A gravity type double-sided insulation test fixture for semiconductor package

Abstract

The utility model belongs to but is not limited to the field of semiconductor device packaging technology discloses a gravity type double -sided insulation test fixture for semiconductor package, and is used in cooperation with golden finger and test piece, including upper double -sided insulation test suite and lower double -sided insulation test suite, the upper double -sided insulation test suite includes fixed base, fixed PEEK material track on the fixed base, is provided with copper pole in PEEK material track inside, and copper pole lead -out terminal passes through PEEK material track, and the fixed bearing is fixed on PEEK material track through locating block, the lower double -sided insulation test suite includes the ceramic track of installing on test seat, and is provided with copper pole in ceramic track middle. The utility model can satisfy the double -sided insulation test of DIP direct -insert type semiconductor package form, has reliable stability and the convenience of operation, improves the equipment productivity, increases the accuracy of product parameter, strengthens the equipment stability, thereby spares maintenance cost.

Description

Technical Field

[0001] This utility model belongs to, but is not limited to, the field of semiconductor device packaging technology, and particularly relates to a gravity-type double-sided insulation test fixture for semiconductor packaging. Background Technology

[0002] In the semiconductor discrete device and IC packaging industry, after chip packaging, curing, and lead cutting, insulation parameter testing of the chip's internal performance is required. This testing necessitates the use of an insulation parameter testing machine. Before testing, the test sample must be fixed in a designated position on the equipment, and a certain level of stability is required to support the entire testing process. Existing insulation clamping fixtures generally correspond to the DBC surface on the back of the product being tested and the resin surface of the product. Due to the high-voltage characteristics, after the fixture is manufactured, its insulation performance (insufficient insulation distance / deteriorated insulation, etc.) cannot guarantee the proper functioning of the tested product. This leads to inaccurate parameter measurements during testing, resulting in mismeasurements and product damage, affecting equipment parameters. Loose connections can also cause damage to the product / equipment.

[0003] In the field of semiconductor packaging and testing, existing double-sided insulating test fixtures typically employ a parallel arrangement of dual pins or dual gold fingers to achieve two-point contact testing of chip pins. However, with the continuous shrinking of chip package sizes and pin pitch, this traditional structure faces the following technical challenges:

[0004] 1. Limited manufacturing precision: Traditional parallel distribution structures are difficult to meet precision requirements under high-density pin layout, resulting in poor contact or increased error during testing.

[0005] 2. Insufficient structural strength: In order to accommodate small-pitch pins, the test probes need to be thinner, which reduces their mechanical strength and makes them prone to bending or breaking during testing.

[0006] 3. Short service life: Frequent insertion and removal and contact will accelerate the wear of probes or gold fingers, especially under high precision requirements, the wear is more serious, and the service life of the fixture is shortened.

[0007] Therefore, existing technologies have shortcomings in terms of manufacturing precision, structural strength, and service life when dealing with double-sided insulation testing of high-density, small-pitch packaged chips, and a new test fixture design is urgently needed to solve the above problems. Utility Model Content

[0008] To address the problems existing in the prior art, this utility model provides a gravity-type double-sided insulation test fixture for semiconductor packaging.

[0009] This invention is implemented as follows: a gravity-type double-sided insulation test fixture for semiconductor packaging, used in conjunction with gold fingers and test pieces, includes an upper double-sided insulation test kit and a lower double-sided insulation test kit.

[0010] The upper double-sided insulation test kit includes a mounting base, on which a PEEK material track is fixed. Copper electrodes are provided inside the PEEK material track, and copper electrode leads pass through the PEEK material track. The pressure block and bearing are fixed on the PEEK material track by a positioning block.

[0011] The lower double-sided insulation test kit includes a ceramic track mounted on a test base, with a copper electrode in the middle of the ceramic track.

[0012] Furthermore, the pressure block is located on the front side of the positioning block and fixed relative to it with screws. The pressure block is located on the stroke cylinder of the equipment and is clamped and fixed thereto.

[0013] Furthermore, a bearing is provided in the middle of the PEEK material track, and the bearing is connected to the stop block by a spring.

