Wafer adsorption stage

Abstract

The utility model provides a kind of wafer adsorption loading platform, it is related to the field of semiconductor testing technology, wafer adsorption loading platform includes chuck, fixed component and first vacuum joint.Chuck has adsorption surface, first fixed surface and first adsorption cavity, adsorption surface is used to fix wafer, and first adsorption cavity forms first fixed opening in fixed surface;Fixed component has second fixed surface, and second fixed surface is in contact with first fixed surface, to close first fixed opening;First vacuum joint inside is communicated with first adsorption cavity, for providing negative pressure for first adsorption cavity.The wafer adsorption loading platform in the utility model embodiment, the flatness of chuck is stronger under long-term work.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor testing technology, specifically to a wafer adsorption stage. Background Technology

[0002] In related technologies, chucks are used to support wafers, enabling them to adhere stably to a wafer mounting platform, facilitating subsequent probe measurements. To accommodate wafers of different sizes, chucks need to be replaced with different sizes. However, existing chucks are all fixed to the base with bolts, which not only makes disassembling the chuck difficult but also causes the bolts used to fix the chuck to exert localized pressure, making the chuck more prone to localized deformation and affecting its flatness during long-term operation. Utility Model Content

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a wafer adsorption stage with improved flatness during long-term operation.

[0004] According to a first aspect embodiment of the present invention, a wafer adsorption stage includes:

[0005] A chuck has an adsorption surface, a first fixing surface, and a first adsorption cavity. The adsorption surface is used to fix the wafer, and the first adsorption cavity forms a first fixing opening on the fixing surface.

[0006] A fixing component has a second fixing surface that contacts the first fixing surface to close the first fixing opening;

[0007] The first vacuum connector is internally connected to the first adsorption chamber and is used to provide negative pressure to the first adsorption chamber.

[0008] The wafer adsorption stage according to the embodiments of this utility model has at least the following beneficial effects: Since the first fixed opening of the first adsorption cavity is closed by the second fixed surface of the fixing component, and the first vacuum connector is only connected to the first adsorption cavity, when the first vacuum connector provides negative pressure to the first adsorption cavity, the external air pressure is greater than the air pressure of the first adsorption cavity. The chuck and fixing component that jointly seal the first adsorption cavity will be subjected to the external air pressure, and the chuck will be fixed on the second fixed surface by the pressure of the external gas towards the second fixed surface. The above solution applies pressure to the chuck as a whole by external air pressure, reducing the local compression of the chuck, which is beneficial to keep the chuck flat during long-term use, and the flatness of the chuck is stronger under long-term operation.

[0009] According to some embodiments of the present invention, the first adsorption chamber further includes an adsorption groove, the adsorption groove being annular, and the axis of the adsorption groove being parallel to the direction from the first fixed surface to the adsorption surface; the adsorption groove is recessed towards the inside of the chuck relative to the first fixed surface, so as to form a portion of the first fixed opening on the fixed surface.

[0010] According to some embodiments of the present invention, the fixing component includes a heating module, a heating plate, and a temperature sensor. The heating plate has a second fixing surface and a heating surface. The heating surface is located on the side of the heating plate opposite to the second fixing surface. The heating module is connected to the heating surface. The temperature sensor is connected to the heating plate and is used to monitor the temperature of the heating plate. The heating module can heat the heating plate according to the temperature monitored by the temperature sensor.

[0011] According to some embodiments of the present invention, the heating plate has a receiving groove, the receiving groove is disposed on the heating surface and recessed towards the second fixing surface, and the temperature sensor is received in the receiving groove.

[0012] According to some embodiments of the present invention, the heating surface has multiple heating areas; the heating module includes multiple heating elements, which are respectively connected to different heating areas; the fixing component also includes multiple temperature sensors, which are used to monitor the temperature of different heating areas; each heating element can heat the heating area connected to it according to the temperature monitored by the temperature sensor.

[0013] According to some embodiments of the present invention, the fixing component further includes a locking piece, which is detachably connected to the heating surface to clamp the heating module together with the heating surface, or to allow the heating module to be separated from the heating plate.

[0014] According to some embodiments of the present invention, the fixing assembly further includes a fixing plate and a plurality of heat insulation columns; the fixing plate is used to be installed to the frame and is located on one side of the heating plate in a first direction, the first direction being the direction from the second fixing surface to the heating surface, the heating surface being connected to the fixing plate through the heat insulation columns; the fixing assembly has a projection plane perpendicular to the first direction, the heat insulation columns having a first projection on the projection plane, the heating plate having a second projection on the projection plane, and the first projection being accommodated within the second projection.

