Dust extraction equipment and laser processing equipment

Abstract

This application relates to the field of laser processing technology, providing a dust extraction device and laser processing equipment. The dust extraction device, applied to circuit board processing, includes a dust extraction pipe and a flow guide channel. The dust extraction pipe is located on the light-emitting side of the laser processing head, and has a light-transmitting opening and a dust extraction inlet arranged opposite to and connected to each other. The light-transmitting opening is adjacent to the laser processing head, and the dust extraction inlet is adjacent to the processing area formed by the laser processing head. The flow guide channel is connected to the light-transmitting opening and is used to form an air curtain covering the light-transmitting opening on the light-emitting side of the laser processing head. This application can effectively improve dust extraction efficiency, prevent processing byproducts such as dust from contaminating the laser processing head, thereby improving processing quality.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, and in particular to a dust extraction device and a laser processing equipment. Background Technology

[0002] Laser processing equipment is an industrial device that uses a high-energy laser beam generated by a laser processing head to precisely process materials. It is widely used in the field of circuit board processing.

[0003] However, during the processing, dust and other processing byproducts will permeate the area around the processing area, contaminating or even damaging the laser processing head and affecting the processing quality. Utility Model Content

[0004] The purpose of this application is to provide a dust extraction device and laser processing equipment, which aims to solve the problem of pollution from processing by-products such as dust in existing laser processing processes.

[0005] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0006] According to a first aspect of the embodiments of this application, a dust extraction device is provided, applied to circuit board processing, comprising:

[0007] A dust extraction duct is provided on the light-emitting side of the laser processing head. The dust extraction duct has a light-transmitting opening and a dust extraction inlet that are arranged opposite to each other and connected. The light-transmitting opening is adjacent to the laser processing head, and the dust extraction inlet is adjacent to the processing area formed by the laser processing head.

[0008] A flow guiding channel, which is connected to the light-transmitting port, is used to form an air curtain covering the light-transmitting port on the light-emitting side of the laser processing head.

[0009] In some embodiments, the flow channel is located upstream of the dust extraction inlet.

[0010] In some embodiments, the dust extraction device further includes:

[0011] An air blowing component, the air blowing component being oriented toward the processing area.

[0012] In some embodiments, the air blowing element acts on the edge of the processing area.

[0013] In some embodiments, the dust extraction device further includes:

[0014] A detection element is used to detect the wind speed in the processing area in order to adjust the blowing speed and / or blowing angle of the blowing element according to the detected wind speed.

[0015] In some embodiments, the dust extraction device further includes:

[0016] A buffer seat is provided, which covers the light-transmitting port and supports the laser processing head. The buffer seat is provided with the flow guiding channel and also with a light-transmitting channel communicating with the light-transmitting port.

[0017] In some embodiments, the buffer seat includes:

[0018] A first seat body, which covers the light-transmitting opening, and the first seat body is provided with a first light-transmitting channel;

[0019] The second base is movably disposed on the first base in a direction close to or away from the light-transmitting opening and is used to support the laser processing head. The second base is provided with a second light-transmitting channel.

[0020] The first seat and / or the second seat are provided with the flow guiding channel; the light transmission channel includes the first light transmission channel and the second light transmission channel.

[0021] In some embodiments, the buffer seat further includes an elastic element disposed between the first seat body and the second seat body;

[0022] And / or, the buffer seat further includes a guide post, which is disposed between the first seat body and the second seat body for guiding the movement of the second seat body.

[0023] In some embodiments, the dust extraction duct includes:

[0024] The first conduit is located on the light-emitting side of the laser processing head, and the first conduit is provided with the light-transmitting port and the dust extraction port;

[0025] The second pipe has one end connected to one end of the first pipe, and the other end of the second pipe is provided with a dust extraction outlet. The flow area of ​​the interface between the second pipe and the first pipe is smaller than the flow area of ​​the dust extraction outlet.

[0026] According to a second aspect of the present application, a laser processing apparatus is provided, comprising: a laser processing head and a dust extraction device as described above, wherein the dust extraction device is used to extract processing byproducts generated in the processing area formed by the laser processing head.

