Module test control device, module test system

Abstract

This utility model discloses a module testing control device and a module testing system. It relates to the field of module testing technology. The device includes: a detection circuit board, which includes a pressing detection pin configured to contact the corresponding pressing pin of the test module when the test module is pressed onto the detection circuit board; an isolation circuit, which includes a first switching transistor, the first end of which is connected to a first preset power supply, the second end of which is grounded, and the control terminal of which is connected to the pressing detection pin; and a microcontroller unit, the first end of which is connected to the first end of the first switching transistor, configured to initiate testing of the test module after detecting a preset level on the pressing detection pin. This prevents cross-current.

Description

Technical Field

[0001] This utility model relates to the field of module testing technology, and in particular to a module testing control device and a module testing system. Background Technology

[0002] The rapid development of the Internet of Things (IoT) has led to the widespread application of smart devices and sensor networks. In the IoT field, cellular communication modules are one of the key components. To ensure the reliability and stability of cellular communication modules, testing is necessary.

[0003] However, in related technologies, cross-current issues may occur when testing the modules. Utility Model Content

[0004] This invention aims to at least partially solve one of the technical problems in the related art. Therefore, the first objective of this invention is to provide a module test control device to prevent cross-current.

[0005] The second objective of this invention is to provide a module testing system.

[0006] To achieve the above objectives, the first aspect of this utility model provides a module testing control device, the device comprising: a detection circuit board, the detection circuit board including a pressing detection pin, the pressing detection pin being configured to contact a corresponding pressing pin of the test module when the test module is pressed onto the detection circuit board; an isolation circuit including a first switching transistor, the first end of the first switching transistor being connected to a first preset power supply, the second end of the first switching transistor being grounded, and the control terminal of the first switching transistor being connected to the pressing detection pin; and a microcontroller unit, the first end of the microcontroller unit being connected to the first end of the first switching transistor, the microcontroller unit being configured to initiate testing of the test module after detecting that the level on the pressing detection pin is a preset level.

[0007] In addition, the module testing control device according to this utility model may also have the following additional technical features:

[0008] In some examples, the isolation circuit includes a first resistor, the first end of which is connected to a first preset power supply.

[0009] In some examples, the isolation circuit further includes: a second switch transistor, the first terminal of which is adapted to be connected to the microcontroller unit, the second terminal of which is grounded, and the control terminal of which is connected to the first terminal of the first switch transistor.

[0010] In some examples, the isolation circuit further includes: a first Zener diode, the cathode of which is connected to the control terminal of the first switching transistor, and the anode of which is grounded; and a second Zener diode, the cathode of which is connected to the first terminal of the second switching transistor, and the anode of which is grounded.

[0011] In some examples, the device further includes a second resistor, the first end of which is connected to a second preset power supply, and the second end of which is connected to the first end of the microcontroller unit.

[0012] In some examples, the detection circuit board further includes: a test pin configured to contact a corresponding test pin of the test module when the test module is pressed onto the detection circuit board; the device further includes: a discharge circuit, a first end of which is connected to the test pin, a second end of which is grounded, and a control end of which is connected to a second end of the microcontroller unit.

[0013] In some examples, the discharge circuit includes: a third resistor, the first end of which is adapted to be connected to the first end of the discharge circuit; a third switch, the first end of which is connected to the second end of the third resistor, the second end of which is adapted to be connected to the second end of the discharge circuit, and the control end of which is adapted to be connected to the control end of the discharge circuit.

[0014] In some examples, the discharge circuit further includes a third Zener diode, the negative terminal of which is connected to the control terminal of the third switching transistor, and the second terminal of which is grounded.

[0015] In some examples, the discharge circuit further includes a fourth resistor, the first end of which is connected to the first end of the third resistor, and the second end of which is connected to the second end of the third resistor.

[0016] To achieve the above objectives, the second aspect of this utility model provides a module testing system, including the aforementioned module testing control device.

