Heat dissipation device and electronic device

Abstract

This application provides a heat dissipation device and an electronic device, relating to the field of heat dissipation technology for electronic devices. The heat dissipation device includes a liquid cooling head and a heat exchanger; the liquid cooling head is plate-shaped, with one side surface of the liquid cooling head in a first direction for connecting to a first heat-generating component of the electronic device to dissipate heat from the first heat-generating component, and the other side surface for connecting to a second heat-generating component of the electronic device to dissipate heat from the second heat-generating component. A microchannel structure is provided inside the liquid cooling head, forming a liquid cooling channel for the flow of a cooling medium; the heat exchanger is connected to the inlet end and outlet end of the liquid cooling channel respectively to exchange heat with the cooling medium.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology for electronic devices, and more particularly to a heat dissipation device and electronic device. Background Technology

[0002] With the development of science and technology, the overall performance of electronic devices is improving day by day. The heat generated by the heat-generating components during operation has increased significantly, which puts forward higher requirements for efficient heat dissipation solutions that are integrated and compact within the limited volume of electronic devices. Utility Model Content

[0003] The purpose of this application is to provide a heat dissipation device and an electronic device, and the technical solution is as follows:

[0004] The first aspect of this application provides a heat dissipation device, comprising:

[0005] The liquid cooling head is plate-shaped. One side surface of the liquid cooling head in a first direction is used to connect to the first heat-generating component of the electronic device to dissipate heat from the first heat-generating component, and the other side surface is used to connect to the second heat-generating component of the electronic device to dissipate heat from the second heat-generating component. The liquid cooling head is provided with a microchannel structure, and a liquid cooling channel is formed in the microchannel structure for the flow of cooling medium.

[0006] The heat exchanger is connected to the inlet and outlet ends of the liquid cooling channel to exchange heat with the cooling medium.

[0007] In some embodiments, the aforementioned heat dissipation device includes a liquid cooling head comprising a first cold plate and a second cold plate spaced apart in a first direction, wherein the surface of the first cold plate facing away from the second cold plate is used to connect a first heating element, and the surface of the second cold plate facing away from the first cold plate is used to connect a second heating element; the microchannel structure includes a first structure and a second structure, wherein the first structure and the second structure are respectively disposed on the side of the first cold plate facing the second cold plate and the side of the second cold plate facing the first cold plate.

[0008] In some embodiments, the aforementioned heat dissipation device has an inlet end disposed on one side of the liquid cooling head in the second direction, and the cooling medium can be input into the liquid cooling channel through the inlet end along the second direction; the first structure includes a plurality of first fins spaced apart along the third direction, and the second structure includes a plurality of second fins spaced apart along the third direction; the second direction, the third direction, and the first direction are perpendicular to each other.

[0009] In some embodiments, the aforementioned heat dissipation device includes a hollow first fin and a second fin that are connected to a liquid cooling channel.

[0010] In some embodiments, the aforementioned heat dissipation device includes a plurality of first fins and a plurality of second fins spaced apart and symmetrically arranged along a first direction.

[0011] In some embodiments, the aforementioned heat dissipation device includes a plurality of first fins and a plurality of second fins interleaved with each other.

[0012] In some embodiments, the aforementioned heat dissipation device includes a first flow channel formed within a first structure and a second flow channel formed within a second structure; the microchannel structure further includes a third structure disposed between the first and second structures and connected to the first and second flow channels respectively to form a liquid cooling flow channel.

[0013] In some embodiments, the aforementioned heat dissipation device further includes a cooling fan, the air outlet of which faces or is away from the heat exchanger.

[0014] In some embodiments, the aforementioned heat dissipation device has an outlet end with a connector, the connector including a first port, a second port and a third port, the first port being connected to the outlet end, the second port being connected to the heat exchanger, and the third port being used for draining the cooling medium.

[0015] A second aspect of this application provides an electronic device, comprising:

[0016] First heating element;

[0017] Second heating element;

[0018] The heat dissipation device includes:

[0019] The liquid cooling head is plate-shaped. One side surface of the liquid cooling head in a first direction is used to connect to a first heating element to dissipate heat from the first heating element, and the other side surface is used to connect to a second heating element to dissipate heat from the second heating element. The liquid cooling head is provided with a microchannel structure, and a liquid cooling channel is formed in the microchannel structure for the flow of cooling medium.

