A computer CPU cooling module

Abstract

This utility model discloses a heat dissipation module for a computer CPU, including a positioning frame. A heat-conducting frame is fixedly connected inside the positioning frame. Four sets of heat dissipation fins are fixedly connected to the bottom surface of the positioning frame. Four fixing blocks are fixedly connected to the bottom surface of the heat-conducting frame. A fixing ring is fixedly connected to the bottom end of each fixing block. A fixing frame is fixedly connected inside the fixing ring. A cooling fan is mounted on the bottom surface of the fixing frame. Fan blades arranged at equal intervals are installed at the output end of the cooling fan. Noise-reducing holes and ventilation slots are arranged at equal intervals on the outer surface of the fixing ring. This device can conduct heat to the computer CPU through the heat-conducting frame, quickly dissipate heat from the computer CPU through the cooperation of the heat dissipation fins and the cooling fan, reduce noise from the cooling fan through the noise-reducing holes, and enhance the heat dissipation effect of the fixing ring through the ventilation slots.

Description

Technical Field

[0001] This utility model relates to the field of computer CPU heat dissipation, and in particular to a heat dissipation module for computer CPUs. Background Technology

[0002] The CPU is the core component of a computer, responsible for data processing and operational control. The internal structure of a CPU can be broadly divided into three parts: the control unit, the logic unit, and the storage unit. It analyzes, judges, calculates, and controls the coordinated operation of various computer components. A cooling module, as the name suggests, is a module unit used for heat dissipation in systems, devices, and equipment. Currently, it specifically refers to the cooling system of notebook computers, and has later expanded to include the cooling systems of desktop computers and projectors that utilize heat pipes. Due to the internal space characteristics of notebook computers, the concept of heat exchange using heat pipes (RHE) is necessary to address the problem of system waste heat. Therefore, the cooling system of a notebook computer basically consists of three main parts: a heat-conducting section, a heat-dissipating section, and a spring-loaded locking mechanism, plus some auxiliary components.

[0003] With the rapid development of computer technology, CPU performance is constantly improving, and its processing speed and power consumption are also increasing, leading to a sharp rise in the heat generated by the CPU. If heat dissipation is not timely, it can cause problems such as CPU throttling, system lag, and even hardware damage. Therefore, an efficient CPU cooling module is a key component to ensure the stable operation of a computer. Currently, computer CPU cooling modules are relatively simple, mostly using only fans for heat dissipation, which has low cooling efficiency and is noisy, affecting people's use of the computer. To address these issues, we propose a computer CPU cooling module to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to provide a heat dissipation module for a computer CPU to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A heat dissipation module for a computer CPU includes a positioning frame, a heat conduction frame fixedly connected inside the positioning frame, four sets of heat dissipation fins fixedly connected to the bottom surface of the positioning frame, four fixing blocks fixedly connected to the bottom surface of the heat conduction frame, a fixing ring fixedly connected to the bottom end of each fixing block, a fixing frame fixedly connected inside the fixing ring, a heat dissipation fan mounted on the bottom surface of the fixing frame, and fan blades arranged at equal intervals mounted on the output end of the heat dissipation fan.

[0007] In a further embodiment, the outer surface of the fixing ring is provided with noise reduction holes arranged at equal intervals, and the outer surface of the fixing ring is provided with ventilation slots arranged at equal intervals.

[0008] In a further embodiment, the positioning frame has symmetrical grooves on its front side, and temperature sensors are installed inside both grooves.

[0009] In a further embodiment, symmetrical shock-absorbing pads are fixedly connected to the front of the positioning frame, and the shock-absorbing pads are made of rubber.

[0010] In a further embodiment, the positioning frame has four mounting holes on its front side, and the fan blades are designed with an arc shape.

[0011] In a further embodiment, the inlet angle of the fan blades is 30°-45°, and the outlet angle of the fan blades is 15°-25°.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] This device conducts heat to the computer CPU through a heat-conducting frame. The combination of heat sink fins and a cooling fan enables rapid heat dissipation from the CPU. Noise reduction holes reduce fan noise, ventilation slots enhance the heat dissipation of the mounting ring, a temperature sensor monitors the CPU temperature in real time, shock-absorbing pads reduce vibration of the positioning frame, mounting holes facilitate easy installation and positioning of the positioning frame, and the arc-shaped fan blades reduce airflow noise and increase air pressure, thus improving CPU cooling performance. Attached Figure Description

[0014] Figure 1 This is a front view of the computer CPU's cooling module.

[0015] Figure 2 This is a bottom view of the computer CPU's cooling module.

[0016] Figure 3 This is a side view of the cooling module for a computer CPU.

[0017] Figure 4 This is a top view of the heatsink fins in the CPU cooling module of a computer.

