An optical module

Abstract

The optical module disclosed herein includes a circuit board, a substrate, a laser, an optical modulation chip, and an optical fiber array. The substrate surface is prone to rust, therefore a protective layer can be formed on the substrate surface. The protective layer corresponding to the area below the optical fiber array undergoes surface roughening treatment, and a first bonding enhancement region exists within the protective layer below the optical fiber array. The first bonding enhancement region includes a first recess array, which comprises multiple recesses. The bottom of the recess is closer to the substrate surface than the bottom of the recess in the non-first bonding enhancement region, and the sidewall inclination angle of the recess is greater than that of the recess in the non-first bonding enhancement region. Therefore, the first bonding enhancement region has a larger specific surface area, which can enhance the mechanical interlocking force and physical adsorption force of the photocurable interface adhesive in this region, thereby significantly improving the bonding strength between the photocurable interface adhesive and the protective layer, and thus improving the bonding stability of the optical fiber array, which is beneficial for ensuring optical path stability.

Description

Technical Field

[0001] This disclosure relates to the field of optical communication technology, and in particular to an optical module. Background Technology

[0002] With the development of new business and application models such as cloud computing, mobile internet, and video, advancements in optical communication technology have become increasingly important. In optical communication technology, the optical module, as one of the key components in optical communication equipment, enables photoelectric signal conversion; and in the development of optical communication technology, the data transmission rate of optical modules is required to continuously improve. Utility Model Content

[0003] In some embodiments, an optical module is provided to increase the adhesion between the optical element and the substrate, thereby ensuring the stability of the optical element.

[0004] In some embodiments, an optical module is provided, comprising:

[0005] Circuit board with notches on the surface;

[0006] A laser is used to output light that does not carry a signal.

[0007] An optical modulation chip is disposed in the output optical path of the laser and is used to modulate the light that does not carry a signal to generate an optical signal;

[0008] An optical fiber array is coupled to the optical modulation chip to transmit the optical signal;

[0009] A substrate, connected to the circuit board through the notch, is used to support the laser, the optical modulation chip, and the fiber array. A protective layer is formed on the surface of the substrate, wherein a first bonding enhancement region exists in the protective layer corresponding to the fiber array. The first bonding enhancement region includes a first recess array, which includes multiple recesses. The bottom of the recess is closer to the substrate surface than the bottom of the recess in the non-first bonding enhancement region. The sidewall inclination angle of the recess is greater than the sidewall inclination angle of the recess in the non-first bonding enhancement region.

[0010] The above technical solution has the following advantages or beneficial effects: The optical module includes a circuit board, a substrate, a laser, an optical modulation chip, and an optical fiber array. The circuit board surface has notches, and the substrate is connected to the circuit board through these notches. The laser is located on the substrate surface, and the substrate has good thermal conductivity, which is beneficial for conducting the heat generated by the laser. The laser outputs light without a signal, and the optical modulation chip receives this light and modulates it to generate an optical signal. The optical signal generated by the optical modulation chip is transmitted through an optical fiber. During long-term use, the substrate surface is prone to rust, and the rust products can easily contaminate the optical path. Therefore, a protective layer can be formed on the substrate surface. Based on the low-temperature rapid curing characteristics and low shrinkage rate of photocurable interface adhesive, the optical fiber array can be bonded and fixed to the substrate surface using photocurable interface adhesive to ensure rapid curing and low optical path offset. However, the interfacial bonding energy between the photocurable interface adhesive and the protective layer is low, forming a weak interfacial layer, resulting in weak adhesion and affecting the stability of the optical fiber array bonding. Therefore, the surface of the protective layer corresponding to the bottom of the optical fiber array is roughened, and a first bonding enhancement region exists in the protective layer below the optical fiber array. The first bonding enhancement region includes a first recess array, which comprises multiple recesses. The bottom of the recess is closer to the substrate surface than the bottom of the recess in the non-first bonding enhancement region, and the sidewall inclination angle of the recess is greater than that of the recess in the non-first bonding enhancement region. Therefore, the first bonding enhancement region has a larger specific surface area, which enhances the mechanical interlocking force and physical adsorption force of the photocurable interface adhesive in this region. This significantly improves the bonding strength between the photocurable interface adhesive and the protective layer, thereby improving the bonding stability of the fiber array and ensuring optical path stability.

[0011] In some embodiments, the optical module includes:

[0012] A lens is disposed in the light output path of the laser;

[0013] There is a second bonding enhancement region in the protective layer below the lens. The second bonding enhancement region includes a second recess array, which includes multiple recesses. The bottom of the recess is closer to the substrate surface than the bottom of the recess in the non-second bonding enhancement region. The sidewall tilt angle of the recess is greater than the sidewall tilt angle of the recess in the non-second bonding enhancement region.

[0014] The above technical solution has the following advantages or beneficial effects: The optical module includes a lens, which is disposed in the output optical path of the laser to converge the diverging light emitted by the laser. When the lens and the substrate are bonded together using a photocurable interface adhesive, the interfacial bonding energy between the photocurable interface adhesive and the protective layer is low, resulting in weak adhesion between the lens and the substrate, thereby reducing the stability of the lens. To address this, a second bonding enhancement region exists in the protective layer corresponding to the lens. The second bonding enhancement region includes a second recess array, which comprises multiple recesses. The bottom of the recess is closer to the substrate surface than the bottom of the recess in the non-second bonding enhancement region, and the sidewall inclination angle of the recess is greater than that of the recess in the non-second bonding enhancement region. Therefore, the second bonding enhancement region has a larger specific surface area, which can enhance the mechanical interlocking force and physical adsorption force of the photocurable interface adhesive in this region, thereby significantly improving the bonding strength between the photocurable interface adhesive and the protective layer, and thus improving the bonding stability of the lens, which is beneficial to ensuring the stability of the optical path.

[0015] In some embodiments, the specific surface area of ​​the first adhesive reinforcement region is greater than that of the non-first adhesive reinforcement region, and the specific surface area of ​​the second adhesive reinforcement region is greater than that of the non-second adhesive reinforcement region.

[0016] The above technical solution has the following advantages or beneficial effects: The specific surface area of ​​the first bonding reinforcement region is greater than that of the non-first bonding reinforcement region, which can enhance the mechanical interlocking force and physical adsorption force of the photocurable interface adhesive in this region, thereby significantly improving the bonding strength between the photocurable interface adhesive and the protective layer, and thus improving the bonding stability of the fiber array, which is beneficial to ensuring the stability of the optical path. The specific surface area of ​​the second bonding reinforcement region is greater than that of the non-second bonding reinforcement region, so the second bonding reinforcement region has a larger specific surface area, which can enhance the mechanical interlocking force and physical adsorption force of the photocurable interface adhesive in this region, thereby significantly improving the bonding strength between the photocurable interface adhesive and the protective layer, and thus improving the bonding stability of the lens, which is beneficial to ensuring the stability of the optical path.

