A VCM chip module flipping device

Abstract

This utility model relates to the field of VCM chip module processing equipment, specifically to a VCM chip module flipping device, including a flipping assembly and an adsorption assembly. The flipping assembly includes a flipping motor and a carrier disposed at the output end of the flipping motor. The carrier is used to place the VCM chip module, and a limiting cylinder is connected to the carrier. A pressure plate is rotatably connected to the output end of the limiting cylinder, and the limiting cylinder is used to drive the pressure plate to press down the VCM chip module. The adsorption assembly is used to transfer the VCM chip module. By setting the limiting cylinder and pressure plate in conjunction with the carrier, the VCM chip module is limited, making it less likely for the VCM chip module to shake relative to the carrier during flipping, reducing the possibility of the actual flipping angle of the VCM chip module not matching the expected angle affecting the adhesion of the magnet.

Description

Technical Field

[0001] This utility model relates to the field of VCM chip module processing equipment, specifically to a VCM chip module flipping device. Background Technology

[0002] Please refer to Figure 1 The VCM chip module 200 includes a VCM motor and a driver chip, and is a camera module capable of achieving automatic focusing. Magnets are a key component of the VCM chip module 200, and need to be attached to multiple surfaces of the VCM chip module using an attachment device. However, due to the small size of the VCM chip module 200, it is usually flipped and fixed in one place using a flipping device before the magnets are attached to the corresponding surfaces.

[0003] In existing technologies, the VCM chip module 200 is typically transferred to a carrier connected to the output of the flip motor 11 via an adsorption component. The flip motor 11 then drives the carrier to rotate the VCM chip module 200. However, the carrier lacks a limit on the VCM chip module 200, causing it to wobble relative to the carrier during flipping. This results in the actual flipping angle of the VCM chip module 200 not matching the expected angle, thus affecting the adhesion of the magnet. Utility Model Content

[0004] The technical solution adopted by this utility model to solve its technical problem is: to provide a VCM chip module flipping device, comprising:

[0005] A flipping assembly includes a flipping motor and a carrier disposed at the output end of the flipping motor. The carrier is used to place a VCM chip module. A limit cylinder is connected to the carrier. A pressure plate is rotatably connected to the output end of the limit cylinder. The limit cylinder is used to drive the pressure plate to press down the VCM chip module.

[0006] An adsorption assembly for transferring VCM chip modules.

[0007] Furthermore, the carrier includes a first mounting block and a second mounting block, the limiting cylinder is connected to the first mounting block, the second mounting block is provided with a through groove adapted to the VCM chip module, and the first mounting block and the pressure plate are respectively pressed on both ends of the VCM chip module in the length direction.

[0008] Furthermore, the pressure plate is provided with a limiting protrusion, which is rotatably connected to the first mounting block.

[0009] Furthermore, the adsorption component includes a moving module and a suction nozzle connected to the output end of the moving module. The moving module is used to drive the suction nozzle to adsorb and move the VCM chip module.

[0010] Furthermore, the mobile module includes a first lead screw drive structure and a lifting cylinder connected to the output end of the first lead screw drive structure, wherein the output end of the lifting cylinder is connected to the suction nozzle.

[0011] Furthermore, it also includes a carrier plate for placing the VCM chip module, and the moving module for driving the suction nozzle to adsorb and transfer the VCM chip module between the carrier plate and the carrier.

[0012] Furthermore, the carrier plate is connected to a second lead screw transmission mechanism, which is used to drive the carrier plate to move.

[0013] Furthermore, there are two carrier plates and two adsorption components, and the carrier plates and adsorption components correspond one to one. The two carrier plates are used to place the VCM chip module before flipping and the VCM chip module after flipping, respectively.

[0014] Furthermore, a first gear is coaxially fixed to the output end of the flipping motor, a rotating shaft is fixed on the carrier, and a second gear is coaxially fixed to the rotating shaft. The first gear and the second gear are connected by a synchronous belt.

[0015] The beneficial effects of this utility model are: by setting the limiting cylinder and pressure plate in conjunction with the carrier, the VCM chip module is limited, so that the VCM chip module is not easy to shake relative to the carrier when it is flipped, reducing the situation where the actual angle of the VCM chip module flipping does not match the expected angle, thus affecting the adhesion of the magnet. Attached Figure Description

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0017] In the picture: Figure 1 This is a three-dimensional structural diagram of the VCM chip module described in the background section;

[0018] Figure 2 An overall structural diagram of a VCM chip module flipping device provided by this utility model;

[0019] Figure 3 for Figure 2 The diagram shows the three-dimensional structure of the flip component;

[0020] Figure 4 for Figure 3 A three-dimensional structural diagram of the part shown;

[0021] Figure 5 for Figure 4 The diagram shows a three-dimensional structural representation of the part shown.

[0022] Explanation of reference numerals in the attached drawings: 100, VCM chip module flipping device; 10, flipping assembly; 11, flipping motor; 111, first gear; 12, first mounting block; 121, limiting through slot; 13, second mounting block; 131, through slot; 14, limiting cylinder; 141, pressure plate; 1411, limiting protrusion; 15, rotating shaft; 151, second gear; 16, synchronous belt; 211, first lead screw transmission structure; 212, lifting cylinder; 22, suction nozzle; 30, carrier plate; 31, second lead screw transmission mechanism; 200, VCM chip module. Detailed Implementation

[0023] To make the technical problem to be solved, the technical solution, and the beneficial effects of this utility model clearer, the present utility model will now be described in detail with reference to the accompanying drawings. This drawing is a simplified schematic diagram, illustrating only the basic aspects of the present utility model, and therefore only shows the components relevant to the present utility model. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0024] Please refer to Figure 2 and Figure 3 This utility model provides a VCM chip module flipping device 100, including a flipping component 10, an adsorption component, and a carrier plate 30 for placing a VCM chip module 200. The adsorption component is used to transfer the VCM chip module 200. The flipping component 10 includes a flipping motor 11 and a carrier disposed at the output end of the flipping motor 11. The carrier is used to place the VCM chip module 200. A limit cylinder 14 is connected to the carrier. A pressure plate 141 is rotatably connected to the output end of the limit cylinder 14. The limit cylinder 14 is used to drive the pressure plate 141 to press down the VCM chip module 200.

