Embedded power module

Abstract

This utility model discloses an embedded power module, including a substrate. A heat dissipation assembly is provided at the bottom of the substrate, comprising: a heat-conducting component installed on one side of the bottom of the substrate; and a cooling component disposed inside the heat-conducting component and attached to the bottom of the substrate. The cooling component first reduces the overall temperature of the substrate. When the cooling effect of the cooling component is insufficient, the heat can be conducted away from the substrate through the heat-conducting component to achieve the purpose of cooling. The heat-conducting component includes a base plate with strip grooves at both ends. Screws are screwed into the strip grooves and fixed to the bottom surface of the substrate. Multiple heat sinks are also fixed to the bottom surface of the base plate. In this utility model, through holes are opened at the bottom of the substrate, which can significantly improve airflow, thereby accelerating the removal of heat accumulated on the surface and surrounding area of ​​the substrate and effectively reducing the substrate temperature.

Description

Technical Field

[0001] This utility model belongs to the field of power module technology, specifically relating to embedded power modules. Background Technology

[0002] An embedded power module is a highly integrated power supply unit designed for computer systems and other electronic devices. It integrates power conversion, management, and protection functions into a compact module, which is directly embedded into the device's circuit board to provide stable and reliable power support for various components in the system, such as the CPU, memory, and chipset.

[0003] In current applications of computers and related electronic devices, embedded power modules play a crucial role. However, their bottom substrate has a significant weakness in heat dissipation. During actual operation, the power module continuously operates, generating a large amount of heat from its internal power conversion circuits and electronic components. Since most embedded power module substrates are typically made of a single piece of resin material, while this material possesses certain insulation and structural strength, its heat dissipation performance is poor. The single-piece structure limits the heat conduction path, making it difficult for heat to dissipate quickly.

[0004] As usage time increases, heat accumulates within the substrate and power module, leading to localized overheating. High temperatures not only affect the performance and stability of electronic components in the power module and accelerate component aging, but can also cause component damage, short circuits, and other malfunctions. Over time, this severely impacts the reliability and lifespan of the entire embedded power module, potentially affecting the normal operation of the entire computer system or electronic device. Utility Model Content

[0005] The purpose of this invention is to provide an embedded power module to solve the problem of heat dissipation in existing embedded power modules mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an embedded power module, including a substrate; a heat dissipation component is provided at the bottom of the substrate, the heat dissipation component including: a heat-conducting component, installed on one side of the bottom of the substrate; and a cooling component, disposed inside the heat-conducting component and attached to the bottom of the substrate. The cooling component first reduces the overall temperature of the substrate. When the cooling effect of the cooling component is not good, the heat can be conducted away from the substrate through the heat-conducting component to achieve the purpose of cooling.

[0007] Preferably, the heat-conducting component includes a base plate with strip grooves at both ends. Screws are screwed into the strip grooves and fixed to the bottom surface of the substrate. Multiple heat sinks are also fixed to the bottom surface of the base plate, and a support plate is fixed between every two heat sinks. The cooling component is placed within the gap between the heat sinks and the substrate. In use, the high temperature generated by the substrate is transferred to the support plate through the base plate and cooled by the support plate, which does not contact the substrate. At the same time, the cooling component can cool the substrate.

[0008] Preferably, the cooling component is a capsule containing built-in coolant. The capsule containing built-in coolant is in contact with the inner wall of the heat sink, the top surface of the support plate, and the bottom surface of the substrate, respectively, so as to achieve cooling of the substrate.

[0009] Preferably, a clamping plate is provided at the bottom of the substrate, and screws pass through both ends of the clamping plate. The top of the screws is fixed to the bottom end of the substrate, and a nut is screwed into the bottom of the screws. A slot is provided on the inner side of the top of the clamping plate, and a sponge strip is bonded to the inner side of the slot. In use, the mounting end of the cooling fan can be inserted between the sponge strip and the bottom end face of the substrate, and the cooling fan can be fastened by rotating the nut.