[0014] Furthermore, a buffer pad is provided between the pressure block and the positioning block to reduce direct contact between the pressure block and the positioning block.

[0015] Furthermore, limit blocks are provided at both ends of the ceramic track to limit the range of movement of the test piece on the ceramic track.

[0016] This invention, through its gravity-assisted positioning and bidirectional conduction structure of the upper and lower double-sided insulation test kit, effectively adapts to the double-sided insulation performance testing requirements of DIP (Dual In-line Package) semiconductor packages. The upper and lower contact interfaces, precisely constructed using clamping blocks, ceramic tracks, and copper electrodes, ensure uniform force and stable positioning of the test piece during testing, effectively avoiding insulation test failures caused by uneven clamping or poor contact. This improves the repeatability and data accuracy of the testing process, making it particularly suitable for insulation withstand voltage testing of high-pin-count, high-density packaged products.

[0017] This invention employs a stroke cylinder to drive the pressure block, achieving precise vertical stroke control. Combined with a PEEK high-performance insulated track and a spring-bearing floating buffer design, the fixture automatically adapts to variations in test piece thickness and tolerance during testing, improving contact consistency and anti-interference capabilities. By reducing multi-degree-of-freedom adjustments and optimizing the contact path, this invention significantly increases overall equipment output, reduces single-test operation time, and effectively supports the high stability and high-cycle testing requirements of high-speed automated production lines.

[0018] Overall, this invention, through modular component design and a structural adaptive control mechanism, reduces equipment failure rates, extends the maintenance cycle of test fixtures, and avoids customer complaints and quality risks caused by missed or misjudged insulation abnormalities. Simultaneously, the improved accuracy of test data further supports yield optimization and process quality control, effectively reducing subsequent rework and maintenance costs, and ultimately enhancing the overall efficiency and economy of the semiconductor packaging production process. Attached Figure Description

[0019] Figure 1 This is a diagram of the upper structure of a gravity-type double-sided insulating test fixture for semiconductor packaging provided in this embodiment of the present invention.

[0020] Figure 2 This is a lower structural diagram of a gravity-type double-sided insulating test fixture for semiconductor packaging provided in this embodiment of the utility model;

[0021] Figure 3 This is a structural diagram of the buffer pad between the pressure block and the positioning block provided in this embodiment of the utility model;

[0022] In the diagram: 1. Pressure block; 2. Positioning block; 3. Copper electrode; 4. Fixing base; 5. PEEK material track; 6. Copper electrode lead-out terminal; 7. Bearing; 8. Spring; 9. Stop block; 10. Ceramic track; 11. Test base; 12. Gold finger; 13. Buffer pad. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this utility model clearer, the following detailed description is provided in conjunction with embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this utility model.

[0024] like Figure 1 As shown, this utility model embodiment provides a gravity-type double-sided insulation test fixture for semiconductor packaging, which is used in conjunction with the gold finger 12 and the test piece, and includes an upper double-sided insulation test kit and a lower double-sided insulation test kit;

[0025] The upper double-sided insulation test kit includes a pressure block 1, which is located on the front side of the positioning block 2 and fixed to it with screws. A copper electrode 3 is located inside the pressure block 1 and fixed to it. The pressure block 1 is located on the equipment stroke cylinder and is clamped and fixed to it.

[0026] like Figure 2 As shown, the lower double-sided insulation test kit includes a ceramic track 10 mounted on a test base 11, with a copper electrode 3 disposed in the middle of the ceramic track 10.

[0027] Furthermore, the upper double-sided insulation test kit includes a fixing base 4, on which a PEEK material track 5 is fixed. A copper electrode 3 is provided inside the PEEK material track 5, and a copper electrode lead-out terminal 6 passes through the PEEK material track 5.

[0028] Furthermore, a bearing 7 is provided in the middle of the PEEK material track 5, and the bearing 7 is connected to the stop block 9 through a spring 8; the stop block 9 is used to prevent the spring 8 from falling off and to limit its movement.

[0029] like Figure 3 As shown, a buffer pad 13 is provided between the pressure block 1 and the positioning block 2 to reduce the direct contact between the pressure block 1 and the positioning block 2.