[0025] By setting the limiting cylinder 14 and the pressure plate 141 in conjunction with the carrier, the VCM chip module 200 is limited, so that the VCM chip module 200 is not easy to shake relative to the carrier when it is flipped, reducing the situation where the actual angle of the VCM chip module 200 flipping does not match the expected angle, thus affecting the adhesion of the magnet.

[0026] For details, please refer to Figure 3 , Figure 4 and Figure 5 The carrier includes a first mounting block 12 and a second mounting block 13. A limiting cylinder 14 is connected to the first mounting block 12. The second mounting block 13 is provided with a through groove 131 that is adapted to the VCM chip module 200. The first mounting block 12 and the pressure plate 141 are respectively pressed on both ends of the VCM chip module 200 in the length direction.

[0027] To limit the rotation range of the pressure plate 141, the pressure plate 141 is provided with a limiting protrusion 1411, which is rotatably connected to the first mounting block 12. At the same time, the first mounting block 12 is provided with a limiting through groove 121 for the output end of the limiting cylinder 14 to pass through.

[0028] For details, please refer to Figure 3 The output end of the flip motor 11 is coaxially fixed with a first gear 111, and a rotating shaft 15 is fixed on the carrier. The rotating shaft 15 is coaxially fixed with a second gear 151. The first gear 111 and the second gear 151 are connected by a synchronous belt 16.

[0029] Please refer to Figure 2 The adsorption assembly includes a movable module and a suction nozzle 22 connected to the output end of the movable module. The movable module drives the suction nozzle 22 to adsorb and move the VCM chip module 200, transferring the VCM chip module 200 between the carrier plate 30 and the carrier. The movable module includes a first lead screw drive structure 211 and a lifting cylinder 212 connected to the output end of the first lead screw drive structure 211. The output end of the lifting cylinder 212 is connected to the suction nozzle 22. A second lead screw drive mechanism 31 is fixedly connected to the carrier plate 30, and the second lead screw drive mechanism 31 drives the carrier plate 30 to move. Specifically, the first lead screw drive mechanism is arranged along the width direction of the VCM chip module 200, the second lead screw drive mechanism 31 is arranged along the length direction of the VCM chip module 200, and the lifting cylinder 212 is arranged along the height direction of the VCM chip module 200. The first lead screw transmission structure 211, the second lead screw transmission mechanism 31 and the lifting cylinder 212 work together to drive the suction nozzle 22 to load the VCM chip module 200 into the corresponding position on the carrier plate 30.

[0030] Please refer to Figure 2 There are two carrier plates 30 and two adsorption components, and the carrier plates 30 and the adsorption components correspond one-to-one. The two carrier plates 30 are used to place the VCM chip module 200 before flipping and the VCM chip module 200 after flipping, respectively. The two carrier plates 30 are located at both ends of the width direction of the VCM chip module 200.

Claims

1. A VCM chip module turnover device, characterized by, include: A flipping assembly includes a flipping motor and a carrier disposed at the output end of the flipping motor. The carrier is used to place a VCM chip module. A limit cylinder is connected to the carrier. A pressure plate is rotatably connected to the output end of the limit cylinder. The limit cylinder is used to drive the pressure plate to press down the VCM chip module. An adsorption assembly for transferring VCM chip modules.

2. The VCM chip module flipping device of claim 1, wherein: The carrier includes a first mounting block and a second mounting block. The limiting cylinder is connected to the first mounting block. The second mounting block is provided with a through groove adapted to the VCM chip module. The first mounting block and the pressure plate are respectively pressed on both ends of the VCM chip module in the length direction.

3. The VCM chip module flipping device of claim 2, wherein: The pressure plate is provided with a limiting protrusion, which is rotatably connected to the first mounting block.

4. The VCM chip module flipping device of claim 1, wherein: The adsorption component includes a moving module and a suction nozzle connected to the output end of the moving module. The moving module is used to drive the suction nozzle to adsorb and move the VCM chip module.

5. The VCM chip module flipping device of claim 4, wherein: The mobile module includes a first lead screw drive structure and a lifting cylinder connected to the output end of the first lead screw drive structure. The output end of the lifting cylinder is connected to the suction nozzle.

6. The VCM chip module flipping device of claim 5, wherein: It also includes a carrier plate for placing the VCM chip module, and a moving module for driving the suction nozzle to adsorb the VCM chip module and transfer it between the carrier plate and the carrier.

7. The VCM chip module flipping device of claim 6, wherein: The carrier plate is connected to a second lead screw transmission mechanism, which is used to drive the carrier plate to move.

8. The VCM chip module flipping device according to claim 7, characterized in that: There are two carrier plates and two adsorption components, and the carrier plates and adsorption components correspond one to one. The two carrier plates are used to place the VCM chip module before flipping and the VCM chip module after flipping, respectively.

9. The VCM chip module flipping device according to claim 1, characterized in that: The output end of the flipping motor is coaxially fixed with a first gear, a rotating shaft is fixed on the carrier, and a second gear is coaxially fixed on the rotating shaft. The first gear and the second gear are connected by a synchronous belt.

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