A circuit board soldering quality inspection device

Abstract

This utility model discloses a circuit board soldering quality inspection device, comprising: an excitation signal generation module, an interference module, a photodiode, and a signal testing module. When inspection is required, the interference module is positioned directly above the circuit board to be inspected, and an induction coil is arranged on the side of the circuit board facing the board with multiple solder pads. The excitation signal generation module is configured to output an excitation signal to the interference module. The interference module is configured to generate an induced magnetic field corresponding to the input excitation signal. The signal testing module is configured to collect the electromotive force generated by the multiple solder pads under the action of the induced magnetic field, and then collect the noise signal generated by the induced electromotive force acting on the multiple solder pads and the photodiode to determine the soldering quality. This utility model discloses a circuit board soldering quality inspection device that achieves soldering quality inspection in a non-contact manner, improving testing accuracy and reliability.

Description

Technical Field

[0001] This utility model relates to electronic component testing technology, and more specifically, to a circuit board soldering quality testing device. Background Technology

[0002] In the manufacturing process of printed circuit board assembly (PCBA) / flexible printed circuit (FPC), soldering is a key process for connecting electronic components to circuit boards, and its quality directly affects the stability and reliability of the entire electronic system.

[0003] In related technologies, the probe-type pressure short-circuit test method is often used to detect the soldering quality of PCBA / FPC circuit boards. This method requires that the number of probes corresponds one-to-one with the pads to be tested, and conduction detection is achieved through the contact between the probes and the pads during the test.

[0004] However, in practical applications, this method is prone to problems such as probe mis-contact and positioning deviation, which can cause unstable detection signals and thus affect the accuracy and reliability of the test. Utility Model Content

[0005] This utility model embodiment provides a circuit board soldering quality inspection device, including:

[0006] The system includes an excitation signal generation module, an interference module, and a signal testing module. The excitation signal generation module is connected to the interference module, and the signal testing module is connected to the circuit board under test. When it is necessary to test the soldering quality of the circuit board under test, the interference module is located directly above the circuit board under test, and an induction coil is arranged on the side facing the circuit board under test.

[0007] The excitation signal generating module is configured to output an excitation signal to the interference module;

[0008] The interference module is configured to generate an induced magnetic field corresponding to the obtained excitation signal using the deployed induction coils.

[0009] The signal testing module is configured to collect the electromotive force induced by multiple pads on the circuit board under test under the action of the induced magnetic field, and determine the soldering quality of the circuit board under test based on the collected electromotive force of the multiple pads.

[0010] This embodiment of the invention outputs an excitation signal to the interference module through an excitation signal generation module. The interference module, which is equipped with induction coils, generates an induced magnetic field. The signal testing module collects the electromotive force induced on multiple pads on the circuit board under test under the action of the induced magnetic field and determines the soldering quality accordingly. Therefore, the soldering quality of the circuit board under test is detected in a non-contact manner, improving the testing accuracy and reliability.

[0011] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of this invention can be realized and obtained by means of the structures particularly pointed out in the description and the drawings. Attached Figure Description

[0012] The accompanying drawings are provided to further understand the technical solution of this utility model and constitute a part of the specification. They are used together with the embodiments of this application to explain the technical solution of this utility model and do not constitute a limitation on the technical solution of this utility model.

[0013] Figure 1 This is a schematic diagram of the structure of a circuit board welding quality inspection device according to the present invention;

[0014] Figure 2 This is a schematic diagram of another circuit board welding quality inspection device according to the present invention;

[0015] Figure 3 This is a schematic diagram of the structure of another circuit board welding quality inspection device according to the present invention;

[0016] Figure 4 This is a schematic diagram of the structure of another circuit board welding quality inspection device according to the present invention;

[0017] Figure 5 This is a schematic diagram of the structure of another circuit board welding quality inspection device according to the present invention;

[0018] Figure 6 This is a schematic diagram of an induction coil arrangement according to the present invention;

[0019] Figure 7 This is a schematic diagram of another arrangement of the induction coil according to this utility model;

[0020] Figure 8 This is a structural schematic diagram of another circuit board welding quality inspection device according to the present invention. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be described in detail below with reference to the accompanying drawings. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be arbitrarily combined with each other.