[0020] The heat exchanger is connected to the inlet and outlet ends of the liquid cooling channel to exchange heat with the cooling medium.

[0021] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, the preferred embodiments of this application are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 The diagram schematically illustrates an isometric view of a heat dissipation device according to an embodiment of this application.

[0024] Figure 2 This schematically illustrates a structural diagram of the microchannel structure of a liquid cooling head of a heat dissipation device according to an embodiment of this application, viewed from a second direction.

[0025] Figure 3 This schematically illustrates a structural diagram of the microchannel structure of the liquid cooling head of another heat dissipation device according to an embodiment of this application, viewed from a second direction.

[0026] Figure 4 This schematic diagram illustrates the microchannel structure of a liquid cooling head of a heat dissipation device according to an embodiment of this application from a third-party perspective.

[0027] Figure 5 A partial structural diagram of a heat dissipation device according to an embodiment of this application is shown schematically;

[0028] Figure 6 The diagram illustrates an isometric view of a first heating element, a second heating element, and a heat dissipation device of an electronic device according to an embodiment of this application.

[0029] Explanation of icon numbers

[0030] 1. Heat dissipation device; 11. Liquid cooling head; 12. Heat exchanger; 13. Microchannel structure; 14. Cooling fan; 111. First cold plate; 112. Second cold plate; 131. First structure; 132. Second structure; 133. Inlet end; 134. Outlet end; 135. Third structure; 136. Liquid cooling channel; 1311. First fin; 1312. First channel; 1321. Second fin; 1322. Second channel; 1341. Connector; 1342. First port; 1343. Second port; 1344. Third port;

[0031] 2. First heating element;

[0032] 3. Second heating element;

[0033] A. First direction; B. Second direction; C. Third direction. Detailed Implementation

[0034] The embodiments of this disclosure will be further described in detail below with reference to the accompanying drawings and examples. The detailed description of the embodiments and the accompanying drawings are used to illustrate the principles of this disclosure by way of example, but should not be used to limit the scope of this disclosure. This disclosure can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0035] These embodiments are provided to make the disclosure thorough and complete, and to fully express the scope of the disclosure to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps, material composition, numerical expressions, and values ​​set forth in these embodiments should be interpreted as exemplary only and not as limiting.

[0036] It should be noted that, in the description of this disclosure, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationship, are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0037] Furthermore, the terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. "Vertical" is not strictly vertical, but within the permissible margin of error. "Parallel" is not strictly parallel, but within the permissible margin of error. Terms such as "including" or "contains" mean that the element preceding the word encompasses the element listed after the word, and do not exclude the possibility of encompassing other elements as well.

[0038] It should also be noted that, in the description of this disclosure, unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this disclosure depending on the specific circumstances. When a particular device is described as being located between a first device and a second device, an intermediary device may or may not be present between the particular device and the first or second device.

[0039] All terms used in this disclosure have the same meaning as understood by one of ordinary skill in the art to which this disclosure pertains, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant art, and not as idealized or highly formalized, unless expressly defined herein.

[0040] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, they should be considered part of the specification.

[0041] Example 1

[0042] like Figures 1 to 6 As shown, the first aspect of this application provides a heat dissipation device 1, including a liquid cooling head 11 and a heat exchanger 12. The liquid cooling head 11 is plate-shaped. One side surface of the liquid cooling head 11 in a first direction A is used to connect to a first heat-generating element 2 of an electronic device to dissipate heat from the first heat-generating element 2, and the other side surface is used to connect to a second heat-generating element 3 of an electronic device to dissipate heat from the second heat-generating element 3. A microchannel structure 13 is provided inside the liquid cooling head 11, and a liquid cooling channel 136 is formed inside the microchannel structure 13. The liquid cooling channel 136 is used to flow through a cooling medium. The heat exchanger 12 is connected to the inlet end 133 and the outlet end 134 of the liquid cooling channel 136 respectively to exchange heat with the cooling medium.