[0015] According to some embodiments of the present invention, the chuck further has a second adsorption cavity, the second adsorption cavity forming a plurality of first adsorption holes on the adsorption surface; the wafer adsorption stage further includes a second vacuum connector, the interior of the second vacuum connector being in communication with the second adsorption cavity for providing negative pressure to the second adsorption cavity; the first adsorption cavity is isolated from the second adsorption cavity.

[0016] According to some embodiments of the present invention, the chuck further has a third adsorption cavity, wherein the third adsorption cavity forms a plurality of second adsorption holes on the adsorption surface; the wafer adsorption stage further includes a third vacuum connector, the interior of which communicates with the third adsorption cavity to provide negative pressure to the third adsorption cavity; the first adsorption cavity, the second adsorption cavity and the third adsorption cavity are isolated from each other;

[0017] The adsorption surface also has a first adsorption region and a second adsorption region, the second adsorption region being disposed outside the first adsorption region, the first adsorption pore being disposed in the first adsorption region, and the second adsorption pore being disposed in the second adsorption region.

[0018] According to some embodiments of the present invention, the second adsorption cavity forms a second fixed opening on the fixed surface; the second fixed surface contacts the first fixed surface to close the first fixed opening and the second fixed opening.

[0019] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0020] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0021] Figure 1 This is an overall schematic diagram of the wafer adsorption stage in some embodiments of this utility model;

[0022] Figure 2 for Figure 1 Explosion diagram of the mid-wafer adsorption stage;

[0023] Figure 3 for Figure 1 Cross-sectional schematic diagram of the wafer adsorption stage;

[0024] Figure 4 for Figure 3 A magnified view shown at point A in the middle;

[0025] Figure 5 for Figure 1 A schematic diagram of the chuck;

[0026] Figure 6 for Figure 5 A magnified view of a section at point B in the middle.

[0027] Figure label:

[0028] Wafer adsorption stage 10;

[0029] Chuck 100, adsorption surface 110, first adsorption area 111, second adsorption area 112, first adsorption hole 120, second adsorption hole 130, first fixing surface 140, first adsorption cavity 150, first fixing opening 151, adsorption groove 152, second adsorption cavity 160, second fixing opening 161, third adsorption cavity 170;

[0030] Fixing component 200, second fixing surface 210, heating module 220, heating element 221, heating plate 230, heating surface 231, receiving groove 232, temperature sensor 240, locking piece 250, fixing plate 260, heat insulation column 270;

[0031] First vacuum connector 300;

[0032] Second vacuum connector 400;

[0033] Third vacuum connector 500. Detailed Implementation

[0034] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0035] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0036] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0037] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0038] In the description of this utility model, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0039] Please refer to Figures 1 to 6 As shown, this utility model proposes a wafer adsorption stage 10, including a chuck 100, a fixing component 200 and a first vacuum connector 300.

[0040] Please refer to Figures 1 to 4 As shown, the chuck 100 of this utility model has an adsorption surface 110, a first fixing surface 140 and a first adsorption cavity 150.

[0041] The adsorption surface 110 of this invention is used to fix the wafer. It should be noted that this invention does not limit the method by which the wafer is fixed using the adsorption surface 110. Please refer to... Figure 1 , Figure 3 , Figure 4 , Figure 5 As shown, in some embodiments, the chuck 100 further includes a second adsorption cavity 160, which forms a plurality of first adsorption holes 120 on the adsorption surface 110. The wafer adsorption stage 10 also includes a second vacuum connector 400, the interior of which communicates with the second adsorption cavity 160 to provide negative pressure to the second adsorption cavity 160. Through the negative pressure provided by the second vacuum connector 400 to the second adsorption cavity 160, the first adsorption holes 120 communicating with the second adsorption cavity 160 can adsorb the wafer placed on the adsorption surface 110, thereby fixing the wafer.

[0042] The first adsorption chamber 150 of this invention forms a first fixed opening 151 on the fixed surface. The fixing assembly 200 has a second fixed surface 210, which contacts the first fixed surface 140 to close the first fixed opening 151. The interior of the first vacuum connector 300 is in communication with the first adsorption chamber 150 and is used to provide negative pressure to the first adsorption chamber 150.