[0017] According to the module testing control device and module testing system of this utility model, the device includes: a detection circuit board, the detection circuit board including a pressing detection pin, the pressing detection pin being configured to contact the corresponding pressing pin of the test module when the test module is pressed onto the detection circuit board; an isolation circuit; and a microcontroller unit, the microcontroller unit being connected to the pressing detection pin through the isolation circuit, and configured to start testing the test module after detecting that the level on the pressing detection pin is a preset level. By setting the isolation circuit, cross-current can be prevented.

[0018] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0019] Figure 1 This is a structural block diagram of the module testing control device according to an embodiment of the present invention;

[0020] Figure 2 This is a schematic diagram of a detection circuit board according to an example of this utility model;

[0021] Figure 3 This is a circuit diagram of an isolation circuit according to an embodiment of the present invention;

[0022] Figure 4 This is a circuit diagram of a module testing control device according to an embodiment of the present invention;

[0023] Figure 5 This is a circuit diagram of a discharge circuit according to an embodiment of the present invention;

[0024] Figure 6 This is a structural block diagram of the module testing system according to an embodiment of the present invention. Detailed Implementation

[0025] The module testing control device and module testing system of this utility model are described below with reference to the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described with reference to the accompanying drawings are exemplary and should not be construed as limiting this utility model.

[0026] Figure 1 This is a structural block diagram of the module testing and control device according to an embodiment of the present invention.

[0027] like Figure 1 As shown, the module test control device 100 includes: a detection circuit board 101, which includes a pressing detection pin configured to contact the corresponding pressing pin of the test module when the test module is pressed onto the detection circuit board 101; an isolation circuit 102, which includes a first switching transistor, the first end of which is connected to a first preset power supply, the second end of which is grounded, and the control end of which is connected to the pressing detection pin; and a microcontroller unit 103, the first end of which is connected to the first end of the first switching transistor, which is configured to start testing the test module after detecting that the level on the pressing detection pin is a preset level.

[0028] Specifically, in order to test the test module, a detection circuit board 101, an isolation circuit 102, and a microcontroller unit 103 are provided. The detection circuit board 101 is a circuit board used for pressing the test module and for testing the test module. When the test module is mounted on the detection circuit board 101, the detection pins of the test module will contact the pressing detection pins of the detection circuit board 101.

[0029] The microcontroller unit 103 is connected to the pressing detection pin of the detection circuit board 101. When the test module is pressed onto the detection circuit board 101, since the detection pin of the test module is connected to the pressing detection pin on the detection circuit board 101, the pressing detection pin on the detection circuit board 101 will be connected to the part inside the test module corresponding to the detection pin. As a result, when the test module is pressed onto the detection circuit board 101, the level on the pressing detection pin will be affected by the test module and become a preset level. For example, if the test pin of the test module is an open-collector output or directly grounded, the level on the pressing detection pin will drop to a low level when the test module is pressed onto the detection circuit board 101.

[0030] The test circuit board 101 includes a socket and an evaluation board. The socket is a slot or socket into which a test module can be placed. (See details...) Figure 2 In the example shown, the center of the socket has several pinholes for mounting metal conductor pins, i.e., push pins. One GND pin can be selected as the press-fit detection pin for the detection circuit board 101.

[0031] exist Figure 2 In the diagram, pressure detection 1 is the port where the isolation circuit 102 connects to the pressure detection pin of the detection circuit board 101, and pressure detection 1-1 is the port where the isolation circuit 102 connects to the microcontroller unit 103. That is, the isolation circuit 102 is located between pressure detection 1 and pressure detection 1-1 (not shown in the figure). Figure 2 In this context, the SICKET socket refers to the socket in which the test module is placed. S1 is the location that can accommodate the engraved serial number, and S2 is the location that can accommodate the engraved mark.

