A transfer device for memory chip processing

Abstract

This utility model relates to a transfer device for memory chip processing, belonging to the field of chip processing technology. The transfer device includes: a transfer box, support columns, collars, and a protective door. Multiple collars are movably fitted onto the surface of the support columns, and a connecting block is fixedly connected between every two support columns. The protective door frame has a silicone sealing strip embedded in its edge and is connected to the main body of the transfer box via hinges. The support columns are solid cylindrical structures, with their bottoms fixed to the bottom surface of the limiting groove and their tops extending to be flush with the top of the transfer box. The inner wall of the collars has an annular protrusion, achieving axial positioning through friction. A connecting block, made of aluminum alloy, is fixedly connected between every two support columns. The mating structure between the limiting groove and the support column ensures connection strength. The annular protrusion design of the collars can withstand lateral loads, and the grid layout of the connecting blocks increases the overall structural rigidity, effectively reducing the risk of chip damage due to collisions during transfer.

Description

Technical Field

[0001] This utility model relates to the field of chip processing technology, and in particular to a transfer device for memory chip processing. Background Technology

[0002] An electronic chip is a miniature electronic device or component. It is made by using certain processes to fabricate the transistors, resistors, capacitors, inductors, and other components required in a circuit, as well as the interconnection of wiring, on a small piece or several small pieces of semiconductor wafers or dielectric substrates. Due to the needs of the production process, electronic chips need to be transported from one process to another at any time. During the transportation process, transfer devices are required.

[0003] In the electronic chip manufacturing process, the transfer device uses a customized bracket to achieve compatible storage of chips of various specifications. Electronic chip transfer usually adopts multiple devices to reduce the number of transfers. However, when the devices are densely arranged, collisions between them can easily cause internal chip vibrations, leading to an increased risk of damage. Utility Model Content

[0004] Therefore, it is necessary to provide a transfer device for memory chip processing to address the problem that electronic chip operation usually adopts multi-device collaborative transfer to reduce the number of times, but when densely arranged, collisions between devices can easily cause internal chip oscillations, leading to an increased risk of damage.

[0005] A transfer device for memory chip processing includes: a transfer box, wherein multiple transfer boxes are provided, and protective doors are movably connected to all four sides of the multiple transfer boxes, and limit grooves are formed on all four sides of the top of the transfer box.

[0006] The support column is provided in multiple ways, and one end of each of the multiple support columns is located inside the limiting groove and is fixedly connected to the top outer wall of the transfer box;

[0007] The collar is provided in multiple ways, and each collar is movably fitted onto the surface of the support column. A connecting block is fixedly connected between every two supports columns.

[0008] In one embodiment, the plurality of transport boxes are placed at equal intervals and at the same height.

[0009] In one embodiment, the surfaces of the plurality of pillars are provided with annular grooves, and the inner sides of the connecting block are slidably connected to limit sliders. One end of each of the limit sliders is inserted into the interior of the annular groove and is movably engaged with the outer wall of the pillar.

[0010] In one embodiment, a pressure block is movably inserted into the middle of the inner wall of the connecting block, and guide posts are fixedly connected to both sides of the pressure block. Guide plates are fixedly connected to the sides of the two limiting sliders that are close to each other, and the two guide plates are movably sleeved on the surface of the guide posts through the waist holes opened inside.

[0011] In one embodiment, a support column is fixedly connected to the inner wall of the connecting block, and one output end of the support column is fixedly connected to the lower part of the pressure block.

[0012] In one embodiment, a second limiting block is fixedly connected to both sides of the pressure block, and one side of the second limiting block is in contact with the inner wall of the connecting block.

[0013] In one embodiment, a first limiting block is fixedly connected to both sides of the two limiting sliders, and the side of the two first limiting blocks that is far apart from each other slides along the inner wall of the connecting block.

[0014] In one embodiment, each of the two limiting sliders has an arc-shaped groove on one side, and the limiting slider is in contact with the outer wall of the support column through the arc-shaped groove on one side.

[0015] Beneficial effects

[0016] 1. The mechanical locking structure achieves rapid positioning and vibration-resistant locking through the precise cooperation of the wedge-shaped slider and the ring groove. The grid layout of the aluminum alloy connecting block improves the overall rigidity. Combined with the multiple buffering mechanism of the silicone sealing strip, the vibration frequency during transportation is reduced. This structure significantly reduces the risk of collision damage during transportation and ensures high-quality transportation of memory chips.

[0017] 2. When the pressure block is pushed by an external force, the support column can absorb the peak stress through the deformation buffer mechanism. The wedge-shaped section of the second limiting block and the guide groove on the inner wall of the connecting block form a precise fit to prevent the guide column and the waist hole of the guide plate from eccentric wear. Through the multi-dimensional linkage of the support column, pressure block and limiting block, the shock resistance of the mechanical locking structure is increased. With the buffer of the silicone sealing strip, the chip breakage rate is reduced. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0020] Figure 2 This is a schematic diagram of the collar structure of this utility model;

[0021] Figure 3 This is a schematic diagram of the internal structure of the connecting block of this utility model;

[0022] Figure 4 This is a schematic diagram of the guide plate structure of this utility model;

[0023] Figure 5 This is a schematic diagram of the overall structure of this utility model in use.