[0017] In some embodiments, the area of ​​the second bonding enhancement region is larger than the area of ​​the lens.

[0018] The above technical solution has the following advantages or beneficial effects: Since the lens size is small, the area of ​​the second bonding enhancement region is set to be larger than the area of ​​the lens, thereby increasing the bonding area between the second bonding enhancement region and the lens, and thus improving the bonding force between the two.

[0019] In some embodiments, a groove is provided between the first adhesive reinforcement region and the second adhesive reinforcement region.

[0020] The above technical solution has the following advantages or beneficial effects: a groove is provided between the first bonding reinforcement area and the second bonding reinforcement area, so that excess photocurable interface adhesive on the surface of the first bonding reinforcement area and the second bonding reinforcement area can overflow into the groove, thereby avoiding excess photocurable interface adhesive from contaminating the optical path.

[0021] In some embodiments, an optical module is provided, comprising:

[0022] Circuit board with notches on the surface;

[0023] A laser is used to output light that does not carry a signal.

[0024] An optical modulation chip is disposed in the output optical path of the laser and is used to modulate the light that does not carry a signal to generate an optical signal;

[0025] An optical fiber array is coupled to the optical modulation chip to transmit the optical signal;

[0026] A substrate, connected to the circuit board through the notch, serves to support the laser, the optical modulation chip, and the fiber array; a protective layer is formed on the surface of the substrate.

[0027] Among them, there is a non-adhesive reinforcement region in the protective layer corresponding to the laser, and the non-adhesive reinforcement region includes a third recess array, which includes multiple recesses;

[0028] The protective layer below the fiber array contains a first bonding enhancement region, which includes a first recess array, and the first recess array includes multiple recesses.

[0029] The bottom of the depression in the first depression array is closer to the substrate surface than the bottom of the depression in the third depression array; the sidewall tilt angle of the depression in the first depression array is greater than the sidewall tilt angle of the depression in the third depression array.

[0030] The above technical solution has the following advantages or beneficial effects: The optical module includes a circuit board, a substrate, a laser, an optical modulation chip, and a fiber array. The circuit board surface has notches, and the substrate is connected to the circuit board through these notches. The laser is located on the substrate surface, and the substrate has good thermal conductivity, which is beneficial for conducting the heat generated by the laser. The laser outputs light without a signal, and the optical modulation chip receives this light and modulates it to generate an optical signal. The optical signal generated by the optical modulation chip is transmitted through optical fiber. During long-term use, the substrate surface is prone to rust, and the rust products can easily contaminate the optical path; therefore, a protective layer can be formed on the substrate surface. Based on the low-temperature rapid curing characteristics and low shrinkage rate of photocurable interface adhesives, the fiber array can be bonded and fixed to the substrate surface using photocurable interface adhesives to ensure rapid curing and low optical path offset. However, the interfacial bonding energy between the photocurable interface adhesive and the protective layer is low, forming a weak interfacial layer, resulting in weak adhesion between them, thus affecting the stability of the fiber array bonding. Therefore, a non-adhesive reinforcement region exists in the protective layer below the laser, including a third recess array comprising multiple recesses. A first adhesive reinforcement region exists in the protective layer below the fiber array, including a first recess array comprising multiple recesses. The bottom of the recesses in the first recess array is closer to the substrate surface than the bottom of the recesses in the third recess array, and the sidewall tilt angle of the recesses in the first recess array is greater than that in the third recess array. This results in a larger specific surface area for the first adhesive reinforcement region, enhancing the mechanical interlocking and physical adsorption forces of the photocurable interface adhesive in this region. This significantly improves the adhesion strength between the photocurable interface adhesive and the protective layer, thereby enhancing the adhesion stability of the fiber array and ensuring optical path stability.

[0031] In some embodiments, the optical module includes:

[0032] A lens is disposed in the light output path of the laser;

[0033] The protective layer below the lens contains a second bonding enhancement region, which includes a second recess array, and the second recess array includes multiple recesses.

[0034] The bottom of the depression in the second depression array is closer to the substrate surface than the bottom of the depression in the third depression array; the sidewall tilt angle of the depression in the second depression array is greater than the sidewall tilt angle of the depression in the third depression array.

[0035] The above technical solution has the following advantages or beneficial effects: The optical module includes a lens, which is disposed in the output optical path of the laser to converge the diverging light emitted by the laser. When the lens and the substrate are bonded together using a photocurable interface adhesive, the interfacial bonding energy between the photocurable interface adhesive and the protective layer is low, resulting in weak adhesion between the lens and the substrate, thereby reducing the stability of the lens. Therefore, a second bonding enhancement region exists in the protective layer corresponding to the lens. The second bonding enhancement region includes a second recess array, which comprises multiple recesses. The bottom of the recesses in the second recess array is closer to the substrate surface than the bottom of the recesses in the third recess array, and the sidewall tilt angle of the recesses in the second recess array is greater than that of the recesses in the third recess array. Therefore, the second bonding enhancement region has a larger specific surface area, which can enhance the mechanical interlocking force and physical adsorption force of the photocurable interface adhesive in this region, thereby significantly improving the bonding strength between the photocurable interface adhesive and the protective layer, and thus improving the bonding stability of the lens, which is beneficial for ensuring the stability of the optical path.

[0036] In some embodiments, the specific surface area of ​​the first adhesive reinforcement region is greater than the specific surface area of ​​the non-adhesive reinforcement region, and the specific surface area of ​​the second adhesive reinforcement region is greater than the specific surface area of ​​the non-adhesive reinforcement region.

[0037] The above technical solution has the following advantages or beneficial effects: The specific surface area of ​​the first bonding reinforcement region is greater than that of the non-bonding reinforcement region, which enhances the mechanical interlocking force and physical adsorption force of the photocurable interface adhesive in this region, thereby significantly improving the bonding strength between the photocurable interface adhesive and the protective layer, and thus improving the bonding stability of the fiber array, which is beneficial to ensuring the stability of the optical path. The specific surface area of ​​the second bonding reinforcement region is greater than that of the non-bonding reinforcement region, so the second bonding reinforcement region has a larger specific surface area, which enhances the mechanical interlocking force and physical adsorption force of the photocurable interface adhesive in this region, thereby significantly improving the bonding strength between the photocurable interface adhesive and the protective layer, and thus improving the bonding stability of the lens, which is beneficial to ensuring the stability of the optical path.

[0038] In some embodiments, the area of ​​the second bonding enhancement region is larger than the area of ​​the lens.

