A wireless power supply antenna array multiplexing structure

Abstract

This utility model discloses a wireless power transmission antenna array multiplexing structure, including a housing and multiple microwave transceiver components. The housing also includes a heat dissipation mechanism, which consists of multiple independent heat dissipation components and a shunt component. Each heat dissipation component includes a thermally conductive substrate. The interior of the thermally conductive substrate, from top to bottom, comprises a diamond thin film layer, a copper-graphene composite material layer, and an aluminum-based silicon carbide layer. The diamond thin film layer covers the outer wall of the microwave transceiver components. The copper-graphene composite material layer forms a non-adhesive gradient interface with the diamond thin film layer and the aluminum-based silicon carbide layer through a laser cladding process. The wireless power transmission antenna array multiplexing structure disclosed in this utility model can reduce the surface temperature of the microwave transceiver components during continuous operation, improve heat dissipation, and maintain the continuous and stable operation of the system.

Description

Technical Field

[0001] This utility model relates to the field of wireless communication technology, and in particular to a wireless power transmission antenna array multiplexing structure. Background Technology

[0002] Massive high-power array antennas are core components of modern wireless communication and wireless power transfer systems, such as 5G / 6G base stations and satellite communications. These antenna systems achieve high gain, beamforming, and beam scanning by controlling the phase and amplitude of multiple radiating elements in the array, thereby directionally radiating electromagnetic energy to far-field targets. In millimeter-wave communication, due to high signal propagation loss and weak diffraction ability, the coverage of a single antenna is limited. Antenna array technology can significantly extend communication distance and improve link stability by highly concentrating energy through beamforming. In addition, in the field of satellite communication, phased array antenna technology enables satellite terminals to track and lock onto moving satellites without mechanical rotation, simplifying the complexity of ground terminals and improving communication continuity.

[0003] Under conditions of continuous high-power operation or frequent power beam switching, the microwave transceiver components of the antenna array will generate a large amount of Joule heat. If this heat cannot be dissipated in a timely and efficient manner, it may cause the core temperature of the microwave transceiver components to rise sharply. Traditional solutions mostly rely on a single homogeneous material for heat diffusion. However, antenna arrays are usually multi-layered structures, including microwave functional layers for radiation / reception, substrate layers that provide structural support, etc. The layers are often connected by thermally conductive adhesives or welding. These interfaces themselves have high thermal resistance. In particular, the heat flow path from the top microwave transceiver components to the bottom heat sink is long and has many interfaces, which may cause heat to accumulate locally, thereby causing performance degradation, reliability reduction, or even permanent damage to the microwave components, which seriously restricts the working life and stability of the entire system. Utility Model Content

[0004] This utility model discloses a wireless power transmission antenna array multiplexing structure, which aims to solve the technical problem that antenna arrays are usually multi-layered structures, including microwave functional layers for radiation / reception, substrate layers for structural support, etc. The layers are often connected by thermally conductive adhesive or welding. These interfaces themselves have high thermal resistance. In particular, the heat flow path from the top microwave transceiver components to the bottom heat sink is long and there are many interfaces, which may cause heat to accumulate locally, thereby causing microwave component performance degradation, reliability reduction, or even permanent damage, which seriously restricts the working life and stability of the entire system.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A wireless power transmission antenna array multiplexing structure includes a housing and multiple microwave transceiver components. The housing is also provided with a heat dissipation mechanism, which consists of multiple independent heat dissipation components and a shunt component. Each heat dissipation component includes a thermally conductive substrate. The interior of the thermally conductive substrate is composed of a diamond thin film layer, a copper graphene composite material layer, and an aluminum-based silicon carbide layer from top to bottom. The diamond thin film layer covers the outer wall of the microwave transceiver component. The copper graphene composite material layer forms a non-adhesive gradient interface with the diamond thin film layer and the aluminum-based silicon carbide layer through a laser cladding process.