[0032] After the test module is pressed onto the detection circuit board 101, the voltage level on the pressing detection pin of the detection circuit board 101 changes to a preset level, such as the low level mentioned above. At this time, the microcontroller unit 103 acquires this information, and the test program starts. For example, the microcontroller unit 103 can detect the voltage level information on the pressing detection pin and use the signal with the preset voltage level as the test start signal. Then, the microcontroller unit 103 prints the detected voltage level signal on the pressing detection pin to the computer via a serial port, so that when the computer determines that it has received the test start signal, it drives the detection circuit board 101 to test the test module, or the test module can be directly tested by an external computer. Moreover, the microcontroller unit 103 can also continuously send the voltage level signal of the pressing detection pin that it monitors to the computer.

[0033] To prevent cross-current, an isolation circuit 102 is provided. The isolation circuit 102 is located between the microcontroller unit 103 and the detection circuit board 101 to prevent the circuit of the microcontroller unit 103 from affecting the detection circuit board 101 due to cross-current.

[0034] Furthermore, an isolation circuit 102 is provided, including a first switching transistor. The control terminal of the first switching transistor is adapted to be connected to a pressure detection pin, meaning that the high or low level on the pressure detection pin can control the on / off state of the first switching transistor. When the first switching transistor is on, the first terminal of the microcontroller unit 103 is grounded through the first switching transistor, and the microcontroller unit 103 receives a low level. When the first switching transistor is off, the first terminal of the microcontroller unit 103 is connected to a first preset power supply, and the microcontroller unit 103 receives a high level.

[0035] Moreover, it is clear that at this time, the power of the circuit where the microcontroller unit 103 is located cannot pass through the first switching transistor to affect the detection circuit board 101, thereby avoiding cross-current.

[0036] Therefore, by setting an isolation circuit 102 between the microcontroller unit 103 and the detection circuit board 101, cross-current can be avoided.

[0037] In some embodiments of this utility model, the isolation circuit 102 includes: a first resistor, the first end of which is connected to a first preset power supply.

[0038] In some embodiments of this utility model, the isolation circuit 102 further includes: a second switching transistor, the first end of which is adapted to be connected to the microcontroller unit 103, the second end of which is grounded, and the control end of which is connected to the first end of the first switching transistor.

[0039] Specifically, the isolation circuit 102 also includes a second switching transistor, the control terminal of which is connected to the first terminal of the first switching transistor, so that the switching on and off of the second switching transistor is controlled by the first switching transistor. When the second switching transistor is turned on, the microcontroller unit 103 is grounded and receives a low level signal.

[0040] Moreover, it is clear that the power in the circuit where the microcontroller 103 is located cannot bypass the second switching transistor to affect the first preset power supply, thereby further preventing cross-current.

[0041] In some embodiments of this utility model, the isolation circuit 102 further includes: a first Zener diode, the negative terminal of which is connected to the control terminal of the first switching transistor, and the positive terminal of which is grounded; and a second Zener diode, the negative terminal of which is connected to the first terminal of the second switching transistor, and the positive terminal of which is grounded.

[0042] Therefore, by setting a first Zener diode and a second Zener diode, ESD (Electrostatic Discharge) protection can be achieved.

[0043] The following is combined Figure 3 The specific embodiments shown will be described in detail.

[0044] exist Figure 3 In the diagram, D1 is the first Zener diode, D2 is the second Zener diode, R1 is the first resistor, Q1 is the first switching transistor, Q2 is the second switching transistor, 1V8 is the port connected to the first preset power supply of 1.8 volts, pressure detection 1 is the port where the isolation circuit 102 is connected to the pressure detection pin of the detection circuit board 101, and pressure detection 1-1 is the port where the isolation circuit 102 is connected to the microcontroller unit 103.

[0045] In this configuration, both the first switch Q1 and the second switch Q2 are N-channel MOSFETs, which are turned on at a low level. The gate of the first switch Q1 is connected to the voltage detection pin, the source of the first switch Q1 is grounded, and the drain of the first switch Q1 is connected to the first preset power supply through the first resistor R1. The gate of the second switch Q2 is connected to the drain of the first switch Q1, the source of the second switch Q2 is grounded, and the gate of the second switch Q2 is connected to the first terminal of the microcontroller unit.

