Arc ion source enhanced magnetron sputtering device

Abstract

This utility model relates to the technical field of magnetron sputtering devices and discloses an arc ion source enhanced magnetron sputtering device, comprising: a coating chamber; a magnetic block disposed on the inner bottom surface of the coating chamber; a target material disposed above the magnetic block for providing material for ion cleaning and thin film deposition; a connector fixedly connected between the magnetic block and the target material, the connector including a backplate box and a cover plate; and a cooling assembly disposed inside the backplate box for removing heat generated during target bombardment. This design employs a staggered arrangement of cooling pipe one and cooling pipe two with opposing flow, allowing heat to transfer between the two pipes, significantly reducing the temperature difference between the two sides of the backplate, improving cooling uniformity and heat dissipation efficiency. Simultaneously, the cooling pipes adopt a snap-fit ​​adjustable fixing structure, facilitating installation and maintenance, enhancing the system's flexibility and operability. The overall design reduces thermal stress deformation, improving the consistency of thin film deposition and the reliability of equipment operation.

Description

Technical Field

[0001] This utility model relates to the field of magnetron sputtering device technology, and in particular to an arc ion source enhanced magnetron sputtering device. Background Technology

[0002] Arc ion source enhanced magnetron sputtering device is a coating equipment that combines arc discharge ion source technology and magnetron sputtering technology. This device enhances the plasma density and energy in the traditional magnetron sputtering process by introducing an arc ion source, thereby significantly improving the thin film deposition rate, improving the thin film quality, and expanding the range of materials that can be processed.

[0003] In existing arc ion source enhanced magnetron sputtering devices, the target material generates a large amount of heat when bombarded by high-energy particles. Traditional cooling systems typically use cooling water to dissipate heat from one end to the other. This method has significant limitations, namely, uneven temperature distribution at both ends of the backplate: the cooling water inlet end is relatively cool due to the continuous flow of low-temperature water, while the outlet end is hotter after the water has absorbed heat for a long time, resulting in poor cooling in this area. This temperature difference leads to inconsistent cooling efficiency in different areas of the target surface, causing local overheating or insufficient cooling of the target. These problems not only result in uneven erosion rates of the target, affecting its service life and the quality of the deposited film, but may also cause deformation or even damage to the backplate due to thermal stress, further affecting the stability and process repeatability of the entire system. In addition, uneven temperature can also change the plasma density distribution, thereby affecting the uniformity and consistency of the coating. Utility Model Content

[0004] The purpose of this invention is to solve the problem of poor cooling uniformity of the target material in the prior art, and to propose an arc ion source enhanced magnetron sputtering device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] An arc ion source enhanced magnetron sputtering device includes: a coating chamber; a magnetic block disposed on the inner bottom surface of the coating chamber; a target material disposed above the magnetic block for providing material for ion cleaning and thin film deposition; a connector fixedly connected between the magnetic block and the target material, the connector including a backplate box and a cover plate; and a cooling assembly disposed inside the backplate box for removing heat generated during target bombardment.

[0007] As a preferred embodiment of this utility model, the cooling assembly includes a control chamber located at the bottom of the coating chamber. A liquid pump and a cooler are installed inside the control chamber, with the liquid pump's outlet end passing through the cooler. The liquid pump's outlet end is connected to an inlet pipe, and the liquid pump's inlet end is connected to an outlet pipe. The back panel box contains several cooling pipes one and several cooling pipes two, which are arranged alternately. Both ends of cooling pipes one and two are connected to the outlet pipe and the inlet pipe, respectively. The connection points of cooling pipes one and two with the outlet pipe are located on opposite sides of the back panel box, and the coolant inside cooling pipes one and two flows in opposite directions.

[0008] As a preferred technical solution of this utility model, the back panel box is provided with an installation component inside. The installation component includes several columns fixedly connected to the bottom surface of the back panel box. The top of all the columns is fixed with an installation plate. Several installation openings are provided on the installation plate. Cooling pipe one and cooling pipe two are both located on the installation plate. Several buckles are provided on cooling pipe one and cooling pipe two. The buckles are adapted to the installation openings.

[0009] As a preferred embodiment of this utility model, the longitudinal section of the buckle is an inverted U-shaped structure, and the bottom ends of both sides of the buckle are inclined.

[0010] As a preferred embodiment of this utility model, the first cooling pipe and the second cooling pipe are in a serpentine structure.

[0011] As a preferred embodiment of this utility model, both the backplate box and the cover plate are made of aluminum, and the cover plate is fixedly connected to the target material by adhesive.