[0043] Specifically, this application includes a liquid cooling head 11, which is plate-shaped to facilitate arrangement within the internal space of the electronic device. By positioning the liquid cooling head 11 along a first direction A between the first heat-generating element 2 and the second heat-generating element 3 of the electronic device, one surface of the liquid cooling head 11 is in contact with the first heat-generating element 2, and the other surface is in contact with the second heat-generating element 3. This achieves simultaneous heat dissipation for both heat-generating elements, eliminating the need for a separate liquid cooling head 11 or other heat dissipation components for each heat-generating element, thus saving space within the electronic device. The first direction A can be the thickness direction of the plate-shaped liquid cooling head 11 to increase the contact area during contact with the two heat-generating elements.

[0044] The first heating element 2 and the second heating element 3 are components that generate heat within the electronic device. In some embodiments, the first heating element 2 can be a CPU (Central Processing Unit) and the second heating element 3 can be a GPU (Graphics Processing Unit); or the first heating element 2 can be a GPU and the second heating element 3 can be a CPU. The first heating element 2 and the second heating element 3 can also be a northbridge chip, a southbridge chip, a power module, a solid-state drive, a hardware accelerator, etc., and are not limited in specific design. The liquid cooling head 11 is positioned between the first heating element 2 and the second heating element 3 according to the heat dissipation requirements and arrangement of the components within the electronic device to meet the heat dissipation requirements.

[0045] This application incorporates a microchannel structure 13 within the liquid cooling head 11, forming liquid cooling channels 136. These channels 136 facilitate the flow of cooling medium. The microchannel structure 13 provides numerous tiny channels within the limited space of the liquid cooling head 11, integrating more heat exchange paths. The high-speed flow of the cooling medium within the microchannel structure 13 helps to rapidly disperse the heat transferred from both sides of the liquid cooling head 11 into the entire liquid cooling channel 136, improving heat exchange efficiency. The microchannel structure 13 can be divided into liquid cooling channels 136 by fins. The arrangement of the liquid cooling channels 136 can be parallel straight channels, wavy or serpentine channels, or intersecting or grid-like channels; the specific arrangement is not limited.

[0046] To facilitate heat exchange with the cooling medium within the liquid-cooled flow channel 136, this application includes a heat exchanger 12 connected to the inlet end 133 and outlet end 134 of the liquid-cooled flow channel 136 of the liquid cooling head 11 to form a circulation loop. This allows the cooling medium to exchange heat and then circulate back into the liquid-cooled flow channel 136 to continue dissipating heat from the heat-generating components. The heat exchanger 12 can be a plate-fin heat exchanger, a shell-and-tube heat exchanger, a spiral plate heat exchanger, an air cooler, or any other type, with no specific limitation. The heat exchanger 12 can be connected to the liquid-cooled flow channel 136 via a circulation pipeline to achieve heat exchange circulation of the cooling medium and meet heat dissipation requirements.

[0047] Furthermore, in the connection between the liquid cooling head 11 and the heat exchange component 12, this application can also adopt a pump-based solution. It can be a conventional pump-driven single-phase fluid circuit for cooling, or an integrated pipeline electromagnetic pump combined with magnetic fluid can be used to achieve circuit cooling, or a pump-driven two-phase fluid circuit can be used for cooling. The specific design is not limited, as long as it can be adapted to the internal microchannel structure 13 of the liquid cooling head 11 to keep the overall structure compact.

[0048] The first aspect of this application provides a heat dissipation device 1, including a liquid cooling head 11 and a heat exchanger 12. The liquid cooling head 11 is plate-shaped. One side surface of the liquid cooling head 11 is used to connect to a first heat-generating element 2 of an electronic device to dissipate heat from the first heat-generating element 2, and the other side surface is used to connect to a second heat-generating element 3 of the electronic device to dissipate heat from the second heat-generating element 3. A microchannel structure 13 is provided inside the liquid cooling head 11, and a liquid cooling channel 136 is formed inside the microchannel structure 13. The liquid cooling channel 136 is used to flow through a cooling medium. The heat exchanger 12 is connected to the inlet end 133 and the outlet end 134 of the liquid cooling channel 136 respectively to exchange heat with the cooling medium. This application achieves simultaneous heat dissipation for two heat-generating components by attaching them to both sides of a plate-shaped liquid cooling head 11, saving space and facilitating integrated and compact arrangement within the limited volume of electronic devices. Simultaneously, the liquid cooling head 11 incorporates a microchannel structure 13 to enhance the heat exchange efficiency between the internal cooling medium and the external heat-generating components, thereby strengthening heat dissipation. Furthermore, a heat exchange component 12 is connected to the liquid cooling channel 136 to achieve heat exchange circulation of the cooling medium, meeting heat dissipation requirements. Through the application of this application, highly efficient integrated and compact heat dissipation within the limited volume of electronic devices is achieved.