[0043] With the above solution, since the first fixed opening 151 of the first adsorption chamber 150 is closed by the second fixed surface 210 of the fixed component 200, and the first vacuum connector 300 is only connected to the first adsorption chamber 150, when the first vacuum connector 300 provides negative pressure to the first adsorption chamber 150, the external air pressure is greater than the air pressure of the first adsorption chamber 150. The chuck 100 and the fixed component 200, which jointly seal the first adsorption chamber 150, will be subjected to the external air pressure. The chuck 100 will be fixed to the second fixed surface 210 by the pressure of the external gas directed towards it. This solution applies pressure to the chuck 100 as a whole through external air pressure, reducing localized compression on the chuck 100 and helping it maintain flatness during long-term use. The chuck 100 exhibits stronger flatness under long-term operation. On the other hand, when the chuck 100 needs to be disassembled, the operator only needs to close the first vacuum connector 300 and stop providing negative pressure to the first adsorption chamber 150 to separate the chuck 100 and the fixing component 200. When the chuck 100 needs to be installed, the operator only needs to place the chuck 100 on the second fixing surface 210 and start the first vacuum connector 300 to make the first adsorption chamber 150 have negative pressure, which will fix the chuck 100 on the second fixing surface 210. The disassembly and assembly of the chuck 100 are simplified.

[0044] Further, please refer to Figure 5 As shown, in some embodiments, the first adsorption chamber 150 further includes an adsorption groove 152, which is an annular groove recessed inward relative to the first fixing surface 140 and facing the chuck 100, forming part of the first fixing opening 151 on the first fixing surface 140. With this design, when the first vacuum connector 300 provides negative pressure to the first adsorption chamber 150, the external air pressure will compress the chuck 100 and the fixing assembly 200. The annular groove structure of the adsorption groove 152 helps to disperse the force of the external gas when the chuck 100 is subjected to external air pressure, thereby further reducing the local compression on the chuck 100 and improving the stability of the chuck 100.

[0045] Please refer to Figure 3 , Figure 4 As shown, in some embodiments, the fixing component 200 includes a heating module 220, a heating plate 230, and a temperature sensor 240. The heating plate 230 has a second fixing surface 210 and a heating surface 231. The heating surface 231 is located on the side of the heating plate 230 opposite to the second fixing surface 210. The heating module 220 is connected to the heating surface 231. The temperature sensor 240 is connected to the heating plate 230 and is used to monitor the temperature of the heating plate 230. The heating module 220 can heat the heating plate 230 according to the temperature monitored by the temperature sensor 240.

[0046] Through the above scheme, the heat transferred from the heating module 220 to the heating plate 230 can be transferred to the chuck 100, and then to the wafer fixed to the chuck 100, simulating the heat generation of the wafer during different working processes. Furthermore, since the temperature sensor 240 can monitor the temperature of the heating plate 230, the heating module 220 can adjust the heating power according to the temperature monitored by the temperature sensor 240, thereby adjusting the temperature of the wafer.

[0047] In existing technologies, to simulate the heat generated by a wafer during operation, a heating device for heating the chuck is installed on the existing wafer adsorption stage, along with a temperature sensor for detecting the wafer temperature, facilitating temperature control by the heating device. Some technologies place the temperature sensor directly within the chuck, allowing it to detect the chuck temperature. However, in this embodiment, the temperature sensor is connected to the heating plate, enabling more sensitive monitoring of the heating module's temperature and facilitating the heating module's own adjustment of heating power.

[0048] Based on the above plan, please refer to Figure 3 , Figure 4 As shown, in some embodiments, the heating plate 230 has a receiving groove 232, which is located on the heating surface 231 and recessed relative to the second fixing surface 210. The temperature sensor 240 is housed in the receiving groove 232. Through this design, the wafer adsorption stage 10 can utilize the internal space of the heating plate 230 to accommodate the temperature sensor 240, reducing the space occupied by the wafer adsorption stage 10. Furthermore, the shorter distance between the temperature sensor 240 housed in the receiving groove 232 and the heating plate 230 improves the accuracy of temperature monitoring and facilitates the adjustment of the heating power of the heating module 220.

