Display device

Abstract

This application relates to a display device in which one end of a flip-chip film is connected to a display panel, and the other end is bent to a back panel away from the display panel and connected to a circuit board. The flip-chip film includes a first sub-part connected to the back panel, and a chip is disposed on the side of the first sub-part away from the back panel. By placing the chip on the side of the flip-chip film away from the back panel, the chip-bonded portion of the flip-chip film can be directly connected to the back panel. The heat generated by the chip can be conducted to the back panel for heat dissipation without the need for an additional heat sink, which can effectively reduce costs.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a display device. Background Technology

[0002] The printed circuit board (PCB) of a liquid crystal display (LCD) device is bonded to the back of the display panel via a chip-on-film (COF) film. The integrated circuit (IC) chip of the LCD device is usually located on the side of the COF film facing the display panel. Since the chip generates a lot of heat, it will affect the performance of the display panel. Therefore, it is necessary to add heat dissipation material between the chip and the COF film, such as thermally conductive aluminum foil or other heat sinks with high thermal conductivity, to dissipate heat from the chip. However, adding heat dissipation material will increase production costs. Utility Model Content

[0003] This application provides a display device that can reduce production costs while achieving chip heat dissipation.

[0004] This application provides a display device, the display device comprising:

[0005] Display panel;

[0006] A back panel is disposed on the back side of the display panel;

[0007] A circuit board is disposed on the side of the back plate away from the display panel;

[0008] A flip-chip film, one end of which is connected to the display panel, and the other end is bent to the side of the back plate away from the display panel and connected to the circuit board. The flip-chip film includes a first sub-part, which is connected to the back plate.

[0009] The chip is located on the side of the first sub-section away from the backplate.

[0010] In some embodiments, the first sub-part is disposed on the side of the back plate away from the display panel.

[0011] In some embodiments, the back panel includes a bottom plate and a side plate disposed at the edge of the bottom plate, the bottom plate being disposed opposite to the display panel, and the side plate intersecting the bottom plate;

[0012] The flip-chip film includes a first part, a second part, and a third part; the first part is located on the side of the side plate near the display panel and is connected to the display panel; the second part is located on the side of the side plate away from the base plate and connects the first part and the third part; the third part is located on the side of the base plate away from the display panel and is connected to the circuit board; wherein, the third part includes the first sub-part.

[0013] In some embodiments, the backplate includes a thermally conductive plate.

[0014] In some embodiments, the back panel comprises a metal plate.

[0015] In some embodiments, the display device further includes a thermally conductive tape disposed at least between the first sub-part and the backplate, wherein the orthographic projection of the chip on the backplate at least partially overlaps with the orthographic projection of the thermally conductive tape on the backplate.

[0016] In some embodiments, one end of the flip-chip film is connected to the side of the display panel away from the back panel, and the other end of the flip-chip film is connected to the side of the circuit board away from the back panel, or the other end of the flip-chip film is connected to the side of the circuit board close to the back panel.

[0017] In some embodiments, the display panel includes a first substrate and a second substrate, the second substrate being located on the side of the first substrate away from the back panel, the first substrate including an extension extending out of the edge of the second substrate; one end of the flip-chip film is connected to the side of the extension away from the back panel.

[0018] In some embodiments, one end of the flip-chip film is connected to the side of the display panel near the back panel, and the other end of the flip-chip film is connected to the side of the circuit board near the back panel.

[0019] In some embodiments, the thickness of the chip is less than or equal to the thickness of the display panel.

