A fluorine pump composite cooling module controller

Abstract

The utility model relates to fluorine pump composite cooling module controller technical field, solved the problem that the lack structure protects the controller, and its easy because long time high -power work and produce the heat damage situation. Specifically for a kind of fluorine pump composite cooling module controller, including controller shell, the inside of controller shell is provided with metal heat conduction interlayer, metal heat conduction interlayer inboard is installed with heating element group, the metal heat conduction interlayer extends to the lateral wall direction of controller shell and forms the radiating fin integrally formed with it, the heating element group and metal heat conduction interlayer keep direct contact to conduct heat to radiating fin;The metal heat conduction interlayer is embedded semiconductor refrigeration piece in the path of extending to form radiating fin, the cold end of the semiconductor refrigeration piece is connected with metal heat conduction interlayer and the hot end is towards the bottom of radiating fin;The metal heat conduction interlayer surface is covered with micro-arc oxidation ceramic layer and is integrated with copper heat pipe inside.

Description

Technical Field

[0001] This utility model relates to the technical field of fluorine pump composite cooling module controllers, specifically a fluorine pump composite cooling module controller. Background Technology

[0002] CN221611616U discloses a refrigerant pump and compressor refrigeration composite system, which includes a shell-and-tube condenser, a shell-and-tube evaporator, a compressor, a main refrigerant pump, a backup refrigerant pump, a throttling device, a solenoid valve, an air-cooled condenser module, an air-cooled cooling device, a cooling water pump, and a controller. The inlet end of the shell-and-tube condenser is connected to the outlet end of the air-cooled condenser module. The liquid inlet end of the shell-and-tube evaporator is connected to the liquid outlet end of the throttling device. The liquid inlet end of the throttling device is connected to the liquid outlet ends of the main refrigerant pump and the backup refrigerant pump. The liquid inlet ends of the main refrigerant pump and the backup refrigerant pump are connected to the liquid outlet end of the shell-and-tube condenser. The water inlet end of the shell-and-tube condenser is connected to the water outlet end of the cooling water pump. The water inlet end of the cooling water pump is connected to the water outlet end of the air-cooled cooling device. The water inlet end of the air-cooled cooling device is connected to the water outlet end of the shell-and-tube condenser.

[0003] It combines a compressor refrigeration system with a refrigerant pump system to achieve three operating modes, making full use of natural cold sources, solving the problems caused by switching between different modes, and better saving energy.

[0004] This comparative document describes a controller that manages a large number of electrical devices to achieve multi-mode operation, but it lacks structural protection for the controller, which is prone to overheating and damage due to prolonged high-power operation. Utility Model Content

[0005] To address the shortcomings of existing technologies, this utility model provides a fluorine pump composite cooling module controller, which solves the problem of the lack of structural protection for the controller, which makes it prone to overheating and damage due to prolonged high-power operation.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a fluorine pump composite cooling module controller, including a controller housing, wherein a metal thermally conductive interlayer is provided inside the controller housing, a heating element assembly is installed on the inner side of the metal thermally conductive interlayer, the metal thermally conductive interlayer extends toward the side wall of the controller housing to form heat dissipation fins integrally formed therewith, and the heating element assembly maintains direct contact with the metal thermally conductive interlayer to conduct heat to the heat dissipation fins.

[0007] In one specific embodiment, the metal thermally conductive interlayer has a semiconductor cooling chip embedded in the path extending to form the heat dissipation fins. The cold end of the semiconductor cooling chip is connected to the metal thermally conductive interlayer, and the hot end faces the bottom of the heat dissipation fins.

[0008] In one specific embodiment, the surface of the metal thermally conductive interlayer is covered with a micro-arc oxide ceramic layer and a copper heat pipe is integrated inside.

[0009] In one specific embodiment, the heating element group is fixedly bonded to the mounting plane of the metal thermally conductive interlayer by a thermally conductive silicone grease layer.

[0010] In one specific embodiment, the heat dissipation fins are formed by extending directly from the metal thermally conductive interlayer in a continuous and equidistant arrangement.

[0011] In one specific embodiment, the heating element group includes a central processing unit chip and a power conversion module, both of which are directly attached to the surface of the metal thermally conductive interlayer.

[0012] Compared with the prior art, this utility model provides a fluorine pump composite cooling module controller, which has the following beneficial effects:

[0013] In the technical solution disclosed in this utility model, the heat generated by the controller during operation is efficiently discharged to the external environment through the integrated structure design of the metal heat-conducting jacket and the heat dissipation fins, which completely solves the problem of high temperature damage to the controller caused by lack of heat dissipation protection in the prior art; based on the synergistic effect of the layered heat-conducting cavity, the fluorine pump composite cooling controller can achieve continuous and stable operation under extreme conditions.

