Battery protection plate and battery
By creating copper-plated vias inside the PCB board to enhance the bonding force between the surface pads and the board body, the problem of tilting and misalignment of electrical connectors is solved, improving the stability of battery packaging and reducing the complexity of circuit design.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUNWODA ELECTRONICS CO LTD
- Filing Date
- 2025-07-10
- Publication Date
- 2026-07-10
Smart Images
Figure CN224481850U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of mobile phone battery technology, and in particular to a battery protection board and a battery. Background Technology
[0002] To meet user needs, most mobile phone products currently aim to make the battery capacity as large as possible, as a larger capacity results in a longer standby time.
[0003] Mobile phone batteries mainly consist of battery cells, battery protection modules, insulating tape, and other structural components. The battery protection module (PCM) is a crucial component that protects the battery from damage caused by overcharging, over-discharging, and short circuits. Battery protection modules include flexible printed circuit boards (FPCs) and printed circuit boards (PCBs).
[0004] Given a given battery size, the smaller the PCM (Polymer Packaging Material) package size, the larger the space left for the battery cell, allowing for a further increase in battery capacity. Therefore, many battery products now adjust the PCM package size from its width to its thickness, meaning the PCM is no longer placed horizontally in the cell recess but vertically at the cell head. Furthermore, to further reduce the PCM packaging space, the L-shaped electrical connector 300 used to connect the battery cell is designed on the side of the PCB board 100. Figure 17 and Figure 18 As shown.
[0005] However, in the above method, the L-shaped electrical connector 300 is attached to the side of the PCB board 100 and is prone to tilting, which can easily cause the surface pads 121 of the L-shaped electrical connector 300 on the PCB board 100 to lift up and detach from the PCB board 100. Utility Model Content
[0006] The purpose of this application is to provide a battery protection board and a battery, thereby solving the problem that in the existing battery packaging method, the L-shaped electrical connector is attached to the side of the PCB board and is prone to skewing, which in turn easily causes the surface pads of the L-shaped electrical connector to lift and detach from the PCB board.
[0007] According to a first aspect of this application, a battery protection board is provided, the battery protection board including a PCB board, the PCB board including a board body, surface pads and side pads; the board body includes two surfaces opposite to each other in its own thickness direction, the surface pads are disposed on one of the surfaces of the board body and the surface pads are disposed on the outer edge of the board body; the side pads are connected to the surface pads and are disposed on the side of the board body; a copper-plated via extending along the thickness direction is formed inside the board body, the copper-plated vias are connected to the surface pads; the pad group formed by the surface pads and the side pads is used for connection with external electrical connectors.
[0008] In any of the above technical solutions, the PCB board further includes multiple layers of inner copper foil, which are disposed between two surfaces of the board body; all of the multiple layers of inner copper foil are connected to the side pads, and the copper-plated vias are connected to at least one layer of inner copper foil.
[0009] In any of the above technical solutions, the copper-plated via is further formed as a copper-plated blind via; the copper-plated blind via is connected to at least one layer of the inner copper foil, and one end of the copper-plated blind via is connected to the surface pad.
[0010] In any of the above technical solutions, the copper-plated via is further formed as a copper-plated through hole; the copper-plated through hole penetrates the board body, the copper-plated through hole is connected to multiple layers of inner copper foil, and one end of the copper-plated through hole is connected to the surface pad.
[0011] In any of the above technical solutions, the copper-plated via further includes copper-plated blind vias and copper-plated buried vias connected sequentially along the thickness direction; one end of the copper-plated blind via is connected to the surface pad, the inner copper foil adjacent to the surface pad is defined as the first inner copper foil, the first inner copper foil is connected to the other end of the copper-plated blind via, and the copper-plated buried via is connected to at least one inner copper foil other than the first inner copper foil.
[0012] In any of the above technical solutions, the copper-plated via is further formed as a solid columnar structure, or the copper-plated via is formed as an annular ring structure.
[0013] In any of the above technical solutions, the board body further includes a length direction that is perpendicular to the thickness direction; a plurality of pad groups are provided along the length direction of the board body, and the plurality of pad groups are all located on the same side of the board body, with each pad group used to connect to an external electrical connector.