[0024] Figure label:

[0025] 100. Transfer box; 101. Protective door; 102. Limiting groove; 103. Support column; 104. Ring groove; 200. Collar; 201. Connecting block; 202. Pressing block; 203. Support column; 204. Limiting slider; 205. First limiting block; 206. Guide plate; 207. Second limiting block; 208. Guide column. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0027] The following is combined Figures 1-5 This invention describes a transfer device for processing memory chips.

[0028] In one embodiment, a transfer device for memory chip processing includes: a transfer box 100, a support column 103, and a collar 200. Multiple transfer boxes 100 are provided, and protective doors 101 are movably connected to all four sides of each transfer box 100. Limiting grooves 102 are provided around the top of each transfer box 100. Multiple support columns 103 are provided, and one end of each support column 103 is located inside the limiting groove 102 and fixedly connected to the top outer wall of the transfer box 100. Multiple collars 200 are provided, and each collar 200 is movably fitted onto the surface of the support column 103. A connecting block 201 is fixedly connected between every two support columns 103.

[0029] In this embodiment, the edge of the protective door 101 frame is inlaid with a silicone sealing strip and is connected to the main body of the transfer box 100 through a hinge. The support column 103 is a solid cylindrical structure, with its bottom fixed to the bottom surface of the limiting groove 102 and its top extending to be flush with the top of the transfer box 100.

[0030] The inner wall of the collar 200 has an annular protrusion, which achieves axial positioning through friction. A connecting block 201 is fixedly connected between every two pillars 103. The connecting block 201 is made of aluminum alloy. The matching structure of the limiting groove 102 and the pillar 103 ensures the connection strength. The annular protrusion design of the collar 200 can withstand lateral loads. The grid layout of the connecting block 201 improves the rigidity of the overall structure and effectively reduces the risk of chip damage caused by collisions during transportation.

[0031] like Figure 1 , Figure 2 and Figure 3 As shown, multiple transfer boxes 100 are placed at equal intervals and at the same height. Multiple support columns 103 have annular grooves 104 on their surfaces. Limiting sliders 204 are slidably inserted into both sides of the inner side of the connecting block 201. One end of each limiting slider 204 is inserted into the inner side of the annular groove 104 and is movably engaged with the outer wall of the support column 103. A pressure block 202 is movably inserted into the middle of the inner wall of the connecting block 201. Guide columns 208 are fixedly connected to both sides of the pressure block 202. Guide plates 206 are fixedly connected to the side of each limiting slider 204 that is close to each other. The two guide plates 206 are movably sleeved on the surface of the guide column 208 through the waist holes opened inside.

[0032] In this embodiment, multiple transfer boxes 100 form a modular transportation unit through standardized design. The equidistant arrangement and consistent height of the multiple transfer boxes 100 ensure the overall structural balance. The annular groove 104 on the surface of the support column 103 and the limiting slider 204 embedded in the connecting block 201 constitute a precision positioning structure.

[0033] When the collar 200 slides along the support column 103 to the target height, the pressure block 202 is pushed by the external force to the guide column 208, which drives the limit sliders 204 on both sides to expand outward synchronously through the waist hole structure of the guide plate 206, so that the end of the slider is stuck into the ring groove 104 to form a mechanical lock. This wedge locking mechanism not only ensures the structural rigidity, but also realizes the function of quick assembly and disassembly.

[0034] Furthermore, the waist hole design of the guide plate 206 allows the limit slider 204 to self-adjust within the range, effectively compensating for manufacturing tolerances. When disassembly is required, only the external constraint of the pressure block 202 needs to be released. Through the multi-point support layout, the lateral load is evenly distributed to the frame of the transfer box 100, in conjunction with the buffering effect of the silicone sealing strip.

[0035] like Figure 1 , Figure 3 and Figure 4As shown, a support column 203 is fixedly connected to the inner wall of the connecting block 201. One output end of the support column 203 is fixedly connected to the lower part of the pressure block 202. Second limiting blocks 207 are fixedly connected to both sides of the pressure block 202. One side of the second limiting block 207 is in contact with the inner wall of the connecting block 201.

[0036] In this embodiment, the support column 203 adopts a hollow steel tube telescopic structure, which is composed of two steel tubes with different diameters that are movably inserted. A spring is installed inside the support column 203. The output end of the support column 203 is rigidly connected to the bottom of the pressure block 202 through threaded fasteners. The design allows the pressure block 202 to form a three-point support structure through the support column 203 when under force, effectively dispersing the vertical load. The upward extension and retraction of the support column 203 can make the pressure block 202 quickly reset. The linear contact structure between the second limiting block 207 and the inner wall of the connecting block 201 can reduce the sliding friction coefficient and ensure that the pressure block 202 maintains a low resistance state when moving axially.