[0039] The above technical solution has the following advantages or beneficial effects: Since the lens size is small, the area of ​​the second bonding enhancement region is set to be larger than the area of ​​the lens, thereby increasing the bonding area between the second bonding enhancement region and the lens, and thus improving the bonding force between the two.

[0040] In some embodiments, a groove is provided between the first adhesive reinforcement region and the second adhesive reinforcement region.

[0041] The above technical solution has the following advantages or beneficial effects: a groove is provided between the first bonding reinforcement area and the second bonding reinforcement area, so that excess photocurable interface adhesive on the surface of the first bonding reinforcement area and the second bonding reinforcement area can overflow into the groove, thereby avoiding excess photocurable interface adhesive from contaminating the optical path. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are merely drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. Furthermore, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0043] Figure 1 This is a partial architecture diagram of an optical communication system according to some embodiments;

[0044] Figure 2 This is a partial structural diagram of a host computer according to some embodiments;

[0045] Figure 3 This is a structural diagram of an optical module according to some embodiments;

[0046] Figure 4 An exploded view of an optical module according to some embodiments;

[0047] Figure 5 This is a structural diagram of the internal structure of an optical module according to some embodiments;

[0048] Figure 6 This is an exploded view of the interior of an optical module according to some embodiments;

[0049] Figure 7 This is an internal cross-sectional view of an optical module according to some embodiments;

[0050] Figure 8 This is a structural diagram of a light emitting component according to some embodiments;

[0051] Figure 9 An exploded view of a light emitting component according to some embodiments;

[0052] Figure 10 This is a cross-sectional structural diagram of a light emitting component according to some embodiments;

[0053] Figure 11 This is a schematic diagram of a substrate structure according to some embodiments;

[0054] Figure 12An exploded view of a substrate structure according to some embodiments;

[0055] Figure 13 This is a schematic diagram of a first connecting plate structure according to some embodiments;

[0056] Figure 14 This is a schematic diagram of a second connecting plate structure according to some embodiments;

[0057] Figure 15 This is a structural diagram of another light-emitting component according to some embodiments;

[0058] Figure 16 An exploded view of another light-emitting component according to some embodiments;

[0059] Figure 17 Another substrate structure according to some embodiments Figure 1 ;

[0060] Figure 18 Another substrate structure according to some embodiments Figure 2 ;

[0061] Figure 19 This is a schematic diagram of the connection between a substrate and a protective layer according to some embodiments. Figure 1 ;

[0062] Figure 20 This is a schematic diagram of the connection between a substrate and a protective layer according to some embodiments. Figure 2 . Detailed Implementation

[0063] The embodiments of this disclosure will now be described clearly and in detail with reference to the accompanying drawings. However, the described embodiments are merely some, and not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0064] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and inclusive, meaning "including, but not limited to"; the terms "first" and "second" should not be construed as indicating or implying relative importance or indicating an upper limit on the number; the term "multiple" means two or more; the term "connection" should be interpreted broadly, for example, "connection" can be a fixed connection, a detachable connection, or an integral part, and can be a direct connection or an indirect connection through an intermediate medium; the use of the terms "applicable to" or "configured to" implies open and inclusive language, which does not exclude applicability to or configuration to devices performing additional tasks or steps; descriptions such as "parallel," "perpendicular," "identical," "consistent," and "aligned" are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges arising in practice, and differences based on the same design concept but due to manufacturing reasons.

[0065] In optical communication technology, to establish information transmission between information processing devices, information is loaded onto light, and the speed of light propagation is used to transmit the information. This light carrying information is called an optical signal. When optical signals are transmitted in optical information transmission equipment, optical power loss can be reduced, enabling long-distance transmission of optical signals. At the same time, the cost of optical information transmission equipment such as optical fibers is lower than that of electrical information transmission equipment such as copper wires. Therefore, optical communication technology can achieve high-speed, long-distance, and low-cost information transmission.

[0066] Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., while optical information transmission equipment typically includes optical fibers and optical waveguides. Information processing equipment can only recognize and process electrical signals, while optical communication technology uses optical signals for transmission, requiring optical modules to convert between optical and electrical signals.

[0067] An optical module enables the conversion between optical signals and electrical signals between information processing equipment and optical information transmission equipment. In some embodiments, at least one of the optical signal input or output terminals of the optical module is connected to an optical fiber, and at least one of the electrical signal input or output terminals of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber.

[0068] Since multiple information processing devices can transmit information via electrical signals, at least one of these devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is also referred to as the host computer of the optical module. Furthermore, the optical signal input or output terminal of the optical module is called the optical port, and the electrical signal input or output terminal is called the electrical port.

[0069] Figure 1 This is a partial structural diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100 for optical modules, an optical module 200, an optical fiber 101, and a network cable 103. Among them, the optical fiber 101 is an optical information transmission device, and the network cable 103 is an electrical information transmission device.

[0070] In some embodiments, one end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can undergo total internal reflection in the optical fiber 101, and the propagation of the optical signal in the direction of total internal reflection can almost maintain the original optical power. The optical signal undergoes multiple total internal reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance information transmission based on low power loss.

[0071] The optical communication system includes one or more optical fibers 101. In some embodiments, the optical fiber 101 is detachably connected to the optical module 200; in some embodiments, the optical fiber 101 is non-detachably connected to the optical module 200.

[0072] The host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor or control the working status of the optical module 200.

[0073] The host computer 100 includes a housing for accommodating the optical module 200, and an optical module interface 102 disposed on the housing. The optical module 200 is inserted into the housing through the optical module interface 102 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0074] The host computer 100 also includes an external power interface that can connect to an electrical signal network. In some embodiments, the external power interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to connect a network cable 103 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103.

[0075] One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. In some embodiments, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted in the optical fiber 101 to the remote information processing device 1000.

[0076] In some embodiments, a first optical signal from a remote information processing device 1000 is transmitted through an optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to an optical module 200. The optical module 200 converts the first optical signal into a first electrical signal, and transmits the first electrical signal to a host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to a local information processing device 2000.

[0077] In some embodiments, the optical module is a tool for converting optical signals to electrical signals. During the conversion process, the information does not change, but the encoding or decoding method of the information changes.

[0078] In addition to optical network terminals, the host computer 100 also includes optical line terminals (OLTs), optical network equipment (ONTs), or data center servers.

[0079] Figure 2 This is a partial structural diagram of a host computer according to some embodiments. To clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. For example... Figure 2As shown, in some embodiments, the host computer 100 further includes a PCB circuit board 105 disposed in the receiving cavity, and a cage 106 disposed on the surface of the PCB circuit board 105; the optical module 200 is inserted into the cage 106 and fixed by the cage 106.

[0080] In some embodiments, a heat sink 107 is provided on the cage 106 to dissipate heat for the optical module; in some embodiments, the heat sink 107 has protruding structures such as fins to increase the heat dissipation area.