[0049] like Figures 1 to 4 As shown, in some embodiments, the liquid cooling head 11 includes a first cold plate 111 and a second cold plate 112 spaced apart in a first direction A. The surface of the first cold plate 111 facing away from the second cold plate 112 is used to connect the first heating element 2, and the surface of the second cold plate 112 facing away from the first cold plate 111 is used to connect the second heating element 3. The microchannel structure 13 includes a first structure 131 and a second structure 132, which are respectively disposed on the side of the first cold plate 111 facing the second cold plate 112 and the side of the second cold plate 112 facing the first cold plate 111.

[0050] Specifically, in order to achieve heat exchange between the first heating element 2 and the second heating element 3, the liquid cooling head 11 of this application includes a first cold plate 111 and a second cold plate 112 spaced apart in a first direction A. The first cold plate 111 is connected to the first heating element 2 through the surface of its opposite side from the second cold plate 112, and the second cold plate 112 is connected to the second heating element 3 through the surface of its opposite side from the first cold plate 111, so as to transfer and exchange heat generated by the two heating elements. The first cold plate 111 and the second cold plate 112 can provide good thermal conductivity and can be made of aluminum alloy, copper, copper-aluminum alloy, graphene material, etc., with no specific limitation.

[0051] The first cold plate 111 and the second cold plate 112 are spaced apart in a first direction A. A microchannel structure 13 is disposed between the first cold plate 111 and the second cold plate 112. The microchannel structure 13 includes a first structure 131 and a second structure 132. The first structure 131 is disposed on the side of the first cold plate 111 facing the second cold plate 112, and the second structure 132 is disposed on the side of the second cold plate 112 facing the first cold plate 111. This allows the first structure 131 and the second structure 132 to provide microchannels for targeted heat dissipation of the first heat-generating element 2 and the second heat-generating element 3. Furthermore, the arrangement of the first structure 131 and the second structure 132 between the first cold plate 111 and the second cold plate 112 can be adaptively adjusted to achieve better heat dissipation for the different heat dissipation power of the first heat-generating element 2 and the second heat-generating element 3.

[0052] like Figures 1 to 3 As shown, in some embodiments, the inlet end 133 is disposed on one side of the liquid cooling head 11 in the second direction B, and the cooling medium can be input into the liquid cooling channel 136 along the second direction B through the inlet end 133; the first structure 131 includes a plurality of first fins 1311 spaced apart along the third direction C, and the second structure 132 includes a plurality of second fins 1321 spaced apart along the third direction C; the second direction B, the third direction C and the first direction A are perpendicular to each other.

[0053] Specifically, this application sets the inlet end 133 of the liquid cooling channel 136 on one side of the liquid cooling head 11 in the second direction B. The first direction A can be the thickness direction of the plate-shaped liquid cooling head 11, and the second direction B is perpendicular to the first direction A. This arrangement of the inlet end 133 on the horizontal side of the liquid cooling head 11 facilitates the installation and connection of pipelines within the electronic device. Furthermore, the arrangement of the plate-shaped liquid cooling head 11 between two heat-generating components saves space within the electronic device. The cooling medium can be input into the liquid cooling channel 136 along the second direction B through the inlet end 133, guiding the cooling medium to be evenly distributed throughout the entire microchannel structure 13.

[0054] In this application, the first structure 131 includes a plurality of first fins 1311 spaced apart along a third direction C, and the second structure 132 includes a plurality of second fins 1321 spaced apart along a third direction C. The perpendicular arrangement of the second direction B, the third direction C, and the first direction A effectively utilizes the internal space of the liquid cooling head 11 to achieve uniform heat exchange in three dimensions. Simultaneously, the arrangement of the first fins 1311 and the second fins 1321 improves the arrangement efficiency of the microchannel structure 13 within the liquid cooling head 11, providing more microchannels. Furthermore, the gaps between the fins provide high-speed flow channels with low flow resistance for the cooling medium, helping to quickly disperse the heat transferred from the two surfaces of the liquid cooling head 11 into the entire liquid cooling flow channel 136, thus improving heat exchange efficiency. The structural forms of the first fins 1311 and the second fins 1321 can be straight fins, wavy fins, or serrated fins; the specific form is not limited.

