Resonance suppression device and electrical apparatus

Abstract

This utility model discloses a resonance suppression device and electrical equipment, relating to the field of conductive connection technology for filter structures. The resonance suppression device includes a conductive busbar, a conductive connector, and a capacitor. The conductive connector is electrically connected to the conductive busbar. The capacitor is electrically connected to the conductive busbar through the conductive connector. The capacitor is electrically connected to the filter housing through a grounding component and the conductive connector. The conductive busbar, conductive connector, capacitor, and grounding component form a filter circuit, and a damping resistor is connected in series in the filter circuit. The technical solution provided by this utility model can solve the EMI resonance problem of existing filters.

Description

Technical Field

[0001] This utility model relates to the field of conductive connection technology of filter structure, and in particular to a resonance suppression device and electrical equipment. Background Technology

[0002] To meet electromagnetic compatibility (EMC) standards, filters are required at the high-voltage ports of electrical equipment to reduce power noise. Filters typically include: a filter capacitor assembly, a magnetic core assembly, a positive busbar, and a negative busbar. The presence of inductance and capacitance in the filter circuit makes it highly susceptible to EMI (Electromagnetic Interference) resonance, which can negatively impact filter performance.

[0003] In related technologies, filter capacitors are usually connected by spring contacts. One end of the spring contact is connected to the Y capacitor by soldering, and the other end is connected to the bus copper busbar or the chassis by screws. However, the contact impedance of this connection method is uncontrollable, so the loop resistance cannot be adjusted according to the actual path, and the EMI resonance problem of the filter cannot be solved. Utility Model Content

[0004] The main purpose of this invention is to propose a resonance suppression device and electrical equipment, which aims to solve the EMI resonance problem of existing filters.

[0005] To achieve the above objectives, this utility model proposes a resonance suppression device, comprising:

[0006] Conductive busbar;

[0007] A conductive connector, wherein the conductive connector is electrically connected to the conductive busbar;

[0008] A capacitor is electrically connected to the conductive busbar via the conductive connector; the capacitor is electrically connected to the filter housing via a grounding member and the conductive connector.

[0009] The conductive busbar, the conductive connector, the capacitor, and the grounding component form a filter circuit, and a damping resistor is connected in series in the filter circuit.

[0010] In one embodiment, at least one of the following is provided: between the conductive busbar and the conductive connector, between the conductive connector and the capacitor, between the conductive connector and the housing, and between the grounding member and the housing.

[0011] In one embodiment, the damping resistor is provided on the surface of at least one of the conductive busbar, the conductive connector, the capacitor, and the grounding member.

[0012] In one embodiment, the damping resistor is at least one of conductive adhesive, conductive rubber, conductive cloth, and conductive paste.

[0013] In one embodiment, the damping resistor comprises one or at least two conductive coating layers;

[0014] Alternatively, the damping resistor may comprise one or at least two conductive plating layers.

[0015] In one embodiment, the filter circuit is further provided with a conductive connector, and the conductive busbar is electrically connected to the conductive connector through the conductive connector.

[0016] In one embodiment, the conductive connector and / or the grounding component is a screw.

[0017] In one embodiment, the conductive connector is a spring.

[0018] In one embodiment, an adhesive dispensing component is provided between the conductive connector and the capacitor.

[0019] To achieve the above objectives, this utility model also proposes a filter, including a filter and a resonance suppression device. The filter includes a housing, which is electrically connected to the capacitor through the grounding member and the conductive connector.

[0020] The technical solution of this utility model is to connect at least one damping resistor with a suitable resistance value in series in the filter circuit. Different resistance values ​​of damping resistors can be selected according to the actual path, so the resistance of the filter circuit can be adjusted according to the actual path. The impedance of the filter circuit can be adjusted in the range of a few tenths of an ohm to several ohms. The design of the damping resistor can consume part of the energy in the filter circuit, thereby reducing the oscillation generated in the filter circuit and playing a role in resonance suppression, thus effectively solving the EMI resonance problem of the filter. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0022] Figure 1 A partial structural schematic diagram of an embodiment of the electrical equipment provided by this utility model;

[0023] Figure 2 A partial structural schematic diagram of another embodiment of the electrical equipment provided by this utility model;

[0024] Figure 3 The resonance suppression device provided by this utility model is a schematic diagram of the EMI resonance suppression principle of the filter.