[0020] This application provides a display device in which one end of the flip-chip film is connected to a display panel, and the other end is bent to a backplate on the side away from the display panel and connected to a circuit board. The flip-chip film includes a first sub-part connected to the backplate, and a chip is disposed on the side of the first sub-part away from the backplate. By changing the chip's placement position, placing the chip on the side of the flip-chip film away from the backplate, this application allows the portion of the flip-chip film that bonds the chip (i.e., the first sub-part) to the backplate to be directly connected. This allows the heat generated by the chip to be directly conducted to the backplate for heat dissipation, preventing heat buildup on the chip. Using this display device structure, there is no need to add an additional heat sink at the chip location, reducing the cost of heat dissipation materials and effectively lowering production costs. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0023] Figure 1 This is a cross-sectional schematic diagram of a display device provided by existing technology;

[0024] Figure 2 This is a planar schematic diagram of a flip-chip film and a chip in a display device provided by existing technology;

[0025] Figure 3 This is a cross-sectional schematic diagram of a display device provided in an embodiment of this application;

[0026] Figure 4 This is a planar schematic diagram of a flip-chip and a display device provided in an embodiment of this application;

[0027] Figure 5 yes Figure 3 An unfolded schematic diagram of a display panel, a flip-chip film, and a circuit board of a display device provided in the embodiment;

[0028] Figure 6 This is a cross-sectional schematic diagram of another display device provided in an embodiment of this application;

[0029] Figure 7 yes Figure 6 An unfolded schematic diagram of a display panel, a flip-chip film, and a circuit board of a display device provided in the embodiment.

[0030] Explanation of reference numerals in the attached figures:

[0031] 100 - Display device; 110 - Display panel; 111 - First substrate; 1111 - Extension; 112 - Second substrate; 120 - Back plate; 121 - Base plate; 122 - Side plate; 130 - Circuit board; 131 - Circuit board connector; 132 - Chip; 140 - Flip film; 141 - First part; 142 - Second part; 143 - Third part; 1431 - First sub-part; 1432 - Second sub-part; 144-U-shaped space; 150-Light guide plate; 151-Light source; 152-Optical film assembly; 153-Reflective film; 154-First adhesive part; 160-Thermal conductive tape; 161-Heat sink; 171-First polarizer; 172-Second polarizer; 180-Frame; 181-First frame part; 182-Second frame part; 183-Second adhesive part; 190-Middle frame; 191-Side frame; 192-Top plate. Detailed Implementation

[0032] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0033] Please refer to Figures 1-2 , Figure 1 A cross-sectional schematic diagram of a display device provided in the prior art. Figure 2 This is a planar schematic diagram of a display device provided by the prior art, including a flip-chip film and a chip. The display device includes a display panel 110, a backplate 120, a circuit board 130, a flip-chip film 140, a chip 132, a thermally conductive tape 160, a heat sink 161, and other structures. In the prior art, the chip 132 is typically disposed on the flip-chip film 140 and located on the side of the flip-chip film 140 facing the backplate 120. Since the chip 132 is disposed in the space between the flip-chip film 140 and the backplate 120, it is not conducive to heat dissipation of the chip 132. The chip 132 generates a lot of heat during operation, and this structure easily causes heat accumulation in the chip 132, affecting the performance of the display device. Therefore, it is usually necessary to add a heat sink 161 between the chip 132 and the flip-chip film 140. The chip 132 is connected to the heat sink 161 through the thermally conductive tape 160 to achieve heat dissipation of the chip 132. The heat sink 161 is usually made of a material with high thermal conductivity, such as thermally conductive aluminum foil. The addition of the heat sink 161 will increase the material cost, which in turn will increase the production cost of the display device.

[0034] To solve the above problems, this application provides a display device 100, please refer to... Figures 3-4 , Figure 3 This is a cross-sectional schematic diagram of a display device provided in an embodiment of this application. Figure 4 This is a planar schematic diagram of a flip-chip and a display device provided in an embodiment of this application.

[0035] Please refer to Figure 3 This application provides a display device 100, which includes a display panel 110, a back plate 120, a circuit board 130, a chip-on-film 140, and a chip 132. The back plate 120 is disposed on the back side of the display panel 110, which is the side away from the light-emitting surface of the display panel 110; the circuit board 130 is disposed on the side of the back plate 120 away from the display panel 110; one end of the chip-on-film 140 is connected to the display panel 110, and the other end is bent to the side of the back plate 120 away from the display panel 110 and connected to the circuit board 130; the chip-on-film 140 includes a first sub-part 1431, which is connected to the back plate 120; the chip 132 is disposed on the side of the first sub-part 1431 away from the back plate 120.

