Silicon wafer blocking mechanism and silicon wafer cleaning apparatus

Abstract

This utility model discloses a silicon wafer blocking mechanism and a silicon wafer cleaning device. The silicon wafer blocking mechanism is applied to a silicon wafer cleaning device. The silicon wafer blocking mechanism includes: a frame with a receiving space for placing a basket; a blocking assembly mounted on the frame, the blocking assembly including an elastic member rotatable horizontally between a first position and a second position; wherein, when the elastic member is in the first position, at least a portion of the elastic member protrudes from the receiving space and abuts against the silicon wafer inside the basket. This utility model can reduce the probability of silicon wafer breakage due to impact between the silicon wafer and the basket during the wafer insertion process of the insertion device.

Description

Technical Field

[0001] This utility model belongs to the field of silicon wafer production technology, specifically relating to a silicon wafer blocking mechanism and a silicon wafer cleaning equipment. Background Technology

[0002] Existing silicon wafer cleaning equipment typically includes an insertion device, a transport mechanism, and a cleaning device. The insertion device separates stacked silicon wafers into individual wafers. The separated wafers are then transported to baskets via a conveyor belt. Driven by the conveyor belt, the wafers are inserted into the baskets due to inertia. To ensure that the wafers are fully inserted into the baskets, the conveyor belt needs to maintain a certain transport speed. However, if the wafers are inserted into the baskets too quickly, they may impact the inner wall of the baskets. Since the wafers are relatively thin, the edges of the wafers may be damaged during the impact process, leading to an increase in the defect rate.

[0003] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this utility model and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content

[0004] The purpose of this invention is to provide a silicon wafer blocking mechanism and a silicon wafer cleaning device, which can protect the silicon wafer during the process of inserting the silicon wafer into the basket, reduce the probability of silicon wafer breakage due to impact, and reduce the silicon wafer defect rate.

[0005] To achieve the above objectives, a specific embodiment of this utility model provides the following technical solution: a silicon wafer blocking mechanism, applied to a silicon wafer cleaning equipment, the silicon wafer blocking mechanism comprising:

[0006] The frame has storage space for placing flower baskets;

[0007] A blocking assembly, mounted on a frame, the blocking assembly including an elastic element rotatable in a horizontal direction between a first position and a second position;

[0008] When the elastic element is in the first position, at least a portion of the elastic element protrudes from the receiving space and can abut against the silicon wafer inside the basket.

[0009] In one or more embodiments of the present invention, the blocking component includes a plurality of elastic members spaced apart.

[0010] In one or more embodiments of this utility model, a plurality of said elastic elements are distributed at intervals along the horizontal direction.

[0011] In one or more embodiments of this utility model, the elastic element is an elastic element made of rubber or silicone.

[0012] In one or more embodiments of the present invention, the blocking assembly further includes a blocking frame, and the elastic element is mounted on the blocking frame.

[0013] In one or more embodiments of the present invention, the blocking assembly further includes a rotary drive unit mounted on the frame, the rotating end of the rotary drive unit being connected to the blocking frame, and the rotary drive unit being used to drive the blocking frame to rotate in the horizontal direction so as to switch the elastic element between a first position and a second position.

[0014] A specific embodiment of this utility model also provides a silicon wafer cleaning device, including:

[0015] The wafer insertion device includes a silicon wafer blocking mechanism. The wafer insertion device is used to slice silicon wafers and load the sliced ​​silicon wafers into a basket on the silicon wafer blocking mechanism. The silicon wafer blocking mechanism is the silicon wafer blocking mechanism described above.

[0016] A cleaning device, comprising several cleaning tanks arranged in parallel, is used to clean silicon wafers in a basket;

[0017] The cleaning conveyor line, located downstream of the wafer insertion device and upstream of the cleaning device, along the transport direction of the basket, is used to transport the basket containing the silicon wafers to the cleaning device.

[0018] The first flipping mechanism is located at the beginning of the cleaning conveyor line and is used to flip the vertical flower basket to a horizontal state and place it on the cleaning conveyor line.

[0019] The flower basket conveyor line is located upstream of the insert device and downstream of the cleaning device, along the transportation direction of the flower baskets, and is used to transport empty flower baskets.

[0020] The second flipping mechanism is located at the end of the flower basket conveyor line. The second flipping mechanism is used to flip the flower baskets that are horizontal on the flower basket conveyor line to a vertical state.

[0021] A robotic arm mechanism is located above the starting end of the silicon wafer blocking mechanism, the cleaning conveyor line, and the transfer conveyor line. It is used to transfer the basket on the silicon wafer blocking mechanism to the first flipping mechanism of the cleaning conveyor line, and to transfer the basket on the first flipping mechanism to the silicon wafer blocking mechanism.

[0022] In one or more embodiments of the present invention, the wafer insertion device includes a first conveying mechanism for transporting silicon wafers and a lifting mechanism disposed at the end of the first conveying mechanism. The lifting mechanism is connected to the frame of the silicon wafer blocking mechanism. The lifting mechanism is used to lift the silicon wafer blocking mechanism so that the silicon wafer on the first conveying mechanism is aligned with the placement slot in the flower basket placed in the receiving space.

[0023] In one or more embodiments of the present invention, the wafer insertion device further includes a fragment detection mechanism disposed above the first conveying mechanism, the fragment detection mechanism being used to detect silicon wafers on the first conveying mechanism.

[0024] In one or more embodiments of the present invention, the fragment detection mechanism includes a detection bracket and an image acquisition unit mounted on the detection bracket, the image acquisition unit being used to detect silicon wafers on the first conveying mechanism.

[0025] In one or more embodiments of the present invention, the wafer insertion device further includes a worktable, the first conveying mechanism is mounted on the worktable, the first conveying mechanism includes a first transmission belt assembly, a second transmission belt assembly and a third transmission belt assembly arranged sequentially along the silicon wafer transport direction, at least a portion of the second transmission belt assembly is located downstream of the fragment detection mechanism, the second transmission belt assembly is rotatably mounted on the worktable, the second transmission belt assembly has a first rotation position and a second rotation position, and a waste bin is provided below the end of the second transmission belt assembly;

[0026] In the first rotational position, the end of the second transmission belt assembly is close to the starting end of the third transmission belt assembly, so as to transport the qualified silicon wafers onto the third transmission belt assembly.

[0027] When the second drive belt assembly is rotated to the second position, the end of the second drive belt assembly is lower than the third drive belt assembly, so as to transport the defective silicon wafers detected by the fragment detection mechanism into the waste bin.

[0028] In one or more embodiments of the present invention, a rotation drive unit is further installed on the workbench, the starting end of the second transmission belt assembly is rotatably connected to the workbench, and the end of the second transmission belt assembly is connected to the rotation drive unit. The rotation drive unit is used to drive the end of the second transmission belt assembly to rotate, so as to switch the second transmission belt assembly between a first rotation position and a second rotation position.

[0029] In one or more embodiments of this utility model, the second transmission belt assembly includes a base, and a drive shaft and a driven shaft rotatably mounted on the base. A second conveyor belt for transporting silicon wafers is connected between the drive shaft and the driven shaft. A drive motor is provided on the worktable. The drive shaft is rotatably connected to the worktable and drively connected to the drive motor. The drive shaft is located at the starting end of the second transmission belt assembly, and the driven shaft is located at the ending end of the second transmission belt assembly. The portion of the base near the driven shaft is connected to a rotation drive unit; and / or,

[0030] The rotation drive unit is a cylinder, the cylinder body is rotatably connected to the worktable, and the piston rod of the cylinder is rotatably connected to the base.

