A device for removing adhesive residue during circuit board processing

Abstract

This utility model discloses a glue residue removal device for circuit board processing, belonging to the field of circuit board processing. It includes a water storage tank, a support frame fixedly installed on the outer wall of the water storage tank, a circular track fixedly installed on the support frame, and four sets of plate placement units evenly arranged on the circular track. Each set of plate placement units includes two unwinding shafts, which are fixedly connected to the plate placement frame by ropes. A swelling tank, an oxidation tank, and a neutralization tank are respectively placed below the three sets of plate placement units. Each of the swelling tank, oxidation tank, and neutralization tank includes a rotating stirring rod, and an elastic element is fixedly installed at the other end of the stirring rod. An electric heating rod and a temperature sensor are also installed in the swelling tank. Three sets of spray washing units are also fixedly installed on the support frame. Each set of spray washing units includes a water supply pipe connected to the water storage tank. Several spray washing pipes are connected to the water supply pipes, and the water outlet ends of the spray washing pipes are all connected to a nozzle.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing, specifically to a device for removing adhesive residue during circuit board processing. Background Technology

[0002] In PCB manufacturing, epoxy resin residue removal, also known as descaling, is a crucial step. Its main purpose is to remove molten epoxy resin (resin residue) remaining on the hole walls after drilling, as well as minor drilling contaminants on the edges of the inner copper rings. This provides a clean, activated hole wall surface with good micro-roughness for subsequent chemical copper plating or direct electroplating, ensuring reliable interlayer bonding after metallization.

[0003] The steps for removing epoxy resin residue include: chemical swelling, which involves using alkaline or solvent-based chemicals to soften the epoxy resin; oxidative removal, which involves using potassium permanganate or plasma treatment to oxidize and decompose the epoxy resin residue; and neutralization cleaning, which involves removing residual chemicals and neutralizing the pore walls.

[0004] Traditionally, circuit boards are manually immersed in solutions in swelling tanks, oxidation tanks, and neutralization tanks to remove adhesive. This not only increases the labor intensity of loading and unloading the boards and prolongs the time for removing adhesive residue, but also significantly reduces the adhesive removal efficiency of the circuit boards. During the immersion process, the circuit boards cannot be slightly shaken, resulting in insufficient contact between the solution and the drilled holes in the circuit boards. Utility Model Content

[0005] To address the traditional method of manually immersing circuit boards in solutions within swelling, oxidation, and neutralization tanks for adhesive removal, which not only increases the labor intensity of loading and unloading boards and prolongs the adhesive removal time, but also significantly reduces the adhesive removal efficiency, this invention provides an adhesive residue removal device for circuit board processing. Furthermore, the inability to allow slight shaking of the circuit board during immersion prevents sufficient contact between the solution and the drilled holes in the board.

[0006] A device for removing adhesive residue in circuit board processing includes a water storage tank. A support frame is fixedly installed on the outer wall of the water storage tank. A circular track is fixedly installed on the support frame. Four sets of plate placement units are evenly arranged on the circular track. Each set of plate placement units includes two unwinding shafts, which are fixedly connected to the plate placement frame by ropes. A swelling tank, an oxidation tank, and a neutralization tank are respectively placed below the three sets of plate placement units. Each of the swelling tank, oxidation tank, and neutralization tank includes a rotating stirring rod. An elastic element is fixedly installed at the other end of the stirring rod. An electric heating rod and a temperature sensor are also installed in the swelling tank. Three sets of spray washing units are also fixedly installed on the support frame. Each set of spray washing units includes a water supply pipe connected to the water storage tank. Several spray washing pipes are connected to the water supply pipes. The water outlet ends of the spray washing pipes are all connected to a nozzle.

