Suction cup polishing device

Abstract

This utility model discloses a suction cup polishing device, including a fixing clamp for fixing the suction cup, a first driving mechanism, and a second driving mechanism. The first driving mechanism drives the polishing component to move relative to the fixing clamp along a first direction, thereby causing the polishing component to move closer to or away from the suction cup along the first direction. The second driving mechanism drives the polishing component to move relative to the fixing clamp along a second direction, thereby causing the polishing component to move closer to or away from the suction cup along the second direction. The polishing component reciprocates along the first direction under the drive of the first driving mechanism to polish the suction cup. Furthermore, the first and second directions intersect, with the second direction being the height direction of the fixing clamp. This allows the first and second driving mechanisms to drive the polishing component closer to or away from the suction cup along the first and second directions respectively, thereby achieving automated polishing of the suction cup surface and improving the efficiency of suction cup polishing.

Description

Technical Field

[0001] This application relates to the field of suction cup processing equipment technology, and in particular to a suction cup grinding device. Background Technology

[0002] In the production of solar cells, suction cups are a crucial auxiliary tool, primarily used for adsorbing, fixing, and transporting the cells. However, due to variations in processing technology or precision, the surface of suction cups may have defects such as unevenness or burrs. These defects can damage the surface of the suction cup when adsorbing the cells, thus requiring surface polishing.

[0003] In related technologies, suction cup polishing is usually done manually, which is inefficient and has a low yield. Utility Model Content

[0004] This utility model discloses a suction cup polishing device that can automatically polish the surface of a suction cup, thereby improving the efficiency and yield of suction cup surface polishing.

[0005] To achieve the above objectives, the first aspect of this utility model discloses a suction cup polishing device, comprising:

[0006] A fixing clamp, wherein the fixing clamp is configured to fix a suction cup;

[0007] A polishing mechanism is disposed on one side of the fixed clamp along a first direction, and the polishing mechanism includes a polishing component;

[0008] A first driving mechanism is connected to the grinding assembly and is configured to drive the grinding assembly to move relative to the fixed clamp along the first direction, so as to move the grinding assembly closer to or further away from the suction cup along the first direction.

[0009] A second driving mechanism is connected to the grinding assembly and is configured to drive the grinding assembly to move relative to the fixed clamp in a second direction, so as to move the grinding assembly closer to or further away from the suction cup in the second direction.

[0010] The polishing component is configured to reciprocate along the first direction under the drive of the first driving mechanism to polish the suction cup.

[0011] The first direction and the second direction intersect, and the second direction is the height direction of the fixing fixture.

[0012] As an optional implementation, the polishing assembly includes an adsorption element and a polishing component, wherein the adsorption element is configured to adsorb the polishing component such that the polishing component is located below the adsorption element along the second direction, and the polishing component is configured to polish the suction cup.

[0013] As an optional implementation, the adsorption element is provided with a plurality of adsorption holes, which are configured to connect to an air source to adsorb the grinding component, and the projection of the grinding component on the adsorption element is located within the range of the plurality of adsorption holes.

[0014] As an optional implementation, the polishing component is a battery cell with a textured surface.

[0015] As an optional implementation, the suction cup polishing device further includes a base, on which both the fixing clamp and the polishing mechanism are disposed.

[0016] As an optional implementation, the suction cup polishing device further includes two detection components, which are spaced apart on the base along the first direction. Each detection component is configured to detect the position of the polishing component along the first direction. Both detection components are electrically connected to the first driving mechanism, which is configured to stop driving the polishing component to move along the first direction based on a signal received from the detection components; and / or,

[0017] The suction cup polishing device includes two first limiting components, which are spaced apart on the base along the first direction. The two first limiting components are configured to limit the movement of the polishing component along the first direction.

[0018] As an optional implementation, the fixing fixture includes a fixing base, a first clamping component, and a second clamping component. The fixing base is disposed on the base, and both the first clamping component and the second clamping component are disposed on the fixing base. The first clamping component is configured to clamp the suction cup along the first direction, and the second clamping component is configured to clamp the suction cup along a third direction.

[0019] The third direction intersects with both the first direction and the second direction.

[0020] As an optional implementation, the fixing base is provided with a plurality of first grooves spaced apart along the third direction, the first grooves extending along the first direction, the first clamping assembly includes a plurality of first clamps, the plurality of first clamps being spaced apart along the first direction, each first clamp including a first fixing part and a plurality of first connecting parts disposed on the first fixing part, the first fixing part being located on the surface of the fixing base and extending along the third direction, the first fixing part being configured to fix the suction cup along the first direction, and the plurality of first connecting parts being slidably located within the plurality of first grooves to drive the first fixing part to move along the first direction;

[0021] The fixing base has a second groove along the third direction. The second clamping assembly includes a plurality of second clamps, which are spaced apart along the third direction. Each second clamp includes a second fixing part and a second connecting part disposed on the second fixing part. The second fixing part is located on the surface of the fixing base and extends along the first direction. The second fixing part is configured to fix the suction cup along the third direction. The second connecting part is slidably located in the second groove to drive the second fixing part to move along the third direction.