[0007] By adopting the above technical solutions, the surface temperature of the microwave transceiver components can be reduced during continuous operation, improving heat dissipation and maintaining the system's continuous and stable operation. Specifically, the synergistic design of the heat dissipation components and the shunt components enables efficient directional heat conduction. Diamond's extremely high thermal conductivity rapidly absorbs heat from the surface of the microwave transceiver components, while its high hardness protects the components from mechanical damage. Through laser cladding, an atomic-level metallurgical bond is formed between the diamond layer and the graphene substrate. The copper substrate provides high electrical conductivity to reduce electromagnetic losses. Graphene nanosheets form a three-dimensional thermally conductive network within the copper substrate, further enhancing thermal conductivity. The aluminum-based silicon carbide layer serves as the bottom support layer, utilizing the lightweight properties of aluminum to reduce overall weight. Silicon carbide particles are uniformly dispersed within the aluminum substrate using powder metallurgy, forming a high thermal conductivity and high-strength composite structure that rapidly transfers heat to the shunt components. The shunt components then remove the heat transferred from the aluminum-based silicon carbide layer from the antenna array.

[0008] As a further embodiment of this utility model: the flow divider is disposed inside the copper-graphene composite material layer, and the interior of the flow divider consists of multiple flow channels, with two adjacent flow channels connected through the same sidewall.

[0009] By adopting the above technical solution, the shunt component is embedded inside the copper graphene composite material layer, and the cooling channel and the heat-conducting substrate form an integrated structure. Heat does not need to be transferred through the contact interface between the traditional cold plate and the substrate, thus avoiding contact thermal resistance.

[0010] As a further embodiment of this utility model: a vortex generator is provided inside the flow channel. The vortex generator is a triangular protrusion structure. The vortex generator is located at the inlet of the flow channel, and the outlet of the flow channel is a Venturi tube structure.

[0011] By adopting the above technical solution, the triangular vortex generator generates uniform turbulence in the front section of the flow channel, providing a stable flow field for subsequent Venturi tube acceleration, avoiding Venturi tube surge caused by uneven inlet flow velocity, and also avoiding thermal damage to the copper graphene composite material layer caused by local overheating. The high-speed jet at the Venturi tube outlet can further break up the large vortices generated by the inlet vortex, forming finer micro-vortices, extending the turbulent heat transfer effect to the outside of the flow channel, and expanding the heat dissipation coverage area.

[0012] In summary, this application includes at least one of the following beneficial technical effects:

[0013] 1. By setting a gradient composite structure of diamond film layer-copper graphene composite layer-aluminum-based silicon carbide layer, and using laser cladding process to achieve atomic-level metallurgical bonding, a continuous, low thermal resistance heat conduction path is constructed from microwave transceiver component to heat dissipation terminal shunt component. The diamond layer is responsible for rapid heat absorption, the copper graphene layer performs lateral heat diffusion and efficient longitudinal heat transfer, and the aluminum-based silicon carbide layer completes the final heat transfer while providing structural support. The three work together to achieve efficient directional heat conduction, significantly reducing the operating temperature of microwave transceiver component.

[0014] 2. The flow channel combines a vortex generator and a venturi tube design. By generating controllable turbulence at the inlet to disrupt the boundary layer and using the venturi effect to accelerate the fluid at the outlet, it not only enhances the convective heat transfer coefficient within the flow channel but also extends the efficient turbulent heat transfer effect to a wider area. This allows it to remove more heat per unit time, effectively coping with the instantaneous high heat flux density generated by beam switching.

[0015] Other features and advantages of this utility model will be disclosed in detail in the following specific embodiments and accompanying drawings. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of a wireless power transmission antenna array multiplexing structure proposed in this utility model.

[0017] Figure 2 For the present utility model in Figure 1 A magnified structural diagram of point A in the middle.

[0018] Figure 3 This is a cross-sectional view of the heat dissipation component structure of a wireless power transmission antenna array multiplexing structure proposed in this utility model.

[0019] Figure 4 This is a cross-sectional view of the shunt component structure of a wireless power transmission antenna array multiplexing structure proposed in this utility model.

[0020] In the attached diagram: 1. Housing; 2. Microwave transceiver assembly; 3. Thermally conductive substrate; 4. Isolation groove; 5. Flexible heat pipe connector; 6. Diamond film layer; 7. Copper-graphene composite material layer; 8. Aluminum-based silicon carbide layer; 9. Positioning boss; 10. Flow channel; 11. Eddy current generator. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Reference Figure 1 and Figure 3 A wireless power transmission antenna array multiplexing structure includes a housing 1 and multiple microwave transceiver components 2. The housing 1 is also provided with a heat dissipation mechanism, which consists of multiple independent heat dissipation components and a shunt component. The heat dissipation component includes a thermally conductive substrate 3. The interior of the thermally conductive substrate 3 is composed of a diamond thin film layer 6, a copper graphene composite material layer 7 and an aluminum-based silicon carbide layer 8 from top to bottom. The diamond thin film layer 6 covers the outer wall of the microwave transceiver component 2. The copper graphene composite material layer 7 forms a gradient interface with the diamond thin film layer 6 and the aluminum-based silicon carbide layer 8 without an adhesive layer through a laser cladding process.

