Pressure control system and semiconductor processing apparatus

Abstract

This utility model discloses a pressure control system and a semiconductor processing device, relating to the field of semiconductor technology. The pressure control system includes a cavity with an inlet unit and an exhaust unit. The exhaust unit includes a vacuum pump and a connecting portion between the vacuum pump and the cavity. The connecting portion has a first valve body and a second valve body axially spaced apart. The first valve body includes a first valve plate for opening or closing the connecting portion. The second valve body includes an opening / closing element for adjusting the opening degree of the connecting portion. The first and second valve bodies are axially spaced apart, and the volume of the opening / closing element is smaller than that of the first valve plate, so that the moment of inertia of the opening / closing element is smaller than that of the first valve plate, allowing for rapid switching between at least two preset opening degrees. This utility model achieves rapid pressure switching through a small inertia structure, eliminating the need for a vacuum pump array, reducing equipment costs, and improving control reliability. It is applicable to semiconductor processes requiring pressure cyclic switching, such as atomic layer etching.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a pressure control system and a semiconductor processing device. Background Technology

[0002] Currently, in processing technologies based on multiple alternating cycles, the process pressure often needs to be switched back and forth between multiple pressures, such as atomic layer etching (ALE) and Bosch processes. The efficiency of such processes is significantly limited by the pressure switching speed.

[0003] To match the target cavity pressure, the pressure can be controlled by adjusting the vacuum valve opening, or by combining auxiliary pressure control and gas supply, or by adjusting the inlet flow rate. Taking atomic layer etching as an example, one cycle mainly includes two stages, with cavity pressures P1 and P2 in the two stages, respectively. Therefore, the cavity pressure changes as follows throughout the process: Figure 1 As shown, the pressure switches back and forth between P1 and P2. To improve pressure switching efficiency, Chinese patent application CN121790264A discloses a pressure control method that fixes the flow rate of a mass flow controller (MFC) and the opening of a vacuum valve during the process, directly controlling the pressure through the flow rate of the MFC, thus avoiding the pressure control delay problem of PID negative feedback regulation in the pressure control mode of valve components. However, this increases the use of process specialty gases and may be difficult to switch quickly in some process environments.

[0004] Therefore, one solution, to improve the opening switching speed and stability, uses a vacuum valve position mode or a simple mechanical motion mode, allowing its opening to switch back and forth between K1 and K2, while simultaneously controlling the internal pressure through intake flow regulation. However, existing vacuum valve bodies are typically large, possessing significant inertia, resulting in a certain degree of lag in their position mode. Figure 2 As shown, when a command is sent to the vacuum valve to change the opening from K1 to K2, the valve plate initially moves rapidly. However, the closer it gets to the target value, the slower its movement becomes, resulting in a long time for it to stabilize at K2, which is not conducive to achieving rapid switching. Similarly, the same problem exists when the opening is closed.

[0005] Chinese patent application CN122054948A discloses a system and method for rapidly regulating process chamber pressure based on a small valve and pump array. This method uses an array of small valves and pumps at the exhaust port to accelerate steady-state pressure regulation in the chamber and achieve finer control to improve substrate uniformity. However, the combination of arrayed valves and pumps increases equipment costs, especially the cost of vacuum pumps. Furthermore, there is a risk of inconsistent pumping speeds among the arrayed pumps. Since the pressure gauge is located inside the chamber, it is difficult to detect the actual pumping speed of each pump, posing a challenge to control reliability. Moreover, valves with vacuum sealing capabilities generally have slow opening control response speeds due to their sealing requirements, limiting the rate of pressure change within the chamber. Utility Model Content

[0006] To address some or all of the problems existing in the prior art, and in order to reduce the opening switching time, achieve rapid pressure switching, and simultaneously reduce equipment costs and improve control reliability, this utility model provides the following technical solution:

[0007] This utility model provides a pressure control system, including a cavity. The cavity includes an air inlet unit and an air outlet unit. The air inlet unit is connected to the cavity and is used to supply process gas. The air outlet unit is connected to the cavity and is used to evacuate the cavity. The air outlet unit includes a vacuum pump and a connecting part. The vacuum pump is connected to the cavity through the connecting part. The connecting part includes a first valve body and a second valve body. The first valve body includes a first valve plate, which is used to open or close the connecting part. The second valve body includes an opening and closing element, which is used to adjust the opening degree of the connecting part. The second valve body and the first valve body are axially spaced apart. The solid volume of the opening and closing element is smaller than the solid volume of the first valve plate, so that the moment of inertia of the opening and closing element is smaller than the moment of inertia of the first valve plate.