[0007] More preferably, the support frame includes several crossbars fixedly installed on the side wall of the water storage tank, the other end of each crossbar being fixedly connected to an annular block, an annular track being fixedly installed at the bottom of the annular block, each set of plate units including a slide seat movably installed on the annular track, an mounting plate being fixedly installed at the bottom of the slide seat, two unwinding shafts rotating to be installed on the top wall of the mounting plate, both ends of the two unwinding shafts being fixedly wound with ropes, the lower ends of the ropes being fixedly connected to the top of the plate frame, and the plate frame having a grid structure.

[0008] More preferably, a synchronous gear is fixedly installed on the outer wall of both unwinding shafts, and two rotating shafts rotate parallel to the two unwinding shafts. Two drive gears are fixedly installed on the outer wall of each rotating shaft. Two drive gears are movably connected by a chain, and the other two drive gears are respectively meshed with two synchronous gears. One of the rotating shafts is fixedly connected to the output shaft of a servo motor installed on the top wall of the mounting plate.

[0009] More preferably, the swelling tank, oxidation tank, and neutralization tank are arranged adjacent to each other in three directions of the annular block. The bottom walls of the swelling tank, oxidation tank, and neutralization tank are all fixedly equipped with support blocks, and each is connected by a covered slag discharge pipe. Servo motors are mounted on the outer walls of the swelling tank, oxidation tank, and neutralization tank via mounting brackets. A stirring rod is fixedly mounted on the output end of the servo motor. The stirring rod has an asymmetrical rod-shaped structure and several elastic elements, all of which are fixedly mounted on the inner walls of the swelling tank, oxidation tank, and neutralization tank.

[0010] More preferably, the electric heating rod is fixedly installed on the bottom wall of the swelling tank, the probe end of the temperature sensor is installed through the inside of the swelling tank, and the output end of the temperature sensor is installed outside the swelling tank.

[0011] More preferably, the three sets of spray washing units are respectively set at the conveying ends of the swelling tank, oxidation tank and neutralization tank. Each of the three water supply pipes is equipped with a booster water pump. The tail ends of the three water supply pipes are fixedly set on the annular block. Inclined outward baffles are fixedly set on both sides of the bottom wall of the annular block, and the spraying end of the nozzle faces the outside of the baffle.

[0012] Compared with the prior art, the advantages of this utility model are: circuit boards can be placed in all four placement frames, and then transported along the circular track to the swelling tank where alkaline or solvent-based chemicals are used to soften the epoxy resin; the oxidation tank is used to oxidize and decompose the glue residue; the neutralization tank removes residual chemicals and neutralizes the hole walls; and the placement frames can be moved up and down with the help of the unwinding shaft and ropes, eliminating the need for repeated manual placement and rewinding of boards, saving time and manpower. In addition, the spray nozzles can be used to spray and wash the residual solution on the circuit boards during the movement, resulting in better removal of glue residue. Attached Figure Description

[0013] Figure 1 This is a top view of the structure of this utility model;

[0014] Figure 2 This is a front view schematic diagram of part of the structure of this utility model;

[0015] Figure 3 This is a top view of the structural plate unit of this utility model;

[0016] Figure 4 This is a schematic diagram of part A of the structure of this utility model;

[0017] Figure 5 This is a schematic diagram of part B of the structure of this utility model;

[0018] Figure 6 This is a schematic diagram of part C of the present invention;

[0019] Figure 7 This is a schematic diagram of part of the structure of this utility model (D).

[0020] Figure 8 This is a schematic diagram of part E of the structure of this utility model;

[0021] Figure 9 This is a schematic diagram of part of the structure F of this utility model.