[0027] The beneficial effects of the dust extraction device and laser processing equipment provided in this application are as follows: This application uses a dust extraction pipe located on the light-emitting side of the laser processing head. The dust extraction pipe has a light-transmitting opening and a dust extraction inlet arranged opposite to each other and connected. The light-transmitting opening is adjacent to the laser processing head, and the dust extraction inlet is adjacent to the processing area formed by the laser processing head. This ensures the normal transmission path of the laser beam generated by the laser processing head and effectively captures processing by-products such as dust generated in the processing area. Furthermore, external airflow can be introduced through the guide channel to form a protective air curtain covering the light-transmitting opening on the light-emitting side of the laser processing head, providing isolation and protection to prevent processing by-products such as dust from contaminating the laser processing head through the light-transmitting opening. Therefore, this application, through the dual-channel design of the dust extraction pipe and the guide channel, can achieve efficient dust extraction while preventing processing by-products such as dust from contaminating the laser processing head, thereby improving processing quality. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 A schematic diagram of the dust extraction device provided in the embodiments of this application from one perspective;

[0030] Figure 2 This is a structural cross-sectional view of the dust extraction device provided in the embodiments of this application;

[0031] Figure 3 for Figure 2 Enlarged view of a portion at point A;

[0032] Figure 4 This is another structural schematic diagram of the dust extraction device provided in the embodiments of this application.

[0033] The following are the labeling elements in the figure:

[0034] 1. Dust extraction duct; 2. Flow guide channel; 3. Laser processing head; 4. Light transmission port; 5. Dust extraction inlet;

[0035] 6. Workpiece to be processed; 7. Air blowing component; 8. Processing area; 9. Inspection component; 10. Mounting base;

[0036] 11. Card slot; 12. Buffer seat; 13. Light transmission channel; 14. First seat body; 15. Second seat body;

[0037] 16. First light-transmitting channel; 17. Second light-transmitting channel; 18. Elastic element; 19. First conduit;

[0038] 20. Second pipe; 21. Dust extraction outlet; 22. Butt joint; 23. Pipe body; 24. Joint;

[0039] 25. Second rack. Detailed Implementation

[0040] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0041] In the description of the embodiments of this application, it should be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0042] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0043] In the embodiments of this application, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0044] During laser processing (such as cutting, drilling, and welding), the high-energy laser beam generated by the laser processing head acts on the surface of the workpiece, producing a large amount of fine particulate dust and other processing byproducts. If these byproducts are not removed in time, they can easily adhere to the optical components (such as focusing lenses) of the laser processing head, leading to a decrease in laser transmission efficiency and even causing overheating or damage to the optical components. Furthermore, the accumulation of processing byproducts in the processing area can cause uneven processing, hole diameter deviations, and welding defects, thus reducing processing quality. Therefore, this application provides a dust extraction device for laser processing of circuit boards. The device efficiently extracts dust through a dust extraction pipe and forms a protective air curtain on the light-emitting side of the laser processing head through a flow guide channel, providing isolation and protection to prevent processing byproducts from contaminating the laser processing head without affecting the laser beam transmission path, thereby improving processing quality.

[0045] In some embodiments, refer to Figures 1 to 4 As shown, this application provides a dust extraction device, including: a dust extraction pipe 1 and a flow guiding channel 2. The dust extraction pipe 1 is located on the light-emitting side of a laser processing head 3, and has a light-transmitting opening 4 and a dust extraction inlet 5 arranged opposite to and connected to each other. The light-transmitting opening 4 is adjacent to the laser processing head 3, and the dust extraction inlet 5 is adjacent to the processing area 8 formed by the laser processing head 3. The flow guiding channel 2 is connected to the light-transmitting opening 4 and is used to form an air curtain covering the light-transmitting opening 4 on the light-emitting side of the laser processing head 3.

[0046] The laser processing head 3 is the core component of the laser processing equipment. It primarily emits a high-energy-density laser beam and precisely projects it onto the workpiece (such as a PCB board) through lenses or other optical elements. The emitting side of the laser processing head 3 can be understood as the side where the laser beam ultimately leaves the laser processing head 3 and acts on the workpiece surface. The processing area 8 can be understood as the location where the laser processing head 3 acts on the workpiece 6, specifically the area within a certain range around the laser beam's focal point. Within this area, the laser energy is concentrated, causing physical changes in the material (such as melting and evaporation), thereby enabling operations such as cutting and drilling.