[0081] In some embodiments, an electrical connector is provided inside the cage 106, which is configured to connect to the electrical port of the optical module 200.

[0082] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is conducted to the cage 106 and then diffused through the heat sink 107.

[0083] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, thereby establishing an electrical signal connection between the optical module 200 and the host computer 100.

[0084] In some embodiments, the optical port of the optical module 200 is connected to the optical fiber 101, thereby enabling the optical module 200 to establish an optical signal connection with the optical fiber 101.

[0085] Figure 3 This is a structural diagram of an optical module according to some embodiments. Figure 4 This is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, in some embodiments, the optical module 200 includes a shell, which comprises an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202, forming two openings 204 and 205, one of which is an electrical port and the other is an optical port. In some embodiments, the shell forms an opening that serves as both an electrical port and an optical port.

[0086] In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0087] The assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, etc. into the housing. The upper housing 201 and the lower housing 202 can encapsulate and protect the above-mentioned devices.

[0088] The direction of the line connecting the two openings 204 and 205 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200. Figure 3 (The right end), opening 205 is also located at the end of optical module 200 ( Figure 3 (The left end). Alternatively, opening 204 is located at the end of optical module 200, while opening 205 is located on the side of optical module 200.

[0089] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011, which covers the two lower side plates 2022 of the lower housing 202 to form the aforementioned housing.

[0090] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to realize that the upper housing 201 covers the lower housing 202.

[0091] like Figure 3 and Figure 4 As shown, in some embodiments, the optical module includes a circuit board 300 disposed within a housing. The circuit board 300 includes circuit traces, electronic components, and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0092] In some embodiments, the circuit board includes a rigid circuit board, which, due to its relatively rigid material, can also serve a load-bearing function, such as being able to stably support the aforementioned electronic components and chips; the rigid circuit board can also be inserted into an electrical connector in the cage 106 of the host computer 100.

[0093] In some embodiments, the circuit board further includes a flexible circuit board, which can be used independently or in conjunction with a rigid circuit board.

[0094] In some embodiments, the circuit board further includes gold fingers formed on its end surface, the gold fingers consisting of a plurality of independent pins.

[0095] In some implementations, the gold fingers 301 are disposed on the surface of one side of the circuit board 300 (e.g., Figure 4 (as shown on the upper surface); In some implementations, the gold fingers 301 are disposed on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thereby adapting to applications with high pin count requirements.

[0096] In some implementations, the gold fingers of the circuit board extend from the opening 204 and are inserted into the electrical connector of the host computer 100; the circuit board is inserted into the cage 106, and the gold fingers 301 are connected to the electrical connector inside the cage 106. The gold fingers 301 are configured to establish an electrical connection with the host computer, enabling electrical connection functions such as power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, and data signal transmission.

[0097] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to establish a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0098] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a locking component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the locking component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the locking component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the fixation between the optical module 200 and the host computer, thereby allowing the optical module 200 to be pulled out of the cage 106.

[0099] In some embodiments, the optical module includes a light emitting component 400.

[0100] In some embodiments, the optical module includes an optical receiving component 500.

[0101] In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 is located on the side of the circuit board 300 away from the gold finger 301.

[0102] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0103] In some embodiments, at least one of the light emitting component or the light receiving component may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on the surface of the circuit board 300 or the side of the circuit board 300.

[0104] Figure 5 This is a diagram illustrating the internal structure of an optical module according to some embodiments. Figure 6 This is an exploded view of the interior of an optical module according to some embodiments. Figure 5 and Figure 6 As shown, in some embodiments, the optical module may include a substrate 700 to support and carry the light emitting component 400. The substrate 700 has good thermal conductivity, which is beneficial for heat dissipation of the light emitting component 400 and ensures that the light emitting component 400 can operate normally.

[0105] In some embodiments, a notch 302 is formed on the surface of the circuit board 300 to embed the substrate 700. If the size of the notch 302 is smaller than the area of ​​the substrate 700, the outer periphery of the substrate 700 supports the circuit board 300.

[0106] In some embodiments, the light emitting component 400 may include a laser 401. The laser 401 is located on the surface of the substrate 700. The laser 401 can emit light along its sides without modulating the optical signal, so that the light emitted by the laser 401 does not carry an optical signal. Exemplarily, the laser 401 is a DFB laser.

[0107] In some embodiments, the light emitting component 400 may include a lens 402. The lens 402 is located on the surface of the substrate 700. The lens 402 is located in the light output path of the laser 401. The lens 402 may be a converging lens to converge the diverging light emitted by the laser 401.

[0108] In some embodiments, the light emitting component 400 may include an isolator 403. The isolator 403 is located on the surface of the substrate 700. The isolator 403 is located in the light output path of the lens 402 to prevent light emitted by the laser 401 from returning to the laser 401, thereby ensuring the light output quality of the laser 401.

[0109] In some embodiments, the light emitting component 400 may include a light modulation chip 404. The light modulation chip 404 is located on the surface of the substrate 700. The light modulation chip 404 is located in the light output path of the isolator 403 and receives the light output from the isolator 403. The light modulation chip 404 performs signal phase modulation on the light output from the isolator 403 to generate an optical signal.

[0110] In some embodiments, the optical modulation chip 404 integrates an MZ modulator to modulate the optical signal and transmit the optical signal. Exemplarily, the optical modulation chip 404 can be a silicon photonics chip, a thin-film lithium niobate chip, or a III-V group photonics chip.

[0111] In some embodiments, the light emitting component 400 may include an optical fiber array 405. The optical fiber array 405 is located on the surface of the substrate 700. The optical fiber array 405 is end-face coupled to the optical modulation chip 404. The optical fiber array 405 is located in the light output path of the optical modulation chip 404 to transmit the optical signal modulated by the optical modulation chip 404 to the outside.

[0112] In some embodiments, the light emitted by the laser 401 is transmitted to the optical modulation chip 404, where it is modulated to generate an optical signal. The optical signal is then output from the optical modulation chip 404 and transmitted through the fiber array 405.

[0113] In some embodiments, the laser 401, lens 402, and isolator 403 are located in the incident optical path of the optical modulation chip 404, providing the light source to be modulated to the optical modulation chip 404. The fiber array 405 is coupled to the output optical port of the optical modulation chip 404. Since the incident and output ports of the optical modulation chip 404 are formed on the same side, the laser 401, lens 402, isolator 403, and fiber array 405 are located on the same side of the optical modulation chip 404.