[0031] In one or more embodiments of the present invention, the insert device further includes a worktable and an air knife mechanism mounted on the worktable. The first conveying mechanism is mounted on the worktable, and at least a portion of the air knife mechanism is located above the first conveying mechanism, with the air outlet of the air knife mechanism facing the first conveying mechanism.

[0032] In one or more embodiments of this utility model, the wafer insertion device further includes a worktable, a wafer slitting mechanism, and a first conveying mechanism for transporting silicon wafers. The first conveying mechanism is disposed on the worktable, and the worktable is provided with a loading trough. The loading trough is disposed below the starting end of the first conveying mechanism. Along the silicon wafer transport direction, the wafer slitting mechanism is disposed upstream of the starting end of the first conveying mechanism and part of it is located in the loading trough. The loading trough is used to accommodate stacked silicon wafer groups. The wafer slitting mechanism is used to slit the stacked silicon wafer groups and transport the slitted individual silicon wafers to the first conveying mechanism.

[0033] In one or more embodiments of this utility model, the loading tank is provided with a silicon wafer group conveying mechanism for transporting silicon wafer groups. The slicing mechanism includes a slicing conveying motor, a vertical conveying component, a transition conveying component, and a slicing liquid spraying head located on at least one side of the silicon wafer group conveying mechanism in the loading tank. The slicing conveying motor is drivenly connected to the vertical conveying component and the transition conveying component. The starting end of the vertical conveying component is close to the end of the silicon wafer group conveying mechanism, the starting end of the transition conveying component is close to the end of the vertical conveying component, and the end of the transition conveying component is close to the starting end of the first conveying mechanism. The slicing liquid spraying head is used to spray liquid onto the silicon wafer group on the silicon wafer group conveying mechanism to slice the silicon wafer group.

[0034] In one or more embodiments of this utility model, the vertical conveying assembly includes a vertical base, a vertical drive roller mounted on the vertical base, a vertical conveyor belt pulsatorically connected to the vertical drive roller, and a suction cup structure mounted on the vertical base. The suction cup structure has an air intake port, and the vertical conveyor belt is provided with a plurality of through-holes at intervals. The suction holes are connected to the air intake port to adsorb the silicon wafer onto the vertical conveyor belt; and / or,

[0035] The transition conveyor assembly includes a transition base, a transition drive roller rotatably mounted on the transition base, and a transition conveyor belt that is drively connected to the transition drive roller.

[0036] In one or more embodiments of this utility model, a pressure roller is provided above the starting end of the transition conveying assembly and the end end of the vertical conveying assembly. The pressure roller cooperates with the transition conveying assembly and the vertical conveying assembly to clamp the silicon wafer; and / or,

[0037] The slicing mechanism further includes an auxiliary blowing assembly, which includes an air blowing head. The auxiliary blowing assembly is mounted above the vertical conveying assembly and / or the transition conveying assembly, and the air blowing head faces the vertical conveying assembly and / or the transition conveying assembly, so that the silicon wafer is attached to the vertical conveying assembly and / or the transition conveying assembly.

[0038] In one or more embodiments of this utility model, the robotic arm mechanism includes a support frame, an X-axis displacement assembly slidably mounted on the support frame, a Y-axis displacement assembly disposed on the X-axis displacement assembly, a Z-axis displacement assembly disposed on the Y-axis displacement assembly, and an electric gripper disposed on the Z-axis displacement assembly. The X-axis displacement assembly is used to drive the Y-axis displacement assembly to move along the X direction, the Y-axis displacement assembly is used to drive the Z-axis displacement assembly to move along the Y direction, and the Z-axis displacement assembly is used to drive the electric gripper to move along the Z direction. The electric gripper is used to grip a flower basket; and / or,

[0039] The first flipping mechanism includes a first flipping seat and a first flipping drive unit. The first flipping seat has a first abutment surface and a second abutment surface, which are used to abut against the two sides adjacent to the flower basket. The first flipping seat is rotatably mounted on the washing conveyor line. The first flipping drive unit is drively connected to the first flipping seat to drive the first flipping seat to rotate; and / or,

[0040] The second flipping mechanism includes a second flipping seat and a second flipping drive unit. The second flipping seat has a third abutting surface and a fourth abutting surface, which are used to abut against the two sides adjacent to the flower basket. The second flipping seat is rotatably mounted on the flower basket conveyor line. The second flipping drive unit is connected to the second flipping seat in a transmission connection to drive the second flipping seat to rotate.

[0041] Compared with the prior art, the silicon wafer blocking mechanism and silicon wafer cleaning equipment of this utility model have at least a portion of the elastic element in the blocking component located inside the basket during the process of inserting the silicon wafer into the basket. Along the direction of silicon wafer movement, the silicon wafer preferentially impacts the elastic element, avoiding direct impact on the inner wall of the basket. By utilizing the elasticity and flexibility of the elastic element, the silicon wafer can be protected during the impact process, reducing the damage caused by the impact and lowering the defect rate of the silicon wafer. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0043] Figure 1 This is a partial schematic diagram of a flower basket in one embodiment of the present invention;

[0044] Figure 2 This is a partial perspective view of a silicon wafer cleaning device according to one embodiment of the present invention;

[0045] Figure 3 This is a schematic diagram of the insert device in one embodiment of the present invention;

[0046] Figure 4 This is a schematic diagram of a vertical conveying assembly and a segmented spray head in one embodiment of the present invention;

[0047] Figure 5 This is an exploded view of the vertical conveying component and the segmented spray head in one embodiment of the present invention;

[0048] Figure 6 This is a partial schematic diagram of the insert device in one embodiment of the present invention;

[0049] Figure 7 This is a schematic diagram showing the cooperation of the first conveying mechanism, the lifting mechanism, and the silicon wafer blocking mechanism in one embodiment of the present invention;

[0050] Figure 8 This is a schematic diagram showing the cooperation between the cleaning conveyor line and the first flipping mechanism in one embodiment of the present invention;

[0051] Figure 9 This is a schematic diagram illustrating the cooperation between the flower basket conveyor line and the second flipping mechanism in one embodiment of the present invention;

[0052] Figure 10 This is a schematic diagram of the robotic arm mechanism in one embodiment of the present invention.

