Integrated water-cooled heating platform and vacuum eutectic reflow soldering furnace thereof

By employing a serpentine water-cooling channel and friction stir welding in a vacuum eutectic reflow oven, a seamless connection between the water-cooled stage and the heating stage is achieved, solving the problems of low heat exchange efficiency and poor structural stability in existing technologies, and realizing rapid cooling and improved equipment stability.

CN224475696UActive Publication Date: 2026-07-10中科光智(重庆)科技有限公司

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
中科光智(重庆)科技有限公司
Filing Date
2025-08-13
Publication Date
2026-07-10

Smart Images

  • Figure CN224475696U_ABST
    Figure CN224475696U_ABST
Patent Text Reader

Abstract

The utility model provides an integral type water -cooling heating platform and vacuum eutectic reflow soldering furnace thereof, include: the furnace body that has installed groove, heating unit, heating unit includes at least one heating pipe, heating pipe is uniformly arranged in the furnace body, heating pipe extends from the furnace body one side to opposite side, and the water -cooling platform that lies in the furnace body processing space, water -cooling platform includes water -cooling base plate and cover, water -cooling base plate surface distribution has the serpentine water -cooling channel, the cover is covered in serpentine water -cooling channel top, water -cooling base plate is connected with water inlet pipe and water outlet pipe, water inlet pipe and water outlet pipe are respectively with serpentine water -cooling channel both ends communication, and water inlet pipe and water outlet pipe are close to water -cooling base plate corner place setting, and water inlet pipe is located water -cooling base plate close to center place. Integral type water -cooling platform realizes the seamless connection of channel and platform through the friction stir welding, eliminates the gap thermal resistance of traditional indirect contact, significantly improves the heat exchange efficiency, satisfies the quick cooling demand.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This utility model belongs to the technical field of vacuum eutectic reflow oven equipment, specifically relating to an integrated water-cooled heating platform and its vacuum eutectic reflow oven. Background Technology

[0002] Vacuum eutectic reflow ovens, as core equipment in the microelectronics industry, rely on the principle of eutectic reaction to complete high-precision welding operations in a vacuum or inert protective atmosphere. The welding process requires maintaining a high-temperature environment of 300-450℃, while subsequent processes have stringent requirements for cooling rates. Rapid cooling is not only crucial for ensuring solder joint density and reducing thermal stress damage, but also a core element for improving production efficiency.

[0003] In existing technologies, the water cooling system of vacuum eutectic reflow ovens mostly adopts an indirect heat exchange mode of "external cooling water pipes + carrier contact", which mainly has the following drawbacks:

[0004] 1. Low heat exchange efficiency: There is a microscopic contact gap between the cooling water pipe and the heating platform, which leads to increased thermal resistance and cannot meet the requirements for rapid cooling.

[0005] 2. Poor structural stability: Cooling water pipes (mostly made of stainless steel) are prone to thermal deformation at temperatures above 300℃, forming periodic alternating stress between them and the platform. Long-term use can lead to scratches on the platform surface, water pipe rupture, and increased equipment maintenance costs. Summary of the Invention

[0006] To address the aforementioned problems in the existing technology, this utility model provides an integrated water-cooled heating stage and its vacuum eutectic reflow oven, including a furnace body with mounting grooves, a heating unit, and a water-cooled stage placed flat within the furnace body's processing space. The surface of the water-cooled substrate of the water-cooled stage is distributed with serpentine water-cooling channels. The integrated water-cooled stage achieves a seamless connection between the channels and the stage through friction stir welding, eliminating the gap thermal resistance of traditional indirect contact, significantly improving heat exchange efficiency, and meeting the requirements for rapid cooling.

[0007] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0008] An integrated water-cooled heating platform includes:

[0009] A furnace body with mounting slots;

[0010] A heating unit, comprising at least one heating tube evenly distributed within the furnace body, extending from one side of the furnace body to the opposite side; and

[0011] A water-cooled platform is placed flat in the processing space of the furnace body. The water-cooled platform includes a water-cooled base plate and a cover plate. The surface of the water-cooled base plate is distributed with serpentine water-cooling channels. The cover plate covers the serpentine water-cooling channels. The water-cooled base plate is connected to an inlet pipe and an outlet pipe. The inlet pipe and the outlet pipe are respectively connected to the two ends of the serpentine water-cooling channels. The inlet pipe and the outlet pipe are located near the corner of the water-cooled base plate, and the inlet pipe is located near the center of the water-cooled base plate.