[0014] In any of the above technical solutions, further, a plurality of copper-plated vias are provided at the position corresponding to each of the pad groups on the board body, the plurality of copper-plated vias are arranged at intervals along the length direction, and the plurality of copper-plated vias are connected to the surface pads.
[0015] In any of the above technical solutions, further, the plurality of pad groups are divided into a positive pad group and a negative pad group; or, the plurality of pad groups are divided into two positive pad groups and two negative pad groups.
[0016] A second aspect of this application provides a battery including a battery protection board as described above, the battery further including a battery cell and an electrical connector; the electrical connector includes a head and a side portion perpendicular to each other, the side portion being connected to the side pad, the head portion being connected to the surface pad, and a tab extending from the battery cell being connected to the side portion opposite to the board body.
[0017] The battery protection board of this application includes a PCB board, which includes a board body, surface pads, and side pads. The board body includes two surfaces opposite each other in its thickness direction. The surface pads are disposed on one of the surfaces of the board body and are located at the outer edge of the board body. The side pads are connected to the surface pads and are located on the sides of the board body. Copper-plated vias extending in the thickness direction are formed inside the board body and are connected to the surface pads. The pad group formed by the surface pads and the side pads is used for connection to external electrical connectors.
[0018] Based on the above technical features, the beneficial effects of this application are as follows:
[0019] The board body of this application has copper-plated vias extending along the thickness direction inside. The copper-plated vias are connected to the surface pads. The copper-plated vias form a connection between the surface pads and the interior of the board body. The copper-plated vias are like patches, making the bonding force between the surface pads and the board body stronger. When the pad group formed by the surface pads and side pads of this application is connected to the external electrical connector, it can effectively solve the problem of the external electrical connector tilting and misaligning, pulling up the surface pads and detaching them from the PCB board.
[0020] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description
[0021] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0022] Figure 1 A top view of a PCB board according to a first embodiment of this application is shown;
[0023] Figure 2 Show Figure 1 Side view;
[0024] Figure 3 A top view of the battery protection board according to the first embodiment of this application is shown;
[0025] Figure 4 A top view of a PCB board according to a second embodiment of this application is shown;
[0026] Figure 5 Show Figure 4 Side view;
[0027] Figure 6 A top view of the battery protection board according to a second embodiment of this application is shown;
[0028] Figure 7 A partial cross-sectional view of the PCB board of this application is shown when it is connected to the electrical connector (the copper-plated vias are not shown).
[0029] Figure 8 This shows a cross-sectional view of the copper-plated via formed as a copper-plated blind via in this application;
[0030] Figure 9 This shows a cross-sectional view of the copper-plated via formed as a copper-plated through-hole in this application;
[0031] Figure 10 This application shows a cross-sectional view of copper-plated vias including copper-plated blind vias and copper-plated buried vias;
[0032] Figure 11 Show Figure 10 Another example of a cross-sectional view;
[0033] Figure 12 This diagram illustrates the distribution of copper-plated vias in the first example of this application.
[0034] Figure 13 This diagram illustrates the distribution of copper-plated vias in a second example of this application.
[0035] Figure 14This diagram illustrates the distribution of copper-plated vias in the third example of this application.
[0036] Figure 15 This diagram illustrates the distribution of copper-plated vias in the fourth example of this application.
[0037] Figure 16 This diagram illustrates the distribution of copper-plated vias in the fifth example of this application;
[0038] Figure 17 This shows a partial cross-sectional view of a PCB board connected to electrical connectors in the prior art;
[0039] Figure 18 This shows a top view of a PCB board in the prior art.
[0040] Icons: 100-PCB board; 110-Board body; 120-Pad group; 121-Surface pad; 122-Side pad; 130-Output pad; 140-Copper plated via; 141-Copper plated blind via; 142-Copper plated through via; 143-Copper plated buried via; 150-Inner copper foil; 200-FPC board; 300-Electrical connector; 310-Head; 320-Side; X-Length direction; Z-Thickness direction. Detailed Implementation
[0041] The following detailed embodiments are provided to help the reader gain a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will be apparent after understanding the disclosure of this application. For example, the order of operations described herein is merely illustrative and is not limited to the order set forth herein; changes that will be apparent after understanding the disclosure of this application are possible, except for operations that must occur in a specific order. Furthermore, for clarity and brevity, descriptions of features known in the art may be omitted.