[0053] Explanation of key figure labels:

[0054] 1. Wafer insertion device; 11. Worktable; 111. Loading trough; 112. Silicon wafer assembly conveying mechanism; 113. Rotary drive unit; 12. Wafer slitting mechanism; 121. Vertical conveying assembly; 1211. Vertical base; 12111. Connecting hole; 1212. Vertical drive roller; 1213. Suction cup structure; 1214. Vertical conveyor belt; 12141. Suction hole; 122. Transition conveying assembly; 1221. Transition base; 1222. Transition drive roller; 1223. Transition conveyor belt; 123. Wafer slitting mechanism 124. Power supply motor; 124. Auxiliary blowing assembly; 1241. Air blowing head; 125. Pressure roller; 126. Segmented spray nozzle; 13. First conveying mechanism; 131. First transmission belt assembly; 1311. Drive pulley; 1312. Driven pulley; 1313. First conveyor belt; 132. Second transmission belt assembly; 1321. Base; 1322. Drive shaft; 1323. Driven shaft; 1324. Second conveyor belt; 133. Third transmission belt assembly; 134. Drive motor; 14. Lifting mechanism; 141. Lifting drive unit 142. Lifting seat; 15. Silicon wafer blocking mechanism; 151. Frame; 1511. Accommodation space; 152. Blocking assembly; 1521. Blocking frame; 1522. Elastic element; 1523. Rotation drive unit; 16. Fragment detection mechanism; 161. Detection bracket; 162. Image acquisition unit; 17. Air knife mechanism; 2. Cleaning conveyor line; 21. First conveyor frame; 3. First flipping mechanism; 31. First flipping seat; 311. First contact surface; 312. Second contact surface; 32. First flipping drive unit 4. Flower basket conveyor line; 41. Second conveyor frame; 5. Second flipping mechanism; 51. Second flipping seat; 52. Second flipping drive unit; 511. Third contact surface; 512. Fourth contact surface; 6. Robotic arm mechanism; 61. Support frame; 62. X-axis displacement assembly; 621. X-axis drive unit; 622. X-axis sliding seat; 63. Y-axis displacement assembly; 64. Z-axis displacement assembly; 65. Electric gripper; 7. Flower basket; 71. Support plate; 72. Rod-shaped support; 73. Reception space; 74. Reception slot. Detailed Implementation

[0055] To enable those skilled in the art to better understand the technical solutions of this utility model, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

[0056] As mentioned in the background section, during the production of monocrystalline silicon wafers, some impurities or dust may remain on the surface of the wafers, requiring cleaning before subsequent processing or other steps. To achieve automated production, multiple silicon wafers are stacked to form wafer assemblies.

[0057] The flower basket 7 includes two opposing support plates 71 and a plurality of spaced-apart rod-shaped support members 72 connecting the two support plates 71. The plurality of support members and the two support plates 71 cooperate to form a receiving space 73 for receiving silicon wafers. Figure 1 As shown, the receiving space 73 has a material inlet, and the rod-shaped support members 72 are provided with multiple receiving slots 74 spaced apart along their axial direction. Receiving slots 74 at the same height on the multiple rod-shaped support members 72 form a group of receiving slots 74. Multiple groups of receiving slots 74 are formed at intervals along the height direction (i.e., the vertical direction). Each group of receiving slots 74 corresponds to the receiving edge portion of a silicon wafer. That is, a silicon wafer is inserted into the receiving space 73 from the material inlet, and the edge portion of the silicon wafer will be inserted into a group of receiving slots 74. The receiving slots 74 not only provide support for the silicon wafers but also allow the multiple silicon wafers contained in the basket 7 to be distributed sequentially and spaced apart, facilitating subsequent picking and cleaning. Furthermore, it is best to insert only one silicon wafer into each receiving slot 74. Figure 1 The flower basket 7 in the image is a vertical flower basket 7, as shown below. Figure 8 The flower basket 7 in the image is in a horizontal position.

[0058] like Figure 2 As shown, the silicon wafer cleaning equipment in one embodiment of this utility model includes a wafer insertion device 1, a cleaning device, a cleaning conveyor line 2, a first flipping mechanism 3, a basket conveyor line 4, a second flipping mechanism 5, and a robotic arm mechanism 6.

[0059] It is understandable that through the cooperation of the various devices and mechanisms mentioned above, the silicon wafers can be slicing, and the sliced ​​silicon wafers can be transferred to the basket 7 for further cleaning. The gaps between the multiple silicon wafers housed in the basket 7 facilitate the picking up and cleaning of the wafers.

[0060] like Figure 1 and 2 As shown, the wafer insertion device 1 in this embodiment includes a worktable 11, a wafer splitting mechanism 12, a first conveying mechanism 13, a lifting mechanism 14, and a silicon wafer blocking mechanism 15. A vertically positioned basket 7 is placed on the silicon wafer blocking mechanism 15. The first conveying mechanism 13 is mounted on the worktable 11 along the silicon wafer transport direction. The wafer splitting mechanism 12 is located upstream of the first conveying mechanism 13, and the lifting mechanism 14 and the silicon wafer blocking mechanism 15 are located downstream of the first conveying mechanism 13. The lifting mechanism 14 is connected to the silicon wafer blocking mechanism 15.

[0061] Understandably, the slicing mechanism 12 is used to slice the silicon wafer group and transport the sliced ​​individual silicon wafers to the first conveying mechanism 13. The first conveying mechanism 13 transports the silicon wafers to the basket 7 on the silicon wafer blocking mechanism 15, so that the silicon wafers are inserted into the receiving slots 74 of the basket 7 in sequence. The lifting mechanism 14 can control the lifting and lowering of the silicon wafer blocking mechanism 15, so that the receiving slots 74 in the basket 7 on the silicon wafer blocking mechanism 15 are aligned with the silicon wafers transported by the first conveying mechanism 13 in sequence, so as to ensure that the silicon wafers can be inserted into the receiving slots 74.

[0062] like Figure 2 As shown, the workbench 11 is provided with a loading trough 111, which is located below the starting end of the first conveying mechanism 13. The wafer slitting mechanism 12 is located upstream of the starting end of the first conveying mechanism 13 along the silicon wafer transport direction and part of it is located in the loading trough 111. The loading trough 111 is used to accommodate the stacked silicon wafer group, and the wafer slitting mechanism 12 is used to slit the stacked silicon wafer group and transport the slitted single silicon wafers to the first conveying mechanism 13.

[0063] The loading trough 111 is equipped with a silicon wafer group conveying mechanism 112, which is used to transport the silicon wafer group to the slitting mechanism 12. The silicon wafer group conveying mechanism 112 can be a common conveyor belt structure or other existing silicon wafer group conveying mechanism 112.

[0064] like Figures 3 to 5 As shown, the wafer slicing mechanism 12 includes a wafer transport motor 123, a vertical conveying assembly 121, a transition conveying assembly 122, and wafer spraying heads 126. The wafer transport motor 123 is connected to the vertical conveying assembly 121 and the transition conveying assembly 122. The starting end of the vertical conveying assembly 121 is near the end of the silicon wafer conveying mechanism 112, the starting end of the transition conveying assembly 122 is near the end of the vertical conveying assembly 121, and the end of the transition conveying assembly 122 is near the starting end of the first conveying mechanism 13. Along the transport direction of the silicon wafers, the wafer spraying heads 126 are located on opposite sides of the silicon wafer conveying mechanism 112 in the loading trough 111. The wafer spraying heads 126 are used to spray liquid onto the silicon wafers on the silicon wafer conveying mechanism 112, using the sprayed liquid to slice the silicon wafers and avoid damage to the silicon wafers due to slicing.

[0065] It is understandable that the vertical conveying component 121 and the transition conveying component 122 work together to form a conveying route for transporting silicon wafers, thereby serving to transport individual silicon wafers to the first conveying mechanism 13.

[0066] The vertical conveyor assembly 121 includes a vertical base 1211, a vertical drive roller 1212 mounted on the vertical base 1211, a vertical conveyor belt 1214 connected to the vertical drive roller 1212, and a suction cup structure 1213 mounted on the vertical base 1211. The suction cup structure 1213 has an air intake. The vertical conveyor belt 1214 is provided with a plurality of through-holes 12141 at intervals. The suction holes 12141 are connected to the air intake to adsorb the silicon wafer onto the vertical conveyor belt 1214.