[0008] Furthermore, the opening and closing element does not completely close the flow section of the connecting portion.

[0009] Furthermore, the second valve body includes a connecting portion baffle and an opening / closing element. The connecting portion baffle at least partially blocks the flow section of the connecting portion. The connecting portion baffle is provided with a first hollow portion and a first blocking portion. The opening / closing element is configured to block or open the first hollow portion so that the second valve body can switch back and forth between at least two preset opening degrees.

[0010] Furthermore, the opening and closing element includes a movable baffle or a valve unit.

[0011] Furthermore, the connecting portion baffle includes a normally open through hole, the connecting portion is coaxially arranged with the cavity, and the normally open through hole and the first hollow portion are rotationally symmetrical with respect to the axis of the cavity.

[0012] Furthermore, the opening and closing element includes multiple valve units arranged in parallel, the valve unit including a tilting valve, a swing valve or a linear motion valve, and the solid volume of the valve plate of the valve unit is smaller than the solid volume of the valve plate of the first valve body.

[0013] Furthermore, the movable baffle includes a louvered structure that covers the first hollow portion. Each louver has a pivot, and the opening of the first hollow portion can be changed by flipping the louver.

[0014] Furthermore, the first hollow portion and the first blocking portion are alternately arranged along the circumference of the connecting portion baffle; the movable baffle is coaxially arranged with the connecting portion baffle, including a second blocking portion and a second hollow portion corresponding to the first hollow portion, and the movable baffle can rotate around the axis to allow the second valve body to switch opening degree repeatedly.

[0015] Furthermore, the connecting portion is coaxially arranged with the cavity, and the first hollow portion is rotationally symmetrical with respect to the axis of the cavity.

[0016] Furthermore, the connecting portion baffle includes a normally open through hole, and the normally open through hole and the first hollow portion are radially spaced outwards and inwards on the connecting portion baffle.

[0017] Furthermore, the first blocking portion and the second blocking portion are arranged radially. On the axial projection of the second valve body, the circumferential wrap angle of the second blocking portion is smaller than the circumferential wrap angle of the first hollow portion and smaller than the circumferential wrap angle of the first blocking portion.

[0018] Furthermore, the movable baffle is located downstream of the connecting portion baffle and is arranged at axial intervals.

[0019] Furthermore, the opening and closing element includes a driving component configured to drive the movable baffle to rotate about an axis.

[0020] Furthermore, the drive component includes a variable speed motor.

[0021] This utility model also provides a semiconductor processing apparatus, including the aforementioned pressure control system, wherein a base is provided in the cavity, and the base is used to support a substrate for implementing semiconductor processing technology.

[0022] The beneficial effects of this utility model are as follows:

[0023] The first valve body and the second valve body are axially spaced apart. The volume of the opening and closing element of the second valve body is smaller than that of the first valve plate of the first valve body. The moment of inertia is low, and its opening degree switching response speed is faster than that of the first valve plate of the first valve body under the same opening degree switching amplitude. This enables rapid reciprocating switching of the cavity pressure.

[0024] No vacuum pump array is required; rapid pressure regulation can be achieved simply by using a vacuum pump with a dual-valve structure, which significantly reduces equipment costs and avoids control reliability issues caused by inconsistent pumping speeds of multiple pumps.