[0014] Through the metal thermally conductive interlayer and semiconductor cooling chip configured in this invention, the heat generated by the heating element assembly is rapidly conducted through the directly contacting metal thermally conductive interlayer, and heat exchange with the ambient air is achieved by the integrally formed heat dissipation fins; the semiconductor cooling chip embedded in the extension path of the metal thermally conductive interlayer actively enhances the heat absorption capacity of the thermally conductive interlayer through the cold end, and the heat at the hot end is concentrated and directed to the bottom of the heat dissipation fins to accelerate heat dissipation; the micro-arc oxide ceramic layer covering the surface of the metal thermally conductive interlayer improves its weather resistance, and the internal copper heat pipe optimizes the longitudinal heat transfer efficiency, ensuring that the thermal conductivity does not degrade under complex environments; the heating element assembly achieves a gapless connection with the plane of the metal thermally conductive interlayer through the thermally conductive silicone grease layer, avoiding the heat accumulation effect of traditional structures; finally, a complete low thermal resistance channel from the heat source to the heat dissipation fins is constructed, significantly extending the equipment life. Attached Figure Description

[0015] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the semiconductor cooling chip structure of this utility model;

[0018] Figure 3 This is a schematic diagram of the metal thermally conductive sandwich structure of this utility model;

[0019] Figure 4 This is a schematic diagram of the disassembled structure of this utility model.

[0020] In the diagram: 1. Controller housing; 2. Metal thermally conductive interlayer; 21. Micro-arc oxidation ceramic layer; 22. Copper heat pipe; 3. Heating element assembly; 31. Thermally conductive silicone grease layer; 4. Heat dissipation fins; 5. Semiconductor cooling chip. Detailed Implementation

[0021] The following will describe in detail the implementation of this application with reference to the accompanying drawings and embodiments, so that the implementation process of how this application uses technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.

[0022] Figures 1-4 As an embodiment of the present invention, a fluorine pump composite cooling module controller includes a controller housing 1, a metal thermally conductive interlayer 2 is disposed inside the controller housing 1, a heating element group 3 is installed on the inner side of the metal thermally conductive interlayer 2, the metal thermally conductive interlayer 2 extends towards the side wall of the controller housing 1 to form a heat dissipation fin 4 integrally formed therewith, and the heating element group 3 is in direct contact with the metal thermally conductive interlayer 2 to conduct heat to the heat dissipation fin 4.

[0023] The specific problem addressed in this embodiment is the lack of structural protection for the controller, which makes it prone to overheating and damage due to prolonged high-power operation. This invention utilizes an integrated structure design of a metal thermally conductive jacket 2 and heat dissipation fins 4 to efficiently dissipate the heat generated during controller operation to the external environment, completely resolving the high-temperature damage problem caused by the lack of heat dissipation protection in the prior art. Based on the synergistic effect of the layered thermally conductive cavity, the fluorine pump composite cooling controller achieves continuous and stable operation under extreme conditions.

[0024] A semiconductor cooling chip 5 is embedded in the path of the metal thermally conductive interlayer 2 extending to form the heat dissipation fins 4. The cold end of the semiconductor cooling chip 5 is connected to the metal thermally conductive interlayer 2 and the hot end faces the bottom of the heat dissipation fins 4. In this specific embodiment, the surface of the metal thermally conductive interlayer 2 is covered with a micro-arc oxide ceramic layer 21 and a copper heat pipe 22 is integrated inside. The heating element group 3 is fixedly bonded to the mounting plane of the metal thermally conductive interlayer 2 by a thermally conductive silicone grease layer 31. The heat generated by the heating element assembly 3 is rapidly conducted through the directly contacting metal thermally conductive interlayer 2, and the heat is exchanged with the ambient air by the integrally molded heat dissipation fins 4. The semiconductor cooling chip 5 embedded in the extension path of the metal thermally conductive interlayer 2 actively enhances the heat absorption capacity of the thermally conductive interlayer through the cold end, and the heat at the hot end is concentrated and directed to the bottom of the heat dissipation fins 4 to accelerate heat dissipation. The micro-arc oxide ceramic layer 21 covering the surface of the metal thermally conductive interlayer 2 improves its weather resistance, and the internal copper heat pipe 22 optimizes the longitudinal heat transfer efficiency to ensure that the thermal conductivity does not degrade under complex environments. The heating element assembly 3 achieves a seamless connection with the plane of the metal thermally conductive interlayer 2 through the thermally conductive silicone grease layer 31, avoiding the heat accumulation effect of traditional structures. Finally, a complete low thermal resistance channel from the heat source to the heat dissipation fins is constructed, which significantly extends the life of the equipment.