[0023] Specifically, the synergistic design of the heat dissipation component and the shunt component enables efficient directional heat conduction. Diamond's extremely high thermal conductivity rapidly absorbs heat from the surface of the microwave transceiver component 2, while its high hardness protects it from mechanical damage. A laser cladding process forms an atomic-level metallurgical bond with the diamond layer. The copper substrate provides high electrical conductivity to reduce electromagnetic losses. Graphene nanosheets form a three-dimensional thermally conductive network within the copper substrate, further enhancing thermal conductivity. The aluminum-based silicon carbide layer 8 serves as the bottom support layer, utilizing the lightweight properties of aluminum to reduce overall weight. Silicon carbide particles are uniformly dispersed within the aluminum substrate using powder metallurgy, forming a highly thermally conductive and high-strength composite structure that rapidly transfers heat to the shunt component. The shunt component then carries the heat transferred from the aluminum-based silicon carbide layer 8 away from the antenna array. This structure can reduce the surface temperature of the microwave transceiver component 2 during continuous operation, improving heat dissipation and maintaining stable system operation.

[0024] Reference Figure 1 , Figure 2 and Figure 4In a preferred embodiment, the flow distribution component is disposed inside the copper graphene composite material layer 7. The interior of the flow distribution component consists of multiple flow channels 10, and two adjacent flow channels 10 are connected through the same sidewall. The flow distribution component is embedded inside the copper graphene composite material layer 7, and the cooling flow channels 10 and the heat-conducting substrate form an integrated structure. Heat does not need to be transferred through the contact interface between the traditional cold plate and the substrate, thus avoiding contact thermal resistance.

[0025] It should be noted that the inner wall of the flow channel 10 is a regular hexagonal honeycomb structure, and the side wall of the flow channel 10 is made of elastic nickel-titanium alloy. Under the high pressure of the coolant, the stress concentration coefficient of the side wall of the regular hexagonal flow channel 10 is much lower than that of the circular flow channel 10, thus avoiding cracking or deformation caused by excessive local stress.

[0026] The flow channel 10 is equipped with a vortex generator 11, which is a triangular protrusion structure. The vortex generator 11 is located at the inlet of the flow channel 10, and the outlet of the flow channel 10 is a Venturi tube structure. The triangular vortex generator 11 generates uniform turbulence at the front of the flow channel 10, providing a stable flow field for the subsequent Venturi tube acceleration, avoiding Venturi tube surge caused by uneven inlet flow velocity, and also avoiding thermal damage to the copper graphene composite material layer 7 caused by local overheating. The high-speed jet at the Venturi tube outlet can further break up the large vortices generated by the inlet vortex, forming finer micro vortices, extending the turbulent heat transfer effect to the outside of the flow channel 10, and expanding the heat dissipation coverage area.

[0027] In the specific implementation process, a flexible heat pipe connector 5 is provided between two adjacent heat dissipation components. The flexible heat pipe connector 5 is a corrugated pipe structure. The corrugated pipe periodically contracts to form a local flow channel 10 contraction. The flow velocity increases at the trough, which accelerates the transfer of heat from the high temperature area to the low temperature area. The flexible structure of the corrugated pipe allows the local heat pipe to expand, avoiding the thermal blockage that may occur due to insufficient flow in traditional rigid heat pipes.

[0028] Reference Figure 1 In a preferred embodiment, an isolation groove 4 is provided at the junction of two adjacent heat dissipation components. The isolation groove 4 has a "V" shaped structure and is filled with ferrite absorbing material.

[0029] Specifically, the sloping design of the "V"-shaped groove increases the surface area at the junction of the heat dissipation components, enhancing the efficiency of air convection heat transfer. After the ferrite particles are filled, a heat conduction path is formed through the contact between the particles, improving the thermal conductivity inside the groove.