[0022] As an optional implementation, the suction cup polishing device further includes a carrier, and the polishing assembly is connected to the carrier along the first direction;

[0023] The first driving mechanism includes a first driving member and a first driving shaft. The first driving member is disposed at one end of the base away from the fixed clamp along the first direction. The first driving shaft extends along the first direction and is connected to the first driving member. The bearing member is drivenly connected to the first driving shaft. The first driving member is configured to drive the first driving shaft to rotate so as to move the grinding assembly along the first direction.

[0024] The second driving mechanism includes a second driving member and a second driving shaft. Both the second driving member and the second driving shaft are disposed on the support member. The second driving member is disposed at one end of the support member away from the fixed clamp along the second direction. The second driving shaft extends along the second direction and is connected to the second driving member. The grinding assembly is drivenly connected to the second driving shaft. The second driving member is configured to drive the second driving shaft to rotate so as to move the grinding assembly along the second direction.

[0025] As an optional implementation, the suction cup polishing device further includes a first guiding mechanism and a second guiding mechanism;

[0026] The first guide mechanism is disposed on the base and extends along the first direction. The carrier is slidably connected to the first guide mechanism along the first direction. The first guide mechanism is configured to guide the movement of the grinding assembly along the first direction.

[0027] The second guide mechanism is disposed on the carrier and extends along the second direction. The grinding assembly is slidably connected to the second guide mechanism along the second direction. The second guide mechanism is configured to guide the movement of the grinding assembly along the second direction.

[0028] The suction cup polishing device further includes two second limiting components, both of which are disposed on the carrier and are respectively disposed near the end of the second guide mechanism along the second direction. The second limiting components are configured to limit the movement of the polishing component along the second direction.

[0029] Compared with the prior art, the beneficial effects of this application are:

[0030] This utility model provides a suction cup polishing device, which includes a fixing clamp for fixing the suction cup and a polishing mechanism located on one side of the fixing clamp along a first direction. The polishing mechanism includes a polishing component. A first driving mechanism is configured to drive the polishing component connected to it to move relative to the fixing clamp along the first direction, thereby moving the polishing component closer to or away from the suction cup along the first direction. A second driving mechanism is configured to drive the polishing component connected to it to move relative to the fixing clamp along a second direction, thereby moving the polishing component closer to or away from the suction cup along the second direction. The polishing component reciprocates along the first direction under the drive of the first driving mechanism to polish the suction cup. This configuration allows the polishing component to move closer to or away from the suction cup in both the first and second directions through the first and second driving mechanisms, thereby adjusting the position of the polishing component along the second direction. This allows the polishing component to move to the surface of the suction cup and reciprocate along the first direction to polish the suction cup surface. This achieves automated polishing of the suction cup surface, thereby improving the efficiency of polishing the suction cup surface and increasing the yield of polished suction cups. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1This is a schematic diagram of the suction cup polishing device disclosed in the embodiments of this application;

[0033] Figure 2 This is a side view of the suction cup polishing apparatus disclosed in the embodiments of this application;

[0034] Figure 3 This is a schematic diagram of the structure of the polishing component disclosed in the embodiments of this application;

[0035] Figure 4 This is a schematic diagram of the structure of the fixing fixture disclosed in the embodiments of this application;

[0036] Figure 5 This is a schematic diagram of the structure of the first and second clamps disclosed in the embodiments of this application;

[0037] Figure 6 This is a schematic diagram of the structure of the first and second clamps disclosed in the embodiments of this application within the groove;

[0038] Figure 7 This is a schematic diagram of the structure of the clamping suction cup of the fixing fixture disclosed in the embodiments of this application;

[0039] Figure 8 This is a schematic diagram of the structure of the carrier disclosed in the embodiments of this application;

[0040] Figure 9 This is a schematic diagram of the structure of the first drive mechanism disclosed in the embodiments of this application;

[0041] Figure 10 This is a schematic diagram of the structure of the second drive mechanism disclosed in the embodiments of this application.

[0042] Explanation of reference numerals in the attached figures:

[0043] 100- Suction cup polishing device; 1- Fixing clamp; 11- Fixing base; 111- First groove; 112- Second groove; 12- First clamping assembly; 121- First clamp; 121a- First fixing part; 121b- First connecting part; 13- Second clamping assembly; 131- Second clamp; 131a- Second fixing part; 131b- Second connecting part; 2- Polishing mechanism; 21- Polishing assembly; 211- Suction element; 211a- Suction hole; 212- Polishing component; 22- 3-Carrier component; 31-First driving mechanism; 32-First driving component; 321-Support base; 4-Second driving mechanism; 41-Second driving component; 42-Second driving shaft; 421-Connector; 5-Base; 51-Detection component; 52-First limiting component; 53-First guide mechanism; 54-Second guide mechanism; 55-Second limiting component; 200-Suction cup; 201-Long side; 202-Short side; X-First direction; Y-Second direction; Z-Third direction. Detailed Implementation

[0044] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0045] In this application, the terms "upper," "lower," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated equipment, elements, or components to having a specific orientation, or to be constructed and operated in a specific orientation.

[0046] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0047] Furthermore, the terms "setup" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection via an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0048] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, components, or parts (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, components, or parts. Unless otherwise stated, "a plurality of" means two or more.

[0049] In the production of solar cells, suction cups are a crucial auxiliary tool. For example, when transferring cells between different processes, such as from a material box to an assembly line, or from one processing device to another, suction cups can quickly and accurately complete this transfer process, thereby improving production efficiency. Alternatively, when it is necessary to accurately position and fix the cells in a specific location, suction cups can adhere the cells to appropriate tooling fixtures or equipment platforms, ensuring the positional accuracy and stability of the cells during processing.