[0012] This utility model has the following beneficial effects:

[0013] 1. Significantly improves cooling uniformity and solves the temperature difference problem at both ends of the backplate: Existing technologies generally adopt a unidirectional cooling method, that is, the coolant enters from one end and exits from the other end. This results in a lower temperature in the area near the inlet of the backplate and a higher temperature in the area near the outlet, causing local overheating of the backplate and the target material, which affects the uniformity of film deposition and the life of the target material. This solution uses a staggered arrangement of cooling pipe 1 and cooling pipe 2 with a counter-flow design to enable heat exchange between the two sets of cooling pipes, effectively balancing the temperature difference on both sides of the backplate. The coolant has a longer flow path and a larger contact area in the serpentine structure, further improving the overall cooling efficiency. This design significantly improves the uniformity and stability of the cooling system, thereby ensuring that the target material is heated uniformly during sputtering, reducing local thermal stress deformation, and extending the life of the target material.

[0014] 2. Enhance the flexibility and maintainability of the cooling system: Traditional cooling systems have a fixed structure and the layout of cooling pipes is not adjustable. Once blockage or local efficiency decline occurs, it often requires complete replacement or complex repairs, resulting in high maintenance costs and low efficiency. This solution introduces a snap-on cooling pipe fixing structure, which uses an inverted U-shaped snap-on to cooperate with the mounting port on the mounting plate to achieve quick installation and removal of cooling pipes. This allows for flexible adjustment of the arrangement position and cooling area of ​​cooling pipes according to actual process requirements. This modular and adjustable design not only improves the adaptability and expandability of the cooling system, but also significantly reduces the cost of later maintenance and replacement, and improves the operability and sustainability of the equipment.

[0015] 3. Improve the overall structural stability and process repeatability of the device: Due to problems such as uneven cooling, low thermal conductivity, and fixed structure in existing cooling systems, uneven heating of the target material, thermal stress concentration, and inconsistent target material erosion are likely to occur, which in turn affect the coating thickness, uniformity, and process repeatability. This solution integrates technologies such as uniform cooling structure, efficient thermal conductive connection, and modular cooling pipe layout to ensure that the target material is always in a stable thermal environment in different working cycles. This structural optimization improves the consistency and repeatability of thin film deposition, and is particularly suitable for high-end manufacturing fields with high requirements for thin film performance, such as semiconductors, optical coatings, and flexible electronics. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the arc ion source enhanced magnetron sputtering device proposed in this utility model;

[0017] Figure 2 This is a schematic diagram of the internal structure of the back panel box;

[0018] Figure 3 This is a schematic diagram of the structure of cooling pipe one and cooling pipe two;

[0019] Figure 4 for Figure 3 Enlarged view of the structure at point A.

[0020] In the diagram: 1 Coating box, 2 Magnetic block, 3 Target material, 4 Backplate box, 5 Cover plate, 6 Liquid pump, 7 Refrigerator, 8 Liquid outlet pipe, 9 Liquid inlet pipe, 10 Cooling pipe one, 11 Cooling pipe two, 12 Mounting plate, 13 Mounting port, 14 Column, 15 Buckle, 16 Control room. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0022] Reference Figures 1-4The arc ion source enhanced magnetron sputtering device includes a coating box 1, a magnetic block 2 and a target 3. The magnetic block 2 is set on the inner bottom surface of the coating box 1. The magnetic field generated by it interacts with the electric field, confining electrons to move near the surface of the target 3. The target 3 is set above the magnetic block 2 and serves as the raw material for ion cleaning and thin film deposition.

[0023] It also includes connectors and cooling components. The connectors are fixedly connected between the magnetic block 2 and the target material 3. The connectors include a backplate box 4 and a cover plate 5, which are compatible and can be fixed together by bolts. Both the backplate box 4 and the cover plate 5 are made of aluminum, which has good thermal conductivity. The cover plate 5 is fixedly connected to the target material 3 by adhesive, which ensures full and uniform contact between the cover plate 5 and the target material 3. The adhesives used include silver-based conductive adhesive, thermal grease, etc.

[0024] The cooling assembly is located inside the backplate box 4 to remove the heat generated during the bombardment of the target material 3. Specifically, the cooling assembly includes a control chamber 16 located at the bottom of the coating chamber 1. A liquid pump 6 and a cooler 7 are installed inside the control chamber 16. The outlet end of the liquid pump 6 passes through the interior of the cooler 7, and the outlet end of the liquid pump 6 is connected to an inlet pipe 9. The inlet end of the liquid pump 6 is connected to an outlet pipe 8. The backplate box 4 contains several cooling pipes 10 and several cooling pipes 11, which are staggered and closely attached to each other, allowing heat transfer between them. Both ends of the cooling pipes 10 and 11 are connected to the outlet pipe 8 and the inlet pipe 9, respectively. The connections between the cooling pipes 10 and 11 and the outlet pipe 8 are located on both sides of the backplate box 4, and similarly, the connections between the cooling pipes 10 and 11 and the inlet pipe 9 are also located on both sides of the backplate box 4. Figure 3 For cooling pipe 10, the coolant inside enters from the left end through the inlet pipe 9 and then exits from the right end through the outlet pipe 8. Cooling pipe 21 flows in the opposite direction. The coolant inside cooling pipe 10 and cooling pipe 21 flows towards each other. This can reduce the temperature difference between the two sides of the back panel box 4 and improve the uniformity of cooling. The serpentine structure of cooling pipe 10 and cooling pipe 21 can increase the cooling area and ensure the cooling effect.

