Semiconductor chip flatness measuring instrument

Abstract

This utility model discloses a semiconductor chip flatness measuring instrument, relating to the field of chip measurement technology. It includes an instrument housing and a detection head disposed within it; a moving component comprising a reciprocating screw rotatably connected to the inner wall of the instrument housing, with a moving frame threadedly connected to the outer surface of the reciprocating screw, and the moving frame slidably connected to the instrument housing; and a conveying component comprising conveying rollers symmetrically rotatably connected to the inner wall of the instrument housing, with a conveyor belt drivingly connecting the symmetrical conveying rollers, and a grooved tray fixedly connected to one of the conveying rollers. A shifting column is slidably fitted inside the grooved tray. This device seamlessly integrates to reduce idle waiting time and automates the parallel processing of measurement and loading / unloading actions. When positioning and placing the next chip, the measuring instrument can simultaneously perform the detection task on the current chip, eliminating the idle time caused by the need for operator intervention after the equipment completes measurement in the traditional manual mode.

Description

Technical Field

[0001] This utility model relates to the field of chip measurement technology, specifically to a semiconductor chip flatness measuring instrument. Background Technology

[0002] A semiconductor chip flatness measuring instrument is a high-precision metrology device used to precisely measure the global and local flatness of surfaces such as silicon wafers, photomasks, and packaging substrates.

[0003] Current semiconductor chip flatness measuring instruments have the following problems:

[0004] When testing chips in batches, the loading and unloading of each chip is entirely done manually. Operators need to repeatedly perform the following actions: take a chip out of the wafer cassette → place it precisely on the stage of the measuring instrument → start the measurement → wait for the measurement to complete → then remove the chip from the stage and put it back into the wafer cassette. This process not only consumes a lot of time, resulting in low throughput per unit time and becoming a bottleneck for production line speed-up, but also easily causes operator fatigue due to its high repetitiveness, thereby increasing the risk of chip surface scratches, edge chipping, or even falling and breaking due to improper handling or placement deviation.

[0005] Therefore, in view of this, the present invention proposes a semiconductor chip flatness measuring instrument to make up for and improve the deficiencies of the prior art. Utility Model Content

[0006] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is: a semiconductor chip flatness measuring instrument, including an instrument shell and a detection end set inside it;

[0007] The moving component includes a reciprocating screw rotatably connected to the inner wall of the instrument housing, a moving frame threadedly connected to the outer surface of the reciprocating screw, and the moving frame slidably connected to the instrument housing.

[0008] The conveying assembly includes conveying rollers symmetrically rotatably connected to the inner wall of the instrument housing, conveyor belts drivingly connecting the symmetrical conveying rollers, and a grooved disc fixedly connected to one of the conveying rollers, with a shifting column slidingly fitted inside the grooved disc.

[0009] Preferably, the moving component also includes a transfer groove formed inside the instrument housing, and the moving frame slides on the inner wall of the transfer groove.

[0010] Preferably, a secondary bevel gear is fixedly connected to the drive end of the reciprocating screw, and a bearing plate is fixedly connected to the inner wall of the instrument housing.

[0011] Preferably, the conveying assembly also includes a dual-axis motor fixedly installed on the outer surface of the instrument housing, with a main bevel gear fixedly connected to one end of the dual-axis motor and a wheel fixedly connected to the other end of the dual-axis motor.

[0012] Preferably, the shifting post is fixedly connected to the outer surface of the wheel, and the shifting post is L-shaped.

[0013] Preferably, a positioning frame is fixedly connected to the outer surface of the instrument housing, and a rotating shaft is rotatably connected inside the positioning frame. One end of the rotating shaft is fixed to the trough, and the other end of the rotating shaft is fixed to the conveying roller.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] This invention utilizes the continuous rotation of a reciprocating screw and the limiting of the moving frame by the supply slide groove to cause the moving frame to move vertically up and down reciprocally with the detection end. The entire process runs automatically and intermittently according to a preset and stable rhythm, eliminating the rhythm fluctuations caused by fatigue and individual differences in manual operation, so that the equipment throughput reaches and remains at the theoretical maximum value, thereby greatly improving the detection capacity per unit time.