[0050] However, the surface of an unpolished suction cup may have rough particles or sharp edges, which can easily scratch the surface of the solar cells when adsorbing and releasing them, potentially affecting the photoelectric conversion efficiency and quality of the solar cells.

[0051] In related technologies, grinding of suction cups is usually done manually, which is inefficient and yields low results.

[0052] In view of this, this application discloses a suction cup polishing device, including a fixing clamp for fixing the suction cup, a first driving mechanism, and a second driving mechanism. The first driving mechanism drives the polishing component to move relative to the fixing clamp along a first direction, thereby causing the polishing component to move closer to or away from the suction cup along the first direction. The second driving mechanism drives the polishing component to move relative to the fixing clamp along a second direction, thereby causing the polishing component to move closer to or away from the suction cup along the second direction. The polishing component reciprocates along the first direction under the drive of the first driving mechanism, thereby polishing the suction cup. Furthermore, the first and second directions intersect, with the second direction being the height direction of the fixing clamp. This allows the first and second driving mechanisms to drive the polishing component to move closer to or away from the suction cup along the first and second directions respectively, thereby achieving automated polishing of the suction cup surface and improving the efficiency of suction cup polishing.

[0053] The technical solution of this application will be further described below with reference to the embodiments and accompanying drawings.

[0054] Please see Figure 1 , Figure 1 This is a schematic diagram of the suction cup polishing device disclosed in this application. The suction cup polishing device 100 includes a fixing clamp 1, a polishing mechanism 2, a first driving mechanism 3, and a second driving mechanism 4. The fixing clamp 1 is configured to fix the suction cup 200. The polishing mechanism 2 is disposed on one side of the fixing clamp 1 along the first direction X, and includes a polishing component 21. The first driving mechanism 3 is connected to the polishing component 21 and is configured to drive the polishing component 21 to move relative to the fixing clamp 1 along the first direction X, thereby causing the polishing component 21 to move closer to or away from the suction cup 200 along the first direction X. The second driving mechanism 4 is connected to the polishing component 21 and is configured to drive the polishing component 21 to move relative to the fixing clamp 1 along the second direction Y, thereby causing the polishing component 21 to move closer to or away from the suction cup 200 along the second direction Y. The polishing component 21 is configured to reciprocate along the first direction X under the drive of the first driving mechanism 3 to polish the suction cup 200. The first direction X mentioned above (e.g.) Figure 1 (left and right directions of the middle paper) and the second direction Y (e.g.) Figure 1 The second direction Y intersects with the vertical direction of the paper surface, and the second direction Y is the height direction of the fixing fixture 1.

[0055] The suction cup polishing device 100 of this application, through the coordinated action of the first driving mechanism 3 and the second driving mechanism 4, enables the polishing component 21 to move in two intersecting directions. This allows the distance between the polishing component 21 and the suction cup 200 to be adjusted along the second direction Y, so that the polishing component 21 can move closer to or further away from the suction cup 200 along the second direction Y. Then, the polishing component 21 can be adjusted to reciprocate along the first direction X, thereby realizing fully automatic polishing of the surface of the suction cup 200. This allows for the completion of comprehensive polishing of the surface of the suction cup 200 in a relatively short time, improving the polishing efficiency of the suction cup 200.

[0056] First, the first drive mechanism 3 can drive the polishing component 21 to move closer to or further away from the suction cup 200 along the first direction X, and the second drive mechanism 4 can drive the polishing component 21 to move closer to or further away from the suction cup 200 along the second direction Y. This bidirectional adjustment function allows the operator to precisely control the distance and relative position between the polishing component 21 and the suction cup 200. During the polishing process, if it is found that certain areas have been over-polished or that specific parts need to be finely polished, the position of the polishing component 21 can be finely adjusted using these two drive mechanisms, thereby avoiding unnecessary damage to the suction cup 200 while ensuring polishing quality.

[0057] Secondly, the polishing component 21 reciprocates along the first direction X under the drive of the first driving mechanism 3 to perform polishing. This reciprocating polishing method allows the polishing component 21 to fully contact the surface of the suction cup 200, uniformly removing material from the surface of the suction cup 200. Furthermore, since the first direction X intersects with the second direction Y, this changes the polishing angle, making the polishing more comprehensive, helping to reduce polishing dead corners, thereby improving the flatness of the suction cup 200 surface and enhancing the overall quality of the suction cup 200.

[0058] It is understandable that the first direction X mentioned above can be as follows: Figure 1 The left-right direction of the paper can also be the front-back direction of the paper. This application will use the first direction X as the left-right direction of the paper for subsequent explanation.

[0059] Please refer to the following: Figure 2 and Figure 3 , Figure 2 This is a side view of the suction cup polishing apparatus disclosed in the embodiments of this application. Figure 3 This is a schematic diagram of the grinding assembly disclosed in the embodiments of this application. In some embodiments, the suction cup grinding device 100 further includes a base 5, on which the fixing clamp 1 and the grinding mechanism 2 are both disposed. By setting the base 5 as the basic support structure of the suction cup grinding device 100, the vibration and friction generated by the suction cup 200 and the grinding assembly 21 can be dispersed through the base 5, thereby providing a stable mounting platform for the fixing clamp 1 and the grinding mechanism 2, ensuring the stability and accuracy of the grinding process.