[0018] In the diagram: 1. Positioning bracket; 2. Heat conduction bracket; 3. Heat dissipation fins; 4. Fixing block; 5. Fixing ring; 6. Shock-absorbing pad; 7. Groove; 8. Temperature sensor; 9. Mounting hole; 10. Fixing bracket; 11. Cooling fan; 12. Fan blades; 13. Ventilation slot; 14. Noise reduction hole. Detailed Implementation

[0019] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0020] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figure 1-4 In this utility model, a heat dissipation module for a computer CPU includes a positioning frame 1. A heat conduction frame 2 is fixedly connected inside the positioning frame 1. Four sets of heat dissipation fins 3 are fixedly connected to the bottom surface of the positioning frame 1. Four fixing blocks 4 are fixedly connected to the bottom surface of the heat conduction frame 2. A fixing ring 5 is fixedly connected to the bottom end of each fixing block 4. A fixing frame 10 is fixedly connected inside the fixing ring 5. A cooling fan 11 is installed on the bottom surface of the fixing frame 10. Fan blades 12 arranged at equal intervals are installed at the output end of the cooling fan 11. The heat conduction frame 2 can conduct heat to the computer CPU. With the cooperation of the heat dissipation fins 3 and the cooling fan 11, the computer CPU can be quickly cooled.

[0023] The outer surface of the fixing ring 5 has noise reduction holes 14 arranged at equal intervals, and the outer surface of the fixing ring 5 has ventilation slots 13 arranged at equal intervals. The front of the positioning bracket 1 has symmetrical grooves 7. Temperature sensors 8 are installed inside the two grooves 7. The noise reduction holes 14 can reduce the noise of the cooling fan 11, the ventilation slots 13 can increase the heat dissipation effect of the fixing ring 5, and the temperature sensors 8 can monitor the CPU temperature in real time.

[0024] The front of the positioning frame 1 is fixedly connected with symmetrical shock-absorbing pads 6, which are made of rubber. The front of the positioning frame 1 has four mounting holes 9. The fan blades 12 adopt an arc blade design. The inlet angle of the fan blades 12 is 30°-45° and the outlet angle of the fan blades 12 is 15°-25°. The shock-absorbing pads 6 can reduce the vibration of the positioning frame 1. The mounting holes 9 facilitate the installation and positioning of the positioning frame 1. The arc blade design of the fan blades 12 can reduce airflow noise and increase air pressure, thereby improving the heat dissipation effect on the CPU.

[0025] The working principle of this utility model is as follows:

[0026] In use, first connect the device to the corresponding power supply, then use the mounting hole 9 to install and position the positioning bracket 1 so that the front of the heat conduction bracket 2 contacts the bottom of the computer CPU. Then, the heat conduction bracket 2 can conduct heat to the computer CPU. With the cooperation of the heat dissipation fins 3 and the cooling fan 11, the computer CPU can be cooled quickly. The noise reduction hole 14 can reduce the noise of the cooling fan 11. The ventilation slot 13 can increase the heat dissipation effect of the fixing ring 5. The temperature sensor 8 can monitor the CPU temperature in real time. The vibration damping pad 6 can reduce the vibration of the positioning bracket 1. The mounting hole 9 can facilitate the installation and positioning of the positioning bracket 1. The fan blades 12 adopt an arc blade design, which can reduce airflow noise and increase air pressure, thereby improving the heat dissipation effect on the CPU.

[0027] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0028] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A heat dissipation module for a computer CPU, characterized by: The device includes a positioning frame (1), a heat-conducting frame (2) is fixedly connected inside the positioning frame (1), four sets of heat dissipation fins (3) are fixedly connected to the bottom surface of the positioning frame (1), four fixing blocks (4) are fixedly connected to the bottom surface of the heat-conducting frame (2), a fixing ring (5) is fixedly connected to the bottom end of each fixing block (4), a fixing frame (10) is fixedly connected inside the fixing ring (5), a heat dissipation fan (11) is installed on the bottom surface of the fixing frame (10), and fan blades (12) arranged at equal intervals are installed at the output end of the heat dissipation fan (11).

2. The heat dissipation module for a computer CPU according to claim 1, characterized in that: The outer surface of the fixing ring (5) is provided with noise reduction holes (14) arranged at equal intervals, and the outer surface of the fixing ring (5) is provided with ventilation slots (13) arranged at equal intervals.

3. The heat dissipation module for a computer CPU according to claim 1, characterized in that: The positioning frame (1) has symmetrical grooves (7) on its front side, and temperature sensors (8) are installed inside both grooves (7).

4. The heat dissipation module for a computer CPU according to claim 1, characterized in that: The front of the positioning frame (1) is fixedly connected with a symmetrical shock-absorbing pad (6), which is made of rubber.

5. A heat dissipation module for a computer CPU according to claim 1, characterized in that: The positioning frame (1) has four mounting holes (9) on its front side, and the fan blades (12) are designed with arc blades.

6. The heat dissipation module for a computer CPU according to claim 1, characterized in that: The inlet angle of the fan blade (12) is 30°-45°, and the outlet angle of the fan blade (12) is 15°-25°.

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