[0055] In some embodiments, the first fin 1311 and the second fin 1321 are hollow to connect to the liquid cooling channel 136.

[0056] Specifically, this application makes the first fin 1311 and the second fin 1321 hollow, so that additional flow channels are formed in the first fin 1311 and the second fin 1321 to connect with the liquid cooling flow channel 136, thereby increasing the heat exchange area between the cooling medium and the first fin 1311 and the second fin 1321 and improving the heat exchange efficiency.

[0057] like Figure 2 As shown, in some embodiments, a plurality of first fins 1311 and a plurality of second fins 1321 are spaced apart and symmetrically arranged along a first direction A.

[0058] Specifically, in one embodiment, this application sets multiple first fins 1311 and multiple second fins 1321 spaced apart and symmetrically arranged along the first direction A, so that the heat transferred and exchanged can be evenly distributed in the liquid cooling head 11, avoiding local overheating. At the same time, the first fins 1311 and the second fins 1321 can evenly distribute and share the heat transferred and exchanged by the first heating element 2 and the second heating element 3, ensuring the heat dissipation effect.

[0059] like Figure 3 As shown, in some embodiments, a plurality of first fins 1311 and a plurality of second fins 1321 are interleaved.

[0060] Specifically, this application forms an interlaced microchannel structure 13 by interlacing multiple first fins 1311 and multiple second fins 1321, which can evenly distribute the heat generated by the first heating element 2 and the second heating element 3, thereby improving heat dissipation efficiency. The interlaced arrangement allows more heat exchange paths to be integrated within the limited space of the liquid cooling head 11, improving space utilization and reducing the arrangement space required for the liquid cooling head 11 in the first direction A. This is beneficial for the integrated and compact arrangement of the heat dissipation device 1 in electronic devices.

[0061] like Figure 4 As shown, in some embodiments, a first flow channel 1312 is formed in the first structure 131, and a second flow channel 1322 is formed in the second structure; the microchannel structure 13 also includes a third structure 135, which is disposed between the first structure 131 and the second structure 132, and is connected to the first flow channel 1312 and the second flow channel 1322 respectively to form a liquid cooling flow channel 136.

[0062] Specifically, this application further includes a third structure 135 within the microchannel structure 13, positioned between the first structure 131 and the second structure 132 to connect the first flow channel 1312 within the first structure 131 and the second flow channel 1322 within the second structure 132. The third structure 135 can be a chamber or channel structure corresponding to the cooling medium, providing an intermediate buffer zone for the flow of the cooling medium between the first flow channel 1312 and the second flow channel 1322. This buffers and controls the flow rate and velocity, ensuring uniform distribution of the cooling medium as it enters the next flow channel. Simultaneously, the third structure 135 reduces the formation of turbulence and eddies during the cooling medium's flow, minimizing pressure loss and thus ensuring the flow efficiency of the cooling medium and guaranteeing heat dissipation.

[0063] like Figure 1 As shown, in some embodiments, a cooling fan 14 is also included, with the air outlet of the cooling fan 14 facing or away from the heat exchanger 12.

[0064] Specifically, to achieve efficient heat exchange in the heat exchanger 12, this application also includes a cooling fan 14. The air outlet of the cooling fan 14 can face or move away from the heat exchanger 12, allowing the heat exchanger 12 to dissipate heat more quickly through airflow, meeting the heat exchange requirements of the cooling medium circulation and improving heat dissipation efficiency. When the air outlet of the cooling fan 14 faces the heat exchanger 12, the cooling fan 14 blows cool air towards the heat exchanger 12, enhancing the convective heat transfer efficiency between the cool air and the surface of the heat exchanger 12. When the air outlet of the cooling fan 14 moves away from the heat exchanger 12, it can draw away the hot air from the surface of the heat exchanger, thus achieving heat transfer. In this application, the cooling fan 14 can be an axial fan, a centrifugal fan, a cross-flow fan, etc., and is not limited to any specific type; it can be flexibly selected according to the structural layout within the electronic device.

