A carrier device and wafer testing equipment

Abstract

This application provides a carrier device and a wafer testing equipment, relating to the field of semiconductor testing technology. The carrier device has a mounting window on its main body to accommodate probe cards and gas supply components. The main body contains a return gas channel, and the cavity wall of the mounting window has a gas return port connected to the return gas channel. The main body also includes a vacuum adsorption port connected to a vacuum device, which is connected to the gas return port via the return gas channel. When gas is blown out from the center of the probe card, opening the vacuum device creates a negative pressure in the return gas channel. The gas flows in the direction of the negative pressure, greatly reducing the pressure difference between the wafer surface and the warped bottom, avoiding the risk of wafer misalignment due to pressure difference. Simultaneously, due to the smaller air volume and lower air pressure, the increase and dissipation of gas inside the machine cavity are close, reducing the backflow of gas inside the machine cavity and minimizing the problem of contaminant particles being carried back to the wafer surface, thus improving cleanliness.

Description

Technical Field

[0001] This application relates to the field of semiconductor testing technology, and in particular to a carrier device and wafer testing equipment. Background Technology

[0002] In traditional technologies, wafer yield testing equipment mainly consists of a tester and a probe station. The tester is used to perform electrical testing; the probe station is used to hold the wafer and move it so that each die on the wafer comes into contact with the probes for electrical testing. The probe station mainly includes: a machine housing, a motion platform, a wafer carrier with heating function, an automatic loading and unloading robotic arm, and a probe card carrier.

[0003] During wafer testing, especially high-voltage testing, excessively high ambient humidity can cause air breakdown and sparking. Therefore, anti-sparking measures are necessary. Current anti-sparking measures involve introducing nitrogen gas into the probe card and blowing it out from the center of the probe card, filling the environment around the chip under test with nitrogen to disrupt the sparking conditions and prevent sparking even in abnormal testing environments. However, the flow of high-pressure nitrogen within the testing equipment can easily cause wafer displacement and can also carry contaminant particles from within the equipment to the wafer surface, affecting wafer cleanliness. Utility Model Content

[0004] The technical problem to be solved by this application is to provide a carrier device and a wafer testing equipment to overcome the problems of wafer displacement caused by large warping due to high-pressure nitrogen gas blown in in the conventional technology, as well as the deterioration of wafer cleanliness.

[0005] In a first aspect, this application proposes a support device, comprising:

[0006] The main body has an installation window for accommodating the air supply component mounted on the probe card;

[0007] The main body has a return air passage, and the cavity wall on the main body forming the mounting window has an air return port, which communicates with the return air passage;

[0008] The main body also includes a vacuum adsorption port connected to a vacuum device;

[0009] The vacuum adsorption port is connected to the gas path return port via the return gas channel. When the vacuum adsorption port is evacuated by the vacuum equipment, the gas supplied by the gas supply component flows sequentially from the gas path return port and the return gas channel to the vacuum adsorption port and then is discharged.

[0010] In one embodiment, the body includes a first panel and a second panel stacked opposite each other;

[0011] Both the first panel and the second panel have openings that form the mounting window, and there is a gap between the first panel and the second panel near the opening. The gap communicates with the inside of the opening to form the air return port and the return air passage. The first panel and the second panel are sealed together on the side away from the opening.

[0012] In one embodiment, the outer periphery of the second panel is provided with a mounting groove, and an airtight adhesive strip is provided in the mounting groove to seal and connect the first panel and the second panel.

[0013] In one embodiment, the main body is provided with a plurality of protrusions, and the probe card is disposed on the protrusions.

[0014] In one embodiment, the probe card further includes a planar substrate fixedly connected to the gas supply component, the planar substrate being fixedly connected to the main body, and the gas supply component being provided with test probes.

[0015] In one embodiment, the wall of the gas return port has a chamfered structure.

[0016] In one embodiment, there are multiple gas return ports, and each gas return port is evenly spaced around the mounting window.

[0017] In one embodiment, the gas return port is an annular opening that surrounds the mounting window.

[0018] In one embodiment, the main body is provided with a guide groove that runs through the main body, and the main body is provided with an air passage connector. The two ends of the guide groove are respectively connected to the air passage return port and the air passage connector.

[0019] Secondly, this application also proposes a wafer testing device, comprising:

[0020] shell;

[0021] The carrier device described in any one of the first aspects is disposed within the housing;

[0022] A probe card is mounted on the carrier device, and the probe card has a gas supply component and a test probe for electrical connection with the wafer under test. The test probe and the gas supply component's outlet are both located in the mounting window of the carrier device.