[0025] The second valve body adopts a structure with a connecting baffle and opening / closing elements. It can switch the opening degree through various opening / closing element forms (valve unit, louver structure, rotating baffle) to adapt to different process requirements. It also has a simple structure and high control robustness. Attached Figure Description

[0026] To further illustrate the above and other advantages and features of the various embodiments of the present invention, a more specific description of the various embodiments of the present invention will be presented with reference to the accompanying drawings. It is understood that these drawings depict only typical embodiments of the present invention and are therefore not intended to limit its scope. In the drawings, for clarity, the same or corresponding parts will be indicated by the same or similar reference numerals.

[0027] Figure 1 A schematic diagram showing the changes in intracavity pressure and the corresponding changes in vacuum valve opening during atomic layer etching;

[0028] Figure 2 This diagram illustrates the existing vacuum valve opening switching process.

[0029] Figure 3 This diagram shows a structural schematic of a pressure control system according to an embodiment of the present invention;

[0030] Figure 4 This diagram shows a structural schematic of the second valve body according to an embodiment of the present invention;

[0031] Figure 5 This diagram shows a structural schematic of the second valve body according to yet another embodiment of the present invention;

[0032] Figure 6 A schematic diagram of the structure of the connecting portion baffle of the second valve body according to another embodiment of the present invention is shown;

[0033] Figure 7 This diagram shows a structural schematic of the second valve body according to another embodiment of the present invention;

[0034] Figure 8 This diagram shows a schematic representation of a semiconductor processing apparatus according to an embodiment of the present invention.

[0035] Figure 9 This diagram illustrates the pressure control effect of one embodiment of the present invention. Detailed Implementation

[0036] In the following description, the present invention is described with reference to various embodiments. However, those skilled in the art will recognize that the embodiments may be implemented without one or more specific details or with other alternatives and / or additional structures and components. In other instances, well-known structures, materials, and operations are not shown or described in detail so as not to obscure the inventive points of the present invention. Similarly, for illustrative purposes, specific configurations are set forth to provide a comprehensive understanding of embodiments of the present invention. However, the present invention is not limited to these specific details. Furthermore, it should be understood that the embodiments shown in the accompanying drawings are illustrative representations and are not necessarily drawn to scale.

[0037] In order to quickly respond to the opening control requirements and realize the rapid switching of cavity pressure, this utility model provides a pressure control system, which adopts a second valve body with a small inertia valve plate structure to realize the rapid opening switching function, and is axially spaced in cooperation with the first valve body to realize the on and off function.

[0038] The technical solution of this utility model will be further described below with reference to the accompanying drawings of the embodiments.

[0039] Figure 3 This diagram illustrates the structure of a pressure control system according to one embodiment of the present invention. Figure 3 As shown, a pressure control system includes a cavity 101, which includes an air intake unit 102 and an exhaust unit 103. The air intake unit 102 is used to supply process gas into the cavity 101, and the exhaust unit 103 is used to evacuate the cavity 101 when the air intake unit 102 supplies gas, so that the cavity 101 operates at the pressure required by the process.

[0040] As shown in the figure, the exhaust unit 103 includes a vacuum pump 131 and a connecting part, wherein the connecting part is used to connect the vacuum pump 131 and the cavity 101, and the vacuum pump 131 evacuates the cavity 101 through the connecting part. In an embodiment of this utility model, the connecting part includes a first valve body 133 and a second valve body 132, wherein the first valve body 133 includes a first valve plate, which is used to open or close the connecting part, and the second valve body 132 includes an opening and closing element, which is used to adjust the opening degree of the connecting part. The second valve body 132 and the first valve body 133 are axially spaced apart, and the solid volume of the opening and closing element is smaller than the solid volume of the first valve plate, so that the moment of inertia of the opening and closing element is smaller than the moment of inertia of the first valve plate.

[0041] It is understood that the solid volume of the valve plate is a concept distinguished from its surface volume. Generally, if the valve plate is a solid plate structure, then its solid volume equals its surface volume. However, in this embodiment, the valve plate can be processed into a hollow structure without changing its shape (i.e., the surface volume remains unchanged), while the solid volume is the surface volume minus the hollow volume. This significantly reduces its moment of inertia and improves the opening control response speed. Alternatively, directly reducing the surface volume of the opening and closing element can also improve the opening control response speed. Unless otherwise specified, all "volumes" in this embodiment refer to solid volumes.