[0067] It is understood that the silicon wafers conveyed by the silicon wafer conveying mechanism 112 in this embodiment are vertically stacked silicon wafers. Therefore, after the wafer slicing spray head 126 slices the silicon wafers, the silicon wafers will also be in a vertical position against the vertical conveying component 121. The suction cup structure 1213 in the vertical conveying component 121 and the adsorption holes 12141 on the vertical conveyor belt 1214 cooperate with each other to adsorb the silicon wafers onto the vertical conveyor belt 1214. Under the action of the rotation of the vertical conveyor belt 1214, the silicon wafers are transported to the transition conveying component 122.

[0068] like Figure 5 As shown, the vertical base 1211 is provided with a connecting hole 12111. One end of the connecting hole 12111 is connected to the air intake, and the other end is located below the vertical conveyor belt 1214 and is used to connect with the adsorption hole 12141 on the vertical conveyor belt 1214.

[0069] Specifically, the vertical conveyor belt 1214 is wound around the vertical drive roller 1212, and the segmented transport motor 123 is connected to the vertical drive roller 1212 through a transmission belt or other transmission structure. The segmented transport motor 123 can drive the vertical drive roller 1212 to rotate, thereby driving the vertical conveyor belt 1214 to move.

[0070] The transition conveying assembly 122 includes a transition base 1221, a transition drive roller 1222 mounted on the transition base 1221, and a transition conveyor belt 1223 that is drively connected to the transition drive roller 1222. As shown in the figure, the transport path formed by the transition conveyor belt 1223 is arc-shaped. When transporting silicon wafers, the transition conveyor belt 1223 can gradually convert vertical silicon wafers into horizontal silicon wafers and transfer them to the first conveying mechanism 13.

[0071] Specifically, the transition conveyor belt 1223 is wound around the transition drive roller 1222, and the segmented transport motor 123 is connected to the transition drive roller 1222 through a transmission belt or other transmission structure. The segmented transport motor 123 can drive the transition drive roller 1222 to rotate, thereby driving the transition conveyor belt 1223 to move.

[0072] Furthermore, the slicing mechanism 12 also includes an auxiliary blowing assembly 124, which includes an air blowing head 1241. The auxiliary blowing assembly 124 is mounted above both the vertical conveying assembly 121 and the transition conveying assembly 122, with the air blowing head 1241 facing the vertical conveying assembly 121 and the transition conveying assembly 122, so that the silicon wafer is attached to the vertical conveying assembly 121 and the transition conveying assembly 122. The auxiliary blowing assembly 124 may include a conventional fan (not shown in the figure), which is connected to the air blowing head 1241 through a pipe. The fan drives the gas flow and flows out through the air blowing head 1241. The force generated by the gas blown out of the air blowing head 1241 is used to attach the silicon wafer to the vertical conveyor belt 1214 of the vertical conveying assembly 121 and the transition conveyor belt 1223 of the transition conveying assembly 122.

[0073] Furthermore, a pressure roller 125 is provided above the starting end of the transition conveyor assembly 122 and the end of the vertical conveyor assembly 121. The pressure roller 125 cooperates with the transition conveyor assembly 122 and the vertical conveyor assembly 121 to clamp the silicon wafer. Since there is no suction cup structure 1213 on the transition conveyor belt 1223 in this embodiment, in order to prevent the silicon wafer from separating from the vertical conveyor belt 1214, the pressure roller 125 can rotate itself. The pressure roller 125 is used to press the silicon wafer onto the transition conveyor belt 1223. With the help of the auxiliary blowing assembly 124, it can be ensured that the transition conveyor assembly 122 transports the silicon wafer to the first conveyor mechanism 13.

[0074] In other embodiments, the transition conveying assembly 122 may also include a suction cup structure 1213 similar to or the same as that in the vertical conveying assembly 121, and the transition conveyor belt 1223 may also have holes communicating with the suction cup structure 1213 to adsorb silicon wafers.

[0075] like Figure 3 As shown, the wafer insertion device 1 also includes a fragment detection mechanism 16 disposed above the first conveying mechanism 13. The fragment detection mechanism 16 is used to detect silicon wafers on the first conveying mechanism 13. The fragment detection mechanism 16 serves to detect whether the silicon wafers are damaged.

[0076] Specifically, the fragment detection mechanism 16 includes a detection bracket 161 and an image acquisition unit 162 mounted on the detection bracket 161. The image acquisition unit 162 is used to detect the silicon wafers on the first conveying mechanism 13. The image acquisition unit 162 can be an industrial camera or other common image acquisition device, which can take pictures of the silicon wafers on the first conveying mechanism 13 and upload the captured image information to a host computer, which can then identify whether the silicon wafers are damaged based on the image information.

[0077] like Figure 6As shown, the first conveying mechanism 13 in this embodiment includes a first transmission belt assembly 131, a second transmission belt assembly 132, and a third transmission belt assembly 133 arranged sequentially along the silicon wafer transport direction. At least a portion of the second transmission belt assembly 132 is located downstream of the fragment detection mechanism 16. The second transmission belt assembly 132 is rotatably mounted on the worktable 11. The second transmission belt assembly 132 has a first rotation position and a second rotation position. A waste bin (not shown in the figure) is provided below the end of the second transmission belt assembly 132. In the first rotation position, the end of the second transmission belt assembly 132 is close to the starting end of the third transmission belt assembly 133 to transport qualified silicon wafers to the third transmission belt assembly 133. In the second rotation position, the end of the second transmission belt assembly 132 is lower than the third transmission belt assembly 133 to transport defective silicon wafers detected by the fragment detection mechanism 16 into the waste bin.

[0078] Understandably, when the second drive belt assembly 132 is in the first rotational position, the first drive belt assembly 131, the second drive belt assembly 132, and the third drive belt assembly 133 cooperate to form a transport line that transports silicon wafers to the basket 7 on the silicon wafer blocking mechanism 15. When the second drive belt assembly 132 is in the second rotational position, since the second drive belt assembly 132 rotates to the second rotational position, the first drive belt assembly 131 and the second drive belt assembly 132 cooperate to form a transport line that transports damaged silicon wafers to the waste bin. This design can effectively remove damaged silicon wafers from the first conveying mechanism 13 in a timely manner. The second drive belt assembly 132 can rotate and switch between the first rotational position and the second rotational position.

[0079] Specifically, a rotation drive unit 113 is also installed on the workbench 11. The starting end of the second transmission belt assembly 132 is rotatably connected to the workbench 11, and the end of the second transmission belt assembly 132 is connected to the rotation drive unit 113. The rotation drive unit 113 is used to drive the end of the second transmission belt assembly 132 to rotate, so that the second transmission belt assembly 132 switches between a first rotation position and a second rotation position.

[0080] Preferably, in this embodiment, the rotation drive unit 113 is a cylinder, the cylinder body of which is rotatably connected to the worktable 11, and the piston rod of which is rotatably connected to the end of the second transmission belt assembly 132, thereby controlling the rotation of the second transmission belt assembly 132. In other embodiments, the rotation drive unit 113 can also be a common structure on the market, such as an electric cylinder or a rotary motor.

[0081] The second transmission belt assembly 132 includes a base 1321, and a drive shaft 1322 and a driven shaft 1323 rotatably mounted on the base 1321. A second conveyor belt 1324 for transporting silicon wafers is connected between the drive shaft 1322 and the driven shaft 1323. At least one drive motor 134 is provided on the worktable 11. The drive shaft 1322 is rotatably connected to the worktable 11 and is drive-driven connected to the drive motor 134. The drive shaft 1322 is located at the starting end of the second transmission belt assembly 132, and the driven shaft 1323 is located at the end of the second transmission belt assembly 132. The portion of the base 1321 near the driven shaft 1323 is connected to the rotation drive unit 113.