[0049] It should be noted that this utility model does not limit the material of the heating plate 230. As a preferred embodiment, the heating plate 230 is made of a ceramic material with high insulation and high thermal conductivity. The above-mentioned ceramic material can further improve the heating rate of the heating plate 230 and can insulate the temperature sensor 240 from the outside. At the same time, the high hardness of the ceramic material is also beneficial to reduce the deformation of the heating plate 230 when subjected to external air pressure, improve the airtightness of the first adsorption cavity 150, reduce the risk of external gas entering the first adsorption cavity 150, and make the chuck 100 more stably fixed on the second fixing surface 210.

[0050] In some embodiments, the heating surface 231 has multiple heating areas (not shown in the figure); the heating module 220 includes multiple heating elements 221, which are respectively connected to different heating areas; the fixing assembly 200 also includes multiple temperature sensors 240, which are used to monitor the temperature of different heating areas; each heating element 221 can heat the heating area connected to it according to the temperature monitored by the temperature sensor 240. Through the above scheme, different heating elements 221 can heat the heating area connected to them during operation, thereby heating different parts of the heating plate 230. The heat from different parts of the heating plate 230 is sequentially transferred to the chuck 100 and the wafer, so that each part of the wafer receives heat from different heating elements 221, which is beneficial for adjusting the temperature of different areas of the wafer through multiple heating elements 221.

[0051] For example, in some embodiments, different wafers, due to their own design and environmental influences, have different heat dissipation properties in different parts of the wafer. This results in different temperatures in different parts of the chuck 100 and heating plate 230. Each heating element 221 can adjust its heating power according to the temperature of the heating plate 230 monitored by the temperature sensor 240, thereby reducing temperature differences across the heating plate 230 and making the temperatures of different parts of the wafer more similar, increasing the temperature uniformity across the wafer. The above embodiments facilitate workers in adjusting the overall temperature of the wafer and can identify areas with poor heat resistance by heating multiple heating elements 221, making wafer designers more efficient in analyzing the wafer.

[0052] In some embodiments, for different wafers, those skilled in the art can also adjust the parameters of each heating element 221 and temperature sensor 240 so that different parts of the wafer have different target temperatures, further simulating the temperature conditions of the wafer during operation.

[0053] Without departing from the inventive concept of this utility model, those skilled in the art can adjust the number of heating element 221, heating area, and temperature sensor 240. Please refer to... Figure 2 As shown, in some embodiments, the heating surface 231 is divided into 12 heating regions, the heating module 220 includes 12 heating elements 221, and the fixing assembly 200 includes 12 temperature sensors 240. Each temperature sensor 240 is used to monitor a different heating region. The heating elements 221 are connected to different heating regions and heat the heating region they are connected to according to the different temperature sensors 240. It should be noted that those skilled in the art can increase or decrease the number of heating elements 221, heating regions, and temperature sensors 240 according to the actual size of the wafer to be heated.

[0054] Further, please refer to Figure 2 As shown, in some embodiments, the fixing component 200 further includes a locking piece 250, which is detachably connected to the heating surface 231 to clamp the heating module 220 together with the heating surface 231, or to allow the heating module 220 to be separated from the heating plate 230. With this solution, when maintenance of the heating module 220 is required, the operator can remove the locking piece 250 and take the heating module 220 out separately for maintenance, which helps improve the maintenance efficiency of the heating module 220.

[0055] Please refer to Figure 3 , Figure 4 As shown, in some embodiments, the fixing assembly 200 further includes a fixing plate 260 and a plurality of heat-insulating columns 270; the fixing plate 260 is used to be mounted to the rack and is located on one side of the heating plate 230 in a first direction, the first direction being the direction from the second fixing surface 210 to the heating surface 231, and the heating surface 231 is connected to the fixing plate 260 through the heat-insulating columns 270; the fixing assembly 200 has a projection plane perpendicular to the first direction, the heat-insulating columns 270 have a first projection on the projection plane, and the heating plate 230 has a second projection on the projection plane, the first projection being accommodated within the second projection. Through the above scheme, the heating plate 230 can be fixed to the fixing plate 260 by the heat-insulating columns 270 connected to the heating surface 231, thereby allowing the entire wafer adsorption stage 10 to be fixed to the rack by the fixing plate 260. After the heating surface 231 receives the heat generated by the heating module 220, since the first projection is contained within the second projection on the projection plane perpendicular to the first direction, the heat gathered on the heating surface 231 is more likely to flow toward the heating plate 230, so that more of the heat from the heating module 220 is used to heat the wafer, reducing heat loss and improving the heating efficiency of the wafer adsorption stage 10.