[0060] Furthermore, by mounting the fixing clamp 1 and the grinding mechanism 2 on the base 5, the installation process of the entire device is simplified. During installation, only the fixing clamp 1 and the grinding mechanism 2 need to be installed on the base 5 sequentially, thereby improving installation efficiency. On the other hand, if it is necessary to move or adjust the position of the suction cup grinding device 100 on the worktable, only the base 5 needs to be moved or adjusted, without the need to adjust the positions of the fixing clamp 1 and the grinding mechanism 2 separately, thus improving the convenience of position adjustment of the grinding device.

[0061] It is understood that the aforementioned base 5 can be a frame-type base or a box-type base, etc., and this embodiment does not make specific limitations on it.

[0062] It is understood that the base 5 can be an integral base as described above, that is, the fixing clamp 1 and the grinding mechanism 2 are mounted on one base 5. The base 5 can also be a split base, that is, the fixing clamp 1 and the grinding mechanism 2 are mounted on different bases 5 respectively. This embodiment does not specifically limit this.

[0063] To prevent the grinding assembly 21 from moving excessively along the first direction X, which could cause it to detach from the base 5 or collide with the fixing fixture 1, it is necessary to limit the movement of the grinding assembly 21 along the first direction X. Various limiting methods can be implemented. For one example, please refer to... Figure 2 The suction cup polishing device 100 also includes two detection components 51, which are spaced apart from the base 5 along the first direction X. Each detection component 51 is configured to detect the position of the polishing component 21 along the first direction X. Both detection components 51 are electrically connected to the first drive mechanism 3, which is configured to stop driving the polishing component 21 to move along the first direction X based on the received signal from the detection components 51. By setting two detection components 51 spaced apart along the first direction X, when the polishing component 21 moves to the detection component 51 along the first direction X, it can be detected by the detection component 51, thereby feeding back the detection signal to the first drive mechanism 3. This causes the first drive mechanism 3 to stop driving the polishing component 21 to move along the first direction X, thus limiting the movement range of the polishing component 21 in the first direction X and preventing the polishing component 21 from moving too far along the first direction X, causing it to detach from the base 5 or collide with the fixing clamp 1.

[0064] In another example, the suction cup polishing device 100 includes two first limiting components 52, which are spaced apart on the base 5 along a first direction X. The two first limiting components 52 are configured to limit the movement of the polishing component 21 along the first direction X. By setting two first limiting components 52 spaced apart along the first direction X, when the polishing component 21 moves to the first limiting component 52 along the first direction X, it can be blocked by the first limiting component 52, thereby limiting the movement range of the polishing component 21 in the first direction X and preventing the polishing component 21 from moving too far along the first direction X and causing it to detach from the base 5 or collide with the fixing clamp 1.

[0065] In another example, the suction cup polishing device 100 includes two detection components 51 and two first limiting components 52. The two detection components 51 are spaced apart on the base 5 along the first direction X, and the two first limiting components 52 are respectively disposed outside the detection component 51 closer to it along the first direction X. The detection components 51 are configured to detect the position of the polishing component 21 along the first direction X. Both detection components 51 are point-connected to the first driving mechanism 3, which is configured to stop driving the polishing component 21 to move along the first direction X according to the signal received from the detection components 51. The two first limiting components 52 are configured to limit the movement of the polishing component 21 along the first direction X. By simultaneously setting up two detection components 51 and two first limiting components 52, with the two first limiting components 52 respectively positioned outside the detection component 51 closer to it along the first direction X, the movement range of the grinding component 21 along the first direction X is limited in two ways. First, the detection component 51 provides the limitation. If the detection component 51 fails or fails to limit the movement, the physical obstruction of the first limiting component 52 can also ensure that the movement of the grinding component 21 along the first direction X is blocked, thereby avoiding equipment damage or personal injury that may be caused by the grinding component 21 going out of control.

[0066] It is understood that the detection component 51 mentioned above can be a photoelectric sensor or an ultrasonic sensor, etc., and this embodiment does not specifically limit it.

[0067] It is understood that the first limiting component 52 mentioned above can be a stop, a baffle, or a limiting post, etc., and this embodiment does not specifically limit it.

[0068] Please continue reading. Figure 2 and Figure 3In some embodiments, the polishing assembly 21 includes an adsorption member 211 and a polishing component 212. The adsorption member 211 is configured to adsorb the polishing component 212, such that the polishing component 212 is located below the adsorption member 211 along the second direction Y. The polishing component 212 is configured as a polishing suction cup 200. Since the polishing assembly 21 consists of the adsorption member 211 and the polishing component 212, the adsorption member 211 can adsorb the polishing component 212. Thus, in actual production, when it is necessary to polish suction cups 200 of different materials or shapes, only the appropriate polishing component 212 needs to be replaced. This design, where the adsorption member 211 adsorbs the polishing component 212, can quickly adapt to various different polishing needs, thereby improving the versatility and flexibility of the suction cup polishing device 100.

[0069] In addition, the adsorption component 211 fixes the grinding component 212 by adsorption, which can ensure that the grinding component 212 is stably located under the adsorption component 211 during the grinding process, thereby avoiding the situation where the grinding quality and efficiency are affected by the loosening of the grinding component 212.

