Passive water-cooling plate and water-cooling testing device

Abstract

This utility model relates to a water-cooling testing device, disclosing a passive water-cooled plate and a water-cooling testing device for passive thermal cycling testing of IGBT devices. It includes a passive water-cooled plate body, which comprises a water-cooled plate flow channel layer and a water-cooled plate heating layer. The flow channel layer of the water-cooled plate has a first guide cavity and a second guide cavity. An S-shaped first guide plate unit is placed in the first guide cavity, and an S-shaped second guide plate unit is placed in the second guide cavity. This utility model forms two independent but interconnected circulation loops by setting the S-shaped guide plate units. This design increases the water channel length, prolongs the contact time between the coolant and the hot and cold plates, and improves heat exchange efficiency. At the same time, the S-shaped structure makes the coolant distribution more uniform inside the hot and cold plates, effectively avoiding the problem of localized overheating.

Description

Technical Field

[0001] This utility model relates to a water-cooled testing device, and more particularly to a passive water-cooled plate and a water-cooled testing device. Background Technology

[0002] In the field of power electronics, IGBT (Insulated Gate Bipolar Transistor) devices are widely used in various converters, such as electric vehicles, industrial automation equipment, and renewable energy systems. IGBT devices generate heat during operation, requiring effective heat dissipation measures to ensure their performance and reliability.

[0003] Traditional air cooling methods have limited heat dissipation efficiency and cannot meet the heat dissipation requirements of high-power-density IGBT devices. Therefore, water cooling technology has emerged. Water cooling removes heat through circulating coolant, resulting in higher heat dissipation efficiency.

[0004] However, when conducting thermal cycling tests on IGBT devices, a single water channel design is typically used, resulting in poor temperature uniformity between the hot and cold plates and low cooling efficiency. Summary of the Invention

[0005] This invention addresses the problem that existing passive water-cooled testing devices typically employ a single water channel design, resulting in poor temperature uniformity between the hot and cold plates and low cooling efficiency. It provides a passive water-cooled plate and a water-cooled testing device.

[0006] To solve the above-mentioned technical problems, the present invention provides a solution through the following technical method:

[0007] A passive water-cooled plate is used in passive thermal cycling tests of IGBT devices. It includes a passive water-cooled plate body, which includes a water-cooled plate flow channel layer and a water-cooled plate heating layer. The flow channel layer of the water-cooled plate is provided with a first flow guiding cavity and a second flow guiding cavity. An S-shaped first flow guiding plate unit is placed in the first flow guiding cavity, and an S-shaped second flow guiding plate unit is placed in the second flow guiding cavity.

[0008] By incorporating S-shaped baffle units, two independent yet interconnected circulation loops are formed. This design increases the water channel length, prolongs the contact time between the coolant and the hot and cold plates, and improves heat exchange efficiency. Simultaneously, the S-shaped structure ensures a more uniform distribution of coolant within the hot and cold plates, effectively preventing localized overheating.

[0009] Preferably, the first guide vane unit includes a first guide vane and a second guide vane; and both the first guide vane and the second guide vane are S-shaped guide vanes.

[0010] The double S-shaped structure allows for a more uniform distribution of coolant within the hot and cold plates, effectively preventing localized overheating.

[0011] Preferably, the second deflector unit includes a third deflector and a fourth deflector; and both the third and fourth deflectors are S-shaped deflectors.

[0012] Preferably, the passive water-cooled plate body has several fixing holes on the side near the heating layer of the water-cooled plate for fixing the water-cooled plate.

[0013] Preferably, the passive water-cooled plate body has several heating through holes on the side near the heating layer of the water-cooled plate for placing heating rods; the heating through holes are evenly distributed in a row.

[0014] Preferably, the water-cooled plate body has several first temperature measuring holes in the middle of the upper and lower surfaces to control the temperature of the heating layer of the water-cooled plate.

[0015] Preferably, a second temperature measuring hole is provided in the middle of the heating through hole where the heating rod is placed for controlling the temperature of the heating layer of the water-cooled plate.

[0016] As a preferred option, the water-cooled plate body is made of copper, and the hot and cold plates are made of copper with a high thermal conductivity, with special surface treatment to enhance heat conduction performance.

[0017] To address the aforementioned technical problems, this application also provides a passive water-cooling testing device, which includes the aforementioned passive water-cooling plate.

[0018] This utility model, by adopting the above technical solution, has significant technical effects:

[0019] This invention utilizes an S-shaped guide vane unit to form two independent yet interconnected circulation loops. This design increases the water channel length, prolongs the contact time between the coolant and the hot and cold plates, and improves heat exchange efficiency. Simultaneously, the S-shaped structure ensures a more uniform distribution of coolant within the hot and cold plates, effectively preventing localized overheating.

[0020] The hot and cold plates of this invention are made of copper with a high thermal conductivity, and the surface is specially treated to enhance the heat conduction performance. Attached Figure Description

[0021] Figure 1 This is a structural diagram of the water-cooled plate with the heating layer facing upwards, according to this utility model.

[0022] Figure 2 This is a structural diagram of the water-cooled plate with the flow channel layer facing upwards.

[0023] Among them, 1—passive water-cooled plate body, 2—water-cooled plate flow channel layer, 3—water-cooled plate heating layer, 4—fixing hole, 5—heating through hole, 6—first temperature measuring hole, 7—second temperature measuring hole, 21—first flow guide cavity, 22—second flow guide cavity, 23—first flow guide plate, 24—second flow guide plate, 25—third flow guide plate, 26—fourth flow guide plate. Detailed Implementation

[0024] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments.