[0022] In the diagram: 1. Water storage tank; 2. Support frame; 3. Circular track; 4. Unwinding shaft; 5. Rope; 6. Placing plate frame; 7. Swelling tank; 8. Oxidation tank; 9. Neutralization tank; 10. Stirring rod; 11. Elastic element; 12. Electric heating rod; 13. Temperature sensor; 14. Water supply pipe; 15. Spraying pipe; 16. Nozzle; 17. Crossbar; 18. Circular block; 19. Slide seat; 20. Mounting plate; 21. Synchronous gear; 22. Rotating shaft; 23. Drive gear; 24. Chain; 25. Servo motor; 26. Support block; 27. Slag discharge pipe; 28. Booster pump; 29. ​​Water baffle. Detailed Implementation

[0023] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0024] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of the utility model described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0025] In this invention, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this invention and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0026] Furthermore, some of the aforementioned terms, besides indicating location or positional relationships, may also have other meanings. For example, the term "above" may, in certain circumstances, indicate a dependency or connection. Those skilled in the art can understand the specific meaning of these terms in this utility model based on the specific circumstances. Additionally, the term "multiple" should mean two or more.

[0027] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments of the present invention can be combined with each other. The following will refer to the accompanying drawings. Figures 1-9 The present invention will be described in detail with reference to the embodiments.

[0028] A device for removing adhesive residue during circuit board processing includes a water tank 1. A covered water inlet pipe is installed through the top of the water tank 1, allowing clean water to be added to the tank for spraying and washing the circuit boards. A support frame 2 is fixedly installed on the outer wall of the water tank 1, and a circular track 3 is fixedly installed on the support frame 2. Four sets of plate placement units are evenly arranged on the circular track 3. The support frame 2 includes several crossbars 17 fixedly installed on the side wall of the water tank 1, and the other end of each crossbar 17 is fixedly connected to a ring block 18. The circular track 3 is fixedly installed at the bottom of the ring block 18. The circular track 3 is a closed-loop circular track in the prior art, driven by a servo motor and a precision reducer, with a gear and rack transmission mechanism, a high-resolution encoder and a grating ruler for high-precision positioning feedback, and a PLC plus motion control module as the control system. Each set of plate placement units includes a slide 19 movably installed on the circular track 3. The slide 19 can be intermittently stopped at fixed positions on the four sides of the circular track 3 by the PLC plus motion control module.

[0029] Each set of plate placement units includes two unwinding shafts 4, which are fixedly connected to the plate placement frame 6 by ropes 5. The bottom of the slide 19 is fixedly provided with an installation plate 20. The two unwinding shafts 4 are rotated to be set on the top wall of the installation plate 20. Both ends of the two unwinding shafts 4 are fixedly wound with ropes 5. The lower end of the ropes 5 is fixedly connected to the top of the plate placement frame 6. The plate placement frame 6 is a grid structure.

[0030] The placement frame 6 is used to place the circuit board. The grid structure facilitates contact between the solution and the circuit board. By winding the rope 5 up and down, the placement frame 6 can be moved up and down, thereby causing the circuit board to be immersed in the solution or carried away from the swelling tank 7, oxidation tank 8 and neutralization tank 9.

[0031] Below the three sets of board placement units are respectively a swelling tank 7, an oxidation tank 8, and a neutralization tank 9. The swelling tank 7 is filled with an alkaline solution (such as NaOH) or a solvent to expand the glue residue; the oxidation tank 8 is filled with a potassium permanganate (KMnO4) solution to oxidize and decompose the glue residue; the neutralization tank 9 is filled with a reducing agent (such as oxalic acid) to neutralize the potassium permanganate remaining in the circuit board. The board placement frame 6 carries the circuit board through the swelling tank 7, oxidation tank 8, and neutralization tank 9 in sequence to obtain a clean circuit board, which is then collected.

[0032] Two unwinding shafts 4 are each fixedly equipped with a synchronous gear 21 on their outer walls. Two rotating shafts 22 rotate parallel to the two unwinding shafts 4. Each rotating shaft 22 is fixedly equipped with two drive gears 23 on its outer wall. Two drive gears 23 are movably connected by a chain 24. The other two drive gears 23 are respectively meshed with two synchronous gears 21. One of the rotating shafts 22 is fixedly connected to the output shaft of a servo motor 25 mounted on the top wall of the mounting plate 20.