[0070] Optionally, please refer to Figure 2 and Figure 3 , Figure 3 This is a schematic diagram of the polishing assembly disclosed in the embodiments of this application. The adsorption member 211 has multiple adsorption holes 211a, which are configured to connect to an air source (not shown) to adsorb the polishing component 212. The projection of the polishing component 212 onto the adsorption member 211 lies within the area of ​​the multiple adsorption holes 211a. By providing multiple adsorption holes 211a on the adsorption member 211 and connecting them to the air source, a stable adsorption force can be generated to firmly adsorb the polishing component 212 onto the adsorption member 211, thereby improving the stability of the polishing component 212.

[0071] In addition, since the projection of the polishing component 212 onto the adsorption component 211 is located within the range of multiple adsorption holes 211a, all parts of the polishing component 212 can be adsorbed by the adsorption holes 211a, thereby improving the stability of the adsorption of the polishing component 212 and preventing the polishing component 212 from falling off due to insufficient adsorption force caused by only being partially adsorbed by the adsorption holes 211a.

[0072] It is understood that the aforementioned adsorption element 211 may be a hollow adsorption plate or a hollow adsorption block, etc., and this embodiment does not specifically limit it.

[0073] It is understood that the gas source mentioned above can be a vacuum pump or an air compressor, etc., and this embodiment does not specifically limit it.

[0074] It is understandable that the multiple adsorption holes 211a opened on the adsorption member 211 can be evenly spaced along the length and width directions of the lower surface of the adsorption member 211 (e.g., Figure 3 As shown in the figure, this can improve the uniformity of the adsorption of the adsorption component 211 and the adsorption of the polishing component 212.

[0075] In some embodiments, the aforementioned polishing component 212 can be sandpaper, a polishing wheel, or a textured solar cell. Sandpaper and polishing wheels can polish larger protrusions on the surface of the suction cup 200, while textured solar cells can polish smaller protrusions or burrs on the surface of the suction cup 200. Specifically, because the textured surface of the solar cell typically exhibits a pyramidal structure, these pyramidal structures are densely distributed on the silicon wafer surface, forming a velvety appearance. This makes the surface of the solar cell relatively rough, but still finer than sandpaper or abrasive wheel polishing. The special structure of the textured surface of the solar cell increases its surface roughness, providing greater friction when in contact with the surface of the suction cup 200. Therefore, during the polishing process, this greater friction helps to more effectively remove material from the surface of the suction cup 200, thereby improving polishing efficiency and quality.

[0076] This application will use the polished component 212 as an example of a battery cell with a textured surface for further explanation.

[0077] Optionally, please refer to Figure 4 , Figure 4 This is a schematic diagram of the structure of the fixing clamp disclosed in this application embodiment. The fixing clamp 1 includes a fixing base 11, a first clamping assembly 12, and a second clamping assembly 13. The fixing base 11 is disposed on the base 5, and both the first clamping assembly 12 and the second clamping assembly 13 are disposed on the fixing base 11. The first clamping assembly 12 is configured to clamp the suction cup 200 along a first direction X, and the second clamping assembly 13 is configured to clamp the suction cup 200 along a third direction Z. Wherein, the third direction Z (e.g., ...) Figure 4 The suction cup 200 is clamped along both the front and back directions of the paper surface and the first direction X and the second direction Y. By setting the first clamping component 12 and the second clamping component 13 on the fixing base 11, the suction cup 200 is clamped along the first direction X and the third direction Z, respectively. This method can clamp the suction cup 200 in both intersecting directions, thereby improving the clamping firmness of the fixing fixture 1 on the suction cup 200 and ensuring the stability of the suction cup 200.

[0078] It is understood that the aforementioned fixing seat 11 can be a fixing block or a fixing plate, etc., and this embodiment does not specifically limit it.

[0079] Optionally, please refer to Figures 4 to 7 , Figure 5 This is a schematic diagram of the structure of the first and second clamps disclosed in the embodiments of this application. Figure 6This is a schematic diagram of the structure of the first and second clamps disclosed in the embodiments of this application within the groove. Figure 7 This is a schematic diagram of the structure of the clamping suction cup of the fixing fixture disclosed in this application embodiment. The fixing base 11 has multiple first grooves 111 spaced apart along a third direction Z. These first grooves 111 extend along a first direction X. The first clamping assembly 12 includes multiple first clamps 121, which are spaced apart along the first direction X. Each first clamp 121 includes a first fixing part 121a and multiple first connecting parts 121b disposed on the first fixing part 121a. The first fixing part 121a is located on the surface of the fixing base 11 and extends along a third direction Z. The first fixing part 121a is configured to fix the suction cup 200 along the first direction X. The multiple first connecting parts 121b are slidably located within the multiple first grooves 111 to drive the first fixing part 121a to move along the first direction X.

[0080] The fixing base 11 has a second groove 112 along the third direction Z. The second clamping assembly 13 includes a plurality of second clamps 131, which are spaced apart along the third direction Z. Each second clamp 131 includes a second fixing part 131a and a second connecting part 131b disposed on the second fixing part 131a. The second fixing part 131a is located on the surface of the fixing base 11 and extends along the first direction X. The second fixing part 131a is configured to fix the suction cup 200 along the third direction Z. The second connecting part 131b is slidably located in the second groove 112 to drive the second fixing part 131a to move along the third direction Z.