[0036] This application changes the placement of the chip 132, positioning it on the side of the flip-chip film 140 away from the backplate 120. The chip 132 does not occupy the space between the flip-chip film 140 and the backplate 120, allowing for direct connection between the flip-chip film 140 and the backplate 120. By directly connecting the first sub-part 1431 of the flip-chip film 140 (i.e., the part of the flip-chip film 140 that binds the chip 132) to the backplate 120, the heat generated by the chip 132 can be directly conducted to the backplate 120, allowing some of the heat generated by the chip 132 to be dissipated through the backplate 120, thus preventing heat buildup on the chip 132 and affecting the performance of the display device 100. In this application, the display device 100 does not require an additional heat sink 161 at the chip 132, thereby reducing the cost of heat dissipation materials and effectively lowering production costs.

[0037] In this application, the display panel 110 may be a liquid crystal display panel, but is not limited thereto. Taking a liquid crystal display panel as an example below, the display panel 110 includes a first substrate 111 and a second substrate 112 disposed opposite to each other, and a liquid crystal layer located between the first substrate 111 and the second substrate 112. The first substrate 111 may be an array substrate, including a substrate and a circuit structure disposed on the substrate, and the second substrate 112 may be a color filter substrate, but is not limited thereto.

[0038] The back plate 120 is used to support and protect the display panel 110 and other structures above it. The material of the back plate 120 can be metal or non-metal, but is not limited thereto. For details, please refer to... Figure 3 The back plate 120 may include a base plate 121 and a side plate 122 disposed on the edge of the base plate 121. The base plate 121 is disposed opposite to the display panel 110 (for example, the two may be parallel). The side plate 122 intersects with the base plate 121. For example, the side plate 122 and the base plate 121 may be perpendicular. The base plate 121 and the side plate 122 enclose a receiving space, and an optical structure or optical film layer is disposed in the receiving space.

[0039] The circuit board 130 is connected to the display panel 110 via the flip-chip film 140 to transmit signals to the display panel 110 and drive the display panel 110 to display images. Furthermore, the circuit board 130 also has a circuit board connector 131, which is located on the side of the circuit board 130 away from the backplate 120 and is electrically connected to the circuit board 130.

[0040] The flip-chip film 140 is flexible and bendable, used to connect the display panel 110 and the circuit board 130 to achieve signal transmission between them. The chip 132 is bonded to the flip-chip film 140 and is used to convert the digital signals of the circuit board 130 into analog voltage signals required by the display panel 110 to control the light transmittance of each pixel, thereby realizing the display image.

[0041] In some embodiments, the first sub-part 1431 is disposed on the side of the back plate 120 away from the display panel 110, in which case the chip 132 has a larger heat dissipation space, further improving the heat dissipation effect of the chip 132.

[0042] For details, please refer to Figures 3-4The flip-chip film 140 includes a first portion 141, a second portion 142, and a third portion 143. The first portion 141 is located on the side of the side plate 122 near the display panel 110 and is connected to the display panel 110; that is, one end of the first portion 141 is connected to the display panel 110, and the other end is connected to the second portion 142. The second portion 142 is located on the side of the side plate 122 away from the base plate 121 and connects the first portion 141 and the third portion 143; that is, one end of the second portion 142 is connected to the first portion 141, and the other end is connected to the third portion 143. The third portion 143 is located on the side of the base plate 121 away from the display panel 110 and is connected to the circuit board 130; that is, one end of the third portion 143 is connected to the second portion 142, and the other end is connected to the circuit board 130.