[0056] It should be noted that this invention does not limit the material of the heat insulation column 270. To further reduce heat loss, those skilled in the art can use materials with low thermal conductivity to manufacture the heat insulation column 270.

[0057] Please refer to Figure 1 , Figure 3 , Figure 4 , Figure 5As shown, in some embodiments, the chuck 100 further includes a second adsorption cavity 160, which forms a plurality of first adsorption holes 120 on the adsorption surface 110; the wafer adsorption stage 10 also includes a second vacuum connector 400, the interior of which communicates with the second adsorption cavity 160 to provide negative pressure to the second adsorption cavity 160; the first adsorption cavity 150 is isolated from the second adsorption cavity 160. Through the negative pressure provided by the second vacuum connector 400 to the second adsorption cavity 160, the first adsorption holes 120 communicating with the second adsorption cavity 160 can adsorb the wafer placed on the adsorption surface 110, thereby fixing the wafer. Furthermore, since the first adsorption chamber 150 is isolated from the second adsorption chamber 160, the first vacuum connector 300 can stably provide negative pressure to the first adsorption chamber 150, preventing the first adsorption chamber 150 from receiving gas from the second adsorption chamber 160, thus preventing the external air pressure from dropping on the chuck 100, and ensuring that the chuck 100 can be firmly fixed on the second fixing surface 210.

[0058] Based on the above solution, those skilled in the art can further adjust the internal structure of the chuck 100.

[0059] As a preferred option, please refer to Figure 5 , Figure 6 As shown, in some embodiments, the chuck 100 further includes a third adsorption chamber 170, which forms a plurality of second adsorption holes 130 on the adsorption surface 110; the wafer adsorption stage 10 also includes a third vacuum connector 500, the interior of which communicates with the third adsorption chamber 170 to provide negative pressure to the third adsorption chamber 170. The first adsorption chamber 150, the second adsorption chamber 160, and the third adsorption chamber 170 are isolated from each other.

[0060] The negative pressure provided to the third adsorption chamber 170 by the third vacuum connector 500 allows the second adsorption hole 130, which is connected to the third adsorption chamber 170, to also adsorb the wafer placed on the adsorption surface 110. Furthermore, since the first adsorption chamber 150, the second adsorption chamber 160, and the third adsorption chamber 170 are isolated from each other, the first vacuum connector 300 can stably provide negative pressure to the first adsorption chamber 150, preventing the pressure in the first adsorption chamber 150 from rising due to receiving gas from the second adsorption chamber 160 and the third adsorption chamber 170. This, in turn, prevents the external air pressure from decreasing on the chuck 100, ensuring that the chuck 100 can be securely fixed on the second fixing surface 210.

[0061] On the other hand, the second vacuum connector 400 and the third vacuum connector 500 generate negative pressure on the second adsorption chamber 160 and the third adsorption chamber 170, respectively, thereby causing the second adsorption hole 130 and the third adsorption hole to adsorb the wafer, so that different parts of the wafer are adsorbed by different adsorption chambers. Those skilled in the art can enable or disable the second vacuum connector 400 and the third vacuum connector 500 as needed, thereby adjusting the adsorption state of the wafer.

[0062] Further, please refer to Figure 5 , Figure 6 As shown, in some embodiments, the adsorption surface 110 further includes a first adsorption region 111 and a second adsorption region 112. The second adsorption region 112 surrounds the outside of the first adsorption region 111. A first adsorption hole 120 is disposed in the first adsorption region 111, and a second adsorption hole 130 is disposed in the second adsorption region 112. When fixing the wafer, the operator can cover the center of the wafer with the first adsorption region 111 and fix the wafer by the adsorption effect of the second adsorption hole 130. When the wafer is large enough to cover the second adsorption region 112, the operator can also use a third vacuum connector 500 to assist in fixing the circumferential edge of the wafer by the adsorption effect of the second adsorption hole 130, further making the wafer more stably fixed on the adsorption surface 110.

[0063] As a preferred option, please refer to Figure 3 , Figure 4 As shown, in some embodiments, the second adsorption cavity 160 forms a second fixing opening 161 on the fixing surface. The second fixing surface 210 contacts the first fixing surface 140 to close the first fixing opening 151 and the second fixing opening 161.

