An OLED substrate encapsulation assembly

Abstract

This utility model discloses an OLED substrate encapsulation assembly, comprising: a substrate, a display functional layer fixedly connected to the top of the substrate, and a cover plate snapped onto the top of the substrate; and a stabilizing assembly, the stabilizing assembly including a frame adhesive, the frame adhesive being fixedly connected to the outer sides of both sides of the display functional layer. This utility model improves the adhesion between the frame adhesive and the substrate by utilizing the strong adhesion between the silicon oxynitride layer and the frame adhesive material, thereby improving the encapsulation efficiency of the frame adhesive. Simultaneously, the combination of slots and blocks enhances stability during the assembly of the substrate and the cover plate, preventing detachment and cracking. The frame adhesive further enhances the stability of the overall device assembly process. Furthermore, the electroactive polymer layer can deform under the influence of an electric field. During encapsulation, by controlling the electric field applied to the electroactive polymer layer, the electroactive polymer layer can use mechanical pressure to expel residual gas from the encapsulation cavity between the display functional layer and the cover plate.

Description

Technical Field

[0001] This utility model relates to the field of packaging components for OLED substrates, specifically to a packaging component for an OLED substrate. Background Technology

[0002] OLED, or Organic Light-Emitting Diode, possesses characteristics such as self-illumination, high brightness, wide viewing angle, high contrast, flexibility, and low power consumption. As a new generation of display technology, it has gradually begun to replace traditional liquid crystal displays (LCDs) and is widely used in mobile phone screens, computer monitors, full-color televisions, and more.

[0003] The existing encapsulation process uses adhesive for encapsulation and adhesion, which results in poor stability of the overall encapsulation process and makes the whole device prone to cracking and falling off during subsequent use. Therefore, it is necessary to provide a new encapsulation component for OLED substrates to solve the above-mentioned technical problems. Utility Model Content

[0004] The purpose of this invention is to provide an OLED substrate encapsulation component that has the advantages of stable encapsulation to improve stability and filling and compaction to improve stability, thus solving the problems in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an OLED substrate encapsulation assembly, comprising: a substrate, a display functional layer fixedly connected to the top of the substrate, and a cover plate snapped onto the top of the substrate; a stabilizing assembly, comprising a frame adhesive fixedly connected to both sides of the display functional layer; and a protective assembly, comprising an upper flexible layer fixedly connected to the bottom of the cover plate. During the substrate encapsulation process, the strong adhesion between the silicon oxynitride layer and the frame adhesive material enhances the adhesion between the frame adhesive and the substrate, thereby improving the encapsulation efficiency. The combination of slots and blocks enhances stability during substrate and cover plate assembly, preventing detachment and cracking. The frame adhesive further improves overall device stability during assembly. The electroactive polymer layer deforms under an electric field; by controlling the applied electric field during encapsulation, mechanical pressure forces residual gas out of the encapsulation cavity between the display layer and cover plate, ensuring a pure vacuum and preventing external interference to the substrate, thus extending the lifespan of the display device.

[0006] Preferably, the stabilizing component further includes a silicon oxynitride layer, which is fixedly connected to the top of the display functional layer. By utilizing the strong adhesion between the silicon oxynitride layer and the frame adhesive material, the adhesion between the frame adhesive and the substrate is improved, thereby enhancing the encapsulation efficiency of the frame adhesive.

[0007] Preferably, the substrate has two slots inside, and the bottom of the cover plate is fixedly connected to two blocks. The combination of slots and blocks makes the substrate and cover plate more stable when assembled, avoiding detachment and cracks. Combined with frame adhesive, the overall device is more stable during assembly.

[0008] Preferably, two molding strips are fixedly connected to the top of the substrate, and the two molding strips are wrapped with a soft layer. The molding strips make the overall device more stable during use.

[0009] Preferably, the protective component further includes an electroactive polymer layer, which is fixedly connected to the bottom of the upper flexible layer. The electroactive polymer layer can deform under the action of an electric field. Thus, during encapsulation, by controlling the electric field applied to the electroactive polymer layer, the electroactive polymer layer can use mechanical pressure to squeeze out the residual gas in the encapsulation cavity between the display functional layer and the cover plate, ensuring a pure vacuum condition in the encapsulation cavity between the substrate and the cover plate, thereby avoiding external interference to the substrate and improving the lifespan of the display device.