[0047] The dust extraction duct 1 is located on the light-emitting side of the laser processing head 3. It ensures that the laser beam can be transmitted unobstructed from the laser processing head 3 to the workpiece 6 and effectively collects processing byproducts such as dust generated during processing. Specifically, the dust extraction duct 1 can be connected to a negative pressure device (not shown in the figure). This device creates a negative pressure environment inside the dust extraction duct 1, generating sufficient suction at the dust extraction inlet 5 to draw in processing byproducts such as dust. The specific type of negative pressure device is not particularly limited in this application; for example, it can be a fan, a vacuum cleaner, etc. The dust extraction duct 1 has a light-transmitting opening 4 and a dust extraction inlet 5 on both sides. The light-transmitting opening 4 is located on the side closer to the laser processing head 3 to ensure the laser beam can pass through unobstructed. The dust extraction inlet 5 is arranged opposite the light-transmitting opening 4, near the processing area 8. Its function is to facilitate the unobstructed passage of the laser beam and to draw in processing byproducts such as dust generated during laser processing into the dust extraction duct 1, thereby avoiding impact on the laser processing head 3 and maintaining a clean working environment. It is understandable that the light-transmitting port 4 and the dust extraction port 5 are located in the path of the laser beam, so that the laser beam can pass smoothly through the entire dust extraction pipe 1 and be accurately projected onto the workpiece 6 to be processed, thus realizing laser processing.

[0048] The flow channel 2 is connected to the light-transmitting port 4 of the dust extraction pipe 1 and is close to the laser processing head 3. Gas (such as air, compressed air or inert gas) can be introduced into the dust extraction pipe 1 through the flow channel 2, thereby forming an isolation and protective air curtain covering the light-transmitting port 4 on the light-emitting side of the laser processing head 3, preventing processing by-products such as dust from contaminating the laser processing head 3 through the light-transmitting port 4.

[0049] The working principle of the dust extraction device provided in the embodiments of this application is described below, which generally includes:

[0050] Upon initiation of processing, the laser processing head 3 emits a high-energy laser beam. This beam passes sequentially through the light-transmitting openings 4 and the dust-collecting inlet 5 on both sides of the dust extraction pipe 1, projecting onto the surface of the workpiece 6. The workpiece 6 undergoes physical changes upon heating (e.g., drilling), simultaneously generating a large amount of processing byproducts such as dust. These byproducts are drawn into the dust extraction pipe 1 under the negative pressure of the dust-collecting inlet 5. Furthermore, under this negative pressure, the flow guide channel 2 directs external airflow into the dust extraction pipe 1, forming an air curtain covering the light-transmitting openings 4 on the light-emitting side of the laser processing head 3, preventing the processing byproducts from contaminating the laser processing head 3 through the light-transmitting openings 4.

[0051] Therefore, the dust extraction device provided in this application embodiment, through the dual-channel design of dust extraction pipe 1 and flow guiding channel 2, can improve dust extraction efficiency, effectively protect the laser processing head 3, and thus improve processing quality.

[0052] In some embodiments, refer to Figure 2 and Figure 3As shown, the flow channel 2 is located on the upstream side of the dust extraction inlet 5.

[0053] Here, "upstream side" can be understood as the direction of the flow guide channel 2 relative to the main airflow (i.e., the airflow of processing by-products such as dust entering through the dust extraction inlet 5) within the dust extraction duct 1. This design allows the air curtain formed by the flow guide channel 2 to not only isolate processing by-products but also act as an auxiliary airflow, flowing towards the main airflow entering through the dust extraction inlet 5. This guides and accelerates the main airflow, avoiding reverse interference, enhancing airflow consistency, and creating a synergistic effect. This improves the transmission efficiency of processing by-products as they continue flowing along the dust extraction duct 1 after entering through the dust extraction inlet 5, thus effectively improving dust extraction efficiency.

[0054] In some embodiments, refer to Figure 1 As shown, the dust extraction device also includes an air blowing component 7, which faces the processing area 8 of the laser processing head 3.

[0055] The main function of the air blowing component 7 is to provide directional auxiliary airflow to blow air towards the processing area 8 during the processing. This airflow can disturb the air field, helping to lift and disperse processing byproducts such as dust, making them easier to capture by the dust extraction pipe 1, thereby improving collection efficiency and processing quality. The specific type of air blowing component 7 is not particularly limited in this application; for example, it can be a nozzle, air knife, or other similar device.

[0056] It should be noted that this application allows for the selection of whether to activate the air blowing component 7 based on the processing quality. Specifically, when the processing quality is found to be substandard, the air blowing component 7 can be activated to spray gas into the processing area 8, disturbing the surrounding airflow and preventing processing byproducts such as dust from depositing on the workpiece surface. This helps to more thoroughly remove processing byproducts and reduce quality problems caused by processing byproduct residues. In other words, activating the air blowing component 7 can improve processing quality. Conversely, when the processing quality is detected to be satisfactory, the air blowing component 7 can be deactivated. This facilitates the collection of processing byproducts, ensuring cleanliness, and also saves energy.