[0037] When the pressure block 202 is pushed by an external force, the support column 203 can absorb the peak stress through the deformation buffer mechanism. The wedge-shaped section of the second limiting block 207 and the guide groove on the inner wall of the connecting block 201 form a precise fit to prevent the guide column 208 and the waist hole of the guide plate 206 from eccentric wear. Through the multi-dimensional linkage of the support column 203, the pressure block 202 and the limiting block, the shock resistance of the mechanical locking structure is increased. With the buffer of the silicone sealing strip, the chip breakage rate is reduced.

[0038] like Figure 1 , Figure 3 and Figure 4 As shown, two limiting sliders 204 are fixedly connected to two first limiting blocks 205 on both sides. The two first limiting blocks 205 slide along the inner wall of the connecting block 201 on the side that is far away from each other. An arc groove is opened on one side of each of the two limiting sliders 204. The limiting sliders 204 fit against the outer wall of the support column 103 through the arc groove on one side.

[0039] In this embodiment, the precise sliding fit between the first limiting block 205 and the inner wall of the connecting block 201 controls the lateral displacement of the limiting slider 204, effectively preventing angular deflection during the locking process. The arc-shaped groove design of the limiting slider 204 increases the contact area and evenly distributes the radial load of the support column 103 to the body of the limiting slider 204, thereby reducing the coefficient of sliding friction. When the mechanical locking structure is subjected to lateral impact, the wedge-shaped guide structure of the first limiting block 205 and the groove on the inner wall of the connecting block 201 form a secondary constraint, preventing the limiting slider 204 from undergoing unexpected displacement due to inertia. This multi-dimensional limiting mechanism works in conjunction with the elastic buffer structure of the support column 203, and with the buffering of the silicone sealing strip, ensures that the micro-environment vibration frequency during chip transportation remains low.

[0040] Working principle: During operation, the collar 200 slides along the support column 103 to the target height. The pressure block 202 is pushed by external force to the guide column 208, which drives the limit sliders 204 on both sides to expand outward synchronously through the waist hole structure of the guide plate 206, so that the ends of the sliders are locked into the ring groove 104 of the support column 103 to form a mechanical lock.

[0041] The hollow steel tube structure of the support column 203 and the internal spring form an elastic buffer structure, which distributes the vertical load to the frame of the transfer box 100 through the multi-point support structure. At the same time, the wedge-shaped section of the second limiting block 207 is precisely matched with the guide groove on the inner wall of the connecting block 201 to prevent the guide component from eccentric wear.

[0042] The first limiting block 205 controls the displacement accuracy of the limiting slider 204 by linearly sliding against the inner wall of the connecting block 201. The arc groove design of the limiting slider 204 increases the contact area of ​​the support column 103 to reduce radial stress. In the locked state, the grid layout of the connecting block 201 and the double buffer of the silicone sealing strip reduce the transport vibration frequency, keep the chip breakage rate stable at a low level, and achieve efficient and reliable transport protection.

[0043] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A transfer device for processing a memory chip, characterized by comprising: include: The transfer box (100) is provided in multiple ways. Each of the multiple transfer boxes (100) is movably connected with a protective door (101) around its four sides. Each of the transfer boxes (100) has a limit groove (102) on its top four sides. The support column (103) is provided in multiple ways, and one end of each of the multiple support columns (103) is located inside the limiting groove (102) and is fixedly connected to the top outer wall of the transfer box (100); Multiple collars (200) are provided, and each collar (200) is movably sleeved on the surface of the support column (103). A connecting block (201) is fixedly connected between every two supports (103).

2. The transfer device for processing memory chips according to claim 1, wherein The multiple transfer boxes (100) are placed at equal intervals, and the multiple transfer boxes (100) are at the same height.

3. The transfer device for processing memory chips according to claim 1, wherein The surfaces of the multiple support columns (103) are provided with annular grooves (104). The inner sides of the connecting block (201) are slidably connected to limit sliders (204). One end of the two limit sliders (204) is inserted into the interior of the annular grooves (104) and is movably engaged with the outer wall of the support column (103).

4. The transfer device for processing memory chips according to claim 3, wherein A pressure block (202) is movably inserted into the middle of the inner wall of the connecting block (201). Guide posts (208) are fixedly connected to both sides of the pressure block (202). Guide plates (206) are fixedly connected to the side of the two limiting sliders (204) that are close to each other. The two guide plates (206) are movably sleeved on the surface of the guide posts (208) through the waist holes opened inside.

5. The transfer device for processing memory chips according to claim 4, wherein The inner wall of the connecting block (201) is fixedly connected to a support column (203), and one output end of the support column (203) is fixedly connected to the lower part of the pressure block (202).

6. The transfer device for processing memory chips according to claim 5, wherein The pressure block (202) is fixedly connected to two sides by a second limiting block (207), and one side of the second limiting block (207) is in contact with the inner wall of the connecting block (201).

7. The transfer device for memory chip processing according to claim 6, characterized in that, Both sides of the two limiting sliders (204) are fixedly connected to a first limiting block (205), and the two first limiting blocks (205) slide along the inner wall of the connecting block (201) on the side that is far away from each other.

8. The transfer device for processing memory chips according to claim 3, wherein Both of the limiting sliders (204) have an arc-shaped groove on one side, and the limiting sliders (204) are in contact with the outer wall of the support column (103) through the arc-shaped groove on one side.

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