[0065] like Figure 5 As shown, in some embodiments, the outlet end 134 is provided with a connector 1341, which includes a first port 1342, a second port 1343 and a third port 1344. The first port 1342 is connected to the outlet end 134, the second port 1343 is connected to the heat exchanger 12, and the third port 1344 is used for draining the cooling medium.

[0066] Specifically, in order to improve the flexibility and maintainability of the heat dissipation device 1, this application provides a connector 1341 at the outlet end 134. The connector 1341 may include a first port 1342, a second port 1343 and a third port 1344, so that the outlet end 134 is connected through the first port 1342, the second port 1343 is connected to the heat exchanger 12 to realize the circulation of cooling medium between the heat exchanger 12 and the liquid cooling head 11, and the third port 1344 can be used as an operation port when maintenance or replacement of cooling medium is required, so that the cooling medium can be discharged or injected through the third port 1344, thereby improving the convenience of maintenance. Furthermore, the number of ports of the connector 1341 provided in this application is not limited to three, and may include more ports, or other components may be connected to the third port 1344 to meet different needs for adjusting the pipeline of the heat dissipation device 1. For example, another heat exchange component may be connected to enable the cooling medium of the liquid cooling head 11 to achieve a dual circulation path, or a circulation pump may be connected to accelerate the circulation flow rate of the cooling medium, or a temperature sensor may be connected to achieve accurate monitoring of the heat dissipation process. The specifics are not limited and can be adjusted adaptively according to actual needs.

[0067] Example 2

[0068] like Figures 1 to 6As shown, a second aspect of this application provides an electronic device, including a first heating element 2, a second heating element 3, and a heat dissipation device 1; wherein the heat dissipation device 1 includes a liquid cooling head 11 and a heat exchanger 12; the liquid cooling head 11 is plate-shaped, one side surface of the liquid cooling head 11 in a first direction A is used to connect to the first heating element 2 for heat dissipation of the first heating element 2, and the other side surface is used to connect to the second heating element 3 for heat dissipation of the second heating element 3, a microchannel structure 13 is provided inside the liquid cooling head 11, and a liquid cooling channel 136 is formed inside the microchannel structure 13, the liquid cooling channel 136 is used to flow through a cooling medium; the heat exchanger 12 is respectively connected to the inlet end 133 and the outlet end 134 of the liquid cooling channel 136 for heat exchange with the cooling medium.

[0069] For details on the specific structure of the heat dissipation device 1, please refer to Embodiment 1, which will not be repeated here.

[0070] The first heating element 2 and the second heating element 3 are components that generate heat within the electronic device. In some embodiments, the first heating element 2 can be a CPU (Central Processing Unit) and the second heating element 3 can be a GPU (Graphics Processing Unit); or the first heating element 2 can be a GPU and the second heating element 3 can be a CPU. The first heating element 2 and the second heating element 3 can also be a northbridge chip, a southbridge chip, a power module, a solid-state drive, a hardware accelerator, etc., and are not limited in specific design. The liquid cooling head 11 is positioned between the first heating element 2 and the second heating element 3 according to the heat dissipation requirements and arrangement of the components within the electronic device to meet the heat dissipation requirements.

[0071] A second aspect of this application provides an electronic device, including a first heating element 2, a second heating element 3, and a heat dissipation device 1; wherein the heat dissipation device 1 includes a liquid cooling head 11 and a heat exchanger 12; the liquid cooling head 11 is plate-shaped, one side surface of the liquid cooling head 11 in a first direction A is used to connect to the first heating element 2 for heat dissipation of the first heating element 2, and the other side surface is used to connect to the second heating element 3 for heat dissipation of the second heating element 3, a microchannel structure 13 is provided inside the liquid cooling head 11, and a liquid cooling channel 136 is formed inside the microchannel structure 13, the liquid cooling channel 136 is used to flow through a cooling medium; the heat exchanger 12 is respectively connected to the inlet end 133 and the outlet end 134 of the liquid cooling channel 136 for heat exchange with the cooling medium. This application achieves simultaneous heat dissipation for two heat-generating components by attaching them to both sides of a plate-shaped liquid cooling head 11, saving space and facilitating integrated and compact arrangement within the limited volume of electronic devices. Simultaneously, the liquid cooling head 11 incorporates a microchannel structure 13 to enhance the heat exchange efficiency between the internal cooling medium and the external heat-generating components, thereby strengthening heat dissipation. Furthermore, a heat exchange component 12 is connected to the liquid cooling channel 136 to achieve heat exchange circulation of the cooling medium, meeting heat dissipation requirements. Through the application of this application, highly efficient integrated and compact heat dissipation within the limited volume of electronic devices is achieved.