[0042] The first valve body 133 only undertakes the function of full opening and full closing during process start-up and shutdown, without the need for frequent switching; the second valve body 132 adopts a small volume opening and closing element, which significantly reduces the moment of inertia. Its opening degree switching response speed is faster than that of the first valve plate under the same opening degree switching amplitude, and it can realize millisecond-level reciprocating switching of the pressure in the cavity 101, solving the problem of large inertia and slow switching of traditional large volume vacuum valves.

[0043] In one embodiment, the opening and closing element of the second valve body 132 does not completely seal the flow cross section of the connecting portion. This reduces the vacuum sealing requirements of the second valve body 132, eliminates the need for a complex sealing structure, further reduces motion resistance, lowers costs, and improves the opening switching speed.

[0044] In one embodiment, the second valve body 132 further includes a connecting portion baffle 1321, which at least partially blocks the flow cross-section of the connecting portion. That is, the connecting portion baffle 1321 can completely cover the flow cross-section of the connecting portion, or partially cover the flow cross-section of the connecting portion, and the flow cross-section is perpendicular to the airflow direction in the connecting portion. The connecting portion baffle 1321 is provided with a first hollow portion and a first blocking portion; the opening and closing element is adapted to the first hollow portion and is configured to block or open the first hollow portion so that the second valve body 132 can switch back and forth between at least two preset opening degrees.

[0045] The design employs a split structure combining a fixed baffle and a movable opening / closing element, separating the functions of blocking the flow section from the opening adjustment. The fixed baffle undertakes the main function of blocking airflow, while the opening / closing element only needs to control the opening and closing of a small area of ​​the hollow section, further reducing the volume and inertia of the moving parts and improving the switching response speed.

[0046] In one embodiment, the proportion of the flow section of the connecting portion covered by the connecting portion baffle 1321 is not less than 70%, so as to improve the control effect of the second valve body 132 on the pressure inside the cavity 101.

[0047] In one embodiment, the opening / closing element includes a movable baffle or a valve unit.

[0048] For example, the connecting part baffle 1321 includes a normally open hole, the connecting part is coaxially arranged with the cavity 101, and the normally open hole and the first hollow part are rotationally symmetrical with respect to the axis of the cavity 101.

[0049] The normally open orifice ensures the basic pumping speed of the cavity 101, avoiding the problem of sudden pressure rise and inability to discharge process gas when the second valve body 132 is completely closed; the coaxial setting and rotational symmetry arrangement make the airflow evenly distributed in the connecting part, avoiding uneven pressure in the cavity 101 caused by local airflow turbulence, and improving the consistency of substrate processing.

[0050] To improve the pressure uniformity inside the cavity 101, in one embodiment, the connecting portion is coaxially arranged with the cavity 101, and the first hollow portion is rotationally symmetrical with respect to the axis of the cavity 101. This further enhances the axisymmetric distribution characteristics of the airflow, eliminates the pressure gradient inside the cavity 101, ensures consistent process conditions at all points on the substrate surface, and improves the uniformity of semiconductor processing.

[0051] The following three specific embodiments illustrate different implementations of the switching element:

[0052] Example 1: Multi-valve unit type second valve body

[0053] Figure 4 This diagram illustrates the structure of a second valve body according to an embodiment of the present invention, which employs multiple valve units arranged in parallel as opening and closing elements. Figure 4 As shown, in this embodiment, the second valve body includes a connecting portion baffle 401, wherein the connecting portion baffle 401 is provided with a plurality of through holes 402, wherein at least some of the through holes 402 serve as the first hollow portion of the connecting portion baffle 401, and the remaining through holes and the portion without through holes serve as the first blocking portion of the connecting portion baffle 401. In order to improve the pressure uniformity in the cavity, each through hole constituting the first hollow portion is arranged rotationally symmetrically with respect to the axis of the connecting portion baffle 401. In one embodiment, the total cross-section of each through hole 402 accounts for no less than 30% of the cross-section of the connecting portion baffle 401, so as to improve the control effect of the second valve body on the pressure in the cavity 101.