[0114] In some embodiments, the lens 402 and the fiber array 405 are respectively bonded and fixed to the surface of the substrate 700 using a photocurable interface adhesive, such as a UV optical adhesive. The photocurable interface adhesive has the characteristic of rapid curing at low temperatures, and its curing process does not require high temperatures, thus avoiding deformation of heat-sensitive optical components, such as the lens 402 and the fiber array 405, due to high temperatures. Furthermore, the photocurable interface adhesive has a low shrinkage rate during curing, preventing deformation of the lens 402 and the fiber array 405 due to stress, and preventing optical path misalignment, thereby ensuring optical path stability. In addition, the photocurable interface adhesive can cure quickly under ultraviolet light, which is beneficial for the passive coupling of the lens 402 or the fiber array 405.

[0115] In some embodiments, the substrate 700 may be a metal substrate to ensure thermal conductivity. However, during long-term use, the surface of the substrate 700 may rust, and the rust products can contaminate the optical path. Therefore, a protective layer is deposited on the surface of the substrate 700.

[0116] In some embodiments, the protective layer can be a nickel plating layer. The nickel plating layer has small grain size and low porosity, thereby effectively blocking the penetration of moisture or oxygen, establishing a physical barrier, and thus achieving a rust-proof effect.

[0117] In some embodiments, the protective layer, such as the nickel plating layer, typically has a lower surface energy than the photocurable interfacial adhesive. This makes it difficult for the photocurable interfacial adhesive to adequately wet the surface of the nickel plating layer. The interfacial bonding between the photocurable interfacial adhesive and the nickel plating layer mainly relies on physical adsorption. The low interfacial bonding energy between the two results in a weak interfacial layer between the nickel plating layer and the photocurable interfacial adhesive. Consequently, the adhesion between the lens 402 or the fiber array 405 and the substrate 700 is weak, which is detrimental to the stability of the lens 402 or the fiber array 405, and consequently, to the stability of the optical path.

[0118] Figure 7 This is an internal cross-sectional view of an optical module according to some embodiments. Figure 8 This is a structural diagram of a light emitting component according to some embodiments. Figure 9 This is an exploded view of a light emitting component according to some embodiments. Figure 7-9 As shown, in some embodiments, the light emitting component 400 is disposed on the surface of the substrate 700.

[0119] In some embodiments, a first connecting plate 406 is provided between the substrate 700 and the fiber array 405. The bottom surface of the first connecting plate 406 is fixedly connected to the substrate 700, and the top surface is fixedly connected to the fiber array 405.

[0120] In some embodiments, the bottom and top surfaces of the first connecting plate 406 are respectively formed with different interface layers, which satisfies the adhesion between the plate and the protective layer and ensures the optical path stability of the fiber array 405.

[0121] In some embodiments, the first connecting plate 406 has a preset thickness to match the optical axis height between the fiber array 405 and the optical modulation chip 404, thereby increasing the coupling efficiency between them. The coefficient of thermal expansion of the first connecting plate 406 is adapted to the coefficient of thermal expansion of the optical modulation chip 404, so that the optical modulation chip 404 and the first connecting plate 406 have the same amount of thermal expansion when the temperature changes, thus avoiding stress between the optical modulation chip 404 and the first connecting plate 406.

[0122] In some embodiments, a second connecting plate 407 is provided between the substrate 700 and the lens 402. The bottom surface of the second connecting plate 407 is fixedly connected to the substrate 700, and the top surface is fixedly connected to the lens 402.

[0123] In some embodiments, the bottom and top surfaces of the second connecting plate 407 are respectively formed with different interface layers, which satisfies the adhesion between the plate and the protective layer and ensures the optical path stability of the lens 402.

[0124] In some embodiments, the second connecting plate 407 has a preset thickness to match the optical axis height between the lens 402 and the laser 401, thereby increasing the coupling efficiency between the two.

[0125] In some embodiments, a first protrusion 701 is formed on the surface of the substrate 700 to support the laser 401. There is a preset height difference between the first protrusion 701 and the second connecting plate 407 to match the optical axis height between the laser 401 and the lens 402, thereby ensuring the coupling efficiency between the laser 401 and the lens 402.

[0126] In some embodiments, the laser 401 is disposed on the surface of the laser substrate 4011. The coefficient of thermal expansion of the second connecting plate 407 is adapted to the coefficient of thermal expansion of the laser substrate 4011, so that the laser 401 and the second connecting plate 407 have the same amount of thermal expansion when the temperature changes, avoiding stress between the laser 401 and the second connecting plate 407. This improves the thermal stability of the optical module.

[0127] Figure 10 This is a cross-sectional structural diagram of a light emitting component according to some embodiments. Figure 11 This is a schematic diagram of a substrate structure according to some embodiments. Figure 12 This is an exploded view of a substrate structure according to some embodiments. Figure 10-12 As shown, in some embodiments, the substrate 700 has good thermal conductivity and is thermally connected to the upper housing 201. The light emitting component 400 is disposed on the surface of the substrate 700 to facilitate heat dissipation through the substrate 700, meeting the heat dissipation requirements of the light emitting component 400. Exemplarily, the heat generated by the laser 401 is dissipated to the upper housing 201 via the substrate 700, and a heat dissipation duct can be formed between the upper housing 201 of the optical module and the cage 106 of the host computer 100.

[0128] In some embodiments, a first protrusion 701 is formed on the surface of the substrate 700. A laser 401 is disposed on the surface of the first protrusion 701.

[0129] In some embodiments, a second protrusion 702 is formed on the surface of the substrate 700. An isolator 403 is provided on the surface of the second protrusion 702.

[0130] In some embodiments, a second connecting plate 407 is disposed between the first boss 701 and the second boss 702. A lens 402 is provided on the surface of the second connecting plate 407. The thickness relationship between the second connecting plate 407, the first boss 701 and the second boss 702 satisfies the optical axis height between the laser 401, the lens 402 and the isolator 403.

[0131] In some embodiments, a third protrusion 703 is formed on the surface of the substrate 700. An optical modulation chip 404 is disposed on the surface of the third protrusion 703.

[0132] In some embodiments, a first connecting plate 406 is disposed on one side of the third protrusion 703. An optical fiber array 405 is provided on the surface of the first connecting plate 406.

[0133] In some embodiments, the thickness relationship between the third boss 703 and the first connecting plate 406 satisfies the optical axis height between the adapter optical modulation chip 404 and the fiber array 405.

[0134] Figure 13 This is a schematic diagram of a first connecting plate structure according to some embodiments. Figure 13 As shown, in some embodiments, the bottom surface of the first connecting plate 406 is fixedly connected to the substrate 700, and the top surface is fixedly connected to the fiber array 405.

[0135] In some embodiments, different interface layers are formed on the bottom surface and top surface of the first connecting plate 406, a first thermosetting interface layer 4061 is formed between the bottom surface of the first connecting plate 406 and the protective layer, and a first photosetting interface layer 4062 is formed between the top surface of the first connecting plate 406 and the fiber array. For example, the first connecting plate 406 may be a ceramic plate.