[0081] The first clamping assembly 12 includes multiple first clamps 121, and the second clamping assembly 13 includes multiple second clamps 131, which are spaced apart along the first direction X and the third direction Z, respectively. This method can clamp different positions of the suction cup 200 simultaneously, thereby improving the uniformity and stability of clamping the suction cup 200.

[0082] Secondly, the fixing base 11 has multiple first grooves 111 and one second groove 112 spaced apart along the third direction Z. The first grooves 111 extend along the first direction X, and the second grooves 112 extend along the third direction Z. The first clamps 121 and the second clamps 131 slide within their respective grooves. This method allows for flexible adjustment of the positions of the first clamps 121 and the second clamps 131 within their respective grooves, enabling the fixing clamp 1 to adapt to suction cups 200 of different sizes and shapes, thereby improving the versatility and flexibility of the fixing clamp 1.

[0083] Understandably, the suction cup 200 has an F-shaped structure, with a long side 201 and multiple short sides 202 connected to the long side 201. The aforementioned first fixing part 121a is used to clamp the long side 201 of the suction cup 200. To better clamp the long side 201, the length of the first fixing part 121a needs to be close to or even greater than the length of the long side 201 of the suction cup 200. Because the first fixing part 121a is relatively long along the third direction Z, it needs to be connected to multiple first connecting parts 121b simultaneously, so that the clamping force can be evenly distributed on the long side 201 of the suction cup 200. This evenly distributed clamping force can prevent the suction cup 200 from undergoing local deformation or displacement during the clamping process, ensuring the overall stability of the suction cup 200.

[0084] It is understood that the first fixing part 121a and the second fixing part 131a mentioned above can be a long strip plate or a long strip block, etc., and this embodiment does not specifically limit them.

[0085] It is understood that the first connecting part 121b and the second connecting part 131b mentioned above can be a connecting post or an L-shaped connecting plate, etc., and this embodiment does not make specific limitations on this.

[0086] It is understandable that the first connecting part 121b is slidably located within the first groove 111, and the second connecting part 131b is slidably located within the second groove 112, which can be achieved through threaded connectors or a slider and slide rail combination. Taking a threaded connector as an example, the lower end of the first connecting part 121b has a first threaded hole, and multiple second threaded holes are spaced apart along the extension direction of the first groove 111. Bolts are passed through the first and second threaded holes respectively to fix the first connecting part 121b and the first groove 111. Bolts are used to connect the first threaded holes to different second threaded holes, thereby enabling the first connecting part 121b to slide within the first groove 111. Taking a slider and slide rail combination as an example, the lower end of the first connecting part 121b is connected to a slider, and a slide rail is provided along the extension direction of the first groove 111. The sliding connection between the slider and the slide rail enables the first connecting part 121b to slide within the first groove 111.

[0087] In some embodiments, please refer to Figures 8 to 10 , Figure 8 This is a schematic diagram of the structure of the carrier disclosed in the embodiments of this application. Figure 9 This is a schematic diagram of the structure of the first drive mechanism disclosed in the embodiments of this application. Figure 10This is a schematic diagram of the structure of the second driving mechanism disclosed in the embodiments of this application. The suction cup polishing device 100 also includes a support member 22, and the polishing assembly 21 is connected to the support member 22 along the first direction X. The first driving mechanism 3 includes a first driving member 31 and a first driving shaft 32. The first driving shaft 32 is disposed at one end of the base 5 away from the fixed clamp 1 along the first direction X. The first driving shaft 32 extends along the first direction X and is connected to the first driving member 31. The support member 22 is drively connected to the first driving shaft 32. The first driving member 31 is configured to drive the first driving shaft 32 to rotate so as to move the polishing assembly 21 along the first direction X. The second drive mechanism 4 includes a second drive member 41 and a second drive shaft 42. Both the second drive member 41 and the second drive shaft 42 are disposed on the support member 22. The second drive member 41 is disposed at one end of the support member 22 away from the fixed clamp 1 along the second direction Y. The second drive shaft 42 extends along the second direction Y and is connected to the second drive member 41. The grinding assembly 21 is connected to the second drive shaft 42 in a transmission manner. The second drive member 41 is configured to drive the second drive shaft 42 to rotate so as to drive the grinding assembly 21 to move along the second direction Y.

[0088] First, the polishing assembly 21 and the second drive mechanism 4 are integrated together by setting up the carrier 22. The first drive mechanism 31 is located at the end of the base 5 away from the fixed clamp 1 along the first direction X, and the second drive mechanism 41 is located at the end of the carrier 22 away from the fixed clamp 1 along the second direction Y. This arrangement ensures that both the first drive mechanism 3 and the second drive mechanism 4 maintain a certain distance from the fixed clamp 1, thereby reducing mutual interference between the drive mechanism and the fixed clamp 1. It also optimizes space utilization, making the entire suction cup polishing device 100 more compact.

[0089] Secondly, by setting the first drive mechanism 3 and the second drive mechanism 4 to control the movement of the grinding component 21 in the first direction X and the second direction Y respectively, the movement of the grinding component 21 in the two directions can be precisely controlled, and the grinding process of the grinding component 21 can be automatically controlled, thereby improving the grinding efficiency and yield of the grinding component 21.