[0042] The features described herein may be implemented in different forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein have been provided merely to illustrate some of the many feasible ways of implementing the methods, apparatus, and / or systems described herein that will be apparent upon understanding the disclosure of this application.
[0043] Throughout the specification, when an element (such as a layer, region, or substrate) is described as being "on" another element, "connected to" another element, "bonded to" another element, "on" another element, or "covering" another element, it may be directly "on" another element, "connected to" another element, "bonded to" another element, "on" another element, or "covering" another element, or there may be one or more other elements in between. In contrast, when an element is described as being "directly on" another element, "directly connected to" another element, "directly bonded to" another element, "directly on" another element, or "directly covering" another element, there may be no other elements in between.
[0044] As used herein, the term “and / or” includes any one of the relevant items listed and any combination of any two or more items.
[0045] Although terms such as “first,” “second,” and “third” may be used herein to describe individual components, assemblies, regions, layers, or parts, these components, assemblies, regions, layers, or parts are not limited by these terms. Rather, these terms are used only to distinguish one component, assembly, region, layer, or part from another. Therefore, without departing from the teachings of the examples described herein, the first component, assembly, region, layer, or part referred to as the second component, assembly, region, layer, or part may also be referred to as the second component, assembly, region, layer, or part.
[0046] For ease of description, spatial relation terms such as “above,” “upper,” “below,” and “lower” are used herein to describe the relationship between one element and another, as shown in the accompanying drawings. Such spatial relation terms are intended to include not only the orientation depicted in the drawings but also different orientations of the device during use or operation. For example, if the device in the drawings is flipped, an element described as being “above” or “upper” relative to another element will subsequently be “below” or “lower” relative to that other element. Therefore, the term “above” includes both “above” and “below” orientations depending on the spatial orientation of the device. The device may also be positioned in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relation terms used herein will be interpreted accordingly.
[0047] The terminology used herein is for the purpose of describing various examples only and is not intended to limit this disclosure. Unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. The terms “comprising,” “including,” and “having” enumerate the stated features, quantities, operations, components, elements, and / or combinations thereof, but do not exclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.
[0048] Variations in the shapes shown in the accompanying drawings may occur due to manufacturing techniques and / or tolerances. Therefore, the examples described herein are not limited to the specific shapes shown in the accompanying drawings, but include changes in shape that may occur during manufacturing.
[0049] The features of the examples described herein can be combined in various ways that will be apparent upon understanding the disclosure of this application. Furthermore, although the examples described herein have a wide variety of constructions, other constructions are possible, as will be apparent upon understanding the disclosure of this application.
[0050] Prior to this application, in order to further increase battery capacity, many battery products adjusted the battery package size from the original PCM width to the PCM thickness. That is, the PCM was changed from being placed parallel to the cell recess to being placed vertically at the cell head. Furthermore, to further compress the PCM packaging space, the L-shaped electrical connector 300 used to connect the cell was designed on the side of the PCB board 100. Figure 17 and Figure 18 As shown. However, in the above method, the L-shaped electrical connector 300 is attached to the side of the PCB board 100 and is prone to skewing, which can easily cause the surface pads 121 of the L-shaped electrical connector 300 on the PCB board 100 to lift up and detach from the PCB board 100.
[0051] In view of this, the first aspect of this application provides a battery protection board, thereby solving the problem that in the existing battery packaging method, the L-shaped electrical connector 300 is attached to the side of the PCB board 100 and is prone to skewing, which in turn easily causes the surface pad 121 of the L-shaped electrical connector 300 to lift up and detach from the PCB board 100.
[0052] The following reference Figures 1 to 16 This application describes a battery protection board according to some embodiments. Furthermore, for ease of description below, the PCB board 100, surface pads 121, and electrical connectors 300 of this application are referred to by the same reference numerals as those in the prior art.
