A type of CPU water block

Abstract

This invention discloses a CPU cold head, including a CPU heatsink plate with a water inlet box. A water inlet box cover is located at the bottom opening of the water inlet box. A central boss extends downwards from the top wall of the water inlet box, with a water outlet hole. An annular water groove surrounds the central boss, communicating with the water inlet hole of the CPU cold head. The bottom of the central boss contacts the top of the water inlet box cover. A row of recessed grooves, communicating with the annular water groove and the water outlet hole, is formed on the top surface of the water inlet box cover. The central boss, annular water groove, and recessed grooves work together to form a circulating water channel. The circulating water passing through this channel can fully absorb heat from the CPU before being discharged, thus improving the heat conduction capacity of the CPU cold head.

Description

Technical Field

[0001] This utility model relates to the field of server heat dissipation technology, specifically to a CPU cold block. Background Technology

[0002] As server processing speeds continue to increase, so too does the heat generated by servers. Traditional air cooling is no longer sufficient to meet the cooling needs of major heat-generating components such as the CPU, leading more and more manufacturers to install water cooling systems in their servers. A water cooling system typically consists of a water block, a reservoir, and a radiator. The water block is mounted on top of the CPU to absorb its heat, the reservoir stores the circulating water and provides power, and the radiator facilitates heat exchange between the circulating water and the surrounding cool air. All three are connected by tubing. However, the current capacity of the water block to absorb CPU heat is not satisfactory, necessitating further improvements in heat dissipation. Utility Model Content

[0003] To address the shortcomings of the prior art, this utility model proposes a CPU cold head with a flow channel formed by a central boss, an annular water tank, and a settling tank. The circulating water passing through this flow channel can quickly absorb and discharge the heat from the CPU, thereby improving the heat conduction capacity.

[0004] This utility model proposes a CPU cold block, including a CPU heat dissipation plate, the CPU heat dissipation plate is provided with a water inlet box, and a water inlet box sealing plate is provided at the bottom opening of the water inlet box.

[0005] The top wall of the water cooling box extends downward to form a central boss with a water outlet. A ring-shaped water channel surrounds the central boss and is connected to the water inlet of the CPU cold head. The bottom of the central boss is positioned at the top of the water cooling box cover.

[0006] The top surface of the water inlet box sealing plate has a row of grooves that connect to the annular water trough and the water outlet.

[0007] Preferably, the central boss is also provided with a water inlet channel, which is located between the water outlet and the settling tank;

[0008] The top opening of the water intake channel is connected to the water outlet, and the bottom opening of the water intake channel spans multiple sedimentation channels.

[0009] Preferably, the CPU cold block also includes a MOS heat dissipation plate, and the CPU heat dissipation plate extends horizontally to one side and is connected to the MOS heat dissipation plate by a connecting plate;

[0010] The MOS heat sink has a water channel, and the water inlet is located at the top of one end of the water channel;

[0011] The connecting plate is equipped with a water passage channel, and the water flow channel and the annular water channel are connected through the water passage channel.

[0012] Preferably, a water channel sealing plate is provided at the bottom opening of the water channel, and the water channel sealing plate is connected to a MOS heat conduction column.

[0013] Preferably, the CPU heat sink, MOS heat sink, and connecting plate are integrally formed.

[0014] Preferably, the material used to make the water inlet box sealing plate is copper.

[0015] Preferably, the MOS heat-conducting pillar and the water channel sealing plate are integrally formed, and the material used to make them is copper.

[0016] Preferably, a water passage sealing plate is provided at the top opening of the water passage.

[0017] The beneficial effects of this utility model include: the central boss, the annular water tank, and the sink trough work together to form a circulating water channel, through which the circulating water can fully absorb the heat of the CPU before being discharged, thus improving the heat conduction capacity of the CPU cold head; the MOS heat conduction plate can also help dissipate heat from the MOS tubes of the server motherboard, thereby improving the overall heat dissipation capacity of the water cooling system for the server; the water box, water tank, and water channel are each equipped with a sealing plate, which can be opened for cleaning, improving the convenience of cleaning. Attached Figure Description

[0018] The present invention will now be described in detail with reference to the embodiments and accompanying drawings, wherein:

[0019] Figure 1 This is an exploded view of the structure of the CPU cold head of this utility model.

[0020] Figure 2 This is a three-dimensional view of the CPU cold head of this utility model.

[0021] Figure 3 This is a bottom view of the integrated structure of the CPU heat-conducting plate, MOS heat-conducting plate and connecting plate of this utility model.

[0022] Figure label:

[0023] 1-CPU heatsink, 11-Water tray, 12-Water tray cover plate, 13-Center boss, 14-Annular water tank, 15-Submersible tank, 16-Water inlet tank, 2-MOS heatsink, 21-Water tank, 22-Water tank cover plate, 23-MOS heatsink pillar, 3-Connecting plate, 31-Water channel, 32-Water channel cover plate, 4-Outlet hole, 5-Inlet hole. Detailed Implementation

[0024] To make the technical problem to be solved, the technical solution, and the beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0025] Therefore, a feature pointed out in this specification is used to describe one feature of one embodiment of the present invention, and does not imply that every embodiment of the present invention must have the described feature. Furthermore, it should be noted that this specification describes many features. Although certain features may be combined to illustrate possible system designs, these features may also be used in other combinations not explicitly stated. Therefore, unless otherwise stated, the described combinations are not intended to be limiting.

[0026] The principle of this utility model will be described in detail below with reference to the accompanying drawings and embodiments.