[0043] The third part 143 includes a first sub-part 1431 and a second sub-part 1432. The second sub-part 1432 is adjacent to the first sub-part 1431. For example, the second sub-part 1432 may be arranged around the first sub-part 1431. The first sub-part 1431 is the part of the third part 143 that is connected to the base plate 121 (e.g., Figure 3 (As shown by the dashed line), the second sub-part 1432 may not be connected to the base plate 121. The chip 132 is disposed on the side of the first sub-part 1431 away from the base plate 121, and the second sub-part 1432 is connected to the circuit board 130. In this application, the third part 143 is disposed opposite to the display panel 110 and located on the back side of the display panel 110. The chip 132 is disposed on the side of the third part 143 away from the display panel 110, which can make reasonable use of the central space, and at the same time, can give the chip 132 a larger heat dissipation space, improve the heat dissipation efficiency of the chip 132, and avoid the chip 132 being disposed on the side of the second part 142 away from the back plate 120, which would affect the bezel width of the display device 100 and the assembly of the middle frame 190 and other structures, and also avoid the chip 132 being disposed on the side of the first part 141 away from the back plate 120, which would affect the bezel width and the assembly of the display panel 110 and other structures.

[0044] In some embodiments, to improve the thermal conductivity of the backplate 120, the backplate 120 may include a thermally conductive material. For example, the backplate 120 may be a thermally conductive metal plate or other materials with high thermal conductivity. When the backplate 120 is a metal plate, it may be a galvanized steel plate, an aluminum plate, etc., but is not limited thereto. In this application, the backplate 120 can replace the heat sink in the prior art to dissipate heat from the chip 132. Therefore, in the structure of the display device 100, there is no need to set up a heat sink, which can save on the cost of heat dissipation materials.

[0045] In some embodiments, please refer to Figure 3 The display device 100 further includes a thermally conductive tape 160, which is at least disposed between the first sub-part 1431 and the back plate 120. The orthographic projection of the chip 132 on the back plate 120 at least partially overlaps with the orthographic projection of the thermally conductive tape 160 on the back plate 120. Furthermore, the orthographic projection area of ​​the chip 132 on the back plate 120 may be greater than or equal to the orthographic projection area of ​​the thermally conductive tape 160 on the back plate 120, thereby improving the thermal conductivity of the thermally conductive tape 160 and the heat dissipation efficiency of the chip 132.

[0046] In some embodiments, please refer to Figure 3 One end of the flip-chip film 140 is connected to the side of the display panel 110 away from the back plate 120, and the other end of the flip-chip film 140 is connected to the side of the circuit board 130 away from the back plate 120, or the other end of the flip-chip film 140 is connected to the side of the circuit board 130 close to the back plate 120.

[0047] For details, please refer to Figure 3 The display panel 110 includes a first substrate 111 and a second substrate 112. The second substrate 112 is located on the side of the first substrate 111 away from the back plate 120. The first substrate 111 includes an extension 1111 extending out of the edge of the second substrate 112. One end of the flip-chip film 140 is connected to the side of the extension 1111 away from the back plate 120 to facilitate the circuit connection between the circuit board 130 and the first substrate 111.

[0048] for Figure 3 In the structure of the display device 100 shown in the embodiment, during the transportation of the display panel 110, the flip-chip film 140, and the circuit board 130 are in an unfolded state to facilitate transportation. However, in the unfolded state, since the chip 132 protrudes from the surface of the display panel 110, the chip 132 is easily knocked off during transportation. Figure 5 yes Figure 3A schematic diagram showing the display panel, flip-chip film, and circuit board of the display device in the embodiment.

[0049] To solve the above problems, this application also provides another structure for the display device 100, please refer to... Figures 6-7 , Figure 6 This is a cross-sectional schematic diagram of another display device provided in an embodiment of this application. Figure 7 yes Figure 6 An unfolded schematic diagram of a display panel, a flip-chip film, and a circuit board of a display device provided in the embodiment.