[0057] In one example, the characterization parameter of processing quality can include the roundness of the hole during laser drilling. When the roundness of the hole is greater than 95%, the processing quality meets the standard; otherwise, it does not. Specifically, the roundness of the hole can be detected by a detection device (such as an optical sensor, 3D scanner, etc.) during or after processing. The data detected by the detection device (not shown in the figure) can be transmitted to the controller (not shown in the figure). The controller compares the actual detected roundness with the roundness of the preset standard. If the detected actual roundness is less than 95%, the controller automatically activates the air blowing component 7 to adjust the airflow environment, raise and disperse the dust deposited on the workpiece surface, so that the dust extraction pipe 1 can more thoroughly remove the dust in the hole, thereby improving the processing accuracy of the hole; otherwise, it indicates that the processing is successfully completed, and the air blowing component 7 is not activated.

[0058] In another example, for the scenario of laser drilling micro-holes in a PCB board, the aperture of the micro-holes can be 30-70 micrometers. The processing quality can be characterized by the aperture. In this case, the activation of the air blowing device 7 can be selected based on the thickness of the dielectric layer of the PCB board. Specifically, when the dielectric layer thickness of the PCB board is greater than 50 micrometers, it indicates a thicker board, making it difficult to achieve the required aperture processing quality. In this case, the air blowing device 7 can be activated, and the gas flow rate in the processing area 8 can be 15 m / s. When the dielectric layer thickness of the PCB board is 20-50 micrometers, it indicates a thinner board, making it easier to achieve the required aperture processing quality. In this case, the air blowing device 7 can be deactivated, and only the dust extraction pipe 1 operates. In this case, the gas flow rate in the processing area 8 can be 10 m / s.

[0059] Of course, parameters such as hole flatness and depth can also be used to characterize the processing quality, and the specific parameters can be adjusted according to actual needs.

[0060] Therefore, the embodiments of this application can select whether to activate the air blowing component 7 according to different processing tasks and quality standards, making the entire dust extraction device more flexible and adaptable to diverse processing needs.

[0061] In some embodiments, refer to Figure 1 and Figure 2 As shown, the air blowing component 7 acts on the edge of the processing area 8.

[0062] In this embodiment, the air blowing component 7 is not directly aligned with the laser beam focal point (i.e., the center of the processing area), but rather faces the edge of the processing area 8, blowing air from the edge of the processing area 8. This design reduces interference with the laser beam path and induces the flow of processing byproducts such as dust during the processing. Combined with the dust extraction inlet 5 located near the processing area 8, these blown-out processing byproducts can be captured more efficiently, thereby improving dust extraction efficiency and processing quality.

[0063] Taking laser drilling as an example: when the roundness of the PCB board hole is detected to be lower than the set standard (such as 95%), it is judged that the processing quality is not up to standard. At this time, the controller automatically starts the air blowing component 7. The air blowing component 7 blows clean air from the edge of the processing hole, pushes the surrounding dust away from the processing surface, and assists the dust extraction pipe 1 to suck it in, making the processing environment cleaner and significantly improving the quality of the subsequently drilled holes.

[0064] Therefore, the embodiments of this application, through the edge blowing design of the processing area 8, can achieve efficient dust removal and improve processing quality without interfering with the laser processing process.

[0065] In some embodiments, the number of air blowing elements 7 is set to multiple, and the multiple air blowing elements 7 are evenly distributed around the edge of the processing area 8.

[0066] At least two air blowing components 7 can be provided, each with an independent air blowing port, all facing the edge of the processing area 8. This multi-point air blowing design allows the airflow to form a relatively uniform air pressure field around the entire processing area 8, avoiding dead zones. Furthermore, processing byproducts such as dust often exhibit a diffuse distribution during laser processing. Multiple air blowing components 7 blowing simultaneously or at different times from different directions can more comprehensively push these byproducts towards the dust extraction inlet 5, effectively preventing backflow or deposition on the workpiece surface. This uniform air blowing design, combined with the dust extraction inlet 5 located near the processing area 8, forms a composite dust extraction mode of "blowing from the outside in and sucking from the bottom up," effectively improving dust extraction efficiency and reducing the time processing byproducts remain suspended in the air.

[0067] In other embodiments, the air blowing component 7 is provided with a plurality of air blowing ports, which are evenly distributed around the edge of the processing area 8.

[0068] Unlike the embodiments described above, in this application embodiment, one air blowing element 7 is equipped with multiple air blowing ports, which can also achieve multi-point air blowing. Furthermore, compared to using multiple independent air blowing elements 7, the design of a single air blowing element 7 simplifies the structure of the dust extraction device and reduces costs.