[0022] In the manufacturing process of PCBA / FPC, soldering is a critical step in connecting electronic components to the circuit board, and its quality directly affects the stability and reliability of the entire electronic system. Common soldering defects include cold solder joints, short circuits, bridging, missing solder joints, solder joint misalignment, and poor wetting. If these defects are not detected and addressed in a timely manner, they may lead to abnormal functionality or even failure of the entire device.

[0023] The probe-based pressure-applied short-circuit test method is a commonly used testing method. This method requires preparing dozens to hundreds of probes and applying a bias voltage to the analog side of the analog-to-digital converter (ADC) to verify the ADC and its soldering quality with the photodiode (PD) pads. This method has some problems, especially regarding probe alignment. When the dimensional tolerances of the PCBA do not meet requirements, this can lead to inaccurate test results, affecting product quality assessment. Furthermore, this method, which achieves short-circuit testing by applying a bias voltage to the pads using probes, is not suitable for all products. For example, when the solder mask layer on the pad is higher than the pad itself, the short-circuit method may not be effectively implemented due to the influence of the solder mask layer. The probe-based pressure-applied short-circuit test method is summarized as follows:

[0024] 1. When the PCBA pads under test have a dense layout, many pads, and very close spacing, the high-density pad design leads to an exponential increase in the number of probes, and the precision requirements for miniaturized probe processing significantly increase manufacturing costs; 2. When the pad spacing is very close, probe testing cannot guarantee that the probes will contact the PCBA pads under test, which can easily lead to test misjudgments due to probe position deviation, resulting in certain test deviations; 3. Probe testing uses manual positioning, which has poor accuracy and cannot achieve automatic control to achieve precise positioning, resulting in a high retest rate; 4. When the solder mask layer on the pad is higher than the pad itself, the short-circuit method may not be effective.

[0025] Therefore, based on the above analysis, it is necessary to find other alternative testing methods to ensure that the ADC soldering quality and ADC quality of these products are accurately verified.

[0026] Therefore, this utility model provides a circuit board soldering quality inspection device, such as... Figure 1As shown, it includes: an excitation signal generation module 11, an interference module 12, a photodiode 13, and a signal testing module 14. The excitation signal generation module 11 is connected to the interference module 12. The signal testing module 14 is connected to the circuit board to be tested, which has multiple pads on one side, through the photodiode 13. When it is necessary to test the soldering quality of the circuit board to be tested, the interference module 12 is located directly above the circuit board to be tested, and an induction coil 121 is arranged on the side of the circuit board to be tested with multiple pads facing the circuit board to be tested.

[0027] The excitation signal generating module 11 is configured to output an excitation signal to the interference module 12;

[0028] The interference module 12 is configured to generate an induced magnetic field corresponding to the input excitation signal using the deployed induction coil 121.

[0029] The signal testing module 14 is configured to collect the noise signal generated by the induced electromotive force on the multiple pads on one side of the circuit board to be tested under the action of the induced magnetic field after the induced electromotive force generates the induced electromotive force on the multiple pads and the photodiode, and determine the soldering quality of the multiple pads on the circuit board to be tested based on the collected noise signal.

[0030] According to Faraday's law of electromagnetic induction, when an alternating magnetic field (induced magnetic field) acts on a conductive material (such as copper pads on a circuit board), an induced electromotive force (voltage) is generated within the material. Therefore, this application utilizes this characteristic to generate an electromotive force on the pads and collects the noise signal generated by the induced electromotive force acting on multiple pads and the photodiode to determine the soldering quality of multiple pads on the circuit board under test. Furthermore, to ensure that all pads on the circuit board under test are within the effective range of the induced magnetic field, the induction coils must be arranged to cover all pad areas, thereby achieving comprehensive soldering quality inspection.

