Three-dimensional heat-conducting structure

Abstract

The utility model provides a three -dimensional heat conduction structure contains a uniform temperature plate, and the uniform temperature plate has a casing, and the casing is equipped with at least one perforation, and the perforation is communicated with the inside of casing. At least one heat pipe has an open end inserted into the perforation and communicated with the inside of the casing. And a ring body is arranged on the outer surface of the uniform temperature plate, wherein the multiple gaps between the ring body and the heat pipe are sealed by laser welding, and the welding ring is welded to further fix the connection between the heat pipe and the uniform temperature plate.

Description

Technical Field

[0001] This utility model relates to a heat-conducting device, and more particularly to a three-dimensional heat-conducting structure. Background Technology

[0002] In traditional heat-conducting structures, heat pipes are bonded to vapor chambers using conventional welding techniques. However, this method can cause molten solder to overflow into undesirable joints and other locations, such as the interior of the vapor chamber, affecting the weld bonding and leading to surface defects and reduced production yield.

[0003] Similar to conventional welding techniques in the prior art, a support ring can be installed on the holes of the heat pipe or vapor chamber. Furthermore, after the heat pipe and vapor chamber are joined, solder is applied around the top of the support ring. A welding process is then applied to secure the connection via the support ring, providing support for the bonding of the heat pipe and vapor chamber.

[0004] However, when the heat pipe is placed in the perforations of the heat spreader, multiple gaps can be formed between the heat pipe and the ring surrounding the perforations. The weld ring and its solder have relatively low melting points and high fluidity after melting. Therefore, these holes allow the molten weld ring and its solder to flow into the interior of the heat spreader. Utility Model Content

[0005] This disclosure provides a solution to the above-mentioned problems. Process

[0006] To achieve the above-mentioned effects, this disclosure provides a three-dimensional heat-conducting structure, comprising: a heat spreader having a shell and at least one perforation formed on the shell and communicating with an interior of the shell; at least one heat pipe having an open end inserted into the perforation and communicating with the interior of the shell; and an annulus formed on an outer edge of the perforation and protruding from an outer surface of the heat spreader, wherein a plurality of gaps between the annulus and the heat pipe are sealed by laser welding; and a welding ring further fixes the connection between the heat pipe and the heat spreader by welding.

[0007] In some embodiments, the vapor chamber further includes a capillary structure and a cooling fluid disposed inside the housing.

[0008] In some embodiments, the welding ring is made of metal, alloy, or heat-resistant non-metallic material.

[0009] In some embodiments, the welded ring is located between the vapor chamber and the heat pipe and does not overflow into the interior of the vapor chamber.

[0010] In some embodiments, the welding ring surrounds and closes the ring body before welding.

[0011] In some embodiments, a robust bond is formed between the ring and the heat pipe after laser welding is applied only to multiple gaps between the heat pipe and the ring.

[0012] In some embodiments, the ring is formed at an outer edge of the perforation and protrudes from the outer surface of the heat spreader.

[0013] In some embodiments, the ring is welded to the outer surface of the heat spreader and surrounds the outer edge of the perforation.

[0014] According to one embodiment of this disclosure, a method for manufacturing a three-dimensional thermally conductive structure includes: forming a heat spreader including a housing having at least one perforation; forming at least one heat pipe having an open end and inserting the open end into the perforation to communicate between the heat pipe and the heat spreader; applying laser welding to a plurality of gaps between the heat pipe and a ring body; placing a welding ring at the junction of the heat pipe and the heat spreader to surround and close the ring body; and applying welding to weld the welding ring to fix the connection between the heat pipe and the heat spreader.

[0015] This invention not only eliminates multiple gaps between the heat pipe and the perforated edge of the heat pipe and the heat spreader by laser welding, but also ensures a fixed connection between the heat pipe and the heat spreader by placing a welding ring on the outer surface of the heat pipe and surrounding and enclosing the ring formed on the outer edge of the perforation. Because there are no or only very small gaps between the heat pipe and the edge of the perforation in the heat spreader, it prevents the molten welding ring and its solder from entering the heat spreader. Attached Figure Description

[0016] Unless otherwise stated, the drawings illustrate the appearance of the novel object described in this utility model. Referring to the drawings, where the same component symbols denote similar parts in multiple views, examples of multiple liquid cooling systems, cooling circuits, and flexible tubes incorporating the principles currently disclosed are illustrated by way of example rather than limitation.

[0017] Figure 1 A flowchart illustrating a method for forming a three-dimensional thermally conductive structure is shown.

[0018] Figure 2 This is an exploded schematic diagram of a three-dimensional heat-conducting structure.

[0019] Figure 3 This is a schematic diagram showing a heat pipe placed in a perforation.

[0020] Figure 3A To present Figure 3 A detailed cross-sectional view of the structure with multiple gaps.