[0069] In some embodiments, the air blowing element 7 is provided with multiple air inlets. Preferably, there are two air inlets. This design can improve the consistency between the middle and edge flow velocities of the airflow blown out by the air blowing element 7, thereby improving the uniformity of the airflow blown out by the air blowing element 7 and thus improving the dust extraction effect.

[0070] In some embodiments, refer to Figure 4 As shown, the dust extraction device also includes a detection element 9, which is used to detect the wind speed in the processing area 8, so as to adjust the blowing speed and / or blowing angle of the blowing element 7 according to the detected wind speed.

[0071] The detection element 9 can be a wind speed measuring device such as an anemometer or wind speed meter. The detection element 9 can include one or more measuring points, which can be the center of the processing area 8 or its surrounding area. When there is only one measuring point, the measured wind speed is the wind speed value of that single measuring point; when there are multiple measuring points, the measured wind speed can be the average wind speed of multiple measuring points. Specific settings can be adjusted according to actual needs. As an example, the dust extraction duct 1 can be connected to the mounting base 10 via screws or other fasteners. The mounting base 10 has a slot 11, in which the detection element 9 is snapped. This detachable design facilitates quick installation and removal of the detection element 9.

[0072] The detection element 9 is mainly used to monitor the wind speed in the processing area 8 and adjust the airflow velocity and / or blowing angle of the air blowing element 7 through feedback control to ensure stable airflow and prevent the escape of processing by-products such as dust. The airflow velocity of the air blowing element 7 can be adjusted by regulating the gas flow rate, pressure, or solenoid valve opening in the air path (not shown in the figure). The blowing angle can be dynamically adjusted by driving the air blowing element 7 to move through a rotating mechanism (not shown in the figure). The blowing angle can be understood as the angle between the air blowing element 7 and the processing area 8. When the blowing angle of the air blowing element 7 is gentler, i.e., the air blowing element 7 is more parallel to the processing area 8, less airflow is blown towards the processing area 8, and the airflow disturbance is smaller. When the blowing angle of the air blowing element 7 is more perpendicular to the processing area 8, more airflow is blown towards the processing area 8, and the airflow disturbance is greater.

[0073] The specific control process of the detection component 9 in this application is described below, which roughly includes: The detection component 9 continuously monitors the wind speed in the processing area 8 and obtains the real-time wind speed value. The measured wind speed value is then sent to the controller. The controller compares the measured wind speed value with a preset wind speed value (e.g., 5 m / s). If the measured wind speed value exceeds the preset wind speed value, it indicates that the current airflow disturbance is too strong, which will lead to dust dispersion. At this time, the controller can automatically reduce the blowing speed of the blowing component 7 (reduce the air supply pressure or reduce the air supply volume) or reduce the blowing angle based on the deviation between the measured wind speed value and the preset wind speed value, making the blowing angle more gradual and changing the airflow direction to reduce disturbance, so that the wind speed at the wind speed measurement point does not exceed the preset wind speed. This indicates that the blowing has not caused dust to escape from the dust extraction range of the dust extraction inlet 5, and the entire flow field is convergent, i.e., the flow field convergence requirement is met. It can be understood that "flow field convergence" means that within a specific area, the airflow velocity distribution tends to be stable, and the local wind speed does not exceed the set safety range, thereby avoiding dust dispersion caused by airflow turbulence.

[0074] Therefore, by introducing the detection element 9 to control the air blowing element 7, the embodiments of this application can effectively prevent dust from escaping, improve dust extraction efficiency and cleanliness, and thus improve processing quality.

[0075] In some embodiments, refer to Figure 3 As shown, the flow area of ​​the dust extraction inlet 5 is larger than that of the light transmission opening 4.

[0076] During processing, the laser beam generated by the laser processing head 3 passes through the light-transmitting opening 4 and the dust extraction inlet 5, projecting onto the surface of the workpiece 6 to form the processing area 8. Therefore, the processing area 8 does not exceed the light-transmitting opening 4, nor does it exceed the larger flow area of ​​the dust extraction inlet 5. Due to the larger flow area of ​​the dust extraction inlet 5, most of the air and dust will be drawn into the dust extraction pipe 1 through this larger inlet, improving the dust extraction effect. This also ensures that the processing area 8 is within the dust extraction area of ​​the dust extraction inlet 5; that is, the larger dust extraction inlet 5 can cover the entire processing area 8, ensuring that the dust generated during processing is kept within the dust extraction area and quickly captured, thereby reducing dust dispersion. Furthermore, when the air blowing nozzle of the air blowing component 7 faces the edge of the processing area 8, the airflow from the nozzle is also within the dust extraction area of ​​the dust extraction inlet 5. In this way, the airflow from the air blowing component 7 helps guide the dust towards the dust extraction inlet 5, further improving the dust extraction efficiency and effect.