[0023] A vacuum device is connected to the vacuum adsorption port of the carrier device.

[0024] The aforementioned support device and wafer testing equipment have at least the following advantages:

[0025] The main body of the carrier device of this application has an installation window for accommodating the probe card and the gas supply component. The main body contains a return air channel, and the cavity wall of the installation window has a gas return port, which communicates with the return air channel. The main body also includes a vacuum adsorption port connected to a vacuum device. The vacuum adsorption port is connected to the gas return port via the return air channel. When the vacuum adsorption port is evacuated by the vacuum device, the gas supplied by the gas supply component flows sequentially from the gas return port and the return air channel to the vacuum adsorption port and then exits. When gas is blown out from the center of the probe card, opening the vacuum device creates a negative pressure in the return air channel. After passing the wafer surface, most of the gas flows towards the negative pressure direction, with only a small amount flowing into the machine cavity. This significantly reduces the pressure difference between the wafer surface and the warped bottom, avoiding the risk of wafer misalignment due to pressure difference. Simultaneously, due to the smaller air volume and lower air pressure, the increase and dissipation of gas within the machine cavity are close, reducing the backflow of gas within the machine cavity and minimizing the problem of contaminant particles being carried back to the wafer surface, thus improving cleanliness. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of a wafer yield testing device in traditional technology;

[0027] Figure 2 This is a top view of the main body in one embodiment;

[0028] Figure 3 This is a bottom view of the main body in one embodiment;

[0029] Figure 4 This is a schematic diagram of the structure of the support device in one embodiment;

[0030] Figure 5 This is a top view of the second panel in one embodiment;

[0031] Figure 6 for Figure 5 Side view.

[0032] Figure 7 This is a front view of the carrier device in one embodiment;

[0033] Figure 8 for Figure 7 A schematic diagram of the structure of E in the middle;

[0034] Figure 9 for Figure 7 Schematic diagram of the structure of H in the middle;

[0035] Figure 10 This is a schematic diagram of the structure of a wafer testing device in one embodiment.

[0036] Figure label:

[0037] 1. Probe card; 2. Probe station; 3. Housing; 4. Probe card carrier; 5. Wafer carrier; 6. Motion platform; 7. Carrier device; 8. Air supply component; 9. Air inlet; 10. Air outlet; 11. Main body; 12. Mounting window; 13. Air return port; 14. Vacuum adsorption port; 15. First panel; 16. Second panel; 17. Mounting slot; 18. Boss; 19. Air connection component; 20. Support component. Detailed Implementation

[0038] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0040] When using the terms “including,” “having,” and “comprising” as described herein, another component may be added unless explicitly qualifying terms such as “only,” “consisting of,” etc. are used. Unless otherwise stated, singular terms may include plural forms and should not be construed as having a quantity of one.

[0041] It should be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the scope of this application, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0042] In this application, unless otherwise expressly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a direct connection or an indirect connection through an intermediate medium, or they can refer to the internal connection of two elements or the interaction between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0043] Please see Figure 1 , Figure 1The diagram shows the structure of a conventional wafer yield testing device. Both the probe card 1 and the probe station 2 are housed within the casing 3. The probe station 2 includes a probe card support 4, a wafer support 5, and a motion platform 6. During testing, the wafer is adsorbed onto the wafer support 5. The motion platform 6, located below the wafer support 5, moves the wafer within a designated area. The probe card 1 is mounted on the probe card support 4 and includes an air inlet 9 and an air supply component 8 located at the center of the probe card 1. During testing, nitrogen gas enters through the air inlet 9 and is blown out from the air supply component 8 at the center of the probe card 1 onto the upper surface of the wafer, following the... Figure 1 The middle arrow indicates the recirculation inside the machine.

[0044] The applicant's analysis of the airflow field inside the testing equipment revealed that after high-pressure nitrogen gas is blown out by the gas supply unit 8, it diffuses outwards from the wafer surface. The current gas pressure is high directly below the probe and gradually decreases from the center of the probe outwards. Because the wafer holder 5 uses vacuum adsorption to hold the wafer, the relative fit between the warped wafer and the wafer holder 5 is poor. During wafer testing, a small gap exists between the wafer and the wafer holder 5, and this gap is open to the outside environment. Under this open state, a pressure difference exists between the gas pressure inside the gap below the wafer and the gas pressure on the wafer surface. This pressure difference causes the gap between the warped wafer and the wafer holder 5 to widen, and the wafer to shift. Furthermore, when the nitrogen gas diffuses from the wafer surface into the equipment, due to the relatively sealed internal structure, the gas will backflow, carrying contaminant particles from inside the equipment to the wafer surface, causing particle contamination and a decrease in cleanliness.