[0064] With the above scheme, when the wafer is placed on the adsorption surface 110 and adsorbed by the second adsorption hole 130, the wafer will cover the second adsorption hole 130, so that the second adsorption cavity 160 is jointly sealed by the wafer, chuck 100 and heating plate 230. When the second vacuum connector 400 provides negative pressure to the second adsorption cavity 160, the external air pressure is greater than the air pressure of the second adsorption cavity 160. The chuck 100 and the fixing component 200 that jointly seal the second adsorption cavity 160 will be subjected to the external air pressure. The chuck 100 will be fixed on the second fixing surface 210 by the pressure of the external gas towards the second fixing surface 210. The above scheme further applies pressure to the chuck 100 as a whole by the external air pressure, so that the chuck 100 is more stably fixed on the heating plate 230.

[0065] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof can be combined with each other unless otherwise specified.

Claims

1. A wafer chucking stage, characterized by, include: A chuck has an adsorption surface, a first fixing surface, and a first adsorption cavity. The adsorption surface is used to fix the wafer, and the first adsorption cavity forms a first fixing opening on the fixing surface. A fixing component has a second fixing surface that contacts the first fixing surface to close the first fixing opening; The first vacuum connector is internally connected to the first adsorption chamber and is used to provide negative pressure to the first adsorption chamber.

2. The wafer chucking stage according to claim 1, wherein, The first adsorption chamber further includes an adsorption groove, which is annular and its axis is parallel to the direction from the first fixed surface to the adsorption surface; the adsorption groove is recessed inward relative to the first fixed surface toward the chuck to form a portion of the first fixed opening on the fixed surface.

3. The wafer chuck of claim 1, wherein The fixing component includes a heating module, a heating plate, and a temperature sensor. The heating plate has a second fixing surface and a heating surface. The heating surface is located on the side of the heating plate opposite to the second fixing surface. The heating module is connected to the heating surface. The temperature sensor is connected to the heating plate and is used to monitor the temperature of the heating plate. The heating module can heat the heating plate according to the temperature monitored by the temperature sensor.

4. The wafer chucking stage according to claim 3, wherein, The heating plate has a receiving groove, which is located on the heating surface and recessed towards the second fixing surface, and the temperature sensor is housed in the receiving groove.

5. The wafer chuck of claim 3, wherein the plurality of electrodes are arranged in a plurality of rows and columns. The heating surface has multiple heating areas; the heating module includes multiple heating elements, which are respectively connected to different heating areas; the fixing component also includes multiple temperature sensors, which are used to monitor the temperature of different heating areas; each heating element can heat the heating area connected to it according to the temperature monitored by the temperature sensor.

6. The wafer chuck of any one of claims 3 to 5, wherein, The fixing component also includes a locking piece, which is detachably connected to the heating surface to clamp the heating module together with the heating surface, or to allow the heating module to be separated from the heating plate.

7. The wafer chucking stage of claim 3, wherein, The fixing assembly further includes a fixing plate and a plurality of heat insulation columns; the fixing plate is used to be installed to the frame and is located on one side of the heating plate in a first direction, the first direction being the direction from the second fixing surface to the heating surface, the heating surface being connected to the fixing plate through the heat insulation columns; the fixing assembly has a projection plane perpendicular to the first direction, the heat insulation columns having a first projection on the projection plane, the heating plate having a second projection on the projection plane, and the first projection being accommodated within the second projection.

8. The wafer chuck of claim 1, wherein: The chuck also has a second adsorption chamber, in which a plurality of first adsorption holes are formed on the adsorption surface; the wafer adsorption stage also includes a second vacuum connector, the interior of which is connected to the second adsorption chamber to provide negative pressure to the second adsorption chamber; the first adsorption chamber is isolated from the second adsorption chamber.

9. The wafer chucking station of claim 8, wherein, The chuck also has a third adsorption chamber, which forms a plurality of second adsorption holes on the adsorption surface; the wafer adsorption stage also includes a third vacuum connector, the interior of which is connected to the third adsorption chamber to provide negative pressure to the third adsorption chamber; the first adsorption chamber, the second adsorption chamber and the third adsorption chamber are isolated from each other; The adsorption surface also has a first adsorption region and a second adsorption region, the second adsorption region being disposed outside the first adsorption region, the first adsorption pore being disposed in the first adsorption region, and the second adsorption pore being disposed in the second adsorption region.

10. The wafer chucking station of claim 8, wherein, The second adsorption cavity forms a second fixed opening on the fixed surface; the second fixed surface contacts the first fixed surface to close the first fixed opening and the second fixed opening.

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