[0077] In some embodiments, refer to Figures 1 to 4 As shown, the dust extraction device also includes: a buffer seat 12, which covers the light-transmitting port 4 and is used to support the laser processing head 3. The buffer seat 12 is provided with a flow guiding channel 2, and the buffer seat 12 is also provided with a light-transmitting channel 13 that connects to the light-transmitting port 4.

[0078] A buffer seat 12 is positioned between the laser processing head 3 and the light-transmitting opening 4 of the dust extraction duct 1, serving to support the laser processing head 3. Specifically, when the laser processing head 3 moves or is impacted by external force and falls onto the buffer seat 12, the buffer seat 12 absorbs some of the energy, preventing direct collision and damage to the laser processing head 3, thus ensuring its stability during operation. During normal use, the laser processing head 3 should be kept as close as possible to the buffer seat 12 (e.g., a distance of 2mm), with the buffer seat 12 tightly covering the light-transmitting opening 4. This enhances the airtightness of the overall structure. Due to this enhanced airtightness, most of the airflow will enter the dust extraction duct 1 from the dust extraction inlet 5 in the adjacent processing area 8, reducing the loss of ineffective airflow and thus improving the dust extraction speed and effect.

[0079] Furthermore, the flow channel 2 is integrated into the buffer seat 12 to guide external air to form an air curtain under negative pressure, protecting the laser processing head 3 from contamination by processing byproducts such as dust. In addition, the light-transmitting channel 13 in the buffer seat 12 allows the laser beam generated by the laser processing head 3 to pass smoothly and be accurately projected onto the workpiece surface through the light-transmitting port 4 and the dust extraction port 5 without affecting the laser processing process.

[0080] Therefore, the buffer seat 12 in this embodiment can ensure the normal operation of the laser processing process, improve dust extraction efficiency, prevent the laser processing head 3 from being damaged by collision, and extend its service life.

[0081] In some embodiments, refer to Figure 3 As shown, the flow area of ​​the dust extraction inlet 5 is larger than that of the flow channel 2.

[0082] The dust extraction inlet 5 is located on the side of the dust extraction duct 1 near the processing area 8, and is used to capture dust generated during laser processing. The flow area of ​​the dust extraction inlet 5 is relatively larger than that of the guide channel 2. As the main airflow channel, it can handle a higher airflow rate and quickly absorb a large amount of processing byproducts such as dust generated during processing, thereby improving dust extraction efficiency.

[0083] The flow channel 2 is formed on the buffer seat 12 and connected to the light-transmitting port 4. The flow area of ​​the flow channel 2 is relatively small compared to the dust extraction inlet 5. As an auxiliary airflow channel, a small amount of air enters through this channel and forms an air curtain covering the light-transmitting port 4 on the light-emitting side of the laser processing head 3. This protects the laser processing head 3 from contamination by processing by-products and can also guide and accelerate the main airflow (i.e., the airflow of dust and other processing by-products entering through the dust extraction inlet 5), thereby effectively improving the dust extraction efficiency.

[0084] Therefore, by designing the flow area of ​​the dust extraction inlet 5 to be larger than that of the flow guide channel 2, the embodiment of this application achieves optimized airflow distribution, which not only improves dust extraction efficiency but also forms an effective air curtain protection.

[0085] In some embodiments, refer to Figure 3 As shown, the buffer seat 12 includes: a first seat body 14 and a second seat body 15. The first seat body 14 covers the light-transmitting opening 4 and has a first light-transmitting channel 16. The second seat body 15 is movably disposed on the first seat body 14 in a direction close to or away from the light-transmitting opening 4 and is used to support the laser processing head 3. The second seat body 15 has a second light-transmitting channel 17. The first seat body 14 and / or the second seat body 15 have a flow guiding channel 2. The light-transmitting channel 13 includes the first light-transmitting channel 16 and the second light-transmitting channel 17.

[0086] The first seat 14 directly covers the light-transmitting opening 4 and is the foundation of the entire buffer seat 12. The first light-transmitting channel 16 within the first seat 14 allows the laser beam to pass through. The second seat 15 can be moved and adjusted along the direction close to or away from the light-transmitting opening 4, thus buffering and supporting the laser processing head 3 and preventing direct collision between the laser processing head 3 and the light-transmitting opening 4, which could cause damage. The second light-transmitting channel 17 within the second seat 15 aligns with the first light-transmitting channel 16 within the first seat 14, ensuring that the laser beam can pass smoothly and reach the surface of the workpiece 6. The flow guide channel 2 can be located on one side of the first seat 14 or one side of the second seat 15. In particular, when both the first seat 14 and the second seat 15 are equipped with flow guide channels 2, a multi-layered air curtain distributed vertically can be formed, further enhancing the protective effect of the laser processing head 3.