[0021] Figure 4 This is a schematic diagram of the connection between the heat pipe and the ring.

[0022] Figure 4A for Figure 4 An enlarged view of the boxed portion.

[0023] Figure 5 This is a cross-sectional view of the heat-conducting structure.

[0024] Figure 6 This is another cross-sectional view of the heat-conducting structure.

[0025] In the attached figures, the following labels are used:

[0026] 102, 104, 106, 108, 110: Steps

[0027] 10: Heat spreader

[0028] 11: Shell

[0029] 12: Perforation

[0030] 13: Ring body

[0031] 15: Gap

[0032] 16: Secure connection

[0033] 17: Welding ring

[0034] 200: Thermal conductive structure

[0035] 20: Heat pipe

[0036] 21: Open end Detailed Implementation

[0037] The detailed description and technical content of this invention are illustrated below with reference to the accompanying drawings. However, it should be understood that this description and drawings are for illustrative and demonstrative purposes only and are not intended to limit the scope of this invention.

[0038] Figure 1 A flowchart illustrating a method for forming a three-dimensional thermally conductive structure is shown. Figure 2 This is an exploded schematic diagram of a three-dimensional heat-conducting structure. Figure 3 This is a schematic diagram showing a heat pipe placed in a perforation. Figure 3A To present Figure 3 A detailed cross-sectional view of the structure with multiple gaps. Figure 4 This is a schematic diagram of the connection between the heat pipe and the ring. Figure 4A for Figure 4 An enlarged view of the boxed portion. Figure 5 This is a cross-sectional view of the heat-conducting structure. Figure 6 This is another cross-sectional view of the heat-conducting structure. Among them, Figures 2 to 6 The manufacturing process for forming a three-dimensional thermally conductive structure is shown.

[0039] Please refer to Figure 1Method 100 begins with step 102, in which, as follows: Figure 2 The diagram shows the formation of a heat spreader 10 and at least one heat pipe 20. Figure 2 The heat-conducting structure 200 includes a vapor chamber 10 and at least one heat pipe 20. The vapor chamber 10 includes a housing 11 and at least one perforation 12 formed on the housing 11 and communicating with the interior of the housing 11. In step 102, in one embodiment, a ring 13 is formed at the periphery of the perforation 12 and protrudes from the outer surface of the vapor chamber 10. In another embodiment, the ring 13 may be welded to the surface of the vapor chamber 10, surrounding the periphery of the perforation 12. The ring 13 is designed to improve the accuracy and alignment when the heat pipe 20 is inserted into the perforation 12 of the vapor chamber 10. The ring 13 ensures optimal fit and connection between the heat pipe 20 and the vapor chamber 10 by providing better positioning. This improves mechanical stability and thermal efficiency, ultimately increasing the efficiency and yield of the three-dimensional heat-conducting structure 200. The precise alignment achieved by the ring 13 contributes to better thermal conductivity, reduced thermal resistance, and optimized heat conduction between the heat pipe 20 and the vapor chamber 10. In one embodiment, the heat spreader 10 further includes a capillary structure (not shown) and a cooling fluid (not shown) disposed inside the housing 11.

[0040] Method 100 continues to step 104, in which, as follows: Figure 3 The heat pipe 20 is placed in the perforation 12 on the heat spreader 10, as shown. Figure 3 The heat pipe 20 is a hollow metal tube. The heat pipe 20 has an open end 21, which is inserted into a perforation 12 and communicates with the interior of the housing 11. In one embodiment, the number of perforations 12 is the same as the number of heat pipes 20. Figure 3A As shown by the dashed lines, there are several tiny gaps 15 between the heat pipe 20 and the assembly ring 13. If these gaps 15 are not properly sealed, there is a risk that solder may flow into the housing 11. Such solder infiltration may compromise structural integrity, reduce thermal efficiency, and cause system failure. To prevent this, it is important to take appropriate measures to effectively seal the gaps 15, such as applying laser welding.

[0041] Method 100 continues to step 106, in which, as follows: Figure 4 The diagram shows the application of laser welding to multiple gaps 15 between the heat pipe 20 and the ring 13. (As shown...) Figure 4AAs shown, multiple gaps 15 between the heat pipe 20 and the ring 13 are sealed. In this step, the laser beam is precisely guided to the multiple gaps 15, effectively sealing them to ensure a robust connection 16 between the components. The high precision provided by laser welding allows for very specific and focused welding, significantly reducing the possibility of heat diffusion to multiple unintended areas. Accordingly, the laser beam does not actually contact or affect any other part of the thermally conductive structure, but only focuses on the multiple gaps 15 between the heat pipe 20 and the ring 13. This application of localized heating minimizes distortion, ensuring the overall structural integrity and performance of the thermally conductive assembly. Furthermore, the high-strength and durable sealed joint produced by the laser welding process further enhances the thermal efficiency and reliability of the assembly and prevents any unwanted materials from entering or interfering with the internal components of the device.