[0025] Furthermore, the back panel box 4 is equipped with mounting components, including several columns 14 fixedly connected to the bottom surface of the back panel box 4. The top of all the columns 14 is fixed with a mounting plate 12. The mounting plate 12 has several mounting holes 13. Cooling pipe 10 and cooling pipe 2 11 are both located on the mounting plate 12. Cooling pipe 10 and cooling pipe 2 11 are equipped with several clips 15. The clips 15 are made of plastic and can undergo reversible deformation. The clips 15 are adapted to the mounting holes 13. The longitudinal section of the clips 15 is an inverted U-shaped structure. The bottom ends of the two sides of the clips 15 are inclined. By inserting the two ends of the clips 15 into the corresponding two mounting holes 13, the cooling pipe 10 and cooling pipe 2 11 can be fixed. This allows for flexible adjustment of the cooling position and cooling area according to actual needs.

[0026] The specific working principle of this utility model is as follows:

[0027] During operation, the liquid pump 6 is started, and the coolant is driven by the liquid pump 6. After being cooled by the cooler 7, it enters the cooling pipe 10 and cooling pipe 2 11 inside the backplate box 4 through the liquid inlet pipe 9. The coolant carries the heat generated during the bombardment of the target material 3 and is then discharged through the liquid outlet pipe 8. Since the cooling pipe 10 and cooling pipe 2 11 are arranged in a serpentine pattern and flow in opposite directions, with the cooling pipe 10 entering from the left and exiting from the right and the cooling pipe 2 11 entering from the right and exiting from the left, the heat is transferred and balanced between the two pipes, which significantly reduces the temperature difference between the two sides of the backplate box 4 and improves the cooling uniformity. At the same time, the pipes are adjustable and fixed to the mounting plate 12 by the clips 15. The operator squeezes the two sides of the clips 15 to deform them and inserts the bottom ends of the clips 15 into the two mounting ports 13. After the clips 15 return to their original shape, the pipes can be fixed. This design enhances the flexibility of the system layout and the convenience of maintenance.

[0028] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. An arc ion source enhanced magnetron sputtering device, characterized in that, include: Coating box (1); Magnetic block (2) is set on the inner bottom surface of coating box (1); The target (3) is disposed above the magnetic block (2) and is used to provide material for ion cleaning and film deposition; A connector is fixedly connected between the magnet (2) and the target (3), and the connector includes a backplate box (4) and a cover plate (5). The cooling component is located inside the backplate box (4) and is used to remove the heat generated during the bombardment of the target material (3).

2. The arc ion source enhanced magnetron sputtering device according to claim 1, characterized in that, The cooling assembly includes a control chamber (16) located at the bottom of the coating chamber (1). Inside the control chamber (16) are a liquid pump (6) and a cooler (7). The outlet end of the liquid pump (6) passes through the cooler (7). The outlet end of the liquid pump (6) is connected to an inlet pipe (9). The inlet end of the liquid pump (6) is connected to an outlet pipe (8). Inside the back panel box (4) are several cooling pipes one (10) and several cooling pipes two (11). The cooling pipes one (10) and cooling pipes two (11) are arranged alternately. Both ends of the cooling pipes one (10) and cooling pipes two (11) are connected to the outlet pipe (8) and the inlet pipe (9) respectively. The connection points of the cooling pipes one (10) and cooling pipes two (11) with the outlet pipe (8) are located on both sides of the back panel box (4). The coolant inside the cooling pipes one (10) and cooling pipes two (11) flows in opposite directions.

3. The arc ion source enhanced magnetron sputtering device according to claim 2, characterized in that, The back panel box (4) is provided with an installation component inside. The installation component includes several columns (14) fixedly connected to the bottom surface of the back panel box (4). The top of all the columns (14) is fixed with an installation plate (12). Several installation ports (13) are provided on the installation plate (12). Cooling pipe one (10) and cooling pipe two (11) are both located on the installation plate (12). Several buckles (15) are provided on cooling pipe one (10) and cooling pipe two (11). The buckles (15) are adapted to the installation ports (13).

4. The arc ion source enhanced magnetron sputtering device according to claim 3, characterized in that, The buckle (15) has an inverted U-shaped cross-section, and the bottom ends of both sides of the buckle (15) are inclined.

5. The arc ion source enhanced magnetron sputtering device according to claim 2, characterized in that, The first cooling pipe (10) and the second cooling pipe (11) have a serpentine structure.

6. The arc ion source enhanced magnetron sputtering apparatus according to claim 1, characterized in that, The backplate box (4) and the cover plate (5) are both made of aluminum, and the cover plate (5) is fixedly connected to the target material (3) by adhesive.

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