[0087] In some embodiments, refer to Figure 3 As shown, the buffer seat 12 also includes an elastic element 18, which is disposed between the first seat body 14 and the second seat body 15.

[0088] The specific type of the elastic element 18 in this application is not particularly limited. For example, it can be a spring, a rubber pad, a shock absorber, or other components. Furthermore, multiple elastic elements 18 can be provided (e.g., two), respectively disposed on both sides of the buffer seat 12, to improve the smoothness of the movement of the second seat 15. When the laser processing head 3 is impacted or vibrates and falls onto the second seat 15, the elastic element 18 can absorb this energy, thereby preventing damage to the laser processing head 3. When the laser processing head 3 detaches from the second seat 15, the elastic element 18 can push the second seat 15 back to its initial position.

[0089] Therefore, by providing an elastic element 18 inside the buffer seat 12, this embodiment of the application not only enhances the buffering capacity of the buffer seat 12, but also realizes the automatic reset function, thereby effectively protecting the laser processing head 3 and extending its service life.

[0090] In some embodiments, refer to Figure 3 As shown, the buffer seat 12 also includes a guide post (not shown in the figure), which is located between the first seat body 14 and the second seat body 15 and is used to guide the movement of the second seat body 15.

[0091] The guide post can be formed on the first base 14, in which case the second base 15 can be provided with a guide channel adapted to the guide post; alternatively, the guide post can be formed on the second base 15, in which case the first base 14 can be provided with a guide channel adapted to the guide post, and the guide post passes through the guide channel. When the second base 15 is pressed and moves, the guide post can move along the guide channel, ensuring that the second base 15 moves smoothly and avoiding deviation or tilting, thereby improving the stability of the second base 15 during movement.

[0092] In some embodiments, refer to Figures 1 to 4 As shown, the dust extraction pipe 1 includes: a first pipe 19 and a second pipe 20. The first pipe 19 is located on the light-emitting side of the laser processing head 3 and has a light-transmitting port 4 and a dust extraction inlet 5. One end of the second pipe 20 is connected to one end of the first pipe 19, and the other end of the second pipe 20 is provided with a dust extraction outlet 21. The flow area of ​​the interface 22 between the second pipe 20 and the first pipe 19 is smaller than the flow area of ​​the dust extraction outlet 21.

[0093] The first pipe 19 is located between the laser processing head 3 and the workpiece 6. A light-transmitting opening 4 corresponding to the laser processing head 3 can be provided on the upper side of the first pipe 19 for the laser beam to pass through without affecting the laser processing process. A dust extraction inlet 5 corresponding to the workpiece 6 can be provided on the lower side of the first pipe 19 to capture dust generated during laser processing. One end of the second pipe 20 is connected to one end of the first pipe 19, and the other end is provided with a dust extraction outlet 21. The dust extraction outlet 21 can be connected to a negative pressure device (such as a fan) to provide sufficient suction to draw dust and other processing byproducts from the dust extraction inlet 5 into the first pipe 19 and discharge them through the second pipe 20.

[0094] It is important to emphasize that the flow area of ​​the interface 22 between the first pipe 19 and the second pipe 20 is smaller than the flow area of ​​the dust extraction outlet 21. For example, the first pipe 19 can be cuboid in shape, and the second pipe 20 includes a pipe body 23 and an interface 24. The pipe body 23 can be a quadrangular prism with a first end and a second end. The first end of the pipe body 23 is connected to one end of the first pipe 19, and the second end is connected to the interface 24. The cross-sectional area of ​​the pipe body 23 gradually increases from the first end to the second end. The end of the interface 24 away from the pipe body 23 is provided with a dust extraction outlet 21. The interface 22 between the pipe body 23 and the first pipe 19 can be rectangular in shape, and the interface 24 can be cylindrical in shape. Correspondingly, the dust extraction outlet 21 is circular in shape, and the rectangular interface 22 is inlaid within the circular dust extraction outlet 21.