[0046] It should be noted that in this embodiment, the first switch Q1 and the second switch Q2 are implemented using NMOS transistors. In other embodiments, the first switch Q1 and the second switch Q2 can also be implemented using PMOS transistors. Furthermore, the first switch Q1 and the second switch Q2 can also be implemented using a combination of NMOS and PMOS transistors. For example, the first switch Q1 uses a PMOS transistor, and the second switch Q2 uses a NMOS transistor; or the first switch Q1 uses an NMOS transistor, and the second switch Q2 uses a PMOS transistor. Those skilled in the art will understand that when using PMOS transistors, the circuit configuration needs to be adjusted according to the characteristics of the PMOS transistor. For example, when using a PMOS transistor, a pull-down resistor needs to be connected to its drain, which will not be elaborated further here.

[0047] Specifically, when the test module is pressed onto the detection circuit board 101, the level of the pressing detection pin on the detection circuit board 101 drops to a low level, the first switch Q1 is turned on, so that the control terminal of the second switch Q2 is grounded, the second switch Q2 is turned on, and a low level is output to the microcontroller unit 103.

[0048] In some embodiments of this utility model, the module test control device 100 further includes: a second resistor, the first end of which is connected to a second preset power supply, and the second end of which is connected to the first end of the microcontroller unit 103.

[0049] Therefore, by setting a second resistor, with its first end connected to a second preset power supply and its second end connected to the first end of the microcontroller unit 103, it can be achieved that when a low level is not received through the isolation circuit 102, the first end of the microcontroller unit 103 receives a high level provided by the second preset power supply; when a low level is received through the isolation circuit 102, the first end of the microcontroller unit 103 receives a low level, and the microcontroller unit 103 initiates the test of the test module based on this low level. This setting ensures that the first end of the microcontroller unit 103 only receives a low level when the isolation circuit 102 sends a low level, thus initiating the test of the test module based on this low level, thereby achieving precise test initiation.

[0050] In some embodiments of this utility model, the detection circuit board 101 further includes: a test pin, which is configured to contact the corresponding test pin of the test module when the test module is pressed onto the detection circuit board 101; the module test control device 100 further includes: a discharge circuit, the first end of the discharge circuit is connected to the test pin, the second end of the discharge circuit is grounded, and the control end of the discharge circuit is connected to the second end of the microcontroller unit 103.

[0051] Specifically, a conductive metal pin is installed on the detection circuit board 101. This conductive metal pin is a test pin. When the test module is pressed onto the detection circuit board 101, the test pin of the detection circuit board 101 contacts the test pin of the test module, so that the detection circuit board 101 or an external computer can test the test module accordingly. For example, the signal on the test pin of the test module can be tested.

[0052] However, after the test is completed, there may be residual charge on both the test module and the test circuit board 101. This residual charge also poses a risk of cross-current. Therefore, a discharge circuit is provided. The first end of the discharge circuit is connected to the test pin, the second end of the discharge circuit is grounded, and the control end of the discharge circuit is connected to the second end of the microcontroller unit 103.

[0053] The microcontroller unit 103 can control the first and second ends of the discharge circuit to connect before the test module is removed after the test is completed, so that the test pin of the detection circuit board 101 is grounded, thereby releasing the residual charge in the circuit.

[0054] In some embodiments of this utility model, the discharge circuit includes: a third resistor, the first end of which is adapted to be connected to the first end of the discharge circuit; a third switch, the first end of which is connected to the second end of the third resistor, the second end of which is adapted to be connected to the second end of the discharge circuit, and the control end of which is adapted to be connected to the control end of the discharge circuit.

[0055] Specifically, the discharge circuit includes a third resistor and a third switching transistor. The control terminal of the third switching transistor is adapted to be connected to the control terminal of the discharge circuit, that is, adapted to be connected to the second terminal of the microcontroller unit 103. When the microcontroller unit 103 issues a discharge control signal, the third switching transistor is turned on, causing the test pin to be grounded through the third resistor and the third switching transistor, thus releasing the residual charge.