[0030] Furthermore, limit blocks are provided at both ends of the ceramic track 10 to limit the range of movement of the test piece on the ceramic track.

[0031] This invention provides a gravity-type double-sided insulation test fixture suitable for testing the electrical performance of semiconductor packages. The fixture comprises upper and lower double-sided insulation test kits, which work in conjunction with the gold fingers 12 and the test piece to complete insulation performance testing. Through its bidirectional conduction structure, the fixture achieves automatic bonding and positioning of the test piece under the assistance of gravity, avoiding the complex multi-degree-of-freedom positioning operations of traditional fixtures and significantly improving testing efficiency and stability.

[0032] The upper double-sided insulation test kit mainly consists of a pressure block 1, a positioning block 2, and an internal copper electrode 3. The pressure block 1 is located on the front side of the positioning block 2 and is connected by screws to form a fixed assembly structure, ensuring stable position during testing. The copper electrode 3 is embedded inside the pressure block 1, serving as the conduction path for the upper electrode signal. The pressure block 1 is also mounted on the equipment's stroke cylinder and connected to the cylinder via a clamping mechanism. The cylinder drives the pressure block 1 to achieve precise vertical stroke control, balancing uniform pressing and repeatability when applying test pressure.

[0033] The lower double-sided insulation test kit consists of a ceramic track 10 mounted on the test base 11. The ceramic material has excellent insulation performance and wear resistance, making it suitable for long-term, high-frequency use. A copper electrode 3 is located in the middle of the ceramic track 10, serving as the lower electrode signal channel. Under the synchronous action of gravity and the upper kit pressure block 1, it can form a double-sided electrical contact closure with the test piece, ensuring low contact impedance and stable conduction during insulation performance testing, meeting the requirements of high-speed testing.

[0034] To further improve structural rigidity and positioning accuracy, the upper double-sided insulation test kit is equipped with a mounting base 4, on which a track made of PEEK material is installed. PEEK material possesses high mechanical strength, high heat resistance, and excellent insulation properties, ensuring that the fixture maintains dimensional stability under high-temperature aging tests or long-term operating conditions. Copper electrodes 3 are embedded inside the PEEK track, and copper electrode lead-out terminals 6 pass through the outer wall of the track, facilitating quick connection to external electrical testing systems and reducing wiring complexity and the risk of contact failure.

[0035] A bearing 7 mechanism is installed in the middle of the PEEK track. The bearing 7 is connected to the stop block 9 via a spring 8, forming a support system with preload function. This design not only provides minor float compensation to absorb slight deviations caused by workpiece dimensional tolerances, but also provides a buffering effect during the upper and lower clamping process, preventing local stress concentration on the surface of the copper electrode 3 due to excessive instantaneous impact force. This extends the service life of the contact surface between the copper electrode 3 and the test piece, and improves the stability and reliability of the detection system.

[0036] This invention achieves efficient positioning, high-precision contact, and reliable conduction of semiconductor packages during double-sided insulation testing through the synergistic effects of a bidirectional conduction structure, gravity-assisted positioning design, application of high-insulation and high-wear-resistant materials, and a bearing-spring buffer mechanism. It is particularly suitable for testing scenarios with extremely high requirements for contact stability and electrical insulation, such as high-density pin packaging and precision withstand voltage testing, and possesses excellent engineering application value and promising prospects for widespread adoption.

[0037] Example 1: Gravity-based double-sided insulation test fixture for QFN packaged devices

[0038] This embodiment provides a gravity-type double-sided insulation test fixture structure for rapid insulation performance testing of QFN packaged power devices, which has the following characteristics:

[0039] Test chip structure matching: In this embodiment, the gold finger 12 corresponds to the pin distribution of the QFN package. The circuit layout inside the test chip is completely consistent with the bottom pad and the top surface pins of the QFN device, ensuring uniform contact between the upper and lower electrodes.

[0040] Upper test kit: The pressure block 1 is made of anodized aluminum alloy, with copper electrodes 3 fixed inside, and is precisely aligned with the test piece by the positioning block 2. The pressure block 1 is driven up and down by the equipment's stroke cylinder. The gravity and stroke are set by the cylinder to achieve controllable pressure testing.