[0033] The timing and duration of the forward and reverse rotation of the servo motor 25 can be controlled by the programming control module in the PLC control system. When the plate frame 6 moves above the swelling tank 7, oxidation tank 8 and neutralization tank 9, the servo motor 25 drives the unwinding shaft 4 to rotate, thereby causing the rope 5 to move downward and move the plate frame 6 into its interior. Conversely, after the circuit board has reacted with the solution, the plate frame 6 moves upward.

[0034] The swelling tank 7, oxidation tank 8 and neutralization tank 9 are arranged adjacent to each other in three directions of the annular block 18. The bottom walls of the swelling tank 7, oxidation tank 8 and neutralization tank 9 are all fixedly equipped with support blocks 26, and each is connected by a covered slag discharge pipe 27. The plate frame 6 moves down onto the support block 26. After the glue residue is removed, the cover on the slag discharge pipe 27 can be opened to discharge the solution.

[0035] The swelling tank 7, oxidation tank 8, and neutralization tank 9 all include a rotating stirring rod 10. An elastic element 11 is fixedly installed at the other end of the stirring rod 10. A servo motor 25 is installed on the outer wall of the swelling tank 7, oxidation tank 8, and neutralization tank 9 via a mounting bracket. The stirring rod 10 is fixedly installed on the output end of the servo motor 25. The stirring rod 10 has an asymmetrical rod-shaped structure. There are several elastic elements 11, all of which are fixedly installed on the inner wall of the swelling tank 7, oxidation tank 8, and neutralization tank 9.

[0036] During the soaking solution, the servo motor 25 is started, which drives the stirring rod 10 to rotate, thereby intermittently colliding with the side wall of the plate frame 6. When the plate frame 6 shakes, it collides with the elastic element 11 and then bounces back, achieving continuous shaking. This allows the circuit board to have sufficient contact with the solution. When the circuit board shakes, the solution in the drill hole can flow fully, driving the solution to remove glue residue.

[0037] An electric heating rod 12 and a temperature sensor 13 are also installed inside the swelling tank 7. The electric heating rod 12 is fixedly installed on the bottom wall of the swelling tank 7, and the sensing end of the temperature sensor 13 is installed through the inside of the swelling tank 7, while the output end of the temperature sensor 13 is located outside the swelling tank 7. After the electric heating rod 12 is connected to an external power source, it can heat the solution in the swelling tank 7, while the temperature sensor 13 can sense the temperature of the solution and control the temperature within 60-80℃.

[0038] Three sets of spray washing units are also fixedly installed on the support frame 2. Each set of spray washing units includes a water supply pipe 14 connected to the water storage tank 1. Several spray washing pipes 15 are connected to the water supply pipes 14. The water outlet ends of the spray washing pipes 15 are all connected to the nozzles 16. The three sets of spray washing units are respectively installed at the conveying ends of the swelling tank 7, oxidation tank 8 and neutralization tank 9. Each of the three water supply pipes 14 is equipped with a booster water pump 28. The tail ends of the three water supply pipes 14 are fixedly installed on the annular block 18. Inclined outward baffles 29 are fixedly installed on both sides of the bottom wall of the annular block 18. The spraying end of the nozzle 16 faces the outside of the baffle 29.

[0039] During the transportation process, the booster water pump 28 is started, so that the water supply pipe 14 can transport the clean water in the water storage tank 1 to several spray pipes 15, and then spray it onto the circuit board through the nozzle 16 to clean the residual solution on the surface of the circuit board. The baffle plate 29 can ensure that the water will not spray onto the mounting plate 20. A water collection tank is movably placed below the nozzle 16, which can be used to receive wastewater.