[0053] like Figure 1 , Figure 2 , Figure 3 and Figure 8As shown, the battery protection board of this application includes a PCB board 100, which includes a board body 110, surface pads 121, and side pads 122. The board body 110 includes two surfaces opposite each other in its thickness direction Z. The surface pads 121 are disposed on one of the surfaces of the board body 110 and are located on the outer edge of the board body 110. The side pads 122 are connected to the surface pads 121 and are located on the side of the board body 110. A copper-plated via 140 extending in the thickness direction Z is formed inside the board body 110 and is connected to the surface pads 121. The pad group 120 formed by the surface pads 121 and the side pads 122 is used for connection with external electrical connectors.
[0054] In other words, the board body 110 of this application has a copper-plated via 140 extending along the thickness direction Z inside. The copper-plated via 140 is connected to the surface pad 121. The copper-plated via 140 makes the surface pad 121 and the board body 110 internally connected. The copper-plated via 140 is like a patch, making the surface pad 121 and the board body 110 more bonded. When the pad group 120 formed by the surface pad 121 and the side pad 122 of this application is connected to the external electrical connector, it can effectively solve the problem of the external electrical connector tilting and misaligning, pulling up the surface pad 121 and detaching it from the PCB board 100.
[0055] Furthermore, in the embodiments of this application, such as Figure 8 As shown, the PCB board 100 also includes multiple layers of inner copper foil 150, which are disposed between the two surfaces of the board body 110. All layers of inner copper foil 150 are connected to the side pads 122, and the copper-plated vias 140 are connected to at least one layer of inner copper foil 150. This arrangement, with the copper-plated vias 140 connected to the inner copper foil 150, strengthens the bond between the surface pads 121 and the board body 110, resulting in higher strength. Furthermore, the connection between the multiple layers of inner copper foil 150 and the side pads 122 strengthens the bond between the side pads 122 and the board body 110, effectively improving the overall structural strength of the PCB board 100. On the other hand, the multiple layers of inner copper foil 150 and the surface pads 121 (surface copper foil) can be electrically connected to other electrical components as needed. By increasing the number of inner copper foil layers 150, the wiring density of the PCB board 100 can be significantly increased, supporting more complex circuit designs.
[0056] In the embodiments of this application, the copper-plated via 140 can take various forms.
[0057] As a first embodiment, such as Figure 8As shown, the copper-plated via 140 is formed as a copper-plated blind via 141. The copper-plated blind via 141 is connected to at least one inner layer copper foil 150, and one end of the copper-plated blind via 141 is connected to the surface pad 121. Here, Figure 8 The diagram illustrates the form of four inner copper foil layers 150 and two surface copper foil layers, with copper-plated blind vias 141 connected to the surface pads 121 and the first inner copper foil layer, respectively.
[0058] As a second embodiment, such as Figure 9 As shown, the copper-plated via 140 is formed into a copper-plated through-hole 142, which penetrates the board body 110. The copper-plated through-hole 142 is connected to multiple inner copper foil layers 150, and one end of the copper-plated through-hole 142 is connected to the surface pad 121. Here, Figure 9 The diagram illustrates the form of four inner copper foil layers 150 and two surface copper foil layers. Copper-plated through-holes 142 penetrate the board body 110, and one end of the copper-plated through-holes 142 is connected to the surface pads 121.
[0059] As a third embodiment, such as Figure 10 As shown, the copper-plated via 140 includes a copper-plated blind via 141 and a copper-plated buried via 143 connected sequentially along the thickness direction Z. One end of the copper-plated blind via 141 is connected to the surface pad 121. The inner layer copper foil 150 adjacent to the surface pad 121 is defined as the first inner layer copper foil. The first inner layer copper foil is connected to the other end of the copper-plated blind via 141. The copper-plated buried via 143 is connected to at least one inner layer copper foil 150 other than the first inner layer copper foil. Here, Figure 10 The diagram illustrates the form of four inner copper foil layers 150 and two surface copper foil layers. The copper-plated blind via 141 can be designed from the surface pad 121 to the first inner copper foil layer, and the copper-plated buried via 143 can be designed from the second to the third layer, that is, from the first inner copper foil layer to the second inner copper foil layer.
[0060] As a fourth embodiment, such as Figure 11 As shown, Figure 11 The diagram illustrates the form of four inner copper foil layers 150 and two surface copper foil layers. The copper-plated blind via 141 can be designed from the surface pad 121 to the first inner copper foil layer, and the copper-plated buried via 143 can be designed from the second to the fifth layer, that is, from the first inner copper foil layer to the fourth inner copper foil layer.