[0136] In some embodiments, the first thermosetting interface layer 4061 may include a thermosetting interface adhesive, such as a non-UV adhesive, to increase the adhesion between the layer and the protective layer. The first photocurable interface layer 4062 may include a photocurable interface adhesive, such as a UV adhesive, to ensure the optical path stability of the fiber array 405.

[0137] In some embodiments, the thermosetting interface adhesive, such as a non-UV adhesive, is thermosetting. The thermosetting process increases the system temperature, thereby releasing reactive groups, such as amine groups (-NH2). The NiO / Ni(OH)2 surface formed by the natural oxidation of the nickel plating layer has a large number of hydroxyl groups (-OH). These polar groups can undergo dehydration condensation with the amine groups (-NH2) in the thermosetting interface adhesive to form strong Ni-OC covalent bonds. Compared with the physical adsorption between the photocurable interface adhesive and the nickel plating layer, the covalent bond energy between the thermosetting interface adhesive and the nickel plating layer is higher, which is beneficial for forming a stronger interface layer with the protective layer, thereby increasing the adhesion between the substrate 700 and the bottom surface of the first connecting plate 406. Exemplarily, the thermosetting temperature of the thermosetting interface adhesive can be around 100°C.

[0138] In some embodiments, the photocurable interface adhesive, such as a UV-curable adhesive, has photocurability and can be cured by ultraviolet irradiation in a short time. The photocurable interface adhesive has the characteristic of rapid curing at low temperatures, and its curing process does not require high temperatures, thereby avoiding deformation of the fiber array 405 due to high temperatures. In addition, the photocurable interface adhesive has a low shrinkage rate during curing, preventing optical path misalignment of the fiber array 405 and thus ensuring optical path stability.

[0139] In some embodiments, the bottom and top surfaces of the first connecting plate 406 are respectively formed with different interface layers, which satisfies the adhesion between the plate and the protective layer and ensures the optical path stability of the fiber array 405.

[0140] In some embodiments, the first thermosetting interface layer 4061 can form a strong chemical bond with the protective layer, increasing the interfacial bonding energy between the protective layer and the first connecting plate 406, thus forming a strong interface layer between the protective layer and the first connecting plate 406, thereby increasing the adhesion between the substrate 700 and the first connecting plate 406.

[0141] In some embodiments, the first photocurable interface layer 4062 is formed by low-temperature curing, thereby preventing the fiber array 405 from deforming due to high temperature. At the same time, the first photocurable interface layer 4062 has a low shrinkage rate, preventing the fiber array 405 from deforming due to stress, thereby reducing the optical path offset of the fiber array 405 and ensuring optical path stability.

[0142] In some embodiments, the bottom and top surfaces of the first connecting plate 406 are bonded and fixed by different types of interface adhesives, which satisfies the adhesion between the plate and the protective layer and ensures the optical path stability of the fiber array.

[0143] In some embodiments, the bottom surface of the first connecting plate 406 is bonded and fixed to the protective layer using a thermosetting interface adhesive. The thermosetting interface adhesive can form a strong chemical bond with the protective layer, increasing the interfacial bonding energy between the protective layer and the first connecting plate 406, thus forming a strong interface layer between the protective layer and the first connecting plate 406, thereby increasing the adhesion between the substrate and the first connecting plate 406.

[0144] In some embodiments, the top surface of the first connecting plate 406 is bonded and fixed to the fiber array 405 using a photocurable interface adhesive. The photocurable interface adhesive has rapid curing characteristics at low temperatures, thereby preventing the fiber array 405 from deforming due to high temperatures. Simultaneously, the photocurable interface adhesive has a low shrinkage rate, preventing the fiber array 405 from deforming due to stress, thereby reducing the optical path offset of the fiber array 405 and ensuring optical path stability.

[0145] In some embodiments, the fiber array 405 includes a fiber fixing part 4051 for fixing and connecting the optical fibers. The fiber fixing part 4051 protects and buffers the optical fibers, thereby preventing fiber breakage. The end of the first connecting plate 406 is spaced away from the fiber fixing part 4051, thereby preventing interference between the first connecting plate 406 and the fiber fixing part 4051.

[0146] Figure 14 This is a schematic diagram of a second connecting plate structure according to some embodiments. Figure 14 As shown, in some embodiments, the bottom surface of the second connecting plate 407 is fixedly connected to the substrate 700, and the top surface is fixedly connected to the lens 402.

[0147] In some embodiments, different interface layers are formed on the bottom and top surfaces of the second connecting plate 407. A second thermosetting interface layer 4071 is formed between the bottom surface of the second connecting plate 407 and the protective layer, and a second photocurable interface layer 4072 is formed between the top surface of the second connecting plate 407 and the lens 402. The characteristics of the second thermosetting interface layer 4071 are the same as those of the first thermosetting interface layer 4061, and the characteristics of the second photocurable interface layer 4072 are the same as those of the first photocurable interface layer 4071, which will not be elaborated further. For example, the second connecting plate 407 can be a ceramic plate.

[0148] In some embodiments, the bottom and top surfaces of the second connecting plate 407 are respectively formed with different interface layers, which satisfies the adhesion between the plate and the protective layer and ensures the optical path stability of the lens 402.

[0149] In some embodiments, the second thermosetting interface layer 4071 can form a strong chemical bond with the protective layer, increasing the interfacial bonding energy between the protective layer and the second connecting plate 407, thereby forming a strong interface layer between the protective layer and the second connecting plate 407, thereby increasing the adhesion between the substrate 700 and the second connecting plate 407.

[0150] In some embodiments, the second photocurable interface layer 4072 is formed by low-temperature curing, thereby preventing the lens 402 from deforming due to high temperature. At the same time, the second photocurable interface layer 4072 has a low shrinkage rate, preventing the lens 402 from deforming due to stress, thereby reducing the optical path offset of the lens 402 and ensuring optical path stability.

[0151] In some embodiments, the bottom and top surfaces of the second connecting plate 407 are bonded and fixed by different types of interface adhesives, which satisfies the adhesion between the plate and the protective layer and ensures the optical path stability of the fiber array.

[0152] In some embodiments, the bottom surface of the second connecting plate 407 is bonded and fixed to the protective layer using a thermosetting interface adhesive. The thermosetting interface adhesive can form a strong chemical bond with the protective layer, increasing the interfacial bonding energy between the protective layer and the second connecting plate 407, thus forming a strong interface layer between the protective layer and the second connecting plate 407, thereby increasing the adhesion between the substrate and the second connecting plate 407.