[0045] Based on this, the structure of the probe card carrier stage 4 has been improved. After the improvement, the gas blown out by the gas supply component 8 can be returned and discharged through a vacuum device, which reduces the gas pressure difference at the wafer, avoids the wafer and the carrier stage from shifting due to widening gap, and reduces particle contamination and improves cleanliness.

[0046] Please see Figure 2 and Figure 3 In one embodiment, this application provides a carrying device 7, comprising:

[0047] The main body 11 is used to carry the probe card 1.

[0048] Specifically, the probe card 1 has multiple test probes. When the probe card 1 is mounted on the main body 11, each test probe is electrically connected to the pads of the wafer under test. Further, the probe card 1 has a gas supply component 8, on which each test probe can be integrated. The gas supply component 8 includes an inlet 9 and an outlet 10. During wafer testing, gas (typically nitrogen) enters through the inlet 9 of the gas supply component 8 and exits through the outlet 10 onto the wafer surface.

[0049] Optionally, the probe card 1 also includes a planar substrate fixedly connected to the air supply component 8, and the planar substrate is fixedly connected to the main body 11.

[0050] The main body 11 has a mounting window 12 for accommodating the air supply component 8. With the above structure, when the probe card 1 is placed on the main body 11, the planar substrate abuts against the main body 11, and part of the air supply component 8 is located within the mounting window 12.

[0051] Please see Figure 4 The main body 11 has a return air passage, and the cavity wall of the main body 11 forming the mounting window 12 has a gas return port 13, which communicates with the return air passage. The main body 11 also includes a vacuum adsorption port 14 connected to a vacuum device, which communicates with the gas return port 13 via the return air passage.

[0052] Specifically, the return air channel is located inside the main body 11, with one end connected to the gas return port 13 and the other end connected to the vacuum adsorption port 14. With this structure, when a vacuum device is installed on the vacuum adsorption port 14, a negative pressure is generated in the return air channel when the vacuum adsorption port 14 is evacuated by the vacuum device. This causes the gas supplied by the gas supply component 8 to flow sequentially from the gas return port 13 and the return air channel to the vacuum adsorption port 14 and then be discharged.

[0053] Furthermore, the gas return port 13 is positioned near the installation window 12 of the gas supply component 8, so that the gas blown out by the gas supply component 8 returns at a closer position, thereby reducing the amount of gas escaping into the machine cavity.

[0054] The aforementioned carrier device 7, by incorporating a return air channel within its main body 11, connects to a vacuum device. When the gas supply component 8 blows gas onto the wafer surface, the vacuum device generates negative pressure within the return air channel. This gas flows into the vacuum device via the return air channel, reducing the pressure difference between the wafer surface and the warped bottom, thus avoiding the risk of wafer misalignment due to pressure differences. Furthermore, the gas return port 13, connected to the return air channel, is located near the mounting window 12 of the gas supply component 8. This allows the gas blown out by the gas supply component 8 to return at a closer location, thereby reducing the amount of gas escaping into the machine cavity, minimizing gas backflow within the machine cavity, reducing the problem of contaminant particles being carried back to the wafer surface, and improving cleanliness.

[0055] Please see Figure 4 Optionally, the main body 11 includes: a first panel 15 and a second panel 16.

[0056] The first panel 15 and the second panel 16 are stacked opposite each other. Both the first panel 15 and the second panel 16 have openings that form the mounting window 12. The first panel 15 and the second panel 16 are sealed together on the side opposite to the openings, and there is a gap between the first panel 15 and the second panel 16 near the openings. This gap communicates with the openings to form a gas return port 13 and a return air passage. It should be understood that the vacuum suction port 14 is located on the first panel 15. With the above structure, a sandwich cavity is formed between the first panel 15 and the second panel 16. This sandwich cavity constitutes the aforementioned return air passage, and the gap constitutes the aforementioned gas return port 13. When the probe card 1 is placed on the first panel 15 and passes through the opening, the gas blown out by the gas supply element 8 enters the sandwich cavity through the gap and is then discharged from the vacuum suction port 14 on the first panel 15.