[0054] In this embodiment, the opening and closing element includes multiple opening and closing valve units arranged in parallel, with each through hole 402 corresponding to an opening and closing valve unit. The valve unit includes a tilting valve, a swing valve, or a linear motion valve, and the volume of the valve plate of each valve unit is smaller than the volume of the first valve plate.

[0055] Multiple small valve units work in parallel, with minimal moment of inertia for each individual valve unit, enabling millisecond-level opening and closing. Multiple valve units can be controlled independently, allowing for multi-level opening adjustment by combining different numbers of opening and closing valve units, resulting in high adjustment accuracy. Even if individual valve units fail, the remaining valve units can still operate normally, improving the reliability of the system.

[0056] The tilt valve can be a butterfly valve or a pivot louver structure, preferably with the pivot shaft located at the center of the valve plate to minimize rotational inertia and improve the opening switching rate; the linear motion valve can be a lift valve or a translation valve, with the lift valve moving perpendicular to the windward side of the valve plate and the translation valve moving parallel to the windward side of the valve plate. The valve unit can be driven reciprocatingly by a motor or cylinder for rapid opening and closing switching.

[0057] In one embodiment, the on / off valve unit includes a normally open valve unit, a normally closed valve unit, and a quick-switching valve unit, wherein the quick-switching valve includes a small quick-opening / closing butterfly valve unit. Based on this, the through holes at the normally open valve unit and the quick-switching valve unit are considered as the first hollow portion of the connecting portion baffle 401, and the through holes at the normally closed valve unit and the portion without through holes are considered as the first blocking portion of the connecting portion baffle 401. By controlling at least some of the small quick-opening / closing valve units to quickly open and close with the process, the overall opening degree switching time can be significantly reduced.

[0058] To improve pressure uniformity within the cavity, preferably, the normally open valve unit, normally closed valve unit, and quick-switching valve unit are all rotationally symmetrically arranged relative to the axis of the connecting baffle 401. It should be understood that in some embodiments of this invention, the normally open valve unit may be omitted, i.e., no valve unit is provided at this through-hole; similarly, the normally closed valve unit may also be omitted, i.e., no through-hole is provided at its corresponding position.

[0059] It should be understood that the shape of the through hole is not limited to, for example... Figure 4 The number and distribution of the circles shown are not limited to the number and distribution shown in the figure, as long as they satisfy a discrete distribution.

[0060] Example 2: Rotary baffle type second valve body

[0061] Figure 5 A schematic diagram of the structure of the second valve body according to another embodiment of the present invention is shown, which uses a movable baffle as the opening and closing element. Figure 5 As shown, in this embodiment, the second valve body includes a communicating portion baffle 510 and a movable baffle 520, wherein... Figure 6As shown, the first hollow portion 511 and the first blocking portion 512 of the connecting portion baffle 510 are alternately arranged circumferentially along the connecting portion baffle 510; the movable baffle 520 is arranged coaxially with the connecting portion baffle 510, including a second blocking portion 522 and a second hollow portion 521 corresponding to the first hollow portion 511, wherein the second blocking portion 522 and the first blocking portion 512 have an axial gap. The movable baffle 520 can rotate about its axis, causing the second valve body to reciprocate and switch its opening degree.

[0062] The opening degree switching is achieved by the unidirectional continuous rotation of the movable baffle 520 without changing the movement direction of the drive mechanism, avoiding vibration and delay caused by the reversing impact. The opening degree switching is smooth and rapid. The structure is simple and only requires one drive component 530, such as a rotary motor. The control logic is simple and the robustness is high.

[0063] It is understandable that the opening is smallest when the second blocking part 522 overlaps with the area of ​​the first hollow part 511; and the opening is largest when the second hollow part 521 overlaps with the area of ​​the first hollow part 511. The opening switching cycle can be controlled by adjusting the rotation speed of the movable baffle 520, thereby matching the process pressure target change cycle.

