LED light source and car interactive screen

Abstract

The utility model relates to LED light emitting device technical field especially, it relates to a kind of LED light source and car interactive screen.A kind of LED light source, it includes PCB board and the LED lamp pearl connected with PCB board, LED lamp pearl includes LED chip and substrate, LED chip is fixed to substrate, substrate is welded on PCB board;LED chip surface is equipped with protective glue and transparent adhesive in proper order, the periphery of substrate is equipped with annular black adhesive layer, the inside of black adhesive layer is equipped with annular white adhesive layer.The utility model is by the periphery of substrate and sets up white adhesive layer, so that light is reflected in periphery, the intensity uniformity of LED lamp pearl luminous is relatively better, and light utilization rate is high.

Description

Technical Field

[0001] This utility model relates to the field of LED light-emitting device technology, and in particular to an LED light source and an automotive interactive screen. Background Technology

[0002] Currently, interactive screens are commonly used in cars. Due to the frequent bumps and vibrations that occur during driving, especially on uneven roads, these interactive screens are often subjected to shocks. Such shocks can affect the internal components of the interactive screen.

[0003] Currently, interactive screens generally use LED light sources, which include LED beads and the PCB board connected to them. The LED beads include internal LED chips and a substrate. The substrate is generally made of PPA or epoxy material, and the LED chips are soldered to the substrate. The substrate is filled with protective glue and transparent glue around the LED chips. A ring-shaped black glue layer is set around the substrate. The black glue layer is used to prevent light from being projected outward from the edges. Due to the absorption of light by the black glue, when the LED beads emit light, the brightness in the center is much higher than that around the edges, resulting in poor uniformity and low light utilization. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies by providing an LED light source that improves the structure of LED beads, resulting in better uniformity of light emitted from the LED beads and improved light extraction efficiency.

[0005] An LED light source includes a PCB board and LED beads connected to the PCB board. The LED beads include an LED chip and a substrate. The LED chip is fixed to the substrate, and the substrate is soldered to the PCB board. A protective adhesive and a transparent adhesive are sequentially provided on the surface of the LED chip. An annular black adhesive layer is provided around the substrate, and an annular white adhesive layer is provided inside the black adhesive layer.

[0006] Furthermore, a flexible buffer layer is provided on the surface of the substrate.

[0007] Preferably, the flexible buffer layer comprises a polymeric elastomer.

[0008] Polymer elastomers include: white glue and nanoscale silica materials, or, polymer elastomers include nanoscale polyimide-SiO2 composite materials.

[0009] Furthermore, a soldering layer is provided between the substrate of the LED lamp bead and the PCB board, and the soldering layer is made of nano silver paste.

[0010] Furthermore, the substrate is an aluminum nitride substrate.

[0011] Furthermore, the PCB board is provided with a carbon fiber mesh layer, which is located below the substrate and has an area larger than that of the substrate.

[0012] An automotive interactive screen includes the aforementioned LED light source.

[0013] The beneficial effects of this utility model are: by setting a white adhesive layer on the periphery of the substrate, the light is reflected on the periphery, and the intensity uniformity of the LED light bead is relatively good. Attached Figure Description

[0014] Figure 1 This is a simplified schematic diagram of an existing LED light source.

[0015] Figure 2 for Figure 1 A cross-sectional schematic diagram.

[0016] Figure 3 This is a simplified schematic diagram of an LED light source in this embodiment.

[0017] Figure 4 for Figure 3 A cross-sectional schematic diagram.

[0018] Figure label:

[0019] 1—PCB board; 2—Black glue layer; 3—Protective glue; 4—LED chip; 5—Substrate; 6—Transparent glue; 7—Soldering layer; 8—Carbon fiber mesh layer; 9—White glue layer; 10—Flexible buffer layer; 20—LED lamp bead. Detailed Implementation

[0020] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0021] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0022] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0024] The present invention will now be described in detail with reference to the accompanying drawings. Figures 1 to 2 As shown.

[0025] Example 1: See Figure 3 , Figure 4 An LED light source includes a PCB board 1 and LED beads 20 connected to the PCB board 1. The LED beads 20 include an LED chip 4 and a substrate 5. The LED chip 4 is fixed to the substrate 5, and the substrate 5 is soldered to the PCB board 1. The surface of the LED chip 4 is provided with a protective adhesive 3 and a transparent adhesive 6. The outer periphery of the substrate 5 is provided with an annular black adhesive layer 2, and the inner side of the black adhesive layer 2 is provided with an annular white adhesive layer 9.

[0026] Compared with existing technologies, this technical solution is described in [reference]. Figure 2 , Figure 4 The improvement lies in the following: a white adhesive layer 9 is provided inside the black adhesive layer 2; when the LED chip 4 in the middle emits light, the light is projected onto the white adhesive layer 9 and then reflected by the white adhesive layer 9; this avoids the situation where the light in the middle of the LED bead 20 is significantly stronger than that around the periphery, resulting in poor uniformity, and also improves the light output efficiency. Secondly, one or more LED chips 4 can be provided inside the LED bead. For example, in this embodiment, three LED chips 4 are provided inside the LED bead 20, namely red, yellow, and blue LED chips, representing three different colors of LED chips.

[0027] See Figure 4 A flexible buffer layer 10 is provided on the surface of the substrate 5.