[0010] Preferably, a through hole is provided in the middle region of the substrate, and two clamping plates are provided and symmetrically arranged on both sides of the through hole. The clamping plates do not contact each other with the heat dissipation component. By providing the through hole, the airflow of the substrate can be improved, thereby achieving the purpose of heat dissipation.

[0011] Preferably, a plurality of electronic components are mounted on the top of the substrate, and the electronic components are located in the vertical projection area of ​​the through hole, thereby increasing the airflow in the electronic component area and improving the heat dissipation efficiency. A power module is also provided on the side of the electronic components, and the power module is located directly above the heat dissipation component. The heat dissipation component is used to dissipate heat from the power module and reduce the operating temperature.

[0012] Preferably, a mounting plate is also provided above the substrate, which is mounted on the power module to realize the installation of the power module and to place the power module within the gap formed by the substrate and the mounting plate, thereby realizing embedded installation. A socket is also installed on the top of the substrate, which is symmetrically distributed on both sides of the electronic component with the mounting plate.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] In this invention, through holes are opened at the bottom of the substrate, which can significantly improve air flow and thus accelerate the removal of heat accumulated on the substrate surface and surrounding area, effectively reducing the substrate temperature. In addition, the added heat dissipation components can quickly conduct and dissipate the heat generated by the substrate, and at the same time, they can also play an auxiliary cooling role, further reducing the heat of the substrate. Through this dual heat dissipation mechanism, the temperature of the substrate can be effectively controlled, avoiding problems such as component performance degradation and accelerated aging caused by prolonged exposure to high temperatures. It effectively prevents the entire embedded power module from being damaged due to excessive substrate temperature, ensuring the stable operation of the power module and extending its service life. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 This is a bottom view of the substrate of this utility model;

[0017] Figure 3 This is a schematic diagram showing the connection between the heat sink and the built-in coolant capsule of this utility model;

[0018] Figure 4 This is a cross-sectional view showing the connection between the clamping plate and the sponge strip of this utility model.

[0019] In the picture:

[0020] 100. Substrate; 101. Electronic component; 102. Connector; 103. Mounting plate; 104. Through hole;

[0021] 200. Clamping plate; 201. Screw; 202. Sponge strip; 203. Slot; 204. Nut;

[0022] 300. Base plate; 301. Support plate; 302. Strip groove; 303. Heat sink; 304. Capsule containing coolant. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figures 1 to 4 This utility model provides a technical solution: an embedded power module, including...

[0025] substrate 100;

[0026] A heat dissipation assembly is provided at the bottom of the substrate 100, the heat dissipation assembly including:

[0027] A heat-conducting component is installed on one side of the bottom of the substrate 100;

[0028] The cooling component is located inside the heat-conducting component and is attached to the bottom of the substrate 100. The cooling component first reduces the overall temperature of the substrate 100. When the cooling effect of the cooling component is not good, the heat can be conducted away from the substrate 100 through the heat-conducting component to achieve the purpose of cooling.

[0029] In this embodiment, preferably, the heat-conducting component includes a base plate 300, with strip grooves 302 at both ends of the base plate 300. Screws are screwed into the strip grooves 302 and fixed to the bottom surface of the substrate 100. Multiple heat sinks 303 are also fixed to the bottom surface of the base plate 300. A support plate 301 is fixed between every two heat sinks 303. The cooling component is placed in the gap between the heat sinks 303 and the substrate 100. In use, the high temperature generated by the substrate 100 is transferred to the support plate 301 through the base plate 300 and cooled by the support plate 301, which does not contact the substrate 100. At the same time, the cooling component can cool the substrate 100.

[0030] In this embodiment, preferably, the cooling component is a capsule 304 with built-in coolant. The capsule 304 with built-in coolant is attached to the inner wall of the heat sink 303, the top surface of the support plate 301, and the bottom surface of the substrate 100 on all four sides. The substrate 100 is cooled by the capsule 304 with built-in coolant.