[0064] In this embodiment, the second valve body further includes a normally open through hole, which is disposed on the connecting portion baffle 510 and is radially spaced outwards and inwards from the first hollow portion 511 on the connecting portion baffle 510. For example, the first hollow portion 511 is disposed at the center of the connecting portion baffle 510, while the edge of the connecting portion baffle 510 is completely hollowed out, which is the normally open through hole; or, for another example, the first hollow portion 511 is disposed at the edge of the connecting portion baffle 510 in an annular shape, while the center of the connecting portion baffle 510 is completely hollowed out, which is the normally open through hole 513.

[0065] The radially spaced normally open holes and the first hollowed-out part 511 separate the basic pumping speed from the adjustable pumping speed. The normally open holes provide a stable basic pumping speed, while the first hollowed-out part 511 is responsible for pressure regulation, which avoids fluctuations in the basic pumping speed during the adjustment process and improves the stability of pressure control.

[0066] In this embodiment, as Figure 5 As shown, the first blocking part 512 and the second blocking part 522 are arranged radially. On the axial projection of the second valve body, the circumferential wrap angle of the second blocking part 522 is smaller than the circumferential wrap angle of the first hollow part 511 and smaller than the circumferential wrap angle of the first blocking part 512.

[0067] In this way, the second blocking part 522 can fall completely into the axial projection area of ​​the first hollow part 511 or the first blocking part 512 for a certain period of time during rotation. Even if the second blocking part 522 continues to rotate, the overall opening of the second valve body does not change. The change in the opening of the second valve body only exists during the time period when the second blocking part 522 enters or exits the first hollow part 511. As a smaller blocking part, the second blocking part 522 can reduce the rotational inertia of the moving parts, which is beneficial to improving the control response speed and reducing airflow disturbance, and preventing particulate matter from flowing back to the substrate area.

[0068] By setting the area ratio of the first hollow portion 511 to the first blocking portion 512, the maximum and minimum opening ranges of the second valve body can be set. For example, the cavity operates in a cyclic process including multiple process stages. The cavity has a pressure switching period T1 and a low-pressure stabilization period T2 during multiple reciprocating pressure changes. Let the circumferential coverage angle of the first blocking portion 512 be denoted as θ1, and the circumferential coverage angle of the second blocking portion 522 be denoted as θ2. If the second blocking portion 522 rotates at a constant speed, then the circumferential coverage angle is configured as: θ2 / (θ1-θ2)=T1 / T2.

[0069] In this embodiment, the movable baffle 520 is located downstream of the connecting portion baffle 510 and is arranged axially at intervals.

[0070] The connecting baffle 510, acting as an upstream shield, can prevent the particles generated by the rotational friction of the movable baffle 520 from flowing back into the substrate area within the cavity 101, thus avoiding particulate contamination and improving the yield of the semiconductor process. The axially spaced arrangement reduces airflow interference between the two baffles, making the opening adjustment more linear and avoiding frictional contamination.

[0071] In this embodiment, the movable baffle 520 is driven to rotate around an axis by the driving component 530.

[0072] With precise control of the drive component 530, the rotation speed of the movable baffle 520 can be steplessly adjusted, thereby flexibly adapting to the pressure switching cycle of different processes and meeting the needs of various semiconductor processes.

[0073] The drive component 530 can move at a constant speed or a variable speed. Preferably, the drive component 530 includes a variable speed motor.

[0074] The variable speed motor can adjust its speed in real time according to process requirements. During the pressure switching stage, the speed is increased to speed up the switching process, and during the pressure stabilization stage, the speed is reduced to reduce vibration and energy consumption, thus achieving the optimal balance between speed and stability.

[0075] Example 3: Louvered Second Valve Body

[0076] In another embodiment of this utility model, the movable baffle includes a louvered structure, such as... Figure 7 As shown, the louvered structure covers the first perforated portion 611 of the connecting baffle 610. Each blade 621 has a rotating shaft 622, and the opening degree of the first perforated portion 611 can be changed by flipping the blade 621. Each blade 621 is connected to a driving component (not shown), which can move at a constant or variable speed to drive the blade 621 to rotate around the shaft. The response speed of the driving component is greater than the opening switching response speed of the first valve plate, and the moment of inertia of the blade 621 is less than the moment of inertia of the first valve plate.