[0061] In the embodiments of this application, the copper-plated via 140 can be formed as a solid columnar structure or as an annular ring structure. That is, through electroplating, the surface pad 121 and the inner copper foil 150 are connected by the copper-plated via 140. The copper-plated via 140 can be completely filled by electroplating or form an annular copper ring. The specific choice depends on the requirements. A solid columnar structure for the copper-plated via 140 maximizes the cross-sectional area and is suitable for high-current transmission scenarios. Forming the copper-plated via 140 as an annular ring structure reduces copper usage by approximately 60% compared to a solid structure, saving raw material costs.
[0062] Furthermore, in the embodiments of this application, the board body 110 also has a length direction X perpendicular to the thickness direction Z. A plurality of pad groups 120 are provided along the length direction X of the board body 110, and all the pad groups 120 are located on the same side of the board body 110. Each pad group 120 is used to connect to an external electrical connector. This arrangement expands the number of pad groups 120 on one hand, and facilitates the connection of the pad groups 120 to external electrical connectors on the other.
[0063] As a first example, such as Figure 1 and Figure 2 As shown, multiple pad groups 120 are divided into a positive pad group B+ and a negative pad group B-. The positive pad group B+ is connected to the positive terminal of the battery cell through an external electrical connector, and the negative pad group B- is connected to the negative terminal of the battery cell through an external electrical connector.
[0064] As a second example, such as Figure 4 and Figure 5 As shown, multiple pad groups 120 are divided into two positive pad groups B1+ and B2+, and two negative pad groups B1- and B2-. The positive pad groups are connected to the positive terminal of the battery cell via external electrical connectors, and the negative pad groups are connected to the negative terminal of the battery cell via external electrical connectors. It should be noted that the two positive pad groups B1+ and B2+ and the two negative pad groups B1- and B2- can be connected to two separate battery cells, or they can be connected to the same battery cell.
[0065] It should be noted that each pad group 120 in the multiple pad groups 120 has multiple layers of inner copper foil 150 (and surface copper foil) at the corresponding position. As for how the multiple layers of inner copper foil 150 (and surface copper foil) achieve electrical connection of the multiple pad groups 120, it can be designed according to the requirements, and this application will not describe it further.
[0066] Furthermore, in the embodiments of this application, such as Figure 3 and Figure 6 As shown, the battery protection board also includes an FPC board 200, and the output pads 130 of the PCB are connected to the FPC board 200.
[0067] It is also worth mentioning that, in the embodiments of this application, a plurality of copper-plated vias 140 are provided at the position corresponding to each pad group 120 of the board body 110. The plurality of copper-plated vias 140 are arranged at intervals along the length direction X, and the plurality of copper-plated vias 140 are all connected to the surface pads 121. With this arrangement, the plurality of copper-plated vias 140 are connected to the inner copper foil 150, so that the bonding force between the surface pads 121 and the board body 110 is stronger and the strength is higher.
[0068] As a first embodiment, such as Figure 12 As shown, two copper-plated vias 140 are arranged at intervals along the length direction X, and both copper-plated vias 140 are connected to the surface pads 121.
[0069] As a second embodiment, such as Figure 13 As shown, three copper-plated vias 140 are arranged at intervals along the length direction X, and all three copper-plated vias 140 are connected to the surface pads 121.
[0070] As a third embodiment, such as Figure 14 As shown, four copper-plated vias 140 are arranged at intervals along the length direction X, and all four copper-plated vias 140 are connected to the surface pads 121.
[0071] As a fourth embodiment, such as Figure 15 As shown, five copper-plated vias 140 are arranged at intervals along the length direction X, and all five copper-plated vias 140 are connected to the surface pads 121.
[0072] As a fifth embodiment, such as Figure 16 As shown, two rows of copper-plated vias 140 are provided, with three copper-plated vias 140 in each row arranged at intervals along the length direction X, and all six copper-plated vias 140 are connected to the surface pads 121.
[0073] According to a second aspect of this application, a battery, such as a mobile phone battery, is provided. The battery includes a battery protection board as described above.
