: an electroplating copper tank device, comprising an electroplating tank body, with an inlet pipe and a drain pipe fixedly connected to one side of the electroplating tank body; lifting components are provided on both the front and rear sides of the electroplating tank body; a protective component is provided on the upper part of the lifting components; the lifting components include a support plate fixedly installed on the electroplating tank body; an electric push rod is fixedly installed on the support plate; the output end of the electric push rod passes through the support plate and is fixedly connected to a placement seat; a limit rod is fixedly connected to the lower part of the placement seat. The lifting components provide a placement position for the electroplated parts and ensure that the electroplated parts do not contact each other, thereby improving the quality of electroplating; the protective components provide a certain degree of protection and dust prevention for the electroplating tank body, improving the safety of the processing.

[0006] According to the aforementioned copper plating tank device, control valves are installed on both the inlet pipe and the outlet pipe, with the inlet pipe located above the outlet pipe.

[0007] According to the copper plating tank device, the protective component includes a protective baffle, side guards are fixedly connected to the left and right sides of the protective baffle, and a fixing rod is fixedly connected to the lower part of the protective baffle.

[0008] An electroplating copper tank device is provided, wherein placement slots are evenly arranged on the placement base.

[0009] According to the electroplating copper tank device, slots are provided on both sides of the support plate, and the fixing rod cooperates with the slots.

[0010] According to the aforementioned copper plating tank device, there are a total of four limiting rods, arranged in pairs symmetrically.

[0011] According to the aforementioned copper plating tank device, the limiting rods pass through the placement base and are slidably connected to each other.

[0012] According to the aforementioned copper plating tank device, the protective baffle is located above the placement base, and the number of fixing rods is four, which are arranged symmetrically along an axis.

[0013] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0014] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0015] Figure 1 This is a perspective view of an electroplating copper tank device according to the present invention;

[0016] Figure 2 This is a perspective view of the electroplating tank body of an electroplating copper tank device according to this utility model;

[0017] Figure 3 This is a perspective view of the protective component of an electroplating copper tank device according to the present invention;

[0018] Figure 4 This is a perspective view of the protective components of an electroplating copper tank device according to the present invention.

[0019] Legend:

[0020] 101. Electroplating tank body; 102. Drainage pipe; 103. Water inlet pipe; 201. Support plate; 202. Limiting rod; 203. Electric push rod; 204. Placement seat; 2041. Placement slot; 301. Fixing rod; 302. Protective baffle; 303. Side guard. Detailed Implementation

[0021] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0022] Reference Figure 1-4This utility model discloses a copper plating tank device, which includes an electroplating tank body 101. An inlet pipe 103 and a drain pipe 102 are fixedly connected to one side of the electroplating tank body 101. Control valves are installed on both the inlet pipe 103 and the drain pipe 102. The inlet pipe 103 is located above the drain pipe 102. Lifting components are provided on both the front and rear sides of the electroplating tank body 101. A protective component is provided on the upper part of the lifting components. The protective component includes a protective baffle 302, which is located above the placement base 204 and a fixed insertion rod. There are four protective baffles 301 arranged symmetrically. Side guards 303 are fixedly connected to the left and right sides of the protective baffle 302. A fixing rod 301 is fixedly connected to the lower part of the protective baffle 302. The lifting assembly includes a support plate 201 fixedly installed on the electroplating tank body 101. Slots are provided on both ends of the support plate 201, and the fixing rod 301 cooperates with the slots. An electric push rod 203 is fixedly installed on the support plate 201. The output end of the electric push rod 203 passes through the support plate 201 and is fixedly connected to a placement seat 204. The base 204 is evenly provided with placement grooves 2041. A limiting rod 202 is fixedly connected to the lower part of the base 204. There are four limiting rods 202 in total, arranged symmetrically in pairs. The limiting rods 202 pass through the base 204 and are slidably connected to each other. An electric push rod 203 drives the base 204 to rise upwards. With the assistance of the limiting rods 202, the stability of the base 204 is ensured. Then, the upper part of the part to be electroplated is placed in the placement groove 2041, so that the electroplated part is located in the electroplating bath. Above the electroplating tank 101, the electric push rod 203 drives the placement seat 204 downward. Due to the restriction of the placement tank 2041, adjacent electroplated parts are less likely to contact or collide with each other, thus improving the electroplating quality. When the electroplating tank 101 is not in use, the protective baffle 302 is placed on the placement seat 204, and the fixing rod 301 is inserted into the placement seat 204. The protective baffle 302 provides a certain degree of protection and dust prevention for the electroplating tank 101, preventing other items from falling into the electroplating tank 101 and improving the safety of the processing. The lifting assembly provides a placement position for the electroplated parts and ensures that the electroplated parts do not contact each other, thereby improving the electroplating quality; the protective assembly provides a certain degree of protection and dust prevention for the electroplating tank 101, improving the safety of the processing.

[0023] Working principle: The entire device is electrically connected to an external power source and a controller, which is a conventional and known device used for control.

[0024] The electric push rod 203 drives the placement seat 204 to rise upwards. With the assistance of the limiting rod 202, the stability of the placement seat 204 is ensured. Then, the upper part of the part to be electroplated is placed in the placement groove 2041, so that the electroplating part of the part to be electroplated is above the electroplating tank 101. The electric push rod 203 drives the placement seat 204 to move downwards. Due to the restriction of the placement groove 2041, adjacent electroplating parts are less likely to come into contact or collide with each other, thereby improving the quality of electroplating. When the electroplating tank 101 is not in use, the protective baffle 302 is placed on the placement seat 204, and the fixing rod 301 is inserted into the placement seat 204. The protective baffle 302 can provide a certain degree of protection and dust prevention for the electroplating tank 101, preventing other items from falling into the electroplating tank 101 and improving the safety of the processing.

[0025] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. An electroplating copper cell apparatus comprising an electroplating cell body (101), characterized in that, One side of the electroplating tank (101) is fixedly connected to a water inlet pipe (103) and a drain pipe (102). Lifting components are provided on both the front and rear sides of the electroplating tank (101). A protective component is provided on the upper part of the lifting component. The lifting component includes a support plate (201) fixedly installed on the electroplating tank (101). An electric push rod (203) is fixedly installed on the support plate (201). The output end of the electric push rod (203) passes through the support plate (201) and is fixedly connected to a placement seat (204). A limit rod (202) is fixedly connected to the lower part of the placement seat (204).

2. An electroplating copper cell apparatus as defined in claim 1, wherein, Control valves are installed on both the water inlet pipe (103) and the drainage pipe (102), with the water inlet pipe (103) located above the drainage pipe (102).

3. An electroplating copper cell apparatus as defined in claim 2, wherein, The protective assembly includes a protective baffle (302), with side guards (303) fixedly connected to the left and right sides of the protective baffle (302), and a fixed insert rod (301) fixedly connected to the lower part of the protective baffle (302).

4. The electroplating copper cell apparatus of claim 3, wherein, The placement seat (204) is provided with placement grooves (2041) evenly distributed.

5. The electroplating copper cell apparatus of claim 4, wherein, The support plate (201) has slots on both sides, and the fixing rod (301) cooperates with the slots.

6. An electroplating copper cell apparatus as defined in claim 5, wherein, There are a total of four limit rods (202), arranged in pairs and symmetrically.

7. An electroplating copper cell apparatus as defined in claim 6, wherein, The limiting rod (202) passes through the placement seat (204) and is slidably connected to each other.

8. The electroplating copper cell apparatus of claim 7, wherein, The protective baffle (302) is located above the placement seat (204), and there are four fixing rods (301) arranged symmetrically.

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