[0031] The circuit board welding quality inspection device provided in this application embodiment is not limited by the shape of the circuit board to be inspected. The shape of the circuit board to be inspected can be any shape, such as a regular shape or an irregular shape.

[0032] The soldering quality of the circuit board under test is determined by collecting the electromotive force (EMF) of multiple pads. The measured EMF value can be compared with the standard value (obtained from testing qualified circuit boards). If the EMF of a certain pad is significantly lower than the standard value (i.e., abnormal amplitude), it may indicate that the solder joint is not completely fused (i.e., cold solder joint). If the phase shift of the EMF is large (i.e., abnormal phase), it may indicate that there is resistance or disconnection in the connection between the pad and the circuit. By analyzing the EMF distribution of multiple pads, the specific problem area can be located. By combining the test results of all pads, it can be determined whether the entire circuit board meets the soldering quality standards.

[0033] The circuit board soldering quality inspection device provided by this utility model outputs an excitation signal to the interference module through an excitation signal generation module. The interference module, which is equipped with induction coils, generates an induced magnetic field. The signal testing module collects the electromotive force induced by multiple pads on the circuit board under test under the action of the induced magnetic field and determines the soldering quality accordingly. Therefore, the soldering quality of the circuit board under test is detected in a non-contact manner, which improves the testing accuracy and reliability.

[0034] In one exemplary instance, such as Figure 2 As shown, it also includes: a driver module 15;

[0035] The driving module 15 is configured to drive the interference module 12 to move to the area directly above the circuit board under test when it is necessary to detect the soldering quality of the circuit board under test, and to drive the interference module 12 to move out of the area directly above the circuit board under test when it is not necessary to detect the soldering quality of the circuit board under test.

[0036] When testing is required, the interference module moves to the area directly above, which can accurately cover the key pads or solder joints of the circuit board, ensuring that electromagnetic induction or optical signals act evenly on all target areas, thereby improving the accuracy of the test results. When testing is not required, the interference module moves out of the area directly above, which can prevent the signals it emits (such as high-frequency electromagnetic fields) from interfering with other functions of the circuit board (such as communication modules and power management circuits), ensuring that the testing process is not affected by external noise.

[0037] In one exemplary instance, such as Figure 3 As shown, the drive module 15 includes a transmission assembly 151 and a drive arm 152, and the interference module is mounted on the drive arm;

[0038] The transmission component 151 is configured to, when it is necessary to inspect the soldering quality of the circuit board under test, control the drive arm 152 to move directly above the circuit board under test, so as to move the interference module 12 to the area directly above the circuit board under test; and is also configured to, when it is not necessary to inspect the soldering quality of the circuit board under test, control the drive arm 152 to move away from directly above the circuit board under test, so as to move the interference module 12 out of the area directly above the circuit board under test.

[0039] The transmission assembly 151 is the power source and motion control core of the drive arm 152, and is responsible for controlling the movement of the drive arm.

[0040] In one exemplary instance, such as Figure 5As shown, the transmission assembly 151 includes a motor 151a and a gear 151b, and the drive arm 152 is mounted on the gear 151b;

[0041] The motor 151a is configured to control the gear 151b to rotate in a first rotation direction when it is necessary to inspect the soldering quality of the circuit board to be inspected; it is also configured to control the gear 151b to rotate in a rotation direction opposite to the first rotation direction when it is not necessary to inspect the soldering quality of the circuit board to be inspected.

[0042] The first rotation direction refers to the rotation direction in which the drive arm 152 moves directly above the circuit board to be tested when the gear 151b moves. The first rotation direction is either clockwise or counterclockwise.

[0043] The motor can be an AC servo motor. AC servo motors have high precision, fast response and stable output torque, making them suitable for precision positioning.