[0050] In this embodiment, one end of the flip-chip film 140 is connected to the side of the display panel 110 near the back plate 120. Specifically, one end of the flip-chip film 140 is connected to the side of the first substrate 111 away from the second substrate 112; the other end of the flip-chip film 140 is connected to the side of the circuit board 130 near the back plate 120. Please refer to [reference needed] in this embodiment. Figure 7 When the display panel 110, the flip-chip film 140, and the circuit board 130 are in the unfolded state, the chip 132, the display panel 110, and the circuit board 130 are all located on the same side of the flip-chip film 140. A U-shaped space 144 is formed between the display panel 110 and the circuit board 130. Since the depth of this U-shaped space 144 in the thickness direction of the display panel 110 is greater, the chip 132 is located within this U-shaped space 144, which reduces the risk of the chip 132 being knocked off during transportation. It should be noted that the other structures in this embodiment are similar to... Figure 3 The implementation methods are the same and will not be repeated here.

[0051] Furthermore, in the thickness direction of the display panel 110, the thickness of the chip 132 can be less than or equal to the thickness of the display panel 110, so as to avoid the chip 132 being knocked off during transportation.

[0052] In some embodiments, the display device 100 further includes a light guide plate 150, a light source 151, an optical film group 152, a reflective film 153, and other structures. The light guide plate 150 is disposed in the receiving space of the back plate 120, the light source 151 is disposed on the side of the light guide plate 150 or on the side of the light guide plate 150 near the bottom plate 121, the optical film is disposed on the side of the light guide plate 150 away from the bottom plate 121, and the reflective film 153 is disposed on the side of the light guide plate 150 near the bottom plate 121. The light source 151 can be a light-emitting diode (LED) lamp panel. The light guide plate 150 is used to convert the light emitted by the light source 151 into a surface light source. The light emitted from the light-emitting surface of the light guide plate 150 enters the optical film group 152. The optical film group 152 is used to improve optical performance and further optimize the brightness, uniformity, and viewing angle of the light. The optical film group 152 may include at least one of a diffusion film, a brightness enhancement film, and a reflective polarizing film. The reflective film 153 is used to improve the light extraction efficiency of the light guide plate 150.

[0053] For details, please refer to Figure 3 When the light source 151 is disposed on the side of the light guide plate 150, there is a height difference between the light guide plate 150 and the light source 151 in the thickness direction of the display panel 110. A first adhesive portion 154 is provided between the base plate 121 and the light guide plate 150 to support the light guide plate 150 and simultaneously adhere the light guide plate 150 and the base plate 121, thereby fixing the light guide plate 150 and the back plate 120. The first adhesive portion 154 can be silicone, but is not limited to this.

[0054] In this embodiment, the first part 141 is located on the side of the light guide plate 150 away from the base plate 121, the second part 142 is located on the side of the side plate 122 away from the light guide plate 150, and the third part 143 is located on the side of the base plate 121 away from the light guide plate 150.

[0055] In some embodiments, please refer to Figure 3 The display device 100 further includes a first polarizer 171 and a second polarizer 172. The first polarizer 171 is disposed on the side of the display panel 110 near the light guide plate 150, and the second polarizer 172 is disposed on the side of the display panel 110 away from the first polarizer 171. The first polarizer 171 and the second polarizer 172 are used to realize the image display of the display panel 110 and improve the optical effect of the display panel 110.

[0056] In some embodiments, please refer to Figure 3The display device 100 further includes a frame 180, which surrounds the back panel 120. Specifically, the frame 180 includes a first frame portion 181 and a second frame portion 182 connected to the first frame portion 181. The first frame portion 181 is located on the side of the side panel 122 away from the light guide plate 150, and the second frame portion 182 is located on the side of the display panel 110 facing the light guide plate 150. The display panel 110 is connected and fixed to the second frame portion 182 via a second adhesive portion 183. The second frame portion 182 is also fixedly connected to the light guide plate 150, while the first frame portion 181 is connected and fixedly connected to the side panel 122. This allows the frame 180 to fix the display panel 110, the light guide plate 150, the back panel 120, and other structures together, preventing displacement or detachment of the components. The second adhesive part 183 can be a foam tape, which can play an adhesive role while also providing a cushioning and shock absorption effect.