[0082] It can be understood that the starting end of the base 1321 is part of the starting end of the second transmission belt assembly 132, and the ending end of the base 1321 is part of the ending end of the second transmission belt assembly 132. That is, the driven shaft 1323 is rotatably mounted on the ending end of the base 1321, and the drive shaft 1322 is rotatably mounted on the starting end of the base 1321. The rotation drive unit 113 is mounted below the second transmission belt assembly 132, thereby driving the second transmission belt assembly 132 to rotate. The drive motor 134 can be a common servo motor or rotary motor, which can be connected to the drive shaft 1322 via conventional gears or transmission belts, thereby driving the drive shaft 1322 to rotate. When the second transmission belt assembly 132 rotates between the first rotation position and the second rotation position, it rotates around the drive shaft 1322.

[0083] The second transmission belt assembly 132 includes a plurality of second transmission belts 1324 spaced apart between the drive shaft 1322 and the driven shaft 1323. This arrangement allows water on the silicon wafer to drip off as much as possible, and also reduces the contact area between the second transmission belt 1324 and the silicon wafer, thereby reducing wear on the silicon wafer caused by the transmission belt.

[0084] like Figure 6 As shown, the first transmission belt assembly 131 includes a drive pulley 1311 and a driven pulley 1312 rotatably mounted on the worktable 11, and multiple first conveyor belts 1313 spaced apart and driven between the drive pulley 1311 and the driven pulley 1312. This arrangement allows water on the silicon wafer to drip off as much as possible, and also reduces the contact area between the second conveyor belt 1324 and the silicon wafer, thus reducing wear on the silicon wafer. The drive motor 134 is driven by the drive pulley 1311. The connection method is similar to the connection method between the drive shaft 1322 and the drive motor 134, and will not be described again here.

[0085] The structure of the third transmission belt assembly 133 in this embodiment can refer to the structure of the first transmission belt assembly 131, and will not be described again here.

[0086] In other embodiments, the first transmission belt assembly 131, the second transmission belt assembly 132, and the third transmission belt assembly 133 can also be common structures with conveyor belts available on the market, as long as they can perform their respective functions as described above.

[0087] In this embodiment, the wafer insertion device 1 further includes an air knife mechanism 17 mounted on the workbench 11. The first conveying mechanism 13 is mounted on the workbench 11, and at least a portion of the air knife mechanism 17 is located above the first conveying mechanism 13, with the air outlet of the air knife mechanism 17 facing the first conveying mechanism 13. The air knife mechanism 17 includes an air nozzle with an air outlet, which blows air onto the silicon wafer on the first conveying mechanism 13 to dry the silicon wafer. The air knife mechanism 17 may also include an air source or a fan, and the air nozzle is connected to the air source or fan through a pipe to obtain a stable air source. In this embodiment, the air blown out by the air outlet of the air knife mechanism 17 is air.

[0088] In other embodiments, the air knife mechanism 17 can also blow out other gases, as long as it does not affect the silicon wafer and can achieve the drying effect; the air knife mechanism 17 can also be a common air knife structure on the market, as long as it does not affect the silicon wafer and can achieve the drying effect.

[0089] The air knife mechanism 17 can be a common air knife structure on the market, mainly used to blow air onto the silicon wafers on the first conveying mechanism 13, thereby drying the silicon wafers. The air knife mechanism 17 can be connected to an air source or a fan to obtain a stable air source. In this embodiment, the air blown out from the air outlet of the air knife mechanism 17 is air. In other embodiments, other gases can also be blown, as long as they do not affect the silicon wafers and achieve the drying effect.

[0090] like Figure 7 As shown, the silicon wafer blocking mechanism 15 includes a frame 151 and a blocking assembly 152. The frame 151 has a receiving space 1511 for placing the flower basket 7. The blocking assembly 152 is mounted on the frame 151 and includes an elastic member 1522 that can rotate in the horizontal direction. The elastic member 1522 has a first position and a second position. When the elastic member 1522 is in the first position, at least a portion of the elastic member 1522 protrudes into the receiving space 1511 and can abut against the silicon wafer in the flower basket 7.

[0091] It is understood that the flower basket 7 includes several spaced-apart support members. Therefore, when the elastic member 1522 rotates, it can be inserted into the flower basket 7 through the space between adjacent support members, thus changing to the first position. At this time, along the transport direction of the silicon wafer (i.e., the direction in which the silicon wafer is inserted into the flower basket 7), the silicon wafer will preferentially contact the elastic member 1522. The elastic member 1522 elastically absorbs the kinetic energy of the silicon wafer, and since the elastic member 1522 has a certain degree of flexibility, the impact between the silicon wafer and the elastic member 1522 will not cause damage to the silicon wafer, avoiding the situation in the prior art where the silicon wafer is damaged due to impact with the flower basket 7 along the transport direction of the silicon wafer. The switching of the elastic member 1522 between the first and second positions adopts a horizontal rotation mode.

[0092] In this embodiment, the rotation angle of the elastic element 1522 between the first position and the second position is 90°. In other embodiments, the rotation angle of the elastic element 1522 between the first position and the second position may be 60°, 135°, 180°, or other angle values.

[0093] The blocking assembly 152 also includes a blocking frame 1521, on which the elastic element 1522 is mounted. Specifically, in this embodiment, the blocking frame 1521 includes a first support and a second support. The length direction of the first support is horizontal, and the length direction of the second support is vertical. One end of the first support is connected to the rotating end of the rotary drive unit 1523, and the other end is connected to the middle of the second support. The elastic element 1522 is mounted on the second support, which supports the elastic element 1522. In other embodiments, the structure of the blocking frame 1521 can also be other common shapes, as long as it can support the elastic element 1522 and connect to the rotating end of the rotary drive unit 1523.

[0094] In this embodiment, there is one second bracket and one elastic element 1522. In other embodiments, there is one second bracket, and a plurality of spaced elastic elements 1522 are mounted on the second bracket; or, one end of the first bracket is connected to a plurality of spaced second brackets, and each second bracket is equipped with one or more spaced elastic elements 1522. Preferably, in other embodiments, the plurality of elastic elements 1522 are spaced apart along the horizontal direction.

[0095] The blocking assembly 152 also includes a rotary drive unit 1523 mounted on the frame 151. The rotating end of the rotary drive unit 1523 is connected to the blocking frame 1521. The rotary drive unit 1523 is used to drive the blocking frame 1521 to rotate in the horizontal direction, so that the elastic element 1522 can switch between a first position and a second position. In this embodiment, the rotary drive unit 1523 is a commercially available rotary motor. In other embodiments, the rotary drive unit 1523 can also be other rotary drive units 1523.

[0096] The elastic element 1522 is made of rubber or silicone.

[0097] like Figure 7 As shown, the lifting mechanism 14 includes a lifting drive unit 141 and a lifting seat 142 connected to each other. The lifting drive unit 141 is installed on the workbench 11 and is located at the end of the first conveying mechanism 13. The frame 151 of the silicon wafer blocking mechanism 15 is fixedly connected to the lifting seat 142. The lifting drive unit 141 is used to drive the lifting seat to rise or fall, thereby driving the silicon wafer blocking mechanism 15 to rise or fall. This allows a set of receiving slots 74 in the basket 7 of the silicon wafer blocking mechanism 15 that do not contain silicon wafers to be aligned with the silicon wafers transported by the first conveying mechanism 13. When a silicon wafer is inserted into the set of receiving slots 74, the lifting mechanism 14 controls the silicon wafer blocking mechanism 15 to rise or fall, continuing to align the set of receiving slots 74 that do not contain silicon wafers with the silicon wafers transported by the first conveying mechanism 13. The above steps are repeated until all the receiving slots 74 in the basket 7 contain silicon wafers.