[0090] Furthermore, the first drive mechanism 3 and the second drive mechanism 4 are powered by a drive component and transmitted through a drive shaft, respectively. This results in a shorter power transmission path, improving power transmission efficiency. On the other hand, this arrangement of the drive component and drive shaft optimizes the overall structure of the suction cup polishing device 100, making the drive mechanism more compact and saving space.

[0091] It is understood that the aforementioned support member 22 may be a support plate or a support block, etc., and this embodiment does not specifically limit it.

[0092] It is understood that the first driving component 31 and the second driving component 41 mentioned above can be a servo motor or a hydraulic cylinder, etc., and this embodiment does not specifically limit them.

[0093] It is understood that the first drive shaft 32 and the second drive shaft 42 mentioned above can be ball screws or helical shafts, etc., and this embodiment does not specifically limit them.

[0094] It is understood that the first drive shaft 32 can be directly connected to the carrier 22 or indirectly connected to the carrier 22. For example, a support base 321 can be provided, which is connected to the first drive shaft 32. The carrier 22 is placed on the support base 321. In this way, the support base 321 can distribute the driving force of the first drive shaft 32 to a larger area, thereby enhancing the stability and load-bearing capacity of the carrier 22. This makes the grinding assembly 21 move more smoothly and can effectively prevent the carrier 22 from deforming or being damaged.

[0095] It is understood that the second drive shaft 42 can be directly connected to the grinding assembly 21 or indirectly connected to it. For example, a connector 421 can be provided, which is connected to the second drive shaft 42. The grinding assembly 21 is connected to the connector 421. In this way, the connector 421 can distribute the driving force of the second drive shaft 42 to a larger area, thereby making the grinding assembly 21 more stable during movement and effectively preventing deformation or damage to the grinding assembly 21.

[0096] Optionally, please refer to Figures 8 to 10 The suction cup polishing device 100 further includes a first guide mechanism 53 and a second guide mechanism 54. The first guide mechanism 53 is disposed on the base 5 and extends along a first direction X. The support member 22 is slidably connected to the first guide mechanism 53 along the first direction X. The first guide mechanism 53 is configured to guide the movement of the polishing assembly 21 along the first direction X. The second guide mechanism 54 is disposed on the support member 22 and extends along a second direction Y. The polishing assembly 21 is slidably connected to the second guide mechanism 54 along the second direction Y. The second guide mechanism 54 is configured to guide the movement of the polishing assembly 21 along the second direction Y. The suction cup polishing device 100 also includes two second limiting components 55. Both second limiting components 55 are disposed on the support member 22 and are respectively disposed near the ends of the second guide mechanisms 54 along the second direction Y. The second limiting components 55 are configured to limit the movement of the polishing assembly 21 along the second direction Y.

[0097] First, by setting the first guide mechanism 53 and the second guide mechanism 54 to provide precise guidance for the carrier 22 and the grinding assembly 21 respectively, it is ensured that their movement along the first direction X and the second direction Y is more stable and accurate. This arrangement helps to improve the grinding accuracy of the suction cup grinding device 100 and avoids problems such as uneven grinding or over-grinding caused by movement deviation.

[0098] Secondly, the first guide mechanism 53 and the second guide mechanism 54 can provide additional support for the carrier 22 and the grinding assembly 21, thereby enhancing the structural rigidity of the entire grinding mechanism 2, enabling the grinding assembly 21 to withstand greater force and torque during grinding operations, and extending the service life of the suction cup grinding device 100.

[0099] In addition, by setting two second limiting components 55 on the carrier 22, and setting the two second limiting components 55 near the end of the second guide mechanism 54 along the second direction Y, the movement range of the grinding component 21 along the second direction Y can be effectively limited, and the grinding component 21 can be prevented from moving too far along the second direction Y to detach from the base 5 or collide with the fixing fixture 1.

[0100] It is understood that the first guide mechanism 53 and the second guide mechanism 54 mentioned above can be a guide rail and a slider or a guide rail and a roller, etc., and this embodiment does not specifically limit them.

[0101] It is understood that the structure of the second limiting component 55 is the same as that of the first limiting component 52, and this embodiment will not elaborate further on this.

[0102] The following is a brief description of the process by which the suction cup polishing device 100 polishes the suction cup 200 disclosed in this application:

[0103] First, place the suction cup 200 on the fixed base 11. Adjust the position of the first connecting part 121b within the first groove 111 so that the first fixing part 121a clamps the long side 201 of the suction cup 200 along the first direction X. Then, adjust the position of the second connecting part 131b within the second groove 112 so that the second fixing part 131a clamps the short side 202 of the suction cup 200 along the third direction Z. Turn on the air source, and the grinding component 212 is adsorbed onto its lower part by the suction member 211. Turn on the first driving member 31 and the second driving member 41 to drive the first driving shaft 32 and the second driving shaft 42 to rotate, thereby adjusting the position of the grinding component 21 along the first direction X and the second direction Y so that the grinding component 21 abuts against the suction cup 200 along the second direction Y. Then, drive the grinding component 21 to reciprocate along the first direction X by the first driving member 31 to grind the suction cup 200. Based on the size of the suction cup 200, the position of the polishing component 21 is controlled by the first driving member 31 and the second driving member 41 to polish the entire surface of the suction cup 200. After polishing, the first driving member 31 and the second driving member 41 drive the polishing component 21 away from the suction cup 200, adjust the position of the first connecting part 121b in the first groove 111 and the position of the second connecting part 131b in the second groove 112, so that the first fixing part 121a and the second fixing part 131a release the suction cup 200, and the polished suction cup 200 is taken out.