[0072] The embodiments of this disclosure have now been described in detail. To avoid obscuring the concept of this disclosure, some details known in the art have not been described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein based on the above description.

[0073] While specific embodiments of this disclosure have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of this disclosure. Those skilled in the art should understand that modifications can be made to the above embodiments or equivalent substitutions can be made to some technical features without departing from the scope and spirit of this disclosure. In particular, as long as there is no structural conflict, the technical features mentioned in the various embodiments can be combined in any manner.

Claims

1. A heat dissipating device, characterized by, include: A liquid cooling head, which is plate-shaped, has one side surface of the liquid cooling head in a first direction for connecting to a first heat-generating component of an electronic device to dissipate heat from the first heat-generating component, and the other side surface for connecting to a second heat-generating component of the electronic device to dissipate heat from the second heat-generating component. The liquid cooling head is provided with a microchannel structure, and a liquid cooling channel is formed in the microchannel structure for the flow of a cooling medium. A heat exchanger is connected to the inlet and outlet ends of the liquid cooling channel to exchange heat with the cooling medium.

2. The heat dissipation device according to claim 1, characterized in that, The liquid cooling head includes a first cold plate and a second cold plate spaced apart in the first direction. The surface of the first cold plate facing away from the second cold plate is used to connect a first heating element, and the surface of the second cold plate facing away from the first cold plate is used to connect a second heating element. The microchannel structure includes a first structure and a second structure, wherein the first structure and the second structure are respectively disposed on the side of the first cold plate facing the second cold plate and the side of the second cold plate facing the first cold plate.

3. The heat dissipation device according to claim 2, characterized in that, The inlet end is located on one side of the liquid cooling head in the second direction, and the cooling medium can be input into the liquid cooling channel through the inlet end along the second direction; The first structure includes a plurality of first fins spaced apart along a third direction, and the second structure includes a plurality of second fins spaced apart along the third direction. The second direction, the third direction, and the first direction are perpendicular to each other.

4. The heat dissipation device according to claim 3, characterized in that, The first fin and the second fin are hollow to connect the liquid cooling channel.

5. The heat dissipation device according to claim 3, characterized in that, The plurality of first fins and the plurality of second fins are spaced apart and symmetrically arranged along the first direction.

6. The heat dissipation device according to claim 3, characterized in that, Multiple first fins and multiple second fins are interleaved.

7. The heat dissipation device according to claim 2, characterized in that, A first flow channel is formed within the first structure, and a second flow channel is formed within the second structure; The microchannel structure further includes a third structure, which is disposed between the first structure and the second structure and connects the first flow channel and the second flow channel to form the liquid cooling flow channel.

8. The heat dissipating device of claim 1, wherein, Also includes: A cooling fan, wherein the air outlet of the cooling fan faces or is away from the heat exchanger.

9. The heat dissipation device according to claim 1, characterized in that, The outlet end is provided with a connector, which includes a first port, a second port and a third port. The first port is connected to the outlet end, the second port is connected to the heat exchanger, and the third port is used for draining the cooling medium.

10. An electronic device, comprising: include: First heating element; Second heating element; A heat dissipation device, wherein the heat dissipation device includes: A liquid cooling head, which is plate-shaped, has one side surface of the liquid cooling head in a first direction for connecting to the first heating element to dissipate heat from the first heating element, and the other side surface for connecting to the second heating element to dissipate heat from the second heating element. The liquid cooling head is provided with a microchannel structure, and a liquid cooling channel is formed in the microchannel structure for the flow of a cooling medium. A heat exchanger is connected to the inlet and outlet ends of the liquid cooling channel to exchange heat with the cooling medium.

Images