[0031] In this embodiment, preferably, a clamping plate 200 is provided at the bottom of the substrate 100. Screws 201 pass through both ends of the clamping plate 200. The top of the screws 201 is fixed to the bottom of the substrate 100, and a nut 204 is screwed into the bottom of the screws 201. A slot 203 is provided on the inner side of the top of the clamping plate 200. A sponge strip 202 is bonded to the inner side of the slot 203. In use, the mounting end of the cooling fan can be inserted between the sponge strip 202 and the bottom surface of the substrate 100, and the cooling fan can be fastened by rotating the nut 204.

[0032] In this embodiment, preferably, a through hole 104 is also provided in the middle region of the substrate 100, and two clamping plates 200 are provided and symmetrically arranged on both sides of the through hole 104. The clamping plates 200 and the heat dissipation components do not contact each other. By providing the through hole 104, the air flow of the substrate 100 can be improved to achieve the purpose of heat dissipation.

[0033] In this embodiment, preferably, a plurality of electronic components 101 are mounted on the top of the substrate 100. The electronic components 101 are located in the vertical projection area of ​​the through hole 104, thereby increasing the airflow in the area of ​​the electronic components 101 and improving the heat dissipation efficiency. A power module is also provided on the side of the electronic components 101. The power module is located directly above the heat dissipation component. The heat dissipation component is used to specifically dissipate heat from the power module and reduce the operating temperature.

[0034] In this embodiment, preferably, a mounting plate 103 is also provided above the substrate 100. The mounting plate 103 is mounted on the power module to realize the installation of the power module and to place the power module within the gap formed by the substrate 100 and the mounting plate 103 to realize embedded installation. A socket 102 is also installed on the top of the substrate 100. The socket 102 and the mounting plate 103 are symmetrically distributed on both sides of the electronic component 101.

[0035] Although embodiments of the present invention have been shown and described (see the detailed description above), it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. Embedded power supply module, including substrate(100); Its features are: A heat dissipation assembly is provided at the bottom of the substrate (100), the heat dissipation assembly comprising: A heat-conducting component is installed on one side of the bottom of the substrate (100); A cooling component is disposed inside the heat-conducting component and is attached to the bottom of the substrate (100).

2. The embedded power supply module according to claim 1, characterized in that: The heat-conducting component includes a base plate (300), with strip grooves (302) at both ends of the base plate (300). Screws are screwed into the strip grooves (302) and fixed to the bottom surface of the substrate (100). A plurality of heat sinks (303) are also fixed to the bottom surface of the base plate (300). A support plate (301) is fixed between every two heat sinks (303). The cooling component is placed in the gap between the heat sinks (303) and the substrate (100).

3. The embedded power supply module according to claim 2, characterized in that: The cooling component is a capsule (304) with built-in coolant. The capsule (304) with built-in coolant is attached to the inner wall of the heat sink (303), the top surface of the support plate (301), and the bottom surface of the substrate (100) on all four sides.

4. The embedded power supply module according to claim 1, characterized in that: The bottom of the substrate (100) is provided with a clamping plate (200), and screws (201) pass through both ends of the clamping plate (200). The top of the screws (201) is fixed to the bottom of the substrate (100), and a nut (204) is screwed into the bottom of the screws (201). A slot (203) is provided on the inner side of the top of the clamping plate (200), and a sponge strip (202) is bonded to the inner side of the slot (203).

5. The embedded power supply module according to claim 4, characterized in that: The substrate (100) also has a through hole (104) in the middle region. There are two clamping plates (200) and they are symmetrically arranged on both sides of the through hole (104). The clamping plates (200) do not contact each other with the heat dissipation components.

6. The embedded power supply module according to claim 5, characterized in that: A plurality of electronic components (101) are mounted on the top of the substrate (100). The electronic components (101) are located in the vertical projection area of ​​the through hole (104). A power module is also provided on the side of the electronic components (101), and the power module is located directly above the heat dissipation assembly.

7. The embedded power supply module according to claim 6, characterized in that: A mounting plate (103) is also provided above the substrate (100), which is mounted on the power module. A socket (102) is also installed on the top of the substrate (100), and the socket (102) and the mounting plate (103) are symmetrically distributed on both sides of the electronic component (101).

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