[0077] The louvered structure allows for the synchronous rotation of multiple blades, enabling continuous linear adjustment of the opening with high precision. The blades are thin and lightweight with minimal moment of inertia and fast switching speed. The airflow experiences low resistance and high extraction efficiency as it passes through the louvered structure.

[0078] Back Figure 3 ,like Figure 3 As shown, the intake unit 102 includes at least one intake end, and an on / off structure, such as an on / off valve structure, may also be provided at the intake end to control the on / off of the intake end. In one embodiment, the intake unit 102 includes a first intake end 121 and a second intake end 122. A first gas mass flow controller (MFC) 123 and a second gas mass flow controller 124 are respectively provided on the upstream side of the first intake end 121 and the second intake end 122. The first gas mass flow controller 123 and the second gas mass flow controller 124 are respectively used to adjust the intake mass flow of the first intake end 121 and the second intake end 122.

[0079] In one embodiment, the first air inlet 121 and the second air inlet 122 can be controlled by a fast on / off valve, such as an atomic layer deposition (ALD) valve, to meet the requirement of fast on / off switching of the first air inlet 121 and the second air inlet 122.

[0080] In another embodiment of this utility model, multiple bypass valves can be used to switch the first air inlet 121 and the second air inlet 122 to bypass to a vacuum channel. When the first air inlet 121 is supplying gas, the bypass valve connected to it is closed; when the first air inlet 121 is closed, the bypass valve connected to it is open. The same applies to the second air inlet 122. By bypassing the gas to the vacuum channel when the air inlet is not supplying gas, the pressure fluctuation when the first air inlet 121 and the second air inlet 122 are switched on and off is reduced.

[0081] like Figure 3 As shown, a base 111 is provided inside the cavity 101 to support the substrate W. During operation, the vacuum pump 131 continuously evacuates the cavity 101, and the evacuation efficiency is controlled by the reciprocating motion of the second valve body 132. The vacuum pump 131 generally operates near full speed to improve the stability of the evacuation capability.

[0082] Based on the aforementioned pressure control system Figure 8 This diagram illustrates the structure of a semiconductor processing apparatus according to one embodiment of the present invention. Figure 8 As shown, a semiconductor processing apparatus includes the aforementioned pressure control system, gas chamber 601, and control unit 602, with a pressure sensor 603 also installed in the cavity 101. The gas chamber 601 is connected to a first inlet 121 and a second inlet 122 to provide gas input to the cavity 101. The control unit 602 is communicatively connected to the pressure sensor 603, vacuum pump 131, first valve body 133, second valve body 132, and gas chamber 601. The control unit 602 controls the pressure control system according to the process progress, enabling rapid switching of pressure within the cavity. It can also fine-tune the pressure within the cavity by controlling the opening of the pressure control system, the first gas mass flow controller 123, and the second gas mass flow controller 124 based on the pressure value measured by the pressure sensor 603.

[0083] By integrating the aforementioned rapid pressure control system into the semiconductor processing device, the base 111 inside the cavity can stably support the substrate. With the rapid pressure environment switching, semiconductor processes that require high pressure switching speed, such as atomic layer etching, atomic layer deposition, and Bosch process, can be realized, which significantly improves process efficiency and product yield. There is no need to configure an expensive vacuum pump array, which greatly reduces equipment costs and avoids the problem of uneven process caused by inconsistent pumping speeds of multiple pumps.

[0084] The control unit 602 controls the second valve body 132 of the pressure control system to cycle back and forth between the first opening degree and the second opening degree, which allows the pressure inside the cavity to switch back and forth between the two target pressures, effectively improving the opening switching speed and stability.

[0085] Through various aspects of the embodiments, the following can be achieved: Figure 9 The rapid high-low pressure switching reaction process shown is particularly suitable for process chambers with high pressure switching speed requirements, such as ALE, ALD, and Bosch processes.