[0025] Explanation of icon numbers:

[0026] label name label name 1000 electrical equipment 60 Damping resistor 100 Resonance suppression device 70 conductive connectors 10 Conductive bus 80 inductance 20 Conductive lap joint 90 Dispensing parts 30 capacitance 200 case 50 grounding component

[0027] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0030] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0031] To meet electromagnetic compatibility (EMC) standards, filters are required at the high-voltage ports of electrical equipment to reduce power noise. Filters typically include: a filter capacitor assembly, a magnetic core assembly, a positive busbar, and a negative busbar. The presence of inductance and capacitance in the filter circuit makes it highly susceptible to EMI (Electromagnetic Interference) resonance, which can negatively impact filter performance.

[0032] In related technologies, filter capacitors are usually connected by spring contacts. One end of the spring contact is connected to the Y capacitor by soldering, and the other end is connected to the bus copper busbar or the chassis by screws. However, the contact impedance of this connection method is uncontrollable, so the loop resistance cannot be adjusted according to the actual path, and the EMI resonance problem of the filter cannot be solved.

[0033] Based on the above problems, this utility model proposes a resonance suppression device 100 to solve the EMI resonance problem of filters. It can adjust the impedance of the filter circuit in the range of a few tenths of an ohm to several ohms, aiming to solve the EMI resonance problem of existing filters.

[0034] Please see Figures 1 to 3 In one embodiment of this utility model, the resonance suppression device 100 includes a conductive bus 10, a conductive connector 20, and a capacitor 30; the conductive connector 20 is electrically connected to the conductive bus 10; the capacitor 30 is electrically connected to the conductive bus 10 through the conductive connector 20; the capacitor 30 is electrically connected to the housing 200 of the filter through a grounding member 50 and the conductive connector 20; wherein, the conductive bus 10, the conductive connector 20, the capacitor 30, and the grounding member 50 form a filter circuit, and a damping resistor 60 is connected in series in the filter circuit.

[0035] The technical solution of this utility model is to connect at least one damping resistor 60 with a suitable resistance value in series in the filter circuit. Different resistance values ​​of the damping resistor 60 can be selected according to the actual path, so the resistance of the filter circuit can be adjusted according to the actual path. The impedance of the filter circuit can be adjusted in the range of a few tenths of an ohm to several ohms. The design of the damping resistor 60 can consume part of the energy in the filter circuit, thereby reducing the oscillation generated in the filter circuit and playing a role in resonance suppression, thus effectively solving the EMI resonance problem of the filter.

[0036] Furthermore, this solution improves filter performance by adding a 60Ω damping resistor, eliminating the need to increase the number of filter stages. It is compatible with new development projects, reducing investment in new project development, minimizing problems in component development, and saving costs.

[0037] It should be noted that the inductor 80 and capacitor 30 in the circuit have equal impedance at a specific frequency (impedance is minimum and current is maximum at series resonance; impedance is maximum and voltage is maximum at parallel resonance), causing energy to be significantly amplified at that specific frequency point. The quality factor Q is an important parameter for evaluating the performance of a resonant circuit. A higher Q value makes it more prone to excessive oscillation and energy accumulation. An excessively high Q value can cause filter loop oscillation, reducing filter performance and leading to a significant increase in the measured amplitude. Therefore, by connecting at least one damping resistor 60 of appropriate value in series with the filter loop, some energy can be effectively dissipated, the Q value reduced, and resonance suppression achieved. Please refer to [link to relevant documentation]. Figure 3 .

[0038] In this embodiment, when interconnected structural components overlap in the filter circuit, a damping resistor 60 with a different resistance value can be connected in series in the filter circuit. By changing the resistance value of the damping resistor 60, the equivalent resistance of the filter circuit can be changed, thereby effectively solving the EMI resonance problem of the filter. The resistance value of the damping resistor 60 can be adjusted by adding conductive coatings, conductive plating, conductive doping, increasing or decreasing the material volume, so that the overlap impedance between interconnected structural components can be precisely adjusted within the range of a few tenths of an ohm to several ohms.