[0012] Furthermore, the cross-section of the serpentine water-cooling channel is circular or rectangular.

[0013] Furthermore, the water-cooled substrate is made of T2 copper and is placed horizontally above the heating tube.

[0014] Furthermore, both the inlet pipe and the outlet pipe extend from the bottom of the furnace body and are connected to the furnace body via a sealing assembly. The sealing assembly is located outside the furnace body and includes a pressure block and a sealing ring. The sealing ring is fitted over the inlet pipe and the outlet pipe. A through hole is formed in the center of the pressure block. After passing through the inlet pipe and the outlet pipe, the pressure block abuts against the sealing ring, and a chamfer is formed on the side of the pressure block near the sealing ring. The pressure block and the furnace body are fixedly connected by fasteners.

[0015] Furthermore, the cover plate is made of T2 copper, and the cover plate and the water-cooled substrate are integrally formed by friction stir welding.

[0016] Furthermore, the serpentine water-cooling channel has a flared structure at the connection with the inlet and outlet pipes.

[0017] In addition, this utility model also claims protection for a vacuum eutectic reflow oven equipped with any of the above-mentioned integrated water-cooled heating platforms.

[0018] Compared with existing technologies, the beneficial effects of this solution are:

[0019] This invention provides an integrated water-cooled heating stage and its vacuum eutectic reflow oven, including a furnace body with an installation groove, a heating unit, and a water-cooled stage placed flat within the furnace body's processing space. The surface of the water-cooled substrate of the stage has serpentine water-cooling channels. The integrated water-cooled stage achieves a seamless connection between the channels and the stage through friction stir welding, eliminating the gap thermal resistance of traditional indirect contact, significantly improving heat exchange efficiency, and meeting the requirements for rapid cooling. It also solves the problem that existing cooling water pipes (mostly made of stainless steel) are prone to thermal deformation at temperatures above 300℃, forming periodic alternating stress with the stage, which can lead to scratches on the stage surface and rupture of the water pipes with long-term use. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the integrated water-cooled heating platform structure.

[0021] Figure 2 This is a sectional view of the utility model.

[0022] Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0023] Figure 4 This is a cross-sectional view of the water-cooled platform;

[0024] Figure 5 for Figure 4 Enlarged view at point B in the middle;

[0025] Figure 6 Schematic diagram of removing the cover plate from the water-cooled stage;

[0026] Figure 7 for Figure 6 Enlarged view of point C.

[0027] The reference numerals in the attached figures are as follows:

[0028] Furnace body 1, heating tube 11, water-cooled platform 2, water-cooled base plate 21, cover plate 22, serpentine water-cooling channel 23, flared structure 231, water inlet pipe 24, water outlet pipe 25, sealing assembly 3, pressure block 31, sealing ring 32. Detailed Implementation

[0029] The present invention will now be described in further detail with reference to the accompanying drawings.

[0030] An integrated water-cooled heating platform, such as Figure 1 and Figure 2 As shown, it includes:

[0031] Furnace body 1 with an installation slot;

[0032] A heating unit, comprising at least one heating tube 11, the heating tubes 11 being evenly distributed within the furnace body 1, extending from one side of the furnace body 1 to the opposite side; and

[0033] A water-cooled stage 2 is placed flat in the processing space of the furnace body 1. The water-cooled stage 2 includes a water-cooled substrate 21 and a cover plate 22. The surface of the water-cooled substrate 21 is distributed with serpentine water-cooling channels 23. The cover plate 22 covers the serpentine water-cooling channels 23. The water-cooled substrate 21 is connected to an inlet pipe 24 and an outlet pipe 25. The inlet pipe 24 and the outlet pipe 25 are respectively connected to the two ends of the serpentine water-cooling channels 23. The inlet pipe 24 and the outlet pipe 25 are located near the corners of the water-cooled substrate 21, and the inlet pipe 24 is located near the center of the water-cooled substrate 21.