[0040] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A glue residue removing device for a wiring board processing, comprising a water storage tank (1), characterized in that: A support frame (2) is fixedly installed on the outer wall of the water storage tank (1). A ring track (3) is fixedly installed on the support frame (2). Four sets of plate placement units are evenly arranged on the ring track (3). Each set of plate placement units includes two unwinding shafts (4). The two unwinding shafts (4) are fixedly connected to the plate placement frame (6) by ropes (5). Swelling tank (7), oxidation tank (8), and neutralization tank (9) are placed below the three sets of plate placement units respectively. The swelling tank (7), oxidation tank (8), and neutralization tank (9) all include A rotating stirring rod (10) is provided, and an elastic element (11) is fixedly provided at the other end of the stirring rod (10). An electric heating rod (12) and a temperature sensor (13) are also provided in the swelling tank (7). Three sets of spray washing units are also fixedly provided on the support frame (2). Each set of spray washing units includes a water supply pipe (14) that is connected to the water storage tank (1). Several spray washing pipes (15) are connected to the water supply pipe (14). The water outlet ends of the spray washing pipes (15) are all connected to the nozzles (16).

2. The glue residue removing device for processing a wiring board according to claim 1, characterized by: The support frame (2) includes several horizontal bars (17) fixedly installed on the side wall of the water storage tank (1). The other end of each horizontal bar (17) is fixedly connected to the ring block (18). The ring track (3) is fixedly installed at the bottom of the ring block (18). Each set of plate units includes a slide (19) movably installed on the ring track (3). The bottom end of the slide (19) is fixedly installed with an installation plate (20). Two unwinding shafts (4) rotate to the top wall of the installation plate (20). Both ends of the two unwinding shafts (4) are fixedly wound with ropes (5). The lower end of the ropes (5) is fixedly connected to the top of the plate frame (6). The plate frame (6) is a grid structure.

3. The adhesive residue removal device for circuit board processing according to claim 2, characterized in that: Two unwinding shafts (4) are fixedly equipped with synchronous gears (21) on their outer walls. Two rotating shafts (22) rotate parallel to the two unwinding shafts (4). Two driving gears (23) are fixedly equipped on the outer wall of each rotating shaft (22). The two driving gears (23) are movably connected by a chain (24). The other two driving gears (23) are respectively meshed with the two synchronous gears (21). One of the rotating shafts (22) is fixedly connected to the output shaft of a servo motor (25) mounted on the top wall of the mounting plate (20).

4. The glue residue removing device for processing a wiring board according to claim 2, characterized by: The swelling tank (7), oxidation tank (8) and neutralization tank (9) are arranged adjacent to each other in three directions of the annular block (18). The bottom walls of the swelling tank (7), oxidation tank (8) and neutralization tank (9) are all fixedly equipped with support blocks (26), and all are connected by covered slag discharge pipes (27). The outer walls of the swelling tank (7), oxidation tank (8) and neutralization tank (9) are all equipped with servo motors (25) through mounting brackets. The stirring rod (10) is fixedly installed on the output end of the servo motor (25). The stirring rod (10) is an asymmetrical rod structure. There are several elastic elements (11), which are all fixedly installed on the inner walls of the swelling tank (7), oxidation tank (8) and neutralization tank (9).

5. The glue residue removing device for processing a wiring board according to claim 4, characterized in that: The electric heating rod (12) is fixedly installed on the bottom wall of the swelling tank (7), the detection end of the temperature sensor (13) is installed inside the swelling tank (7), and the output end of the temperature sensor (13) is installed outside the swelling tank (7).

6. The glue residue removing device for processing a wiring board according to claim 2, characterized by: The three sets of spray washing units are respectively set at the conveying ends of the swelling tank (7), oxidation tank (8) and neutralization tank (9). Each of the three water supply pipes (14) is equipped with a booster water pump (28). The tail ends of the three water supply pipes (14) are fixedly set on the annular block (18). The bottom walls of the annular block (18) are fixedly set with outward-facing baffles (29). The spraying end of the nozzle (16) faces the outside of the baffle (29).

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