[0039] In practical applications, the damping resistor 60 can be placed between interconnected structural components, or on the surface or inside at least one of the conductive busbar 10, conductive connector 20, capacitor 30, and grounding component 50, as long as the resistance of the filter circuit can be adjusted through the damping resistor 60. The main function of the damping resistor 60 is to achieve impedance matching in the circuit. Its working principle is to place a resistor with appropriate impedance in the signal transmission path to produce a damping effect and dissipate the excess energy generated by resonance.

[0040] The conductive busbar 10 can be made of copper or aluminum.

[0041] The conductive connector 20 can be a spring, a steel sheet, or other conductive component, as long as it can connect with the conductive busbar 10, the capacitor 30, and the housing 200.

[0042] The conductive connector 20 and the conductive busbar 10 can be connected by screws, adhesive, welding, or other methods to achieve a conductive connection. Furthermore, the conductive connector 20 and the capacitor 30 can be connected by adhesive, welding, screws, or other methods to achieve a conductive connection. The grounding component 50 used between the conductive connector 20 and the housing 200 can be a screw, or a structural component such as an adhesive layer or a weld layer.

[0043] The capacitor 30 can be a Y capacitor 30, specifically a feedthrough capacitor or a finished capacitor.

[0044] Please see Figure 1 In one embodiment of this utility model, at least one of the following is provided with a damping resistor 60: between the conductive busbar 10 and the conductive connector 20, between the conductive connector 20 and the capacitor 30, between the conductive connector 20 and the housing 200, and between the grounding member 50 and the housing 200.

[0045] This configuration, by placing the damping resistor 60 between at least one of the following: between the conductive busbar 10 and the conductive connector 20, between the conductive connector 20 and the capacitor 30, between the conductive connector 20 and the housing 200, and between the grounding component 50 and the housing 200, fills the spaces between interconnected structural components. This design facilitates the series connection of the damping resistor 60 in the filter circuit, allowing the resistance of the filter circuit to be adjusted according to the actual path. The design of the damping resistor 60 can dissipate some of the energy in the filter circuit, thereby reducing the oscillations generated in the filter circuit and achieving resonance suppression, thus effectively solving the EMI resonance problem of the filter.

[0046] In some embodiments, conductive material can be filled into at least one of the following: between the conductive busbar 10 and the conductive connector 20, between the conductive connector 20 and the capacitor 30, between the conductive connector 20 and the housing 200, and between the grounding member 50 and the housing 200, to form a damping resistor 60, the overlap impedance of which can be adjusted by increasing or decreasing the volume of the material used.

[0047] In other embodiments, a material with different conductivity is used as a damping resistor 60 to control the overlap impedance between the conductive bus 10 and the conductive overlap 20, between the conductive overlap 20 and the capacitor 30, between the conductive overlap 20 and the housing 200, and between the grounding member 50 and the housing 200.

[0048] In some other embodiments, conductive materials with different coatings are filled into at least one of the following: between the conductive busbar 10 and the conductive overlap 20, between the conductive overlap 20 and the capacitor 30, between the conductive overlap 20 and the housing 200, and between the grounding member 50 and the housing 200, to form a damping resistor 60, and the overlap impedance is adjusted by changing the coating material.

[0049] In another embodiment, conductive materials with different conductive coatings are filled into at least one of the following: between the conductive busbar 10 and the conductive connector 20, between the conductive connector 20 and the capacitor 30, between the conductive connector 20 and the housing 200, and between the grounding member 50 and the housing 200, thereby adjusting the overlap impedance by changing the coating material.

[0050] In another embodiment, conductive materials with different conductive doping ratios are filled into at least one of the following: between the conductive busbar 10 and the conductive connector 20, between the conductive connector 20 and the capacitor 30, between the conductive connector 20 and the housing 200, and between the grounding member 50 and the housing 200, thereby adjusting the connection impedance by changing the doping material.