[0025] In this specific embodiment, the heat dissipation fins 4 are formed by extending directly from the metal heat-conducting interlayer 2 in a continuous and equidistant arrangement. By designing the heat dissipation fins 4 as a continuous and equidistant arrangement that extends directly from the metal heat-conducting interlayer 2, the connection gaps of traditional segmented welded fins are eliminated during the manufacturing process using an integrated metal material processing technology. The continuous arrangement allows high-speed airflow to form a laminar flow channel along the fin axis, while the equidistant structure avoids the generation of local vortices in the airflow. Ultimately, this improves the surface area utilization of the heat dissipation fins 4 and simultaneously reduces the airflow resistance, solving the problem of a sharp drop in heat dissipation efficiency in strong wind outdoor environments.

[0026] In this specific embodiment, the heating element group 3 includes a central processing unit chip and a power conversion module, both of which are directly mounted on the surface of the metal thermally conductive interlayer 2. The heating element group 3 consists of a central processing unit chip and a power conversion module directly mounted on the surface of the metal thermally conductive interlayer 2. During installation, a thermally conductive silicone grease layer 31 is first applied to the surface of the interlayer before the component pins are pressed in. This structure allows the heat generated by the chip / power module to be transferred to the metal thermally conductive interlayer 2 through the thermally conductive silicone grease layer 31 without any distance, eliminating the heat accumulation effect caused by the multi-layer structure of traditional circuit boards. At the same time, the insulation properties of the micro-arc oxidation ceramic layer 21 of the metal thermally conductive interlayer 2 can prevent short circuits of the high-voltage power module, and achieve uniform temperature distribution of the core components when the controller is running at full load.

[0027] Working principle: The heat generated by the heating element group 3 is transferred to the surface of the metal thermally conductive interlayer 2 through the thermally conductive silicone grease layer 31 in direct contact with it without gaps. The copper heat pipe 22 embedded in the interlayer evenly diffuses the heat in the lateral direction. At the same time, the integrated heat dissipation fins 4 formed by the metal thermally conductive interlayer 2 extending to the side wall of the controller housing 1 establish a longitudinal heat conduction path. When the ambient temperature rises and the heat dissipation efficiency decreases, the semiconductor cooling chip 5 embedded in the extension path of the metal thermally conductive interlayer 2 is automatically activated. Its cold end actively absorbs the heat stored in the metal thermally conductive interlayer 2 and conducts the heat to the bottom of the heat dissipation fins 4 in a directional and accelerated manner through the hot end. The continuous equidistant arrangement of the heat dissipation fins 4 enables the air to form a laminar flow and efficiently remove the heat from the fin surface. The micro-arc oxide ceramic layer 21 on the surface of the metal thermally conductive interlayer 2 prevents electrochemical corrosion and maintains thermal conductivity stability in a humid environment. Finally, the multi-dimensional thermal management of the metal thermally conductive interlayer 2 achieves continuous low-resistance heat transfer from the heating element group 3 to the external environment.

[0028] The control method of this utility model is automatic control through a controller. The control circuit of the controller can be implemented by simple programming by those skilled in the art. The power supply is also common knowledge in the field. Since this utility model is mainly used to protect mechanical devices, the control method and circuit connection will not be explained in detail.

[0029] It should be noted that, in this document, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A controller for a fluorine pump composite cooling module, comprising a controller housing (1), characterized in that: The controller housing (1) has a metal heat-conducting interlayer (2) inside. A heating element group (3) is installed inside the metal heat-conducting interlayer (2). The metal heat-conducting interlayer (2) extends toward the side wall of the controller housing (1) to form a heat dissipation fin (4) integrally formed therewith. The heating element group (3) is in direct contact with the metal heat-conducting interlayer (2) to conduct heat to the heat dissipation fin (4).

2. The fluorine pump composite cooling module controller according to claim 1, characterized in that: The metal thermally conductive interlayer (2) has a semiconductor cooling chip (5) embedded in the path that extends to form the heat dissipation fins (4). The cold end of the semiconductor cooling chip (5) is connected to the metal thermally conductive interlayer (2) and the hot end faces the bottom of the heat dissipation fins (4).

3. The fluorine pump composite cooling module controller according to claim 1, characterized in that: The surface of the metal thermally conductive interlayer (2) is covered with a micro-arc oxide ceramic layer (21) and a copper heat pipe (22) is integrated inside.

4. The fluorine pump composite cooling module controller according to claim 1, characterized in that: The heating element group (3) is fixedly bonded to the mounting plane of the metal thermally conductive interlayer (2) by a thermally conductive silicone grease layer (31).

5. A fluorine pump composite cooling module controller according to claim 1, characterized in that: The heat dissipation fins (4) are formed by extending directly from the metal heat-conducting interlayer (2) in a continuous and equidistant arrangement.

6. A fluorine pump composite cooling module controller according to claim 1, characterized in that: The heating element group (3) includes a central processing unit chip and a power conversion module, which are directly attached to the surface of the metal thermally conductive interlayer (2).

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