[0153] In some embodiments, the top surface of the second connecting plate 407 is bonded and fixed to the lens 402 using a photocurable interface adhesive. The photocurable interface adhesive has the characteristic of rapid curing at low temperatures, thereby preventing the lens 402 from deforming due to high temperatures. Simultaneously, the photocurable interface adhesive has a low shrinkage rate, preventing the lens 402 from deforming due to stress, thereby reducing the optical path offset of the lens 402 and ensuring optical path stability.

[0154] In some embodiments, the lens 402 is small in size, so the area of ​​the second connecting plate 407 is set to be larger than the area of ​​the lens 402, thereby increasing the bonding area between the second connecting plate 407 and the substrate 700, thereby improving the bonding force between the second connecting plate 407 and the substrate 700, which is beneficial to improving the bonding stability of the second connecting plate 407.

[0155] Figure 15 This is a structural diagram of another light-emitting component according to some embodiments. Figure 16 This is an exploded view of another light-emitting component according to some embodiments. Figure 15 and Figure 16 As shown, in some embodiments, laser 401, lens 402, isolator 403, optical modulation chip 404 and fiber array 405 are disposed on the surface of substrate 700.

[0156] In some embodiments, the lens 402 and the fiber array 405 are respectively bonded and fixed to the surface of the substrate 700 using a photocurable interface adhesive, such as a UV optical adhesive. The photocurable interface adhesive has the characteristic of rapid curing at low temperatures, and its curing process does not require high temperatures, thus avoiding deformation of heat-sensitive optical components, such as the lens 402 and the fiber array 405, due to high temperatures. Furthermore, the photocurable interface adhesive has a low shrinkage rate during curing, preventing deformation of the lens 402 and the fiber array 405 due to stress, and preventing optical path misalignment, thereby ensuring optical path stability. In addition, the photocurable interface adhesive can cure quickly under ultraviolet light, which is beneficial for the passive coupling of the lens 402 or the fiber array 405.

[0157] In some embodiments, the surface of the substrate 700 may rust or corrode during long-term use, and the products of rust or corrosion may contaminate the optical path. Therefore, a protective layer is deposited on the surface of the substrate 700 to prevent rust or corrosion.

[0158] In some embodiments, the protective layer may be a nickel plating layer or a chromium plating layer. The nickel plating layer has small grain size and low porosity, thereby effectively blocking the penetration of moisture or oxygen, establishing a physical barrier, and thus achieving a rust-proof effect.

[0159] In some embodiments, the protective layer, such as the nickel plating layer, typically has a lower surface energy than the photocurable interfacial adhesive. This makes it difficult for the photocurable interfacial adhesive to adequately wet the surface of the nickel plating layer. The interfacial bonding between the photocurable interfacial adhesive and the nickel plating layer mainly relies on physical adsorption. Since the interfacial bonding energy between the two is low, a weak interfacial layer is formed between the nickel plating layer and the photocurable interfacial adhesive. Consequently, the adhesion between the lens 402 or the fiber array 405 and the substrate 700 is weak, or even leads to adhesion failure, which is detrimental to the stability of the lens 402 or the fiber array 405, and consequently, to the stability of the optical path.

[0160] In some embodiments, a first bonding enhancement region 740 exists in the protective layer beneath the fiber array 405. The first bonding enhancement region 740 has a large specific surface area, which can enhance the mechanical interlocking force and physical adsorption force of the photocurable interface adhesive in this region, thereby significantly improving the bonding strength between the photocurable interface adhesive and the protective layer, and thus improving the bonding stability of the fiber array 405, which is beneficial to ensuring the stability of the optical path.

[0161] In some embodiments, a second bonding enhancement region 730 is present in the protective layer beneath the lens 402. The second bonding enhancement region 730 has a large specific surface area, which can enhance the mechanical interlocking force and physical adsorption force of the photocurable interface adhesive in this region, thereby significantly improving the bonding strength between the photocurable interface adhesive and the protective layer, and thus improving the bonding stability of the lens 402, which is beneficial to ensuring the stability of the optical path.

[0162] In some embodiments, the protective layer beneath the fiber array 405 is surface roughened to form a first bonding enhancement region 740. The protective layer beneath the lens 402 is surface roughened to form a second bonding enhancement region 730.

[0163] In some embodiments, the protective layer beneath the fiber array 405 can be processed by laser ablation to form a micro-rough structure, thereby forming the first bonding enhancement region 740. Similarly, the protective layer beneath the lens 402 can be processed by laser ablation to form a micro-rough structure, thereby forming the first bonding enhancement region 740.

[0164] In some embodiments, laser ablation is a localized processing method. By adjusting laser parameters, such as laser energy and laser pulse width, microstructures can be formed only in the local area where bonding is required, and the ablation depth is controllable. This ensures that the protective layer is not penetrated, thus preserving the protective function of the protective layer and preventing the substrate 700 from rusting or being corroded.

[0165] like Figure 17 and Figure 18 As shown, in some embodiments, a protective layer is formed on the surface of the substrate 700, a first bonding enhancement region 740 is present in the protective layer below the fiber array 405, and a second bonding enhancement region 730 is present in the protective layer below the lens 402.

[0166] In some embodiments, a first protrusion 710 is formed on the surface of the substrate 700. A laser 401 is disposed on the surface of the first protrusion 710.

[0167] In some embodiments, a second protrusion 720 is formed on the surface of the substrate 700. An optical modulation chip 404 is disposed on the surface of the second protrusion 720.

[0168] In some embodiments, the first boss 710 has a preset thickness to match the optical axis height between the laser 401 and the lens 402. The second boss 720 has a preset thickness to match the optical axis height between the optical modulation chip 404 and the fiber array 405.

[0169] In some embodiments, the first adhesive reinforcement region 740 is disposed on one side of the second boss 720, and the second adhesive reinforcement region 730 is disposed on one side of the first boss 710.

[0170] In some embodiments, a groove 750 is provided between the first bonding reinforcement region 740 and the second bonding reinforcement region 730, so that excess photocurable interface adhesive on the surfaces of the first bonding reinforcement region 740 and the second bonding reinforcement region 730 can overflow into the groove 750, thereby preventing excess photocurable interface adhesive from contaminating the optical path.

[0171] In some embodiments, since the lens 402 is small, the area of ​​the second bonding enhancement region 730 is set to be larger than the area of ​​the lens 402, thereby increasing the bonding area between the second bonding enhancement region 730 and the lens 402, and thus improving the bonding force between them.

[0172] like Figure 19 and Figure 20 As shown, in some embodiments, a protective layer is formed on the surface of the substrate 700, a first bonding enhancement region 740 is present in the protective layer below the fiber array 405, and a second bonding enhancement region 730 is present in the protective layer below the lens 402.