[0057] For example, the two openings constituting the mounting window 12 are coaxial circular holes. This circular hole structure helps reduce airflow resistance, ensuring that the gas pressure in different directions is completely symmetrical, thereby guaranteeing pressure balance on the wafer surface.

[0058] Please see Figure 5 and Figure 6 , Figure 5 and Figure 6 The diagram shows the structure of the second panel 16. Optionally, the second panel 16 is provided with a plurality of support members 20 near the circular hole, and each support member 20 is evenly distributed around the circular hole. When the first panel 15 is placed on the second panel 16, each support member 20 contacts the first panel 15 to form the aforementioned gap.

[0059] Please see Figure 7 and Figure 8 Optionally, a mounting groove 17 is provided on the outer periphery of the second panel 16, and an airtight adhesive strip is provided in the mounting groove 17 to seal and connect the first panel 15 and the second panel 16. Using the above structure, the airtightness of the interlayer cavity can be guaranteed to a certain extent, improving the adsorption capacity of the vacuum equipment.

[0060] Please see Figure 8 Optionally, the main body 11 is provided with a plurality of protrusions 18, and the probe card 1 is disposed on the protrusions 18. Exemplarily, the protrusions 18 in this embodiment are disposed in the edge region. By adopting the above structure, the contact area between the main body 11 and the probe card 1 can be reduced, avoiding contact between the main body 11 and the pads on the probe card 1, which would affect the electrical characteristics of the wafer test.

[0061] Please see Figure 8 Optionally, the gas return port 13 has a chamfered structure on its port wall.

[0062] Specifically, the first panel 15 and the second panel 16 are separated by a gap near the circular hole. This gap serves as a gas return port connected to the return air passage. The wall of the gas return port is set as a chamfered surface that gradually converges along the gas flow direction, which reduces the separation and eddies caused by the airflow hitting the sharp edge, thereby allowing the gas to enter the return air passage more smoothly.

[0063] Optionally, there are multiple air return ports 13, and each air return port 13 is evenly spaced around the mounting window 12. Specifically, multiple gap holes can be formed along the outer periphery of the circular holes on the first panel 15 and the second panel 16, using the gap holes to connect the gap between the two panels to the external space. With the above structure, the symmetrical arrangement can form a radially symmetrical negative pressure around the mounting window 12, avoiding uneven air cushioning or probe warping caused by unilateral suction.

[0064] Optionally, the gas return port 13 is an annular opening surrounding the mounting window 12. Specifically, the first panel 15 and the second panel 16 are spaced apart at the outer periphery of the circular hole without a sealing separation structure, forming an annular opening between the first panel 15 and the second panel 16. Using this structure, the opening area of ​​the gas return port 13 can be maximized, and the annular structure is concentrically distributed. The pressure difference from the center of the mounting window 12 is nearly uniform at any angle. The annular opening blows the probe card 1 into the center and forms a complete closed loop with circumferential return, allowing the airflow to exit via the shortest path from any angle, eliminating corner stagnation areas, carrying away particulate contaminants, and significantly reducing the wafer surface contamination rate.

[0065] Optionally, the main body 11 is provided with a guide groove that runs through the main body 11, and the two ends of the guide groove are respectively connected to the gas return port 13 and the vacuum adsorption port 14.

[0066] Specifically, the guide channel is set on the inner wall of the main body 11 to guide the gas to the vacuum adsorption port 14, so as to avoid the gas from stagnating in the interlayer cavity and improve the reflux effect.

[0067] Please see Figure 2 and Figure 4 Optionally, the main body 11 is further provided with a gas path connector 19. One end of the gas path connector 19 is connected to a guide groove located inside the main body 11, and the other end is connected to a vacuum device to provide a gas passage. Exemplarily, there are two gas path connectors 19, symmetrically arranged on both sides of the main body 11. Further, each gas path connector 19 has two parallel circular through holes, and a connecting cavity is provided inside the gas path connector 19. The bottoms of the two circular through holes are connected through the connecting cavity to form an integrated gas passage. The vacuum device is mounted on the circular through holes. With the above structure, the impedance between the two through holes is consistent, and the gas automatically balances between the two holes, avoiding flow deviation problems. At the same time, the design of the gas path connector 19 also provides expandability and maintainability.