[0010] Preferably, a transparent electrode layer is fixedly connected to the bottom of the electroactive polymer layer, and an insulating layer is fixedly connected to the bottom of the transparent electrode layer. The transparent electrode layer is made of a transparent conductive material, such as ITO or IZO, so as not to affect the display of the display function layer. After an electrical signal is applied to the transparent electrode layer, the electroactive polymer layer can undergo mechanical deformation under the action of an electric field, which can further clean up the residual gas inside the encapsulation cavity.

[0011] Preferably, a lower flexible layer is fixedly connected to the bottom of the transparent electrode layer. The combination of the lower flexible layer and the upper flexible layer can both protect the display functional layer when the substrate and the cover plate are assembled.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0013] I. In the process of encapsulating the substrate, this utility model improves the adhesion between the frame adhesive and the substrate by utilizing the strong adhesion between the silicon oxynitride layer and the frame adhesive material, thereby improving the encapsulation efficiency of the frame adhesive. At the same time, the combination of slots and blocks makes the assembly of the substrate and the cover plate more stable and avoids falling off and cracking. Combined with the frame adhesive, it makes the overall device more stable during assembly.

[0014] II. This utility model utilizes the fact that the electroactive polymer layer can deform under the action of an electric field. By controlling the electric field applied to the electroactive polymer layer during encapsulation, the electroactive polymer layer can squeeze out the residual gas in the encapsulation cavity between the display functional layer and the cover plate by mechanical pressure, ensuring a pure vacuum condition in the encapsulation cavity between the substrate and the cover plate, thereby avoiding external interference to the substrate and improving the lifespan of the display device. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the external structure of an OLED substrate encapsulation assembly according to the present invention.

[0016] Figure 2 This is a schematic diagram of the disassembly structure of an OLED substrate packaging assembly according to the present invention.

[0017] Figure 3 This is a schematic diagram of the external structure of the silicon oxynitride layer in the encapsulation assembly of an OLED substrate according to the present invention.

[0018] Figure 4 This is a disassembled structural diagram of the electroactive polymer layer 11 of the encapsulation component of an OLED substrate according to the present invention.

[0019] In the diagram: 1. Substrate; 2. Display functional layer; 3. Cover plate; 4. Frame adhesive; 5. Card slot; 6. Card block; 7. Molding strip; 8. Silicon oxynitride layer; 9. Lower flexible layer; 10. Upper flexible layer; 11. Electroactive polymer layer; 12. Transparent electrode layer; 13. Insulating layer. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figures 1 to 4This utility model provides a technical solution: an OLED substrate encapsulation assembly, comprising: a substrate 1, a display functional layer 2 fixedly connected to the top of the substrate 1, and a cover plate 3 clamped to the top of the substrate 1; a stabilizing assembly, comprising a frame adhesive 4 fixedly connected to the outer sides of the display functional layer 2; and a protective assembly, comprising an upper flexible layer 10 fixedly connected to the bottom of the cover plate 3. During the encapsulation process of the substrate 1, the strong adhesion between the silicon oxynitride layer 8 and the frame adhesive 4 material improves the adhesion between the frame adhesive 4 and the substrate 1, thereby improving the encapsulation efficiency of the frame adhesive 4. The combination of slot 5 and block 6 makes the assembly of substrate 1 and cover plate 3 more stable and prevents them from falling off and cracking. The frame adhesive 4 makes the overall device more stable during assembly. The electroactive polymer layer 11 can deform under the action of an electric field. By controlling the electric field applied to the electroactive polymer layer 11 during encapsulation, the electroactive polymer layer 11 can squeeze out the residual gas in the encapsulation cavity between the display function layer 2 and cover plate 3 by mechanical pressure, ensuring a pure vacuum condition in the encapsulation cavity between substrate 1 and cover plate 3, thereby avoiding interference to substrate 1 from the outside and improving the life of the display device.

[0022] Furthermore, the stabilizing component also includes a silicon oxynitride layer 8, which is fixedly connected to the top of the display functional layer 2. By utilizing the strong adhesion between the silicon oxynitride layer 8 and the frame adhesive 4 material, the adhesion between the frame adhesive 4 and the substrate 1 is improved, thereby enhancing the encapsulation performance of the frame adhesive 4.

[0023] Furthermore, two slots 5 are provided inside the substrate 1, and two blocks 6 are fixedly connected to the bottom of the cover plate 3. By combining the slots 5 and the blocks 6, the substrate 1 and the cover plate 3 can be more stable when assembled to avoid falling off and cracking. With the frame adhesive 4, the overall device can be more stable during assembly.

[0024] Furthermore, two molding strips 7 are fixedly connected to the top of the substrate 1. The two molding strips 7 are covered with a soft layer, which makes the whole device more stable during use.