[0098] Specifically, the lifting drive unit 141 is a common electric screw structure, and the lifting seat 142 is connected to the electric screw structure to control the raising or lowering of the lifting seat 142. In other embodiments, the lifting drive unit 141 can also be an existing lifting drive structure such as a cylinder or an electric cylinder.

[0099] The cleaning device (not shown in the figure) includes several cleaning tanks arranged in parallel, each filled with cleaning fluid. The cleaning fluid in different tanks can be the same or different, depending on the actual needs. The cleaning device cleans the silicon wafers in basket 7. The cleaning device may also include a drying mechanism to dry the cleaned silicon wafers. The cleaning device can be any commercially available silicon wafer cleaning device.

[0100] like Figure 2 and Figure 8As shown, the cleaning conveyor line 2 is located near the wafer insertion device 1 and the cleaning device. Along the transport direction of the basket 7, the cleaning conveyor line 2 can be considered to be located downstream of the wafer insertion device 1 and upstream of the cleaning device. That is, the starting end of the cleaning conveyor line 2 is near the wafer insertion device 1, and the ending end of the cleaning conveyor line 2 is near the cleaning device. Thus, the basket 7 containing the silicon wafer is transported to the cleaning device for cleaning.

[0101] Specifically, the cleaning conveyor line 2 includes a first conveyor frame 21, a first conveyor drive unit, a first drive roller, a first driven roller, and a first conveyor belt. The first conveyor drive unit is mounted on the first conveyor frame 21, and the output end of the first conveyor drive unit is connected to the first drive roller to drive the first drive roller to rotate. The first drive roller and the first driven roller are both rotatably mounted on the first conveyor frame 21. The first conveyor belt is installed between the first drive roller and the first driven roller. The flower basket 7 is placed on the first conveyor belt, thereby playing the role of transporting the flower basket 7.

[0102] The first flipping mechanism 3 is located at the beginning of the cleaning conveyor line 2 and is used to flip the vertical basket 7 to a horizontal position and place it on the cleaning conveyor line 2. This arrangement ensures that the material inlet of the basket 7 faces upwards, preventing the silicon wafers in the basket 7 from falling out during transport on the cleaning conveyor line 2. The robotic arm mechanism 6 can then transfer the basket 7 containing the silicon wafers to the first flipping mechanism 3, at which point the robotic arm mechanism 6 picks up the basket 7 in a vertical position.

[0103] Specifically, the first flipping mechanism 3 includes a first flipping seat 31 and a first flipping drive unit 32 mounted on the cleaning conveyor line 2. The first flipping seat 31 has a first abutting surface 311 and a second abutting surface 312. The first abutting surface 311 and the second abutting surface 312 are used to abut against the two sides adjacent to the flower basket 7. The first flipping seat 31 is rotatably mounted on the cleaning conveyor line 2. The first flipping drive unit 32 is connected to the first flipping seat 31 in a transmission connection to drive the first flipping seat 31 to rotate.

[0104] It is understood that two spaced-apart first conveyor belts are connected between the first drive roller and the first driven roller, and the flower basket 7 is placed on the two first conveyor belts. The first flipping mechanism 3 has a first flipping position and a second flipping position. When the first flipping mechanism 3 is in the first flipping position, the first abutment surface 311 is horizontal and the second abutment surface 312 is vertical. The flower basket 7 on the first flipping mechanism 3 is in a vertical state. When the first flipping mechanism 3 is in the second flipping position, the first abutment surface 311 is vertical and the second abutment surface 312 is horizontal. The second abutment surface 312 is located between the two first conveyor belts and is slightly lower than the top of the first conveyor belts. The flower basket 7 on the first flipping mechanism 3 is in a horizontal state. That is, at this time, the horizontal flower basket 7 abuts against the first conveyor belt in the vertical direction. The movement of the first conveyor belt can move the flower basket 7 out of the first flipping mechanism 3 and transport it to the cleaning device.

[0105] In this embodiment, the first tilting seat 31 is rotatably mounted on the first conveyor frame 21 of the cleaning conveyor line 2, and the first tilting drive unit 32 is a cylinder, with the cylinder body movably mounted on the first conveyor frame 21 and the piston rod rotatably connected to the first tilting seat 31. In other embodiments, the first tilting drive unit 32 can be other common drive structures, such as a servo motor, as long as it can drive the first tilting seat 31 to rotate.

[0106] like Figure 2 and Figure 9 As shown, the flower basket conveyor line 4 is located upstream of the insert device 1 and downstream of the cleaning device along the transport direction of the flower basket 7. It is used to transport empty flower baskets 7. The end of the flower basket conveyor line 4 is close to the start of the cleaning conveyor line 2.

[0107] Specifically, the flower basket conveyor line 4 includes a second conveyor frame 41, a second conveyor drive unit, a second drive roller, a second driven roller, and a second conveyor belt. The second conveyor drive unit is mounted on the second conveyor frame 41, and the output end of the second conveyor drive unit is connected to the second drive roller to drive the second drive roller to rotate. Both the second drive roller and the second driven roller are rotatably mounted on the second conveyor frame 41. The second conveyor belt is installed between the second drive roller and the second driven roller. The flower basket 7 is placed on the second conveyor belt, thereby playing the role of transporting the empty flower basket 7.

[0108] The second flipping mechanism 5 is located at the end of the flower basket conveyor line 4, and is used to flip the horizontal flower basket 7 to a vertical position and place it on the flower basket conveyor line 4. This facilitates the robotic arm mechanism 6 to pick up the empty flower basket 7 (vertical position) on the second flipping mechanism 5 and transfer it to the silicon wafer blocking mechanism 15.

[0109] Specifically, the second flipping mechanism 5 includes a second flipping seat 51 and a second flipping drive unit 52 mounted on the flower basket conveyor line 4. The second flipping seat 51 has a third abutting surface 511 and a fourth abutting surface 512, which are used to abut against the two sides adjacent to the flower basket 7. The second flipping seat 51 is rotatably mounted on the flower basket conveyor line 4. The second flipping drive unit 52 is connected to the second flipping seat 51 in a transmission connection to drive the second flipping seat 51 to rotate.

[0110] Understandably, two spaced-apart second conveyor belts are connected between the second drive roller and the second driven roller, and the flower basket 7 is placed on the two second conveyor belts. The second flipping mechanism 5 has a third flipping position and a fourth flipping position. When the second flipping mechanism 5 is in the third flipping position, the third abutment surface 511 is horizontal and the fourth abutment surface 512 is vertical, and the flower basket 7 on the second conveyor belt is horizontal. When the second flipping mechanism 5 is in the fourth flipping position, the third abutment surface 511 is vertical and the fourth abutment surface 512 is horizontal, and the flower basket 7 on the second flipping mechanism 5 is horizontal, with the fourth abutment surface 512 located between the two second conveyor belts and slightly lower than the top of the second conveyor belts. During the process of the second flipping mechanism 5 rotating from the third flipping position to the fourth flipping position, the third abutment surface 511 gradually changes from a horizontal state to a vertical state, and the third abutment surface 511 will abut against the flower basket 7 on the second conveyor belt, causing the flower basket 7 to change from a horizontal state to a vertical state.