[0028] The flexible buffer layer 10 is used to mitigate or reduce the impact between the LED chip 4 and the substrate 5. When used as a light source for automotive interactive screens, it inevitably encounters bumpy roads and significant vibrations. In such cases, the LED chip 4 and substrate 5 will experience substantial impact forces during shaking, leading to loosening of the solder joints, poor electrical contact, and intermittent lighting of the LED beads 20. To avoid this, a flexible buffer layer 10 is provided on the surface of the substrate 5 in this embodiment. The flexible buffer layer 10 has through holes that mate with the solder joints of the LED chip 4, and it surrounds the LED chip 4. When shaking occurs, the LED chip 4 also presses against the flexible buffer layer 10, reducing the impact on the substrate 5. Simultaneously, it also buffers the impact in the lateral vibration direction, reducing the shear force between the LED chip 4 and the substrate 5. i When O2 particles are subjected to lateral impact, localized stress is generated to disperse the lateral shear force.

[0029] See Figure 4 The flexible buffer layer 10 comprises a polymer elastomer, which includes white glue and nano-sized silica material, or the polymer elastomer comprises nano-sized polyimide-S. i O2 composite material.

[0030] Using a polymer elastomer can effectively mitigate the impact between the LED chip 4 and the substrate 5. Specifically, the polymer elastomer can be a combination of white glue and nano-sized silica material, or it can be nano-sized polyimide-S. i O2 composite material.

[0031] See Figure 2 , Figure 4 A soldering layer 7 is provided between the substrate 5 of the LED lamp bead 20 and the PCB board 1. The soldering layer 7 is nano silver paste.

[0032] In traditional manufacturing, the solder joints of the LED beads 20 are soldered to the PCB board 1 using solder or other soldering materials, forming a solder layer 7 between the LED beads 20 and the PCB board 1. During use, when encountering severe bumps, a significant impact will occur between the substrate 5 and the PCB board 1. The existing solder paste used as the solder layer 7 has weak shear stress resistance. In this embodiment, nano silver paste is used to replace the traditional solder paste; a porous silver network structure is formed by sintering at 250°C, which improves the shear strength and effectively enhances the connection strength between the substrate 5 and the PCB board 1.

[0033] See Figures 3 to 4 The substrate 5 is an aluminum nitride substrate 5.

[0034] The aluminum nitride substrate 5 has good thermal conductivity. Currently, during the use of the interactive screen, the heat generated by the LED chip 4 is transferred to the substrate 5. If the heat dissipation of the substrate 5 is poor and the usage time is long, more heat will accumulate on the substrate 5, and the temperature of the substrate 5 will rise. This will affect the solder joint between the substrate 5 and the LED chip 4, as well as the solder joint between the substrate 5 and the PCB board 1. The solder joint may soften, resulting in insufficient connection and poor electrical contact. Using aluminum nitride for the substrate 5 can reduce the thermal resistance of the substrate 5, which is beneficial for transferring heat to the PCB board 1.

[0035] See Figure 3 , Figure 4 The PCB board 1 is provided with a carbon fiber mesh layer 8, which is located below the substrate 5 and the area of ​​the carbon fiber mesh layer 8 is larger than the area of ​​the substrate 5.

[0036] In the specific setup, recessed holes are made on PCB board 1, and the recessed holes are filled with carbon fiber mesh layer 8. Secondly, the placement of the carbon fiber mesh layer 8 does not affect the circuit design; the carbon fiber mesh layer 8 surrounds the substrate 5. PCB board 1 and carbon fiber mesh layer 8 are set in separate sections: one section is a solid carbon plate with drilled holes to match copper electrodes, surrounded by a dense fibrous mesh layer 8. The carbon fiber mesh layer 8 allows the substrate 5 to match the LED beads 20 when heated, reducing thermal vibration damage caused by inconsistent thermal expansion. The carbon fiber mesh accounts for 5%-15% of the volume; it is incorporated into PCB board 1. It should be noted that circuitry is still present within the carbon fiber mesh.

[0037] Example 2: An automotive interactive screen, including the aforementioned LED light source.

[0038] The above description is only a preferred embodiment of this utility model. For those skilled in the art, there will be changes in the specific implementation method and application scope based on the idea of ​​this utility model. The content of this specification should not be construed as a limitation of this utility model.

Claims

1. An LED light source, comprising a PCB board and LED beads connected to the PCB board, the LED beads comprising an LED chip and a substrate, the LED chip being fixed to the substrate, and the substrate being soldered to the PCB board; a protective adhesive and a transparent adhesive are sequentially disposed on the surface of the LED chip, and an annular black adhesive layer is disposed around the periphery of the substrate, characterized in that: A ring-shaped white adhesive layer is provided on the inner side of the black adhesive layer.

2. The LED light source according to claim 1, characterized in that: A flexible buffer layer is provided on the surface of the substrate.

3. The LED light source according to claim 2, characterized in that: The flexible buffer layer comprises a polymer elastomer.

4. The LED light source according to claim 2, characterized in that: Polymer elastomers include: white glue and nano-sized silica materials.

5. The LED light source according to claim 2, characterized in that: Polymer elastomers include nanoscale polyimide-SiO2 composite materials.

6. The LED light source according to claim 1, characterized in that: A soldering layer, made of nano-silver paste, is provided between the substrate of the LED lamp bead and the PCB board.

7. The LED light source according to claim 1, characterized in that: The substrate is an aluminum nitride substrate.

8. The LED light source according to claim 1, characterized in that: The PCB board has a carbon fiber mesh layer, which is located below the substrate and has an area larger than that of the substrate.

9. A car interactive screen, characterized in that: Includes the LED light source as described in any one of claims 1 to 8.

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