[0044] In the method of using a combination of motor and gear as the transmission component, the drive module and the circuit board to be tested can be arranged on the same axis. When it is necessary to test the soldering quality of the circuit board to be tested, the motor controls the gear to rotate in the first rotation direction, driving the drive arm to move in an arc motion towards the top of the circuit board to be tested (that is, the drive arm falls down), thereby moving the interference module to the area directly above the circuit board to be tested. When it is not necessary to test the soldering quality of the circuit board to be tested, the motor controls the gear to rotate in the opposite rotation direction to the first rotation direction, driving the drive arm to move away from the circuit board to be tested in an arc motion (that is, the drive arm is raised up), thereby moving the interference module out of the area directly above the circuit board to be tested.

[0045] In one exemplary instance, such as Figure 6 As shown, it also includes: control module 16;

[0046] The control module 16 is configured to send a first drive command to the motor 151a when it is necessary to inspect the soldering quality of the circuit board to be inspected, and to send a stop rotation command to the motor 151a after the interference module 12 moves to the area directly above the circuit board to be inspected; it is also configured to send a second drive command to the motor 151a when it is not necessary to inspect the soldering quality of the circuit board to be inspected, and to send a stop rotation command to the motor 151a after the interference module 12 moves to the area directly above the circuit board to be inspected.

[0047] Wherein, the first driving command is used to cause the motor 151a to drive the gear to rotate in the first rotation direction, and the second driving command is used to cause the motor 151a to drive the gear to rotate in the opposite rotation direction to the first rotation direction.

[0048] The control module can be a microcontroller unit (MCU).

[0049] When the soldering quality of the circuit board under test needs to be inspected, the control module sends a first drive command to the motor. Upon receiving the first drive command, the motor controls the gear to rotate in a first rotation direction, causing the drive arm to move in an arc motion towards the top of the circuit board under test, thereby moving the interference module to the area directly above the circuit board under test. When the soldering quality of the circuit board under test does not need to be inspected, the control module sends a second drive command to the motor. Upon receiving the second drive command, the motor controls the gear to rotate in a rotation direction opposite to the first rotation direction, causing the drive arm to move in an arc motion away from the circuit board under test (i.e., causing the drive arm to lift up), thereby moving the interference module out of the area directly above the circuit board under test.

[0050] In one exemplary instance, such as Figure 5 As shown, it also includes: control module 16;

[0051] The control module 16 is configured to send a signal generation command to the excitation signal generation module 11 when the interference module 12 moves to the area directly above the circuit board to be tested, and is also configured to send a signal stop generation command to the excitation signal generation module 11 when it is not necessary to detect the soldering quality of the circuit board to be tested.

[0052] When the interference module moves to the area directly above the circuit board to be tested, the control module sends a signal generation command to the excitation signal generation module, and the excitation signal generation module emits an excitation signal after receiving the signal generation command; when it is not necessary to detect the soldering quality of the circuit board to be tested, the control module sends a signal stop generation command to the excitation signal generation module, and the excitation signal generation module stops emitting excitation signals after receiving the signal stop generation command.

[0053] The triggering condition for the control module to send a signal generation instruction to the excitation signal generation module can be set as that the interference module has moved to the area directly above the circuit board to be detected. This is because during the process that the motor drives the gear to rotate in the first rotation direction and drives the driving arm to move in an arc trajectory towards directly above the circuit board, if the interference module has not fully reached the area directly above, there may be differences in the distances between it and different positions on the circuit board. At this time, if the control module sends a signal generation instruction to the excitation signal generation module in advance and outputs an excitation signal, it will cause inconsistent electromagnetic induction intensities generated by the interference module on the circuit board pads, resulting in measurement errors of the induced electromotive force and ultimately affecting the accuracy of the welding quality detection.

[0054] In an exemplary instance, when the interference module moves to the area directly above the circuit board to be detected, the interference module is parallel to the circuit board to be detected and maintains a preset distance.

[0055] When the interference module is parallel to the circuit board to be detected, it can ensure that all pads on one side of the circuit board to be detected are evenly induced by the magnetic field generated by the interference module.