[0095] This embodiment of the application increases the local wind speed under the same flow conditions by reducing the flow area of ​​the interface 22. According to Bernoulli's equation, a smaller cross-sectional area leads to a higher flow velocity, forming a stronger suction force, effectively capturing dust particles, and thus improving dust extraction efficiency. Furthermore, since the flow area of ​​the interface 22 is smaller than that of the dust extraction outlet 21, the airflow can be more evenly distributed after entering the second pipe 20, avoiding turbulence or uneven flow caused by changes in cross-section, which is beneficial to improving the overall airflow stability and wind speed consistency.

[0096] The laser processing equipment provided in the embodiments of this application will continue to be described below. The specific type of laser processing equipment in this application is not particularly limited; for example, it can be a laser drilling machine, a laser cutting machine, etc.

[0097] In some embodiments, refer to Figure 1 As shown in the illustration, this application provides a laser processing apparatus, including a laser processing head 3 and a dust extraction device as described in the above embodiment. The dust extraction device is used to extract processing byproducts generated in the processing area 8 formed by the laser processing head 3. Processing byproducts include, but are not limited to, dust, particulate matter, etc.

[0098] The laser processing equipment may also include a stage (not shown in the figure) and a fixed frame. The stage is used to stably place the workpiece 6 to be processed. The fixed frame includes a first frame (not shown in the figure) and a second frame 25 set on the stage. The first frame is used to install the laser processing head 3, and the second frame 25 is used to install the dust extraction pipe 1. Specifically, the first pipe 19 of the dust extraction pipe 1 is fixedly connected to the second frame 25, thereby realizing the integration of the equipment.

[0099] Since the laser processing equipment provided in this application includes the dust extraction device of any of the above embodiments, it has all the technical effects of the dust extraction device of any of the above embodiments, and will not be described in detail here.

[0100] The above are merely preferred embodiments of this application and are not intended to limit the embodiments of this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the embodiments of this application should be included within the protection scope of the embodiments of this application.

Claims

1. A dust extraction device, characterized in that, Used in circuit board manufacturing, including: A dust extraction duct is provided on the light-emitting side of the laser processing head. The dust extraction duct has a light-transmitting opening and a dust extraction inlet that are arranged opposite to each other and connected. The light-transmitting opening is adjacent to the laser processing head, and the dust extraction inlet is adjacent to the processing area formed by the laser processing head. A flow guiding channel, which is connected to the light-transmitting port, is used to form an air curtain covering the light-transmitting port on the light-emitting side of the laser processing head.

2. The dust extraction device according to claim 1, characterized in that, The flow channel is located upstream of the dust extraction inlet.

3. The dust extraction device according to claim 1, characterized in that, The dust extraction device also includes: An air blowing component, the air blowing component being oriented toward the processing area.

4. The dust extraction device according to claim 3, characterized in that, The air blowing component acts on the edge of the processing area.

5. The dust extraction device according to claim 3, characterized in that, The dust extraction device also includes: A detection element is used to detect the wind speed in the processing area in order to adjust the blowing speed and / or blowing angle of the blowing element according to the detected wind speed.

6. The dust extraction device according to any one of claims 1 to 5, characterized in that, The dust extraction device also includes: A buffer seat is provided, which covers the light-transmitting opening and is used to support the laser processing head. The buffer seat is provided with the flow guiding channel and also with a light-transmitting channel communicating with the light-transmitting opening.

7. The dust extraction device according to claim 6, characterized in that, The buffer seat includes: A first seat body, which covers the light-transmitting opening, and the first seat body is provided with a first light-transmitting channel; The second base is movably disposed on the first base in a direction close to or away from the light-transmitting opening and is used to support the laser processing head. The second base is provided with a second light-transmitting channel. The first seat and / or the second seat are provided with the flow guiding channel; the light transmission channel includes the first light transmission channel and the second light transmission channel.

8. The dust extraction device according to claim 7, characterized in that, The buffer seat also includes an elastic element, which is disposed between the first seat body and the second seat body; And / or, the buffer seat further includes a guide post, which is disposed between the first seat body and the second seat body for guiding the movement of the second seat body.

9. The dust extraction device according to any one of claims 1 to 5, characterized in that, The dust extraction pipe includes: The first conduit is located on the light-emitting side of the laser processing head, and the first conduit is provided with the light-transmitting port and the dust extraction port; The second pipe has one end connected to one end of the first pipe, and the other end of the second pipe is provided with a dust extraction outlet. The flow area of ​​the interface between the second pipe and the first pipe is smaller than the flow area of ​​the dust extraction outlet.

10. A laser processing device, characterized in that, include: A laser processing head and a dust extraction device according to any one of claims 1 to 9, the dust extraction device being used to extract processing byproducts generated in the processing area formed by the laser processing head.

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