A mobile phone button structure

By integrating the keycaps with the flexible circuit board using adhesive bonding technology, combined with waterproof adhesive fixing and bending fitting groove design, the complexity of traditional mobile phone button structures and waterproof design problems are solved, resulting in a high-performance button module suitable for mid-to-low-end mobile phones.

CN224457946UActive Publication Date: 2026-07-03SHENZHEN YAMILA ELECTRONICS TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN YAMILA ELECTRONICS TECH CO LTD
Filing Date
2025-07-14
Publication Date
2026-07-03

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    Figure CN224457946U_ABST
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Abstract

This application relates to the field of button structures for electronic devices, and more particularly to a button structure for a mobile phone. It includes a keycap and a flexible circuit board, which are fixedly connected to form an independent button module using an adhesive bonding process. The flexible circuit board includes a main functional part and an extension part. One side of the main functional part has a capacitive sensing circuit for sliding touch functionality, and the other side has a pressure sensing circuit for detecting pressure intensity. The extension part houses other electronic components and is electrically connected to the aforementioned circuit. The keycap is made of an insulating material such as tempered glass, and its outer edge extends beyond the edge of the main functional part to form a stepped structure. The extension part is bent to enclose the keycap, forming a mounting groove. This application achieves the technical effect of integrating multiple functions into one unit, combining sliding touch and pressure intensity detection functions, and facilitating the assembly and installation of other electronic components through a reasonable structural design.
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