[0173] In some embodiments, the first bonding enhancement region 740 includes a first recess array 741, which includes a plurality of recesses 7411. The bottom of the recesses 7411 is closer to the surface of the substrate 700 than the bottom of the recesses in the non-first bonding enhancement region, and the sidewall inclination angle of the recesses 7411 is greater than that of the recesses in the non-first bonding enhancement region. Therefore, the first bonding enhancement region 740 has a larger specific surface area, which can enhance the mechanical interlocking force and physical adsorption force of the photocurable interface adhesive in this region, thereby significantly improving the bonding strength between the photocurable interface adhesive and the protective layer, and thus improving the bonding stability of the fiber array 405, which is beneficial to ensuring the stability of the optical path.

[0174] In some embodiments, patterned ablation is performed within the first adhesion enhancement region 740 to form a surface structure with a specific morphology and a specific roughness, thereby optimizing the adhesion effect. Exemplarily, the first recess array 741 may include regularly arranged recesses or irregularly arranged recesses.

[0175] In some embodiments, the second adhesion enhancement region 730 includes a second recess array comprising multiple recesses. The bottom of the recess is closer to the substrate surface than the bottom of the recess in the non-second adhesion enhancement region, and the sidewall inclination angle of the recess is greater than that of the recess in the non-second adhesion enhancement region. Therefore, the second adhesion enhancement region 730 has a larger specific surface area, which enhances the mechanical interlocking force and physical adsorption force of the photocurable interface adhesive in this region, thereby significantly improving the adhesion strength between the photocurable interface adhesive and the protective layer, and thus improving the adhesion stability of the lens, which is beneficial for ensuring optical path stability. The structure of the second recess array can refer to the structure of the first recess array 741.

[0176] In some embodiments, there is a non-adhesive enhancement region in the protective layer below the laser 401. The non-adhesive enhancement region includes a third recess array 4012, which includes a plurality of recesses 4013.

[0177] In some embodiments, the bottom of the recess 7411 in the first recess array 741 is closer to the surface of the substrate 700 than the bottom of the recess 4013 in the third recess array 4012, and the sidewall tilt angle of the recess in the first recess array 741 is greater than the sidewall tilt angle of the recess in the third recess array 4012. Therefore, the first bonding enhancement region 740 has a larger specific surface area, which can enhance the mechanical interlocking force and physical adsorption force of the photocurable interface adhesive in this region, thereby significantly improving the bonding strength between the photocurable interface adhesive and the protective layer, and thus improving the bonding stability of the fiber array 405, which is beneficial to ensuring the stability of the optical path.

[0178] In some embodiments, the bottom of the recess in the second recess array is closer to the surface of the substrate 700 than the bottom of the recess 4013 in the third recess array 4012, and the sidewall tilt angle of the recess in the second recess array is greater than the sidewall tilt angle of the recess 4013 in the third recess array 4012. Therefore, the second bonding enhancement region 730 has a larger specific surface area, which can enhance the mechanical interlocking force and physical adsorption force of the photocurable interface adhesive in this region, thereby significantly improving the bonding strength between the photocurable interface adhesive and the protective layer, and thus improving the bonding stability of the lens 402, which is beneficial to ensuring the stability of the optical path.

[0179] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. An optical module characterized by comprising: include: Circuit board with notches on its surface; A laser is used to output light that does not carry a signal. An optical modulation chip is disposed in the output optical path of the laser and is used to modulate the light that does not carry a signal to generate an optical signal; An optical fiber array is coupled to the optical modulation chip to transmit the optical signal; A substrate, connected to the circuit board through the notch, is used to support the laser, the optical modulation chip, and the fiber array. A protective layer is formed on the surface of the substrate, wherein a first bonding enhancement region exists in the protective layer corresponding to the fiber array. The first bonding enhancement region includes a first recess array, which includes multiple recesses. The bottom of the recess is closer to the substrate surface than the bottom of the recess in the non-first bonding enhancement region. The sidewall inclination angle of the recess is greater than the sidewall inclination angle of the recess in the non-first bonding enhancement region.

2. The optical module according to claim 1, characterized by The optical module includes: A lens is disposed in the light output path of the laser; There is a second bonding enhancement region in the protective layer below the lens. The second bonding enhancement region includes a second recess array, which includes multiple recesses. The bottom of the recess is closer to the substrate surface than the bottom of the recess in the non-second bonding enhancement region. The sidewall tilt angle of the recess is greater than the sidewall tilt angle of the recess in the non-second bonding enhancement region.

3. The optical module according to claim 2, characterized by The specific surface area of ​​the first adhesive reinforcement region is greater than that of the non-first adhesive reinforcement region, and the specific surface area of ​​the second adhesive reinforcement region is greater than that of the non-second adhesive reinforcement region.

4. The optical module according to claim 2, characterized by The area of ​​the second bonding enhancement region is larger than the area of ​​the lens.

5. The optical module of claim 2, wherein A groove is provided between the first adhesive reinforcement area and the second adhesive reinforcement area.

6. An optical module characterized by comprising: include: Circuit board with notches on its surface; A laser is used to output light that does not carry a signal. An optical modulation chip is disposed in the output optical path of the laser and is used to modulate the light that does not carry a signal to generate an optical signal; An optical fiber array is coupled to the optical modulation chip to transmit the optical signal; A substrate, connected to the circuit board through the notch, serves to support the laser, the optical modulation chip, and the fiber array; a protective layer is formed on the surface of the substrate. Among them, there is a non-adhesive reinforcement region in the protective layer corresponding to the laser, and the non-adhesive reinforcement region includes a third recess array, which includes multiple recesses; The protective layer below the fiber array contains a first bonding enhancement region, which includes a first recess array, and the first recess array includes multiple recesses. The bottom of the depression in the first depression array is closer to the substrate surface than the bottom of the depression in the third depression array; the sidewall tilt angle of the depression in the first depression array is greater than the sidewall tilt angle of the depression in the third depression array.

7. The optical module according to claim 6, characterized by The optical module includes: A lens is disposed in the light output path of the laser; The protective layer below the lens contains a second bonding enhancement region, which includes a second recess array, and the second recess array includes multiple recesses. The bottom of the depression in the second depression array is closer to the substrate surface than the bottom of the depression in the third depression array; the sidewall tilt angle of the depression in the second depression array is greater than the sidewall tilt angle of the depression in the third depression array.

8. The optical module according to claim 7, characterized by The specific surface area of ​​the first adhesive reinforcement region is greater than that of the non-adhesive reinforcement region, and the specific surface area of ​​the second adhesive reinforcement region is greater than that of the non-adhesive reinforcement region.

9. The optical module according to claim 7, characterized in that, The area of ​​the second bonding enhancement region is larger than the area of ​​the lens.

10. The optical module of claim 7, wherein, A groove is provided between the first adhesive reinforcement area and the second adhesive reinforcement area.

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