[0051] In another embodiment, by filling the damping resistor 60 into at least one of the following: between the conductive busbar 10 and the conductive overlap member 20, between the conductive overlap member 20 and the capacitor 30, between the conductive overlap member 20 and the housing 200, and between the grounding member 50 and the housing 200, the overlap impedance can be adjusted by flexibly controlling the overlap area. For example, the area of ​​the conductive material can be cut according to requirements to control the overlap area.

[0052] Please see Figure 2 In another embodiment of the present invention, at least one of the conductive busbar 10, conductive connector 20, capacitor 30 and grounding member 50 is provided with a damping resistor 60 on its surface.

[0053] By designing the damping resistor 60 on the surface of at least one of the conductive busbar 10, conductive connector 20, capacitor 30, and grounding component 50, the damping resistor 60 can be used to manufacture the corresponding structural components. The connector impedance can be adjusted by changing the impedance of the corresponding structural components. Similarly, the resistance of the filter circuit can be adjusted according to the actual path. The design of the damping resistor 60 can consume part of the energy in the filter circuit, thereby reducing the oscillation generated in the filter circuit and achieving the effect of resonance suppression, thus effectively solving the EMI resonance problem of the filter.

[0054] Please see Figures 1 to 2 In one embodiment of this utility model, the damping resistor 60 is at least one of conductive adhesive, conductive pad, conductive rubber, conductive cloth, and conductive paste.

[0055] With this setup, at least one of conductive adhesive, conductive rubber, conductive cloth, or conductive paste can be used as the damping resistor 60, which can not only effectively adjust the resistance of the filter circuit, but also has a relatively low material cost.

[0056] Conductive adhesive is an adhesive that exhibits conductivity after curing or drying. It can connect various conductive materials together, creating an electrical path between the connected materials. Conductive adhesive mainly consists of a resin matrix, conductive particles, dispersing additives, and auxiliaries. The matrix primarily includes epoxy resin, acrylate resin, and polyurethane. This solution utilizes a conductive adhesive with an existing composition.

[0057] Conductive rubber can specifically include graphite nickel-plated silicone rubber, silver-filled silicone rubber, aluminum silver-plated silicone rubber, nickel silver-plated silicone rubber, copper silver-plated silicone rubber, graphite silicone rubber, pure silver silicone rubber, etc.

[0058] Conductive cloth can be specifically gold-plated conductive cloth, carbon-plated conductive cloth, nickel-plated conductive cloth, etc.

[0059] Conductive paste can specifically be conductive paste containing metal powders such as silver, copper, and nickel.

[0060] Please see Figures 1 to 2 In one embodiment of this utility model, the damping resistor 60 includes one or at least two conductive coating layers.

[0061] With this setup, different layers of conductive coating can be selected according to the actual path, and a damping resistor 60 with an appropriate resistance value can be connected in series in the filter circuit. This can effectively consume some of the energy in the filter circuit, reduce the oscillation generated in the filter circuit, and achieve the effect of resonance suppression, thereby effectively solving the EMI resonance problem of the filter.

[0062] The conductive coating can be a graphene coating, an indium tin oxide coating, etc.

[0063] Please see Figures 1 to 2 In one embodiment of this utility model, the damping resistor 60 includes one or at least two conductive plating layers.

[0064] With this setup, different numbers of conductive coating layers can be selected according to the actual path. Similarly, a damping resistor of appropriate resistance value 60 can be connected in series in the filter circuit, which can effectively consume some of the energy in the filter circuit, reduce the oscillation generated in the filter circuit, and play a role in resonance suppression, thereby effectively solving the EMI resonance problem of the filter.

[0065] Conductive plating can specifically include gold plating, silver plating, copper plating, tin plating, alloy plating, chemical plating, electroplating, etc.

[0066] Please see Figures 1 to 2 In one embodiment of this utility model, the filter circuit is further provided with a conductive connector 70, and the conductive busbar 10 is electrically connected to the conductive connector 20 through the conductive connector 70.