[0056] In an exemplary instance, the interference module includes: an interference plate, and the induction coils are uniformly arranged on the interference plate in a way of nested square arrangement.

[0057] The arrangement of the induction coils can be as Figure 6 shown, and the way of nested square arrangement can be as Figure 6 shown, starting from the center position of the interference plate and spreading towards the periphery of the interference plate in turn.

[0058] In an exemplary instance, the multiple pads arranged on one side of the circuit board to be detected include: the pads in multiple pad concentration areas, each pad concentration area contains multiple pads, the interference module includes: an interference plate, and the induction coils include: multiple sub-induction coils correspondingly arranged according to the positions of the multiple pad concentration areas, where at least one sub-induction coil corresponds to the position of each pad concentration area.

[0059] There are multiple pads on one side of the circuit board to be detected, and these pads are distributed in several pad concentration areas. Each concentration area contains multiple pads, and the induction coils are composed of multiple sub-induction coils. These sub-induction coils are arranged according to the positions of the pad concentration areas. Specifically, at least one sub-induction coil corresponds to each pad concentration area to ensure that the pads in each area can be accurately detected.

[0060] This design ensures targeted magnetic field induction for each solder pad, thereby improving the accuracy and reliability of soldering quality inspection. By configuring an independent sub-induction coil for each concentrated area of ​​solder pads, the electromagnetic induction of each pad area can be more precisely controlled and monitored, reducing errors and improving inspection results.

[0061] Each sub-induction coil can be arranged in a nested pattern, and the design method of the induction coil can be as follows: Figure 7 As shown.

[0062] In one exemplary instance, the excitation signal generating module includes: an excitation signal generating module for emitting a sinusoidal excitation signal.

[0063] This utility model embodiment provides a circuit board welding quality inspection device in which materials engineering can select ABS printing material based on 3D printing to achieve lightweight design; process adaptation can be performed, that is, design for manufacturing (DFM) optimization for mass production; and electromechanical synergy can be performed, that is, the integration of servo motor precision transmission structure and electronic module can be realized.

[0064] The circuit board soldering quality inspection device provided in this embodiment can build a high-precision motion control system through motor motion control, including: motion planning, that is, based on the servo motor movement algorithm, to achieve a positioning accuracy of ±0.1mm, the set movement position is controllable and can be adjusted at any time according to different PCBA / FPCs under test; dynamic parameter adjustment, that is, to realize real-time control of servo motor angle control PID parameter optimization; and through a programmable microcontroller (MCU), to control the servo motor to accurately position the non-contact coupling interference board to the test position, and remove it after the test is completed.

[0065] The circuit board soldering quality inspection device provided in this embodiment addresses the shortcomings of existing probe short-circuit tests. Based on the principle of electromagnetic induction and non-contact coupling, a set frequency is sensed on the pads of the PCBA or FPC under test, and then on the ADC chip connected to the product pads. At the same time, the MCU controls the precise movement of the motor, causing the coupling interference board to move in a curved path under the motor's control. The pads of the PCBA / FPC under test will sense an alternating magnetic field, and the readout system will determine the quality of the ADC itself and the soldering quality of the PCBA / FPC under test.

[0066] The circuit board welding quality inspection device provided in this embodiment of the utility model has the following characteristics:

[0067] Non-contact coupling detection: Completely solves the problems of probe positioning deviation and the dimensional tolerance of the PCBA / FPC under test; Improved accuracy: Achieves millimeter-level positioning accuracy in conjunction with 3D printed mechanical parts, avoiding signal interference caused by physical contact; The non-contact detector test board has a built-in AC signal generator; Precisely locates near the PCBA to excite the electromagnetic induction of the ADC component; Uses a servo motor to drive the excitation module; Increases power supply stability by adjusting the power supply filter, avoiding abnormal displacement of the servo mechanism caused by pulse crosstalk; Improves the positioning accuracy of the servo system to ±0.1mm; Expands the applicability of irregularly shaped FPC substrates.