[0027] This utility model proposes a CPU cold head, including a CPU heat dissipation plate 1, a water inlet box 11, and a water inlet box sealing plate 12 at the bottom opening of the water inlet box 11; a central boss 13 extends downward from the top wall of the water inlet box 11, and a water outlet hole 4 is opened on the central boss 13. An annular water groove 14 is provided around the central boss 13, and the annular water groove 14 is connected to the water inlet hole 5 of the CPU cold head. The bottom of the central boss 13 is in contact with the top of the water inlet box sealing plate 12; a row of recessed grooves 15 are opened on the top surface of the water inlet box sealing plate 12, which are connected to the annular water groove 14 and the water outlet hole 4.

[0028] After absorbing heat from the CPU, the water inlet cover 12 directly transfers some of the heat to the central boss 13. The CPU water block is made of metal, which has good thermal conductivity, allowing heat to be diffused throughout the entire water block, increasing the heat exchange area with the circulating water. The central boss 13, the annular water channel 14, and the submerged groove 15 work together to form a circulating water channel. The circulating water enters the submerged groove 15 from the annular water channel 14, directly contacting the water inlet cover 12 to absorb heat, and finally exits from the outlet hole 4. The numerous submerged grooves 15 are arranged in an array, increasing the heat exchange area with the circulating water. Because the bottom of the central boss 13 directly contacts the top of the submerged groove 15, the circulating water can only enter the outlet hole 4 through the submerged groove 15, preventing the circulating water from being discharged without fully absorbing heat and improving the thermal conductivity of the CPU water block.

[0029] In this embodiment, the central boss 13 is also provided with a water inlet channel 16, which is located between the water outlet 4 and the settling tank 15. The top opening of the water inlet channel 16 is connected to the water outlet 4, and the bottom opening of the water inlet channel 16 spans multiple settling tanks 15. The area of ​​the water outlet 4 is limited, and the water inlet channel 16 allows more settling tanks 15 to be connected to the water outlet 4.

[0030] In this embodiment, the CPU cold head also includes a MOS heat-conducting plate 2. The CPU heat-conducting plate 1 extends horizontally to one side, and a connecting plate 3 connects to the MOS heat-conducting plate 2. The MOS heat-conducting plate 2 is provided with a water channel 21, and a water inlet 5 is opened at the top of one end of the water channel 21. The connecting plate 3 is provided with a water passage channel 31, and the water channel 21 and the annular water channel 14 are connected through the water passage channel 31. A water channel sealing plate 22 is provided at the bottom opening of the water channel 21, and a MOS heat-conducting pillar 23 is connected to the water channel sealing plate 22. The MOS heat-conducting plate 2 is used to help dissipate heat from the MOS transistors of the server motherboard. Generally, the MOS transistors are arranged in a straight line. The long strip-shaped MOS heat-conducting pillar 23 contacts the top of a row of MOS transistors to absorb heat. The water channel sealing plate 22 also plays a role in transferring heat between the circulating water and the MOS heat-conducting plate 2. At the same time, the MOS heat-conducting plate 2 is also designed in a long strip shape to match the shape of the MOS heat-conducting plate 2.

[0031] In this embodiment, the CPU heat-conducting plate 1, the MOS heat-conducting plate 2, and the connecting plate 3 are integrally formed. The beneficial effect is that it reduces seams and prevents water leakage, and the integral forming helps to improve its own heat conduction capacity.

[0032] In this embodiment, the water inlet box cover 12 is made of copper, which can improve the efficiency of the water inlet box cover 12 in absorbing CPU heat.

[0033] In this embodiment, the MOS heat-conducting pillar 23 and the water channel sealing plate 22 are integrally formed and made of copper, which can improve the efficiency of the water channel sealing plate 12 in absorbing the heat of the MOS tube.

[0034] In this embodiment, a water passage sealing plate 32 is provided at the top opening of the water passage 31. The water box 11, the water passage 21 and the water passage 31 are each provided with a sealing plate, which can be opened for cleaning, thus improving the convenience of cleaning.

[0035] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A CPU cold head, characterized by, Includes a CPU heatsink, wherein the CPU heatsink is provided with a water inlet box, and a water inlet box sealing plate is provided at the bottom opening of the water inlet box; The top wall of the water-cooling box extends downward to form a central boss, which has a water outlet hole. An annular water groove is provided around the central boss and is connected to the water inlet hole of the CPU cold head. The bottom of the central boss is in contact with the top of the water-cooling box sealing plate. The top surface of the water inlet box sealing plate has a row of sinks that are connected to the annular water trough and the water outlet.

2. The CPU cold head of claim 1, wherein, The central boss is also provided with a water inlet channel, which is located between the water outlet and the settling tank. The top opening of the water inlet channel is connected to the water outlet, and the bottom opening of the water inlet channel spans multiple sinkholes.

3. The CPU cold head of claim 1, wherein, The CPU cold head also includes a MOS heat-conducting plate, and the CPU heat-conducting plate extends horizontally to one side and is connected to the MOS heat-conducting plate by a connecting plate. The MOS heat-conducting plate is provided with a water channel, and the water inlet is opened at the top of one end of the water channel; The connecting plate is provided with a water passage groove, and the water passage groove and the annular water groove are connected through the water passage groove.

4. The CPU cold head of claim 3, wherein, The bottom opening of the water channel is provided with a water channel sealing plate, and the water channel sealing plate is connected to a MOS heat-conducting pillar.

5. The CPU cold head of claim 3, wherein, The CPU heat-conducting plate, the MOS heat-conducting plate, and the connecting plate are integrally formed.

6. The CPU cold head of claim 1, wherein, The sealing plate of the water inlet box is made of copper.

7. The CPU cold head of claim 4, wherein, The MOS heat-conducting pillar and the water channel sealing plate are integrally formed and made of copper.

8. The CPU cold head of claim 3, wherein, The top opening of the water passage is provided with a water passage sealing plate.

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