[0067] This configuration, through the design of the conductive connector 70, makes it easier to achieve the conductive connection between the conductive busbar 10 and the conductive overlap member 20.

[0068] The conductive connector 70 can specifically be a structural component such as a screw, glue, or solder.

[0069] Please see Figures 1 to 2 In one embodiment of this utility model, the conductive connector 70 and / or the grounding connector 50 are screws.

[0070] This configuration, using screws as conductive connectors 70, ensures a reliable connection between the conductive busbar 10 and the conductive connector 20 while effectively guaranteeing their conductivity. Similarly, using screws as grounding connectors 50 ensures a reliable connection between the conductive connector 20 and the housing 200 while effectively guaranteeing their grounding conductivity.

[0071] Please see Figures 1 to 2 In one embodiment of this utility model, the conductive connector 20 is a spring sheet.

[0072] With this configuration, by using a spring sheet as the conductive connector 20, the conductive connector 20 can have a certain buffering effect, and can absorb vibration waves in a vibrating environment, thereby improving the connection reliability between the conductive connector 20 and the conductive busbar 10, capacitor 30, housing 200 and other structures.

[0073] Please see Figures 1 to 2 In one embodiment of this utility model, an adhesive dotting component 90 is provided between the conductive connector 20 and the capacitor 30.

[0074] Related technologies typically use soldering to connect capacitor 30 and conductive connector 20. However, because soldering requires high temperatures, the overlap area cannot be flexibly controlled, easily increasing the inductance of the filter circuit. Therefore, this solution uses adhesive dispensing to connect capacitor 30 and conductive connector 20, forming an adhesive dispensing element 90 between them. This method effectively avoids the problem of soldering easily increasing the inductance of the filter circuit under high-temperature conditions.

[0075] This utility model also proposes an electrical device 1000, which includes a filter and a resonance suppression device 100. The specific structure of the resonance suppression device 100 is as described in the above embodiments. Since this electrical device 1000 adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here. The filter includes a housing 200, which is electrically connected to the capacitor 30 through a grounding member 50 and a conductive connecting member 20.

[0076] In practical applications, this electrical equipment can be used in vehicles, medical devices, military equipment, and other equipment with high electromagnetic compatibility requirements.

[0077] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A resonance suppression device, characterized by comprising: include: Conductive busbar; A conductive connector, wherein the conductive connector is electrically connected to the conductive busbar; A capacitor is electrically connected to the conductive busbar via the conductive connector; the capacitor is electrically connected to the filter housing via a grounding member and the conductive connector. The conductive busbar, the conductive connector, the capacitor, and the grounding component form a filter circuit, and a damping resistor is connected in series in the filter circuit.

2. The resonance suppression device of claim 1, wherein At least one of the following is provided: between the conductive busbar and the conductive connector, between the conductive connector and the capacitor, between the conductive connector and the housing, and between the grounding member and the housing.

3. The resonance suppression device of claim 1, wherein The surface of at least one of the conductive busbar, the conductive connector, the capacitor, and the grounding member is provided with the damping resistor.

4. The resonance suppression device according to any one of claims 1 to 3, characterized in that, The damping resistor is at least one of conductive adhesive, conductive rubber, conductive cloth, and conductive paste.

5. The resonance suppression device according to any one of claims 1 to 3, wherein The damping resistor includes one or at least two conductive coating layers; Alternatively, the damping resistor may comprise one or at least two conductive plating layers.

6. The resonance suppression device according to any one of claims 1 to 3, wherein The filter circuit is also provided with a conductive connector, and the conductive busbar is electrically connected to the conductive connector through the conductive connector.

7. The resonance suppression device of claim 6, wherein The conductive connector and / or the grounding component is a screw.

8. The resonance suppression device according to any one of claims 1 to 3, wherein The conductive connector is a spring.

9. The resonance suppression device according to any one of claims 1 to 3, wherein An adhesive dispensing component is provided between the conductive connector and the capacitor.

10. An electrical device, characterized by The device includes a filter and a resonance suppression device as described in any one of claims 1 to 9, wherein the filter includes a housing that is electrically connected to the capacitor via the grounding member and the conductive connector.

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