[0068] The circuit board soldering quality inspection device provided in this embodiment of the utility model is designed to address the shortcomings of existing probe short-circuit tests by providing a non-contact coupling effect based on the principle of electromagnetic induction. This allows a set frequency to be sensed on the pads of the PCBA or FPC under test, and then on the ADC chip connected to the product pads. Simultaneously, the MCU controls the precise movement of the motor, causing the coupling interference board to move in a curved path under the motor's control. The pads of the PCBA / FPC under test will be sensed by an alternating magnetic field, and the readout system will determine the quality of the ADC itself and the soldering quality of the PCBA / FPC under test.

[0069] The circuit board soldering quality inspection device provided in this embodiment of the present invention has the following general working process:

[0070] 1. After the PCBA is powered on, the servo motor positions the excitation coil directly above the ADC pad (0.5mm spacing, which needs to be adjusted according to different PCBAs / FPCs under test).

[0071] 2. The AC signal generator outputs a 100KHz sine wave, which generates an alternating magnetic field through a coil (this frequency needs to be adjusted according to the ADC of the PCBA / FPC under test).

[0072] 3. The ADC pads induce electromotive force, and the test software collects the output digital signal.

[0073] 4. Generate a three-dimensional mapping map from the data and compare it with theoretical values ​​to determine open circuit / short circuit defects.

[0074] The circuit board welding quality inspection device provided in this embodiment of the utility model can, as follows: Figure 8 As shown, the operation steps can be as follows (in this process, the interference module is a non-contact coupling interference board):

[0075] Step 1: Control the non-contact coupling interference board to the "start" position using the programmable microcontroller (MCU) code.

[0076] Step 2: After power-on, the non-contact coupling interference board generates and outputs a set frequency.

[0077] Step 3: Precisely control the operation of the servo motor through a programmed microcontroller MCU, and move the non-contact coupling interference board to the interference working position above the PCBA / FPC under test.

[0078] Step 4: Conduct noise testing on the PCBA / FPC under test through the testing system.

[0079] Step 5: Move the non-contact coupling interference board to the "starting" position by moving the servo motor.

[0080] Step 6: Implement normal testing of the PCBA / FPC under test.

[0081] Step 7: Through the testing platform, the test results can be directly output.

[0082] Step 8: Determine whether the PCBA / FPC under test is qualified or fails.

[0083] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "one side", "the other side", "one end", "the other end", "edge", "opposite", "four corners", "perimeter", "the structure of the character 'kou'", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the structure referred to has a specific orientation, is constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present utility model.

[0084] In the description of the embodiments of the present utility model, unless otherwise clearly specified and limited, the terms "connection", "direct connection", "indirect connection", "fixed connection", "installation", "assembly" shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; the terms "installation", "connection", "fixed connection" can be directly connected, or indirectly connected through an intermediate medium, and can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0085] Although the disclosed embodiments of the present utility model are as above, the content described is only the embodiments adopted for the convenience of understanding the present utility model, and is not used to limit the present utility model. Any person skilled in the art within the field of the present utility model can make any modifications and changes in the form and details of the implementation without departing from the spirit and scope disclosed by the present utility model. However, the scope of patent protection of the present utility model shall still be defined by the appended claims.

Claims

1. A circuit board solder quality inspection apparatus, comprising: The system includes an excitation signal generation module, an interference module, a photodiode, and a signal testing module. The excitation signal generation module is connected to the interference module. The signal testing module is connected to a circuit board under test with multiple pads on one side via the photodiode. When it is necessary to test the soldering quality of the circuit board under test, the interference module is positioned directly above the circuit board under test, and an induction coil is arranged on the side of the circuit board under test with multiple pads facing it. The excitation signal generating module is configured to output an excitation signal to the interference module; The interference module is configured to generate an induced magnetic field corresponding to the input excitation signal using the deployed induction coils. The signal testing module is configured to acquire the electromotive force generated by multiple pads on one side of the circuit board under test under the action of the induced magnetic field, acquire the noise signal generated by the induced electromotive force acting on the multiple pads and the photodiode, and determine the soldering quality of the multiple pads on the circuit board under test based on the acquired noise signal.