[0025] Furthermore, a lower flexible layer 9 is fixedly connected to the bottom of the transparent electrode layer 12. The lower flexible layer 9 and the upper flexible layer 10 are used together to protect the display functional layer 2 when the substrate 1 and the cover plate 3 are assembled.

[0026] When the encapsulation assembly of this OLED substrate is used, the strong adhesion between the silicon oxynitride layer 8 and the frame adhesive 4 improves the adhesion between the frame adhesive 4 and the substrate 1, thereby improving the encapsulation efficiency of the frame adhesive 4. At the same time, the combination of the slot 5 and the block 6 makes the substrate 1 and the cover plate 3 more stable during assembly, preventing them from falling off and cracking. The frame adhesive 4 makes the overall device more stable during assembly.

[0027] Please see Figures 1 to 4 This utility model provides a technical solution: an OLED substrate encapsulation assembly, the protective assembly further includes an electroactive polymer layer 11, the electroactive polymer layer 11 is fixedly connected to the bottom of the upper flexible layer 10, the electroactive polymer layer 11 can deform under the action of an electric field, so that during encapsulation, by controlling the electric field applied to the electroactive polymer layer 11, the electroactive polymer layer 11 can squeeze out the residual gas in the encapsulation cavity between the display functional layer 2 and the cover plate 3 by mechanical pressure, ensuring the pure vacuum condition of the encapsulation cavity between the substrate 1 and the cover plate 3, thereby avoiding the substrate 1 from being interfered with by the outside world and improving the life of the display device.

[0028] Furthermore, a transparent electrode layer 12 is fixedly connected to the bottom of the electroactive polymer layer 11, and an insulating layer 13 is fixedly connected to the bottom of the transparent electrode layer 12. The transparent electrode layer 12 is made of a transparent conductive material, such as ITO or IZO, so as not to affect the display of the display function layer 2. After an electrical signal is applied to the transparent electrode layer 12, the electroactive polymer layer 11 can undergo mechanical deformation under the action of an electric field, which can further clean up the residual gas inside the encapsulation cavity.

[0029] When the OLED substrate encapsulation assembly is used, the electroactive polymer layer 11 can deform under the action of an electric field. Thus, by controlling the electric field applied to the electroactive polymer layer 11 during encapsulation, the electroactive polymer layer 11 can squeeze out the residual gas in the encapsulation cavity between the display function layer 2 and the cover plate 3 by mechanical pressure, ensuring a pure vacuum condition in the encapsulation cavity between the substrate 1 and the cover plate 3.

[0030] The standard parts used in this embodiment can be purchased directly from the market, while the non-standard structural parts described in the specification and drawings can be processed without any doubt based on existing technical common sense. At the same time, the connection methods of each component adopt mature conventional methods in the existing technology, and the machinery, parts and equipment all adopt conventional models in the existing technology, so they will not be described in detail here.

[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An encapsulation assembly of an OLED substrate, characterized in that, include: A substrate (1) is fixedly connected to a display function layer (2) on its top, and a cover plate (3) is snapped onto the top of the substrate (1). A stabilizing component, the stabilizing component including frame adhesive (4), the frame adhesive (4) being fixedly connected to the outer sides of the display functional layer (2); The protective component includes an upper flexible layer (10) which is fixedly connected to the bottom of the cover plate (3).

2. The encapsulation assembly of an OLED substrate according to claim 1, wherein: The stabilizing component also includes a silicon oxynitride layer (8), which is fixedly connected to the top of the display functional layer (2).

3. The encapsulation assembly of an OLED substrate according to claim 1, wherein: The substrate (1) has two slots (5) inside, and the bottom of the cover plate (3) is fixedly connected to two blocks (6).

4. The encapsulation assembly for the OLED substrate according to claim 1, characterized in that: Two molding strips (7) are fixedly connected to the top of the substrate (1), and the two molding strips (7) are wrapped with a soft layer.

5. The encapsulation assembly of the OLED substrate according to claim 1, wherein: The protective component also includes an electroactive polymer layer (11), which is fixedly connected to the bottom of the upper flexible layer (10).

6. The encapsulation assembly of the OLED substrate according to claim 5, wherein: A transparent electrode layer (12) is fixedly connected to the bottom of the electroactive polymer layer (11), and an insulating layer (13) is fixedly connected to the bottom of the transparent electrode layer (12).

7. The encapsulation assembly of an OLED substrate according to claim 6, wherein: The bottom of the transparent electrode layer (12) is fixedly connected to a lower flexible layer (9).

Images