[0041] Lower test kit: Ceramic track 10 is mounted on high-strength test base 11, with copper electrode 3 in the center, which contacts the bottom of the test piece; Ceramic material has good electrical insulation and high temperature resistance, which can prevent thermal expansion and contraction from affecting test stability.

[0042] PEEK Insulated Rail: A PEEK material rail 5 is installed on the fixed base 4. The internal copper pole 3 leads out the signal connection line through the terminal 6, and a spring-loaded bearing 7 is set in the middle to automatically adjust the contact pressure and improve the consistency and repeatability of the test.

[0043] Application effect: Suitable for double-sided withstand voltage / insulation performance testing of QFN type devices, it can perform rapid testing without damaging the device, improving yield identification efficiency.

[0044] Example 2: Automated Multi-bit Parallel Test Fixture for SOP Devices

[0045] This embodiment applies to power chips in SOP (Small Outline Package) packages, with a focus on supporting multi-channel parallel testing to improve testing efficiency and automation integration.

[0046] Structural optimization: The upper and lower test kits have basically the same structure, but multiple sets of copper electrodes 3 and PEEK material tracks 5 are added in parallel, each set corresponding to one test position; up to 8 channels of parallel insulation testing can be achieved.

[0047] Automatic alignment mechanism: The pressure block 1 in the upper test kit is connected to a servo stroke cylinder, which can automatically adjust the pressing stroke according to the feedback signal from the testing platform to ensure that multiple SOP devices are in contact at the same time and with uniform pressure.

[0048] Contact stability design: The buffer mechanism of the combination of bearing 7 and spring 8 ensures that even if there are slight differences in height in the SOP package, the position difference can be absorbed by the flexibility of the spring to prevent damage to the solder joints or pins.

[0049] Ceramic track 10 customization: To adapt to the layout of SOP devices, ceramic track 10 adopts a strip partition structure, with each partition having an independent copper pole 3 to ensure test signal isolation and reduce crosstalk.

[0050] Standardized interface: The copper lead-out terminal 6 is connected to the data acquisition module via a multi-core flat connector, which facilitates quick replacement of the fixture module and system integration.

[0051] Application effect: This structure can be embedded in automated production lines to achieve batch insulation screening of power modules before they come off the production line, significantly reducing manual testing errors and time costs.

[0052] In the description of this utility model, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In addition, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0053] The above description is only a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any modifications, equivalent substitutions and improvements made by those skilled in the art within the technical scope disclosed in this utility model, and within the spirit and principles of this utility model, should be included within the protection scope of this utility model.

Claims

1. A gravity-type double-sided insulating test fixture for semiconductor packaging, characterized in that, Used in conjunction with gold fingers and test pieces, including upper double-sided insulation test kits and lower double-sided insulation test kits; The upper double-sided insulation test kit includes a mounting base, on which a PEEK material track is fixed. Copper electrodes are provided inside the PEEK material track, and copper electrode leads pass through the PEEK material track. The pressure block and bearing are fixed on the PEEK material track by a positioning block. The lower double-sided insulation test kit includes a ceramic track mounted on a test base, with a copper electrode in the middle of the ceramic track.

2. The gravity-type double-sided insulation test fixture for semiconductor packaging as described in claim 1, characterized in that, The pressure block is located on the front side of the positioning block and fixed relative to it with screws. The pressure block is located on the stroke cylinder of the equipment and is clamped and fixed thereto.

3. The gravity-type double-sided insulation test fixture for semiconductor packaging as described in claim 1, characterized in that, A bearing is provided in the middle of the PEEK material track, and the bearing is connected to the stop block by a spring.

4. The gravity-type double-sided insulation test fixture for semiconductor packaging as described in claim 1, characterized in that, A buffer pad is provided between the pressure block and the positioning block to reduce the direct contact between them.

5. The gravity-type double-sided insulation test fixture for semiconductor packaging as described in claim 1, characterized in that, Limiting blocks are provided at both ends of the ceramic track to limit the range of movement of the test piece on the ceramic track.

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