2. The circuit board solder quality inspection apparatus according to claim 1, characterized by Also includes: Driver module; The driving module is configured to drive the interference module to move to the area directly above the circuit board under test when it is necessary to detect the soldering quality of the circuit board under test, and to drive the interference module to move out of the area directly above the circuit board under test when it is not necessary to detect the soldering quality of the circuit board under test.

3. The circuit board solder quality inspection apparatus of claim 2, wherein The drive module includes a transmission assembly and a drive arm, and the interference module is mounted on the drive arm. The transmission component is configured to, when it is necessary to inspect the soldering quality of the circuit board under test, control the drive arm to move directly above the circuit board under test, so as to move the interference module to the area directly above the circuit board under test; and is also configured to, when it is not necessary to inspect the soldering quality of the circuit board under test, control the drive arm to move away from the area directly above the circuit board under test, so as to move the interference module out of the area directly above the circuit board under test.

4. The circuit board solder quality inspection apparatus of claim 3, wherein The transmission assembly includes a motor and a gear, with the drive arm mounted on the gear; The motor is configured to control the gear to rotate in a first rotation direction when it is necessary to inspect the soldering quality of the circuit board to be inspected; and is also configured to control the gear to rotate in a rotation direction opposite to the first rotation direction when it is not necessary to inspect the soldering quality of the circuit board to be inspected. The first rotation direction refers to the rotation direction in which the gear moves, driving the drive arm to move directly above the circuit board to be tested. The first rotation direction is either clockwise or counterclockwise.

5. The circuit board solder joint quality inspection apparatus of claim 4, wherein Also includes: Control module; The control module is configured to send a first drive command to the motor when it is necessary to inspect the soldering quality of the circuit board under test, and to send a stop rotation command to the motor after the interference module moves to the area directly above the circuit board under test; it is also configured to send a second drive command to the motor when it is not necessary to inspect the soldering quality of the circuit board under test, and to send a stop rotation command to the motor after the interference module moves to the area directly above the circuit board under test. Wherein, the first driving command is used to cause the motor to drive the gear to rotate in the first rotation direction, and the second driving command is used to cause the motor to drive the gear to rotate in the opposite rotation direction to the first rotation direction.

6. The circuit board solder joint quality inspection apparatus of claim 4, wherein Also includes: Control module; The control module is configured to send a signal generation command to the excitation signal generation module when the interference module moves to the area directly above the circuit board to be tested, and is also configured to send a signal stop generation command to the excitation signal generation module when it is not necessary to detect the soldering quality of the circuit board to be tested.

7. The circuit board solder quality inspection apparatus according to claim 1 or 2 or 3 or 5 or 6, characterized by, When the interference module moves to the area directly above the circuit board under test, the interference module is parallel to the circuit board under test and maintains a preset distance.

8. The circuit board solder quality inspection apparatus according to claim 1 or 2 or 3 or 5 or 6, characterized by, The interference module includes an interference board, and the induction coils are evenly distributed on the interference board in a nested arrangement.

9. The circuit board soldering quality inspection device according to claim 1, 2, 3, 5, or 6, characterized in that, The multiple pads on one side of the circuit board to be tested include: pads in multiple pad concentration areas, each pad concentration area containing multiple pads; the interference module includes: an interference board; and the induction coil includes: multiple sub-induction coils corresponding to the locations of the multiple pad concentration areas, wherein each pad concentration area has at least one sub-induction coil.

10. The circuit board solder joint quality inspection apparatus of claim 1, wherein, The excitation signal generation module includes: an excitation signal generation module for emitting a sine wave excitation signal.

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