[0086] Although various embodiments of the present invention have been described above, it should be understood that they are presented by way of example only and not as limitations. It will be apparent to those skilled in the art that various combinations, modifications, and alterations can be made without departing from the spirit and scope of the present invention. Therefore, the breadth and scope of the present invention disclosed herein should not be limited by the exemplary embodiments disclosed above, but should be defined solely by the appended claims and their equivalents.

Claims

1. A pressure control system comprising a cavity, the cavity including an intake unit and an exhaust unit, the intake unit being connected to the cavity for supplying process gas, and the exhaust unit being connected to the cavity for evacuating the cavity, characterized in that, The exhaust unit includes: Vacuum pump and connecting part, The vacuum pump is connected to the cavity through a connecting part; The connecting portion includes a first valve body and a second valve body, wherein the first valve body includes a first valve plate, which is used to open or close the connecting portion, and the second valve body includes an opening and closing element, which is used to adjust the opening degree of the connecting portion. The second valve body and the first valve body are axially spaced apart, and the solid volume of the opening and closing element is smaller than the solid volume of the first valve plate, so that the moment of inertia of the opening and closing element is smaller than the moment of inertia of the first valve plate.

2. The pressure control system as described in claim 1, characterized in that, The opening and closing element does not completely close the flow section of the connecting part.

3. The pressure control system as described in claim 1, characterized in that, The second valve body includes: a connecting portion baffle, which at least partially blocks the flow section of the connecting portion, and the connecting portion baffle is provided with a first hollow portion and a first blocking portion; The opening and closing element is configured to block or open the first hollow portion so that the second valve body switches back and forth between at least two preset opening degrees.

4. The pressure control system as described in claim 3, characterized in that, The opening and closing element includes a movable baffle or a valve unit.

5. The pressure control system as described in claim 3, characterized in that, The connecting portion baffle includes a normally open through hole. The connecting portion is coaxially arranged with the cavity. The normally open through hole and the first hollowed-out portion are arranged in a rotationally symmetrical manner with respect to the axis of the cavity.

6. The pressure control system as described in claim 3, characterized in that, The opening and closing element includes multiple valve units arranged in parallel. The valve unit includes a tilting valve, a swing valve, or a linear motion valve. The solid volume of the valve plate of the valve unit is smaller than the solid volume of the valve plate of the first valve body.

7. The pressure control system as described in claim 4, characterized in that, The movable baffle includes a louvered structure that covers the first hollow section. Each louver has a pivot, and the opening of the first hollow section can be changed by flipping the louver.

8. The pressure control system as described in claim 4, characterized in that, The first hollow portion and the first blocking portion are arranged alternately along the circumference of the connecting portion baffle; The movable baffle and the connecting baffle are arranged coaxially, including a second blocking part and a second hollow part corresponding to the first hollow part. The movable baffle can rotate around the axis to allow the second valve body to switch opening degrees repeatedly.

9. The pressure control system as described in claim 8, characterized in that, The connecting portion is coaxially arranged with the cavity, and the first hollow portion is rotationally symmetrical with respect to the axis of the cavity.

10. The pressure control system as described in claim 8, characterized in that, The connecting portion baffle includes a normally open hole, and the normally open hole and the first hollow portion are radially spaced outwards and inwards on the connecting portion baffle.

11. The pressure control system as described in claim 8, characterized in that, The first blocking part and the second blocking part are arranged radially. On the axial projection of the second valve body, the circumferential wrap angle of the second blocking part is smaller than the circumferential wrap angle of the first hollow part and smaller than the circumferential wrap angle of the first blocking part.

12. The pressure control system as described in claim 8, characterized in that, The movable baffle is located downstream of the connecting baffle and is arranged at axial intervals.

13. The pressure control system as described in claim 8, characterized in that, The opening and closing element includes a driving component configured to drive the movable baffle to rotate about an axis.

14. The pressure control system as described in claim 13, characterized in that, The drive component includes a variable speed motor.

15. A semiconductor processing apparatus, characterized in that, The pressure control system includes any one of claims 1 to 14, wherein the cavity is provided with a base, the base supporting a substrate for implementing semiconductor processing.

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