[0057] In this embodiment, the first portion 141 of the flip-chip film 140 may be disposed on the side of the second frame portion 182 away from the light guide plate 150, and the second portion 142 may be disposed on the side of the first frame portion 181 away from the light guide plate 150, so as to avoid affecting the fixing effect of the frame 180 on the back plate 120 and the display panel 110.

[0058] In some embodiments, please refer to Figure 3 The display device 100 further includes a middle frame 190, which surrounds the display panel 110. Specifically, the middle frame 190 includes a side frame 191 and a top plate 192 connected to the side frame 191. The side frame 191 is located on the side of the first frame portion 181 away from the side plate 122, and the top plate 192 is located on the side of the display panel 110 away from the light guide plate 150. The middle frame 190 protects and supports the sides of the module, and also provides light shielding for the module's frame area.

[0059] In this embodiment, the second portion 142 of the flip-chip film 140 is disposed between the side frame 191 and the first adhesive frame portion 181 to protect the flip-chip film 140 and prevent damage to the flip-chip film 140.

[0060] This application provides a display device. One end of the flip-chip film in this display device is connected to a display panel, and the other end is bent to a backplate on the side away from the display panel and connected to a circuit board. The flip-chip film includes a first sub-part connected to the backplate, and a chip is disposed on the side of the first sub-part away from the backplate. By changing the chip's placement position, placing the chip on the side of the flip-chip film away from the backplate, the portion of the flip-chip film that bonds the chip (i.e., the first sub-part) can be directly connected to the backplate. This allows the heat generated by the chip to be directly conducted to the backplate for heat dissipation, preventing heat buildup on the chip. Using this display device structure, there is no need to add an additional heat sink at the chip location, reducing the cost of heat dissipation materials and effectively lowering production costs.

[0061] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0062] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0063] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0064] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A display device, characterized in that, include: Display panel; A back panel is disposed on the back side of the display panel; A circuit board is disposed on the side of the back plate away from the display panel; A flip-chip film, one end of which is connected to the display panel, and the other end bent to the side of the backplate away from the display panel and connected to the circuit board, the flip-chip film including a first sub-part connected to the backplate; and The chip is located on the side of the first sub-part away from the backplate.

2. The display device according to claim 1, characterized in that, The first sub-part is located on the side of the back plate away from the display panel.

3. The display device according to claim 1, characterized in that, The back panel includes a base plate and a side plate disposed on the edge of the base plate, wherein the base plate is disposed opposite to the display panel, and the side plate intersects with the base plate; The flip-chip film includes a first part, a second part, and a third part; the first part is located on the side of the side plate near the display panel and is connected to the display panel; the second part is located on the side of the side plate away from the base plate and connects the first part and the third part; the third part is located on the side of the base plate away from the display panel and is connected to the circuit board; wherein, the third part includes the first sub-part.

4. The display device according to claim 1, characterized in that, The backplate includes a thermally conductive material.

5. The display device according to claim 4, characterized in that, The back panel comprises a metal plate.

6. The display device according to claim 1, characterized in that, The display device further includes a thermally conductive tape, which is disposed at least between the first sub-part and the back plate, wherein the orthographic projection of the chip on the back plate and the orthographic projection of the thermally conductive tape on the back plate at least partially overlap.

7. The display device according to claim 1, characterized in that, One end of the flip-chip film is connected to the side of the display panel away from the back panel, and the other end of the flip-chip film is connected to the side of the circuit board away from the back panel, or the other end of the flip-chip film is connected to the side of the circuit board close to the back panel.

8. The display device according to claim 7, characterized in that, The display panel includes a first substrate and a second substrate, the second substrate being located on the side of the first substrate away from the back plate, and the first substrate including an extension extending out of the edge of the second substrate; one end of the flip-chip film is connected to the side of the extension away from the back plate.

9. The display device according to claim 1, characterized in that, One end of the flip-chip film is connected to the side of the display panel near the back panel, and the other end of the flip-chip film is connected to the side of the circuit board near the back panel.

10. The display device according to claim 9, characterized in that, The thickness of the chip is less than or equal to the thickness of the display panel.

Images