[0042] Method 100 continues to step 108, in which, as follows: Figure 5 A welding ring 17 is placed at the joint between the heat pipe 20 and the heat spreader 10, as shown. Figure 5 A cross-sectional view of the heat-conducting structure 200 is provided. Figure 5 In this embodiment, a welding ring 17 is fitted onto the outer surface of the heat pipe 20 and disposed on the housing 11, so that the welding ring 17 surrounds and seals the ring body 13. The welding ring 17 is located above the sealed plurality of gaps 15 and contacts the outer surface of the ring body 13. In one embodiment, the welding ring 17 is primarily made of metal (e.g., copper). However, this embodiment is not limited thereto. In other embodiments, the welding ring 17 may be made of alloy or heat-resistant non-metallic material. In one embodiment, the welding ring 17 serves as a solder. In other embodiments, the solder may also be a welding rod or solder paste.

[0043] Method 100 continues to step 110, in which, as follows: Figure 6 The welding ring 17 is shown to be welded to secure the connection between the heat pipe 20 and the heat spreader 10. Figure 6 Another cross-sectional view of the thermally conductive structure 200 is provided. Figure 6 In this process, a welding ring 17 is welded to secure the heat pipe 20 to the vapor chamber 10. Since the multiple gaps 15 between the heat pipe 20 and the ring body 13 have been sealed by laser welding in a previous step, the welded ring will not overflow into the interior of the vapor chamber 10. By following the above process, the gaps between the heat pipe 20 and the vapor chamber 10 can be tightly sealed, allowing the heat pipe 20 to conduct heat quickly and uniformly.

[0044] Therefore, the embodiments disclosed herein are sufficient to achieve the above-mentioned objectives and advantages, and can also achieve the essential effects that should be possessed. The specific embodiments described above are merely illustrative examples, and those skilled in the art can make various modifications and equivalent implementations after understanding the content of this disclosure. Except as described in the following claims, the disclosed structural and design details are not limited. Therefore, it is understood that the specific embodiments described above can be changed, combined, or modified, and all such changes should be considered to be covered within the scope and spirit of this disclosure. Furthermore, it should be understood that the constituent elements of this embodiment are not mutually exclusive, and those skilled in the art can arbitrarily combine the constituent elements according to design requirements.

[0045] The embodiments illustrated in this disclosure can be implemented without any undisclosed elements and / or optional elements. Although various components or steps are described herein with terms such as "comprising," "containing," or "including," the composition and methods disclosed herein may also be "substantially composed of" or "entirely composed of" those components or steps. All the foregoing values ​​and ranges may vary to some extent. When a numerical range is disclosed with a lower and upper limit, any value within that range and its subranges are considered disclosed. In particular, when a value range is disclosed (e.g., "about a to about b," "about ab"), it should be understood to encompass all specific values ​​and subranges within that larger value range. Furthermore, the terms used in the claims have their ordinary and general meanings unless expressly defined by the patentee. In addition, the indefinite articles such as "a" or "an" used in the claims should be interpreted to include the elements described as "at least one."

Claims

1. A three-dimensional thermally conductive structure, characterized in that, Include: A heat spreader has a housing and at least one perforation formed on the housing and communicating with an interior of the housing; At least one heat pipe having an open end that is inserted into the perforation and communicates with the interior of the housing; and A ring body is disposed on an outer surface of the heat spreader, wherein multiple gaps between the ring body and the heat pipe are sealed by laser welding, and A welding ring is used to fix the connection between the heat pipe and the heat spreader by welding.

2. The three-dimensional thermally conductive structure as described in claim 1, characterized in that, The vapor chamber further includes a capillary structure and a cooling fluid disposed inside the housing.

3. The three-dimensional thermally conductive structure as described in claim 1, characterized in that, The welding ring is made of metal, alloy, or heat-resistant non-metallic material.

4. The three-dimensional thermally conductive structure as described in claim 1, characterized in that, The welded ring is located between the heat spreader and the heat pipe, and does not overflow into the interior of the heat spreader.

5. The three-dimensional thermally conductive structure as described in claim 1, characterized in that, The welding ring surrounds and seals the ring body before welding.

6. The three-dimensional thermally conductive structure as described in claim 1, characterized in that, A robust bond is formed between the ring and the heat pipe by applying laser welding only to the gaps between the heat pipe and the ring.

7. The three-dimensional thermally conductive structure as described in claim 1, characterized in that, The ring is formed at one outer edge of the perforation and protrudes from the outer surface of the heat spreader.

8. The three-dimensional thermally conductive structure as described in claim 7, characterized in that, The ring is welded to the outer surface of the heat spreader and surrounds the outer edge of the perforation.

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