[0111] In this embodiment, the second flipping seat 51 is rotatably mounted on the second conveyor frame 41 of the flower basket conveyor line 4. The second flipping drive unit 52 is a servo motor, which is fixedly mounted on the second conveyor frame 41. The output end of the servo motor is rotatably connected to the second flipping seat 51. In other embodiments, the second flipping drive unit 52 can be other common drive structures, such as cylinders, as long as they can drive the second flipping seat 51 to rotate.

[0112] like Figure 2 and 10 As shown, the robotic arm mechanism 6 is located above the starting end of the silicon wafer blocking mechanism 15, the cleaning conveyor line 2, and the transfer conveyor line. It is used to transfer the basket 7 on the silicon wafer blocking mechanism 15 to the first flipping mechanism 3 on the cleaning conveyor line 2, and to transfer the basket 7 on the first flipping mechanism 3 to the silicon wafer blocking mechanism 15.

[0113] Specifically, the robotic arm mechanism 6 includes a support frame 61, an X-axis displacement assembly 62 slidably mounted on the support frame 61, a Y-axis displacement assembly 63 mounted on the X-axis displacement assembly 62, a Z-axis displacement assembly 64 mounted on the Y-axis displacement assembly 63, and an electric gripper 65 disposed on the Z-axis displacement assembly 64. The X-axis displacement assembly 62 is used to drive the Y-axis displacement assembly 63 to move along the X direction, the Y-axis displacement assembly 63 is used to drive the Z-axis displacement assembly 64 to move along the Y direction, and the Z-axis displacement assembly 64 is used to drive the electric gripper 65 to move along the Z direction. The electric gripper 65 is used to grip the flower basket 7.

[0114] Preferably, the X-axis displacement assembly 62 may include an X-axis drive unit 621 and an X-axis slide seat 622. The X-axis drive unit 621 is a motor. A rotating shaft is rotatably mounted on the X-axis slide seat 622. A rack structure is mounted on the support frame 61. One end of the rotating shaft is connected to the motor for transmission, and the other end is equipped with a gear that meshes with the rack structure. The X-axis slide seat 622 is slidably connected to the support frame 61. The motor drives the rotating shaft to rotate, which in turn drives the gear to rotate and move on the rack structure, thereby driving the X-axis slide seat 622 to move along the X direction on the support frame 61.

[0115] In other embodiments, the X-axis drive unit 621 can also be a commercially available electric lead screw, and the X-axis slide seat 622 is mounted on the electric lead screw, which can drive the X-axis slide seat 622 to move along the X direction.

[0116] In other embodiments, the X-axis drive unit 621 may also be a combination structure of an electric cylinder, a pneumatic cylinder, a rotary motor, and a track assembly, etc., as long as it can be connected to the X-axis sliding seat 622 and drive the X-axis sliding seat 622 to move along the X direction on the support frame 61.

[0117] The structures of the Y-axis displacement assembly 63 and the Z-axis displacement assembly 64 in this embodiment can be referred to the structure and composition of the X-axis displacement assembly 62, and will not be repeated here.

[0118] In other embodiments, the robotic arm mechanism 6 can be a common picking mechanism on the market, as long as it can transfer the basket 7 on the silicon wafer blocking mechanism 15 to the first flipping mechanism 3 of the cleaning conveyor line 2, and transfer the basket 7 on the first flipping mechanism 3 to the silicon wafer blocking mechanism 15.

[0119] like Figure 2As shown, the silicon wafer cleaning equipment in this embodiment includes two parallel wafer insertion devices 1. Each wafer insertion device 1 includes a workbench 11 with two parallel loading troughs 111. The other structures in each wafer insertion device 1, except for the workbench 11, are arranged in two parallel sets. By adjusting the start time of the four sets of structures in the two wafer insertion devices 1 (e.g., staggering their adjustment times), the four sets of structures can be inserted simultaneously, and the baskets 7 containing silicon wafers can be transported to the cleaning transport line at staggered times. This can save the floor space of the entire silicon wafer cleaning equipment and further improve the silicon wafer cleaning efficiency.

[0120] Furthermore, this embodiment includes two robotic arm mechanisms 6. One robotic arm mechanism 6 is used to transfer the basket 7 on the silicon wafer blocking mechanism 15 to the first flipping mechanism 3 of the cleaning conveyor line 2, and the other robotic arm mechanism 6 is used to transfer the basket 7 on the first flipping mechanism 3 to the silicon wafer blocking mechanism 15. This arrangement can improve the working efficiency of the entire equipment.

[0121] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0122] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A silicon wafer blocking mechanism, applied in a silicon wafer cleaning equipment, characterized in that, The silicon wafer blocking mechanism includes: The frame has storage space for placing flower baskets; A blocking assembly, mounted on a frame, the blocking assembly including an elastic element rotatable in a horizontal direction between a first position and a second position; When the elastic element is in the first position, at least a portion of the elastic element protrudes from the receiving space and can abut against the silicon wafer inside the basket.

2. The silicon wafer blocking mechanism of claim 1, wherein, The blocking assembly includes a plurality of elastic elements spaced apart.

3. The silicon wafer blocking mechanism of claim 2, wherein, The plurality of elastic elements are distributed at intervals along the horizontal direction.

4. The silicon wafer blocking mechanism of claim 1, wherein, The elastic element is made of rubber or silicone.

5. The silicon wafer blocking mechanism of claim 1, wherein, The blocking assembly also includes a blocking frame, on which the elastic element is mounted.

6. The silicon wafer blocking mechanism of claim 5, wherein, The blocking assembly also includes a rotary drive unit mounted on the frame. The rotating end of the rotary drive unit is connected to the blocking frame. The rotary drive unit is used to drive the blocking frame to rotate in the horizontal direction so that the elastic element can switch between a first position and a second position.

7. A silicon wafer cleaning apparatus, characterized by comprising: include: A wafer insertion device, including a silicon wafer blocking mechanism, the wafer insertion device being used to slice silicon wafers and load the sliced ​​silicon wafers into a basket on the silicon wafer blocking mechanism, the silicon wafer blocking mechanism being the silicon wafer blocking mechanism according to any one of claims 1 to 6. A cleaning device, comprising several cleaning tanks arranged in parallel, is used to clean silicon wafers in a basket; The cleaning conveyor line, located downstream of the wafer insertion device and upstream of the cleaning device, along the transport direction of the basket, is used to transport the basket containing the silicon wafers to the cleaning device. The first flipping mechanism is located at the beginning of the cleaning conveyor line and is used to flip the vertical flower basket to a horizontal position and place it on the cleaning conveyor line. The flower basket conveyor line is located upstream of the insert device and downstream of the cleaning device, along the transportation direction of the flower baskets, and is used to transport empty flower baskets. The second flipping mechanism is located at the end of the flower basket conveyor line. The second flipping mechanism is used to flip the flower baskets that are horizontal on the flower basket conveyor line to a vertical state. A robotic arm mechanism is located above the starting end of the silicon wafer blocking mechanism, the cleaning conveyor line, and the transfer conveyor line. It is used to transfer the basket on the silicon wafer blocking mechanism to the first flipping mechanism of the cleaning conveyor line, and to transfer the basket on the first flipping mechanism to the silicon wafer blocking mechanism.