[0016] This invention utilizes a rotating wheel carrying a shifting column. Each rotation of the shifting column causes it to enter a sliding groove in a tray, intermittently rotating the tray at a fixed angle. This allows the conveyor belt to sequentially move equidistantly placed chips to below the detection end, seamlessly connecting and reducing idle time. Automation enables parallel processing of measurement and loading / unloading operations. While positioning and placing the next chip, the measuring instrument can simultaneously perform detection on the current chip, eliminating the idle time that occurs in traditional manual methods where the equipment must wait for operator intervention after measurement. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of a preferred embodiment of the present invention;

[0018] Figure 2 This is a cross-sectional view of the overall structure of this utility model;

[0019] Figure 3 As shown in this utility model Figure 2 Enlarged structural diagram at point A;

[0020] Figure 4 This is a schematic diagram of the connection structure between the slotted plate and the shifting column shown in this utility model.

[0021] The numbers on the map are:

[0022] 1. Instrument housing; 2. Detection end; 3. Moving assembly; 4. Conveying assembly; 31. Reciprocating screw; 32. Feeding chute; 33. Moving frame; 34. Secondary bevel gear; 35. Bearing plate; 41. Dual-axis motor; 42. Positioning frame; 43. Main bevel gear; 44. Wheel; 45. Rotating shaft; 46. Groove plate; 47. Displacement column; 48. Conveying roller; 49. Conveying belt. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Embodiments of this utility model

[0025] Please refer to Figures 1 to 4 As shown, the semiconductor chip flatness measuring instrument includes an instrument housing 1 and a detection end 2 disposed inside it;

[0026] The moving component 3 includes a reciprocating screw 31 rotatably connected to the inner wall of the instrument housing 1, a moving frame 33 threadedly connected to the outer surface of the reciprocating screw 31, and the moving frame 33 slidably connected to the instrument housing 1. The moving component 3 also includes a transfer groove 32 opened inside the instrument housing 1, the moving frame 33 sliding on the inner wall of the transfer groove 32, a secondary bevel gear 34 fixedly connected to the drive end of the reciprocating screw 31, and a bearing plate 35 fixedly connected to the inner wall of the instrument housing 1.

[0027] Additional explanation: The detection end 2 is equipped with a detection element for detecting the flatness of the semiconductor chip, and the detection end 2 is fixedly installed in the middle section of the moving frame 33. The moving frame 33 is located directly above the support plate 35. The support plate 35 is used to support the detection end 2 and the chip to be tested when the detection end 2 moves down with the moving frame 33.

[0028] The above solution is adopted: by the continuous rotation of the reciprocating screw 31, and in conjunction with the limiting of the moving frame 33 by the transfer slide 32, the moving frame 33 is prompted to carry the detection end 2 to move vertically up and down reciprocally. The whole process runs automatically and intermittently according to a preset and stable rhythm, eliminating the rhythm fluctuations caused by fatigue and individual differences in manual operation, so that the equipment throughput reaches and is maintained at the theoretical maximum value, thereby greatly improving the detection capacity per unit time.

[0029] Please refer to Figures 2 to 4As shown, the conveying assembly 4 includes conveying rollers 48 symmetrically rotatably connected to the inner wall of the instrument housing 1, and a conveyor belt 49 drivingly connected between the symmetrical conveying rollers 48. One of the conveying rollers 48 is fixedly connected to a grooved plate 46, and a shifting column 47 is slidably adapted inside the grooved plate 46. The conveying assembly 4 also includes a dual-axis motor 41 fixedly installed on the outer surface of the instrument housing 1. One end of the dual-axis motor 41 is fixedly connected to a main bevel gear 43, and the other end of the dual-axis motor 41 is fixedly connected to a wheel 44. The shifting column 47 is fixedly connected to the outer surface of the wheel 44, and the shifting column 47 is L-shaped. A positioning frame 42 is fixedly connected to the outer surface of the instrument housing 1. A rotating shaft 45 is rotatably connected inside the positioning frame 42. One end of the rotating shaft 45 is fixed to the grooved plate 46, and the other end of the rotating shaft 45 is fixed to the conveying rollers 48.