[0034] According to a specific embodiment provided by this utility model, the specific structural layout inside the furnace body 1 is as follows:

[0035] The furnace body 1 has mounting holes arranged in a straight horizontal array on both sides. The heating tube 11 (infrared quartz lamp tube is used in this embodiment) is fixed in the hole and sealed at both ends. It runs horizontally through the entire furnace body 1 and heats the water-cooled stage 2 through thermal radiation. The water-cooled stage 2 has a hexahedral structure and is placed horizontally above the heating lamp tube. The water-cooled substrate 21 is connected and fixed to the lower cavity of the furnace body 1 through the mounting holes at the four corners using bolts (not visible in the figure). The water-cooled substrate 21 and the heating tube 11 maintain a certain radiation distance.

[0036] The present invention features serpentine water-cooling channels 23 distributed on the surface of the water-cooled substrate 21. Compared with the existing method where the cooling water pipes are distributed outside the heating platform, there is a microscopic contact gap between the cooling water pipes and the heating platform, which reduces thermal resistance and greatly improves heat exchange efficiency, thereby meeting the requirements for rapid cooling.

[0037] At the same time, it solves the problem that existing cooling water pipes (mostly made of stainless steel) are prone to thermal deformation at temperatures above 300℃, forming periodic alternating stress between them and the platform, which can lead to scratches on the platform surface and rupture of the water pipes after long-term use.

[0038] Furthermore, such as Figure 4 and Figure 5 As shown, the serpentine water-cooling channel 23 has a circular or rectangular cross-section. The serpentine water-cooling channel 23 has a cross-section that is easily processed, such as circular or square, and is constructed using...

[0039] The layout is "dense at the center and sparse at the edges". The water inlet pipe 24 is located on the side close to the center of the water-cooled substrate 21, and the water outlet pipe 25 is located at the edge, thus forming a cooling path of "cooling the center first and then spreading to the edge".

[0040] Furthermore, the water-cooled substrate 21 is made of T2 copper and is horizontally positioned above the heating tube 11. The water-cooled substrate 21 is preferably made of T2 copper, which possesses high thermal conductivity, excellent welding performance, and resistance to thermal deformation.

[0041] Furthermore, both the inlet pipe 24 and the outlet pipe 25 extend from the bottom of the furnace body 1, and both are connected to the furnace body 1 via a sealing assembly 3, such as... Figure 2 and Figure 3 As shown, the sealing assembly 3 is located outside the furnace body 1. The sealing assembly 3 includes a pressure block 31 and a sealing ring 32. The sealing ring 32 is sleeved on the outside of the water inlet pipe 24 and the water outlet pipe 25. The pressure block 31 has a through hole in the middle. After the pressure block 31 passes through the water inlet pipe 24 and the water outlet pipe 25, it abuts against the sealing ring 32. The side of the pressure block 31 near the sealing ring 32 has a chamfer. The pressure block 31 and the furnace body 1 are fixedly connected by fasteners.

[0042] According to a specific embodiment of this utility model, the inlet pipe 24 and outlet pipe 25 (made of the same material as the substrate) and the sealing assembly 3 of the furnace body 1 adopt a "pressure block 31 + sealing ring 32" combination structure. The sealing ring 32 (made of fluororubber, which can withstand high temperatures ≥200℃) is fitted onto the outer wall of the inlet pipe 24 and outlet pipe 25. The pressure block 31 has a through hole in the middle that matches the outer diameter of the water pipe. A 45° chamfer is provided on the side near the furnace body 1 so that the sealing ring 32 can be placed inside the chamfer. The chamfer is a ring structure. The pressure block 31 is connected to the furnace body 1 by fasteners. Specifically, a threaded hole can be opened on the furnace body 1, and the fastener, i.e., a bolt (not visible in the figure), passes through the pressure block 31 and is threadedly connected to the furnace body 1. The pre-tightening force of the bolt forces the sealing ring 32 to be squeezed and deformed against the outer surface of the furnace body 1 and the chamfered surface of the pressure block 31, forming a radial and axial double seal to ensure the sealing performance in a vacuum or inert atmosphere environment. By using the sealing component 3, the connection between the water inlet pipe 24 and the water outlet pipe 25 and the furnace body 1 is prevented from failing due to thermal deformation, which could lead to a decrease in vacuum or leakage of inert gas and affect the stability of welding quality.