[0056] In some embodiments of this utility model, the discharge circuit further includes: a third Zener diode, the negative terminal of which is connected to the control terminal of the third switching transistor, and the second terminal of the third Zener diode is grounded.

[0057] This allows for ESD protection.

[0058] In some embodiments of this utility model, the discharge circuit further includes: a fourth resistor, the first end of which is connected to the first end of the third resistor, and the second end of which is connected to the second end of the third resistor.

[0059] The following description uses a specific example.

[0060] See Figure 4R2 is the second resistor mentioned above. The 3.3V pull-up source on the MCU side is the port connected to the second preset power supply mentioned above. GPIO1 is the first terminal of the microcontroller unit 103, connected to the upper... Figure 3 The pressure detection 1-1 port is connected, GPIO2 is the second terminal of the microcontroller 103, and the second terminal GPIO2 of the microcontroller 103 is the discharge enable port.

[0061] See Figure 5 Q3 is the third switching transistor mentioned above, a P-channel MOSFET, which is turned on at low level. D3 is the third Zener diode mentioned above. R3 is the third resistor mentioned above. R4 is the fourth resistor mentioned above. DC3V8 is the port connected to the test pin of the detection circuit board 101. The control terminal of the third switching transistor Q3 is connected to the discharge enable port of the microcontroller unit 103.

[0062] As can be seen, in this specific embodiment, the first terminal GPIO1 of the microcontroller unit 103 is connected to the pressure detection pin on the detection circuit board 101 through a dual MOS isolation circuit 102.

[0063] Specifically, since the first terminal GPIO1 of the microcontroller 103 is connected to the pressure detection 1-1 port and the second resistor R2, when the second switch Q2 is not turned on, the first terminal GPIO1 of the microcontroller 103 is connected to the second preset power supply, and the level received by the first terminal GPIO1 of the microcontroller 103 is high.

[0064] In other words, when the test module is not pressed, the microcontroller unit 103 can only collect the pull-up source voltage of 3.3V on the MCU board. With the addition of the isolation circuit 102, the 3.3V on the microcontroller unit 103 side will not be pumped to the detection circuit board 101 side and the first preset power supply of 1.8V.

[0065] When the test module is pressed, the level on the pressing detection pin of the detection circuit board 101 becomes low, the first switch Q1 is turned on, which grounds the control terminal of the second switch Q2. The second switch Q2 is turned on, and the first terminal GPIO1 of the microcontroller 103 is grounded through the second switch Q2. The first terminal GPIO1 of the microcontroller 103 detects a low level.

[0066] After the test is completed and before replacing the next module under test, the residual charge on the test pin is automatically released through the discharge circuit to avoid the risk of electrical breakdown to the module placed later. At this time, the microcontroller unit 103 outputs a low level through the discharge enable port, the third switch Q3 is turned on, and the test pin of the detection circuit board 101 is grounded, thus realizing the discharge.

[0067] In summary, the module testing control device of this utility model, by setting up an isolation circuit, can prevent cross-current. Furthermore, by setting up a discharge circuit, residual charge can be released after the test is completed.

[0068] Furthermore, this utility model proposes a module testing system.

[0069] Figure 6 This is a structural block diagram of the module testing system according to an embodiment of the present invention.

[0070] like Figure 6 As shown, the module testing system 10 includes the module testing control device 100 described above.

[0071] The module testing system of this embodiment, through the module testing control device of the above embodiment, incorporates an isolation circuit to prevent cross-current. Furthermore, the inclusion of a discharge circuit allows for the release of residual charge after testing.