[0030] Reference Figure 3 In a preferred embodiment, the bottom of the aluminum-based silicon carbide layer 8 is provided with four positioning bosses 9, the positioning bosses 9 are cylindrical structures, and the positioning bosses 9 are connected to the thermally conductive substrate 3 by an interference fit.

[0031] Specifically, the interference fit uses the radial pressure generated by elastic deformation to tightly bond the boss with the thermally conductive substrate 3, thereby improving the connection strength and achieving efficient heat conduction.

[0032] Working Principle: During use, the synergistic design of the heat dissipation component and the shunt component enables efficient directional heat conduction. Diamond's extremely high thermal conductivity rapidly absorbs heat from the surface of the microwave transceiver component 2, while its high hardness protects it from mechanical damage. Through laser cladding, an atomic-level metallurgical bond is formed between the diamond layer and the transceiver. The copper substrate provides high electrical conductivity to reduce electromagnetic losses. Graphene nanosheets form a three-dimensional thermally conductive network within the copper substrate, further enhancing thermal conductivity. The aluminum-based silicon carbide layer 8 serves as the bottom support layer, utilizing the lightweight properties of aluminum to reduce overall weight. Silicon carbide particles are uniformly dispersed within the aluminum substrate using powder metallurgy, forming a highly thermally conductive and high-strength composite structure that rapidly transfers heat to the shunt component. The shunt component then carries the heat transferred from the aluminum-based silicon carbide layer 8 away from the antenna array. This structure can reduce the surface temperature of the microwave transceiver component 2 during continuous operation, improving heat dissipation and maintaining stable system operation.

[0033] The above description is merely a preferred embodiment of this utility model, but the protection scope of this utility model is not limited thereto. The substitutions may be replacements of some structures, devices, or method steps, or they may be complete technical solutions. Equivalent substitutions or modifications made based on the technical solution and inventive concept of this utility model should all be covered within the protection scope of this utility model.

Claims

1. A wireless energy transmission antenna array multiplexing structure, comprising a shell (1) and a plurality of microwave transceiver components (2), characterized in that, The housing (1) is also provided with a heat dissipation mechanism, which consists of multiple independent heat dissipation components and a shunt component. The heat dissipation component includes a thermally conductive substrate (3). The interior of the thermally conductive substrate (3) consists of a diamond film layer (6), a copper graphene composite material layer (7), and an aluminum-based silicon carbide layer (8) from top to bottom. The diamond film layer (6) covers the outer wall of the microwave transceiver component (2). The copper graphene composite material layer (7) forms a gradient interface with the diamond film layer (6) and the aluminum-based silicon carbide layer (8) through a laser cladding process.

2. The wireless power transmission antenna array multiplexing structure of claim 1, wherein, The flow divider is disposed inside the copper graphene composite material layer (7). The interior of the flow divider consists of multiple flow channels (10), and two adjacent flow channels (10) are connected through the same sidewall.

3. The wireless power transmission antenna array multiplexing structure of claim 2, wherein, The inner wall of the flow channel (10) is a regular hexagonal honeycomb structure, and the side wall of the flow channel (10) is made of elastic nickel-titanium alloy.

4. The wireless power transmission antenna array multiplexing structure of claim 3, wherein, The flow channel (10) is equipped with a vortex generator (11) inside. The vortex generator (11) is a triangular protrusion structure. The vortex generator (11) is located at the inlet of the flow channel (10), and the outlet of the flow channel (10) is a Venturi tube structure.

5. The wireless power transmission antenna array multiplexing structure of claim 4, wherein, A flexible heat pipe connector (5) is provided between two adjacent heat dissipation components. The flexible heat pipe connector (5) is a corrugated pipe structure.

6. The wireless power delivery antenna array multiplexing structure of Claim 1, wherein, An isolation groove (4) is provided at the junction of two adjacent heat dissipation components. The isolation groove (4) has a "V" shaped structure and is filled with ferrite absorbing material.

7. The wireless power transmission antenna array multiplexing structure of claim 6, wherein, The bottom of the aluminum-based silicon carbide layer (8) is provided with four positioning bosses (9), the positioning bosses (9) are cylindrical structures, and the positioning bosses (9) are connected to the thermally conductive substrate (3) by interference fit.

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