[0104] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A suction cup polishing device, characterized in that, include: Base; A fixing clamp is disposed on the base and configured to fix a suction cup; A polishing mechanism is disposed on one side of the fixed clamp along a first direction, and the polishing mechanism includes a polishing component; A first driving mechanism is connected to the grinding assembly and is configured to drive the grinding assembly to move relative to the fixed clamp along the first direction, so as to move the grinding assembly closer to or further away from the suction cup along the first direction. A second driving mechanism is connected to the grinding assembly and is configured to drive the grinding assembly to move relative to the fixed clamp in a second direction, so as to move the grinding assembly closer to or further away from the suction cup in the second direction. Two detection components are disposed at a distance from each other on the base along the first direction. The detection components are configured to detect the position of the grinding component along the first direction. Both detection components are electrically connected to the first drive mechanism. The first drive mechanism is configured to stop driving the grinding component to move along the first direction according to the signal received from the detection components. And / or, Two first limiting components are disposed at a distance from each other on the base along the first direction, and the two first limiting components are configured to limit the movement of the grinding component along the first direction. The polishing component is configured to reciprocate along the first direction under the drive of the first driving mechanism to polish the suction cup. The first direction and the second direction intersect, and the second direction is the height direction of the fixing fixture.

2. The suction cup polishing device according to claim 1, characterized in that, The polishing assembly includes an adsorption element and a polishing component. The adsorption element is configured to adsorb the polishing component such that the polishing component is located below the adsorption element along the second direction. The polishing component is configured to polish the suction cup.

3. The suction cup polishing device according to claim 2, characterized in that, The adsorption element is provided with a plurality of adsorption holes, which are configured to connect to an air source to adsorb the grinding component. The projection of the grinding component on the adsorption element is located within the range of the plurality of adsorption holes.

4. The suction cup polishing device according to claim 2, characterized in that, The polishing component is a battery cell with a textured surface.

5. The suction cup polishing device according to any one of claims 1-4, characterized in that, The suction cup polishing device also includes a base, and the fixing clamp and the polishing mechanism are both disposed on the base.

6. The suction cup polishing device according to claim 5, characterized in that, The fixing fixture includes a fixing base, a first clamping component, and a second clamping component. The fixing base is disposed on the base, and both the first clamping component and the second clamping component are disposed on the fixing base. The first clamping component is configured to clamp the suction cup along the first direction, and the second clamping component is configured to clamp the suction cup along a third direction. The third direction intersects with both the first direction and the second direction.

7. The suction cup polishing device according to claim 6, characterized in that, The fixing base is provided with a plurality of first grooves spaced apart along the third direction. The first grooves extend along the first direction. The first clamping assembly includes a plurality of first clamps. The plurality of first clamps are spaced apart along the first direction. Each first clamp includes a first fixing part and a plurality of first connecting parts disposed on the first fixing part. The first fixing part is located on the surface of the fixing base and extends along the third direction. The first fixing part is configured to fix the suction cup along the first direction. The plurality of first connecting parts are slidably located in the plurality of first grooves to drive the first fixing part to move along the first direction. The fixing base has a second groove along the third direction. The second clamping assembly includes a plurality of second clamps, which are spaced apart along the third direction. Each second clamp includes a second fixing part and a second connecting part disposed on the second fixing part. The second fixing part is located on the surface of the fixing base and extends along the first direction. The second fixing part is configured to fix the suction cup along the third direction. The second connecting part is slidably located in the second groove to drive the second fixing part to move along the third direction.

8. The suction cup polishing device according to claim 5, characterized in that, The suction cup polishing device further includes a carrier, and the polishing assembly is connected to the carrier along the first direction; The first driving mechanism includes a first driving member and a first driving shaft. The first driving member is disposed at one end of the base away from the fixed clamp along the first direction. The first driving shaft extends along the first direction and is connected to the first driving member. The bearing member is drivenly connected to the first driving shaft. The first driving member is configured to drive the first driving shaft to rotate so as to move the grinding assembly along the first direction. The second driving mechanism includes a second driving member and a second driving shaft. Both the second driving member and the second driving shaft are disposed on the support member. The second driving member is disposed at one end of the support member away from the fixed clamp along the second direction. The second driving shaft extends along the second direction and is connected to the second driving member. The grinding assembly is drivenly connected to the second driving shaft. The second driving member is configured to drive the second driving shaft to rotate so as to move the grinding assembly along the second direction.

9. The suction cup polishing device according to claim 8, characterized in that, The suction cup polishing device also includes a first guiding mechanism and a second guiding mechanism; The first guide mechanism is disposed on the base and extends along the first direction. The carrier is slidably connected to the first guide mechanism along the first direction. The first guide mechanism is configured to guide the movement of the grinding assembly along the first direction. The second guide mechanism is disposed on the carrier and extends along the second direction. The grinding assembly is slidably connected to the second guide mechanism along the second direction. The second guide mechanism is configured to guide the movement of the grinding assembly along the second direction. The suction cup polishing device further includes two second limiting components, both of which are disposed on the carrier and are respectively disposed near the end of the second guide mechanism along the second direction. The second limiting components are configured to limit the movement of the polishing component along the second direction.

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