[0030] Additional explanation: Four sliding grooves are equidistantly provided on the tray 46. Each time the shifting column 47 rotates one revolution with the wheel 44, it enters one sliding groove. This is used to intermittently rotate the tray 46 at a fixed angle, thereby moving the chip conveyed by the conveyor belt 49 a fixed distance. Through multiple tests, personnel can control the distance between adjacent chips placed on the conveyor belt 49. Each time the moving frame 33 moves back and forth with the detection end 2, the conveyor belt 49 moves the conveyed chips to below the detection end 2 in sequence.

[0031] The above solution involves rotating the shifting column 47 via the wheel 44. Each rotation of the shifting column 47 causes it to enter a sliding groove in the tray 46, intermittently rotating the tray 46 at a fixed angle. This allows the conveyor belt 49 to move the equidistantly placed chips sequentially to below the detection end 2, seamlessly reducing idle waiting time. Automation enables parallel processing of measurement and loading / unloading actions. While positioning and placing the next chip, the measuring instrument can simultaneously perform the detection task on the current chip, eliminating the idle time caused by the equipment having to wait for operator operation after measurement in the traditional manual mode.

[0032] Working principle and usage process of this utility model:

[0033] First, the staff places a batch of chips to be tested on the conveyor belt 49 at equal intervals according to the test distance. Then, the staff starts the testing end 2 and the dual-axis motor 41. The start of the dual-axis motor 41 drives the main bevel gear 43 and the wheel 44 to rotate. The main bevel gear 43, in conjunction with the secondary bevel gear 34, rotates accordingly, causing the reciprocating screw 31 to rotate continuously. This, along with the limiting of the moving frame 33 by the transfer groove 32, causes the moving frame 33 to carry the testing end 2 to move vertically up and down. At the same time, the wheel 44 carries the rotating shifting column 47. Each rotation of the shifting column 47 causes it to enter a sliding groove in the tray 46, intermittently rotating the tray 46 at a fixed angle. This causes the conveyor belt 49 to move the chips placed at equal intervals sequentially to below the testing end 2.

[0034] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0035] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip flatness measuring instrument, characterized in that, include: The instrument housing (1) and the detection head (2) set inside it; The moving assembly (3) includes a reciprocating screw (31) rotatably connected to the inner wall of the instrument housing (1), the outer surface of the reciprocating screw (31) being threadedly connected to a moving frame (33), and the moving frame (33) being slidably connected to the instrument housing (1). The conveying assembly (4) includes conveying rollers (48) symmetrically rotatably connected to the inner wall of the instrument housing (1), and conveyor belts (49) are symmetrically connected between the conveying rollers (48). One of the conveying rollers (48) is fixedly connected to a grooved plate (46), and a shifting column (47) is slidably adapted inside the grooved plate (46).

2. The semiconductor chip flatness measuring instrument according to claim 1, characterized in that, The moving component (3) also includes a transfer groove (32) opened inside the instrument housing (1), and the moving frame (33) slides on the inner wall of the transfer groove (32).

3. The semiconductor chip flatness measuring instrument according to claim 1, characterized in that, The drive end of the reciprocating screw (31) is fixedly connected to a secondary bevel gear (34), and the inner wall of the instrument housing (1) is fixedly connected to a bearing plate (35).

4. The semiconductor chip flatness measuring instrument according to claim 1, characterized in that, The conveying assembly (4) also includes a dual-axis motor (41) fixedly installed on the outer surface of the instrument housing (1). One end of the dual-axis motor (41) is fixedly connected to a main bevel gear (43), and the other end of the dual-axis motor (41) is fixedly connected to a wheel (44).

5. The semiconductor chip flatness measuring instrument according to claim 4, characterized in that, The shifting post (47) is fixedly connected to the outer surface of the wheel (44), and the shifting post (47) is L-shaped.

6. The semiconductor chip flatness measuring instrument according to claim 1, characterized in that, A positioning frame (42) is fixedly connected to the outer surface of the instrument housing (1). A rotating shaft (45) is rotatably connected inside the positioning frame (42). One end of the rotating shaft (45) is fixed to the trough (46), and the other end of the rotating shaft (45) is fixed to the conveying roller (48).

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