8. The silicon wafer cleaning apparatus of claim 7, wherein The wafer insertion device includes a first conveying mechanism for transporting silicon wafers and a lifting mechanism disposed at the end of the first conveying mechanism. The lifting mechanism is connected to the frame of the silicon wafer blocking mechanism. The lifting mechanism is used to lift the silicon wafer blocking mechanism so that the silicon wafer on the first conveying mechanism is aligned with the placement slot in the flower basket placed in the receiving space.

9. The apparatus of claim 8 wherein, The wafer insertion device further includes a fragment detection mechanism disposed above the first conveying mechanism, the fragment detection mechanism being used to detect silicon wafers on the first conveying mechanism.

10. The apparatus for cleaning a silicon wafer as set forth in claim 9, wherein The fragment detection mechanism includes a detection bracket and an image acquisition unit mounted on the detection bracket. The image acquisition unit is used to detect silicon wafers on the first conveying mechanism.

11. The apparatus for cleaning a silicon wafer as set forth in claim 9, wherein The wafer insertion device also includes a worktable, and the first conveying mechanism is mounted on the worktable. The first conveying mechanism includes a first transmission belt assembly, a second transmission belt assembly, and a third transmission belt assembly arranged sequentially along the silicon wafer transport direction. At least a portion of the second transmission belt assembly is located downstream of the fragment detection mechanism. The second transmission belt assembly is rotatably mounted on the worktable and has a first rotation position and a second rotation position. A waste bin is provided below the end of the second transmission belt assembly. In the first rotational position, the end of the second transmission belt assembly is close to the starting end of the third transmission belt assembly, so as to transport the qualified silicon wafers onto the third transmission belt assembly. When the second drive belt assembly is in the second rotation position, the end of the second drive belt assembly is lower than the third drive belt assembly, so as to transport the defective silicon wafers detected by the fragment detection mechanism into the waste bin.

12. The silicon wafer cleaning apparatus of claim 11, wherein A rotation drive unit is also installed on the workbench. The starting end of the second transmission belt assembly is rotatably connected to the workbench, and the end of the second transmission belt assembly is connected to the rotation drive unit. The rotation drive unit is used to drive the end of the second transmission belt assembly to rotate, so that the second transmission belt assembly switches between a first rotation position and a second rotation position.

13. The silicon wafer cleaning apparatus of claim 12, wherein The second transmission belt assembly includes a base, and a drive shaft and a driven shaft rotatably mounted on the base. A second conveyor belt for transporting silicon wafers is connected between the drive shaft and the driven shaft. A drive motor is provided on the worktable. The drive shaft is rotatably connected to the worktable and drively connected to the drive motor. The drive shaft is located at the starting end of the second transmission belt assembly, and the driven shaft is located at the ending end of the second transmission belt assembly. The portion of the base near the driven shaft is connected to a rotation drive unit; and / or, The rotation drive unit is a cylinder, the cylinder body is rotatably connected to the worktable, and the piston rod of the cylinder is rotatably connected to the base.

14. The silicon wafer cleaning apparatus of claim 8, wherein The insert device also includes a worktable and an air knife mechanism mounted on the worktable. The first conveying mechanism is mounted on the worktable, and at least part of the air knife mechanism is located above the first conveying mechanism, with the air outlet of the air knife mechanism facing the first conveying mechanism.

15. The apparatus for cleaning a silicon wafer of claim 7, wherein, The wafer insertion device further includes a worktable, a wafer slitting mechanism, and a first conveying mechanism for transporting silicon wafers. The first conveying mechanism is located on the worktable, which has a loading trough located below the starting end of the first conveying mechanism. Along the silicon wafer transport direction, the wafer slitting mechanism is located upstream of the starting end of the first conveying mechanism, with a portion of it situated within the loading trough. The loading trough is used to accommodate stacked silicon wafer groups, and the wafer slitting mechanism is used to slit the stacked silicon wafer groups and transport the slitted individual silicon wafers to the first conveying mechanism.

16. The silicon wafer cleaning apparatus of claim 15, wherein The loading trough is equipped with a silicon wafer conveying mechanism for transporting silicon wafer assemblies. The slicing mechanism includes a slicing conveying motor, a vertical conveying component, a transition conveying component, and a slicing liquid spray head located on at least one side of the silicon wafer conveying mechanism within the loading trough. The slicing conveying motor is drivenly connected to the vertical conveying component and the transition conveying component. The starting end of the vertical conveying component is adjacent to the ending end of the silicon wafer conveying mechanism, the starting end of the transition conveying component is adjacent to the ending end of the vertical conveying component, and the ending end of the transition conveying component is adjacent to the starting end of the first conveying mechanism. The slicing liquid spray head is used to spray liquid onto the silicon wafers on the silicon wafer conveying mechanism to slice the silicon wafers.

17. The silicon wafer cleaning equipment according to claim 16, characterized in that, The vertical conveying assembly includes a vertical base, vertical drive rollers mounted on the vertical base, a vertical conveyor belt pulsatorically connected to the vertical drive rollers, and a suction cup structure mounted on the vertical base. The suction cup structure has an air intake port. The vertical conveyor belt has a plurality of through-holes spaced apart, and the suction holes communicate with the air intake port to adsorb the silicon wafer onto the vertical conveyor belt; and / or, The transition conveyor assembly includes a transition base, a transition drive roller rotatably mounted on the transition base, and a transition conveyor belt that is drively connected to the transition drive roller.

18. The silicon wafer cleaning apparatus of claim 16, wherein A pressure roller is provided above the starting end of the transition conveying assembly and the end of the vertical conveying assembly. The pressure roller cooperates with the transition conveying assembly and the vertical conveying assembly to clamp the silicon wafer; and / or, The slicing mechanism further includes an auxiliary blowing assembly, which includes an air blowing head. The auxiliary blowing assembly is mounted above the vertical conveying assembly and / or the transition conveying assembly, and the air blowing head faces the vertical conveying assembly and / or the transition conveying assembly, so that the silicon wafer is attached to the vertical conveying assembly and / or the transition conveying assembly.

19. The apparatus of claim 7 wherein, The robotic arm mechanism includes a support frame, an X-axis displacement assembly slidably mounted on the support frame, a Y-axis displacement assembly disposed on the X-axis displacement assembly, a Z-axis displacement assembly disposed on the Y-axis displacement assembly, and an electric gripper disposed on the Z-axis displacement assembly. The X-axis displacement assembly drives the Y-axis displacement assembly to move along the X direction, the Y-axis displacement assembly drives the Z-axis displacement assembly to move along the Y direction, and the Z-axis displacement assembly drives the electric gripper to move along the Z direction. The electric gripper is used to grip a flower basket; and / or, The first flipping mechanism includes a first flipping seat and a first flipping drive unit. The first flipping seat has a first abutment surface and a second abutment surface, which are used to abut against the two sides adjacent to the flower basket. The first flipping seat is rotatably mounted on the washing conveyor line. The first flipping drive unit is drively connected to the first flipping seat to drive the first flipping seat to rotate; and / or, The second flipping mechanism includes a second flipping seat and a second flipping drive unit. The second flipping seat has a third abutting surface and a fourth abutting surface, which are used to abut against the two sides adjacent to the flower basket. The second flipping seat is rotatably mounted on the flower basket conveyor line. The second flipping drive unit is connected to the second flipping seat in a transmission connection to drive the second flipping seat to rotate.

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