[0068] The following combination Figure 2-8 The working principle of the bearing device 7 in this application is explained in detail below:

[0069] After the wafer is placed on the wafer stage 5, the wafer stage 5 is moved by the motion platform 6 so that the wafer pads contact the test probes of the probe card 1. After the test starts, gas is introduced through the gas inlet 9 of the gas supply component 8 and blown out to the wafer surface through the gas outlet 10 of the gas supply component 8. At the same time, the vacuum setting provided on the gas path connector 19 is activated, and the blown gas passes sequentially through the gas path return port 13, the return groove, and the through hole of the gas path connector 19 around the gas outlet 10, and is finally discharged.

[0070] Please see Figure 10 In one embodiment, this application provides a wafer testing device, including: a housing 3, a carrier device 7, a probe card 1, and a vacuum device.

[0071] The carrier device 7 and the probe card 1 are housed inside the outer casing 3. The structure and working principle of the carrier device 7 are the same as those disclosed in the above embodiments, and will not be repeated here for the sake of brevity.

[0072] The probe card 1 is mounted on the carrier device 7, and the probe card 1 has an air supply component 8 and a test probe for electrical connection with the wafer under test. The test probe and the air outlet 10 of the air supply component 8 are both located in the mounting window 12 of the carrier device 7.

[0073] A vacuum device is connected to the vacuum adsorption port 14 of the carrier device 7.

[0074] When gas is blown out from the center of probe card 1, the vacuum equipment can create negative pressure in the return air channel. After passing the wafer surface, most of the gas flows in the direction of negative pressure, and only a small amount of gas flows into the machine cavity. This greatly reduces the pressure difference between the wafer surface and the warped bottom, avoiding the risk of wafer displacement caused by pressure difference. At the same time, due to the small air volume and low air pressure, the increase and dissipation of gas in the machine cavity are close, reducing the backflow of gas in the machine cavity and reducing the problem of contaminant particles being carried back to the wafer surface, thus improving cleanliness.

[0075] Please note that the above embodiments are for illustrative purposes only and do not imply any limitation on this application.

[0076] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0077] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0078] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A load bearing device, characterized by, include: The main body has an installation window for accommodating the air supply component mounted on the probe card; The main body has a return air passage, and the cavity wall on the main body forming the mounting window has an air return port, which communicates with the return air passage; The main body also includes a vacuum adsorption port connected to a vacuum device; The vacuum adsorption port is connected to the gas path return port via the return gas channel. When the vacuum adsorption port is evacuated by the vacuum equipment, the gas supplied by the gas supply component flows sequentially from the gas path return port and the return gas channel to the vacuum adsorption port and then is discharged.

2. The load bearing device of claim 1, wherein, The main body includes a first panel and a second panel that are stacked opposite to each other; Both the first panel and the second panel have openings that form the mounting window, and there is a gap between the first panel and the second panel near the opening. The gap communicates with the opening to form the air return port and the return air passage. The first panel and the second panel are sealed together on the side away from the opening.

3. The load bearing device of claim 2, wherein, The second panel has a mounting groove on its outer periphery, and an airtight adhesive strip is provided in the mounting groove to seal the first panel and the second panel together.

4. The load bearing device of claim 1, wherein, The main body is provided with multiple protrusions, and the probe card is disposed on the protrusions.

5. The load bearing device of claim 1, wherein, The probe card also includes a planar substrate fixedly connected to the gas supply component. The planar substrate is fixedly connected to the main body, and the gas supply component is provided with test probes.

6. The load bearing device of claim 1, wherein, The gas return port has a chamfered structure on its inlet wall.

7. The load bearing device of claim 6, wherein, The number of gas return ports is multiple, and each gas return port is evenly spaced around the installation window.

8. The load bearing device of claim 6, wherein, The gas return port is an annular opening that surrounds the mounting window.

9. The load bearing device of claim 1, wherein, The main body is provided with a guide groove that runs through the main body, and the main body is provided with an air passage connector. The two ends of the guide groove are respectively connected to the air passage return port and the air passage connector.

10. A wafer testing device, characterized in that, include: shell; The supporting device according to any one of claims 1-9 is disposed within the housing; A probe card is mounted on the carrier device, and the probe card has a gas supply component and a test probe for electrical connection with the wafer under test. The test probe and the gas supply component's outlet are both located in the mounting window of the carrier device. A vacuum device is connected to the vacuum adsorption port of the carrier device.

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