[0072] It should be noted that the logic and / or steps represented in the flowchart or otherwise described herein can be considered as a ordered list of executable instructions for implementing logical functions, and can be specifically implemented in any computer-readable medium for use by, or in conjunction with, an instruction execution system, apparatus, or device (such as a computer-based system, a processor-included system, or other system that can fetch and execute instructions from, an instruction execution system, apparatus, or device). For the purposes of this specification, "computer-readable medium" can be any means that can contain, store, communicate, propagate, or transmit programs for use by, or in conjunction with, an instruction execution system, apparatus, or device. More specific examples (a non-exhaustive list) of computer-readable media include: an electrical connection having one or more wires (electronic device), a portable computer disk drive (magnetic device), random access memory (RAM), read-only memory (ROM), erasable and editable read-only memory (EPROM or flash memory), fiber optic devices, and portable optical disc read-only memory (CDROM). Alternatively, the computer-readable medium may be paper or other suitable media on which the program can be printed, since the program can be obtained electronically, for example, by optically scanning the paper or other medium, followed by editing, interpreting, or otherwise processing as necessary, and then stored in a computer memory.

[0073] It should be understood that the various parts of this utility model can be implemented using hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented using software or firmware stored in memory and executed by a suitable instruction execution system. If implemented in hardware, as in another embodiment, it can be implemented using any one or a combination of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.

[0074] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0075] In the description of this specification, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and should not be construed as a limitation of this utility model.

[0076] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0077] In this specification, unless otherwise stated, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly defined. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0078] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0079] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A module testing control device, characterized in that, The device includes: A test circuit board, the test circuit board including a press-fit detection pin, the press-fit detection pin being configured to contact a corresponding press-fit pin of the test module when the test module is pressed onto the test circuit board; An isolation circuit, the isolation circuit including a first switching transistor, a first terminal of the first switching transistor being connected to a first preset power supply, a second terminal of the first switching transistor being grounded, and a control terminal of the first switching transistor being connected to the pressure detection pin. A microcontroller unit, the first terminal of which is connected to the first terminal of the first switching transistor, is configured to initiate testing of the test module after detecting that the level on the pressure detection pin is a preset level.

2. The module testing control device according to claim 1, characterized in that, The isolation circuit includes: The first resistor has its first end connected to a first preset power supply.

3. The module testing control device according to claim 1, characterized in that, The isolation circuit further includes: A second switch transistor, the first end of which is adapted to be connected to the microcontroller unit, the second end of which is grounded, and the control terminal of which is connected to the first end of the first switch transistor.

4. The module testing control device according to claim 3, characterized in that, The isolation circuit further includes: The first Zener diode has its cathode connected to the control terminal of the first switching transistor, and its anode grounded. The second Zener diode has its cathode connected to the first terminal of the second switching transistor, and its anode grounded.

5. The module testing control device according to claim 1, characterized in that, The device further includes: The second resistor has its first end connected to a second preset power supply and its second end connected to the first end of the microcontroller unit.

6. The module testing control device according to claim 1, characterized in that, The detection circuit board also includes: A test pin, configured to contact a corresponding test pin of the test module when the test module is pressed onto the detection circuit board; The device further includes: The discharge circuit has a first terminal connected to the test pin, a second terminal grounded, and a control terminal connected to the second terminal of the microcontroller unit.

7. The module testing control device according to claim 6, characterized in that, The discharge circuit includes: A third resistor, the first end of which is adapted to be connected to the first end of the discharge circuit; A third switching transistor, the first end of which is connected to the second end of the third resistor, the second end of which is adapted to be connected to the second end of the discharge circuit, and the control end of which is adapted to be connected to the control end of the discharge circuit.

8. The module testing control device according to claim 7, characterized in that, The discharge circuit further includes: The third Zener diode has its cathode connected to the control terminal of the third switching transistor, and its second terminal grounded.

9. The module testing control device according to claim 7, characterized in that, The discharge circuit further includes: A fourth resistor, the first end of which is connected to the first end of the third resistor, and the second end of which is connected to the second end of the third resistor.

10. A module testing system, characterized in that, Includes the module test control device according to any one of claims 1-9.

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