[0025] Example 1

[0026] A passive water-cooled plate is used in passive thermal cycling tests of IGBT devices. It includes a passive water-cooled plate body 1, which includes a water-cooled plate flow channel layer 2 and a water-cooled plate heating layer 3. The flow channel layer of the water-cooled plate is provided with a first flow guiding cavity 21 and a second flow guiding cavity 22. An S-shaped first flow guiding plate 23 unit is placed in the first flow guiding cavity 21, and an S-shaped second flow guiding plate 24 unit is placed in the second flow guiding cavity 22.

[0027] By incorporating S-shaped baffle units, two independent yet interconnected circulation loops are formed. This design increases the water channel length, prolongs the contact time between the coolant and the hot and cold plates, and improves heat exchange efficiency. Simultaneously, the S-shaped structure ensures a more uniform distribution of coolant within the hot and cold plates, effectively preventing localized overheating.

[0028] The passive water-cooled plate body 1 has several fixing holes 4 on the side near the water-cooled plate heating layer 3 for fixing the water-cooled plate.

[0029] The passive water-cooled plate body 1 has several heating through holes 5 on the side near the water-cooled plate heating layer 3 for placing heating rods; the heating through holes 5 are evenly distributed in a row.

[0030] Several first temperature measuring holes 6 are provided in the middle of the upper and lower surfaces of the water-cooled plate body 1 to control the temperature of the water-cooled plate heating layer 3. The first temperature measuring holes 6 are used to mount thermocouple top devices to detect the shell temperature of the devices and realize temperature control.

[0031] The water-cooled plate body 1 is made of copper, and the hot and cold plates are made of copper with high thermal conductivity. The surface is specially treated to enhance the heat conduction performance.

[0032] Example 2

[0033] A passive water-cooled plate is used in passive thermal cycling tests of IGBT devices. It includes a passive water-cooled plate body 1, which includes a water-cooled plate flow channel layer 2 and a water-cooled plate heating layer 3. The flow channel layer of the water-cooled plate is provided with a first flow guiding cavity 21 and a second flow guiding cavity 22. An S-shaped first flow guiding plate 23 unit is placed in the first flow guiding cavity 21, and an S-shaped second flow guiding plate 24 unit is placed in the second flow guiding cavity 22. The first flow guiding plate 23 unit includes a first flow guiding plate 23 and a second flow guiding plate 24. Both the first flow guiding plate 23 and the second flow guiding plate 24 are S-shaped flow guiding plates.

[0034] The passive water-cooled plate body 1 has several fixing holes 4 on the side near the water-cooled plate heating layer 3 for fixing the water-cooled plate.

[0035] The passive water-cooled plate body 1 has several heating through holes 5 on the side near the water-cooled plate heating layer 3 for placing heating rods; the heating through holes 5 are evenly distributed in a row.

[0036] The water-cooled plate body 1 has several first temperature measuring holes 6 in the middle of its upper and lower surfaces to control the temperature of the water-cooled plate heating layer 3.

[0037] The double S-shaped structure allows for a more uniform distribution of coolant within the hot and cold plates, effectively preventing localized overheating.

[0038] The second guide vane unit 24 includes a third guide vane 25 and a fourth guide vane 26; and both the third guide vane 25 and the fourth guide vane 26 are S-shaped guide vanes.

[0039] The water-cooled plate body 1 is made of copper, and the hot and cold plates are made of copper with high thermal conductivity. The surface is specially treated to enhance the heat conduction performance.

[0040] Example 3

[0041] Based on the above embodiment, this embodiment also provides a second temperature measuring hole 7 in the middle of the heating through hole 5 where the heating rod is placed, for controlling the temperature of the water-cooled plate heating layer 3. The second temperature measuring hole 7 is used to place a thermocouple to collect the over-temperature protection temperature.

[0042] Example 4

[0043] Based on the above embodiments, this embodiment is a passive water-cooled testing device, which includes the aforementioned passive water-cooled plate.

Claims

1. A passive water-cooled plate for use in passive thermal cycling testing of IGBT devices, comprising a passive water-cooled plate body, characterized in that, The passive water-cooled plate body includes a water-cooled plate flow channel layer and a water-cooled plate heating layer; the flow channel layer of the water-cooled plate is provided with a first flow guide cavity and a second flow guide cavity; the first flow guide cavity is provided with an S-shaped first flow guide plate unit, and the second flow guide cavity is provided with an S-shaped second flow guide plate unit.

2. The passive water-cooling plate of claim 1, wherein The first deflector unit includes a first deflector and a second deflector; and both the first deflector and the second deflector are S-shaped deflectors.

3. The passive water-cooling plate of claim 1, wherein The second deflector unit includes a third deflector and a fourth deflector; and both the third and fourth deflectors are S-shaped deflectors.

4. The passive water-cooling plate of claim 1, wherein The passive water-cooled plate body has several fixing holes on the side near the heating layer of the water-cooled plate for fixing the water-cooled plate.

5. A passive water-cooled plate according to claim 1, characterized in that, The passive water-cooled plate body has several heating through holes on the side near the heating layer of the water-cooled plate for placing heating rods; the heating through holes are evenly distributed in a row.

6. The passive water-cooling plate of claim 1, wherein Several primary temperature measuring holes are provided in the middle of the upper and lower surfaces of the water-cooled plate body to control the temperature of the heating layer of the water-cooled plate.

7. The passive water-cooling plate of claim 1, wherein A second temperature measuring hole is also provided in the middle of the heating through hole where the heating rod is placed, for controlling the temperature of the heating layer of the water-cooled plate.

8. The passive water-cooling plate of claim 1, wherein, The water-cooled plate is made of copper.

9. A passive water-cooled test device, characterized by Includes the passive water-cooled plate as described in any one of claims 1-8.

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