[0043] Furthermore, the cover plate 22 is made of T2 copper, and the cover plate 22 and the water-cooled substrate 21 are integrally formed by friction stir welding. The cover plate 22 (of the same material as the substrate) covers the water-cooling channel and is welded together by friction stir welding. After welding, the surface is precision machined to ensure the channel's sealing performance and the flatness of the platform surface. The welding between the inlet pipe 24 and the outlet pipe 25 and the water-cooled substrate 21 is treated in the same way.

[0044] Furthermore, such as Figure 6 and Figure 7 As shown, the serpentine water-cooling channel 23 has a flared structure 231 at the connection with the water inlet pipe 24 and the water outlet pipe 25.

[0045] According to a specific embodiment of the present invention, a flared structure 231 (with a diameter larger than that of the water cooling channel) is provided at the connection between the water inlet pipe 24 and the water outlet pipe 25 and the serpentine water cooling channel 23. Since the water inlet pipe 24 and the water outlet pipe 25 are perpendicular to the surface of the water cooling platform 2, the flared structure 231 can play a guiding role, reduce fluid resistance, and increase the cooling water flow rate.

[0046] In addition, this utility model also claims protection for a vacuum eutectic reflow oven equipped with any of the above-mentioned integrated water-cooled heating platforms.

[0047] Working principle of this utility model:

[0048] Heating stage: When the heating tube 11 is powered on, it generates infrared radiation. The heat is transferred through the internal space of the furnace body 1 to the water-cooled stage 2. Water cooling raises the surface temperature of the stage to the temperature required by the process.

[0049] Cooling stage: External cooling water enters through the inlet pipe 24, first passing through the flared structure 231 of the serpentine water-cooling channel 23 for buffering and guidance, and then flowing into the serpentine water-cooling channel 23. This is because the temperature is highest in the central area of ​​the water-cooled platform 2, so the cooling water preferentially flows through the central area to quickly remove the core heat, and then flows towards the edge to gradually reduce the overall temperature. The heat is transferred to the cooling water through the high thermal conductivity of the water-cooled base plate 21 and the cover plate 22, and finally discharged through the outlet pipe 25, completing the heat exchange cycle.

[0050] Finally, it should be noted that in the description of this invention, the terms "vertical," "upper," "lower," "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0051] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0052] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An integrated water-cooled heating platform, characterized in that, include: A furnace body with mounting slots; A heating unit, the heating unit including at least one heating tube, the heating tubes being evenly distributed in the furnace body, the heating tubes extending from one side of the furnace body to the opposite side; as well as A water-cooled platform is placed flat in the processing space of the furnace body. The water-cooled platform includes a water-cooled base plate and a cover plate. The surface of the water-cooled base plate is distributed with serpentine water-cooling channels. The cover plate covers the serpentine water-cooling channels. The water-cooled base plate is connected to an inlet pipe and an outlet pipe. The inlet pipe and the outlet pipe are respectively connected to the two ends of the serpentine water-cooling channels. The inlet pipe and the outlet pipe are located near the corner of the water-cooled base plate, and the inlet pipe is located near the center of the water-cooled base plate.

2. The integrated water-cooled heating platform according to claim 1, characterized in that, The serpentine water-cooling channel has a circular or rectangular cross-section.

3. The integrated water-cooled heating platform according to claim 2, characterized in that, The water-cooled substrate is made of T2 copper and is placed horizontally above the heating tube.

4. The integrated water-cooled heating platform according to claim 3, characterized in that, Both the inlet and outlet water pipes extend from the bottom of the furnace body and are connected to the furnace body via a sealing assembly. The sealing assembly is located outside the furnace body and includes a pressure block and a sealing ring. The sealing ring is fitted over the inlet and outlet water pipes. A through hole is formed in the center of the pressure block. After passing through the inlet and outlet water pipes, the pressure block abuts against the sealing ring, and a chamfer is formed on the side of the pressure block closest to the sealing ring. The pressure block and the furnace body are fixedly connected by fasteners.

5. The integrated water-cooled heating platform according to claim 4, characterized in that, The cover plate is made of T2 copper, and the cover plate and the water-cooled substrate are integrally formed by friction stir welding.

6. The integrated water-cooled heating platform according to claim 5, characterized in that, The serpentine water-cooling channel has a flared structure at the connection with the inlet and outlet pipes.

7. A vacuum eutectic reflow oven, characterized in that: The device is equipped with an integrated water-cooled heating platform as described in any one of claims 1-6.