[0074] Furthermore, such as Figure 7 As shown, the battery also includes a cell and an electrical connector 300. The electrical connector 300 is preferably an L-shaped nickel block, which is connected to an integrally structured L-shaped pad assembly 120 (surface pad 121 and side pad 122). As an example, the electrical connector 300 includes a head 310 and a side portion 320 perpendicular to each other. The side portion 320 is connected to the side pad 122, and the head 310 is connected to the surface pad 121. A tab extending from the cell is connected to one side of the side portion 320 opposite to the back of the main body 110.
[0075] In summary, the board body 110 of this application has a copper-plated via 140 extending along the thickness direction Z inside. The copper-plated via 140 is connected to the surface pad 121. The copper-plated via 140 connects the surface pad 121 and the interior of the board body 110. The copper-plated via 140 acts like a patch, making the bonding force between the surface pad 121 and the board body 110 stronger. When the pad group 120 formed by the surface pad 121 and the side pad 122 of this application is connected to the electrical connector 300, it can effectively solve the problem of the electrical connector tilting and misaligning, pulling up the surface pad 121 and detaching it from the PCB board 100.
[0076] Finally, it should be noted that the above-described embodiments are merely specific implementations of this application, used to illustrate the technical solutions of this application, and not to limit them. The protection scope of this application is not limited thereto. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can still modify or easily conceive of changes to the technical solutions described in the foregoing embodiments within the scope of the technology disclosed in this application, or make equivalent substitutions for some of the technical features. Such modifications, changes, or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be covered within the protection scope of this application.
Claims
1. A battery protection board, characterized in that, The battery protection board includes a PCB board (100), which includes a board body (110), surface pads (121), and side pads (122). The board body (110) includes two surfaces that are opposite to each other in its thickness direction (Z). The surface pad (121) is disposed on one of the surfaces of the board body (110) and is disposed on the outer edge of the board body (110). The side pad (122) is connected to the surface pad (121) and is disposed on the side of the board body (110). The interior of the board body (110) is provided with copper-plated vias (140) extending along the thickness direction (Z), and the copper-plated vias (140) are connected to the surface pads (121). The pad group (120) formed by the surface pad (121) and the side pad (122) is used for connection with external electrical connectors.
2. The battery protection board according to claim 1, characterized in that, The PCB board (100) also includes multiple layers of inner copper foil (150), which are disposed between two surfaces of the board body (110); All of the inner copper foils (150) are connected to the side pads (122), and the copper-plated vias (140) are connected to at least one inner copper foil (150).
3. The battery protection board according to claim 2, characterized in that, The copper-plated via (140) is formed as a copper-plated blind via (141). The copper-plated blind via (141) is connected to at least one inner copper foil (150), and one end of the copper-plated blind via (141) is connected to the surface pad (121).
4. The battery protection board according to claim 2, characterized in that, The copper-plated via (140) is formed as a copper-plated through hole (142). The copper-plated through hole (142) penetrates the board body (110), and the copper-plated through hole (142) is connected to multiple layers of inner copper foil (150), and one end of the copper-plated through hole (142) is connected to the surface pad (121).
5. The battery protection board according to claim 2, characterized in that, The copper-plated via (140) includes copper-plated blind via (141) and copper-plated buried via (143) connected sequentially along the thickness direction (Z). One end of the copper-plated blind via (141) is connected to the surface pad (121). The inner copper foil (150) adjacent to the surface pad (121) is defined as the first inner copper foil. The first inner copper foil is connected to the other end of the copper-plated blind via (141). The copper-plated buried via (143) is connected to at least one inner copper foil (150) other than the first inner copper foil.
6. The battery protection board according to claim 2, characterized in that, The copper-plated via (140) is formed as a solid columnar structure, or the copper-plated via (140) is formed as an annular ring structure.
7. The battery protection board according to any one of claims 1-6, characterized in that, The plate body (110) also has a length direction (X), which is perpendicular to the thickness direction (Z); A plurality of pad groups (120) are provided along the length direction (X) of the board body (110), and the plurality of pad groups (120) are all provided on the same side of the board body (110), and each pad group (120) is used to connect to an external electrical connector.
8. The battery protection board according to claim 7, characterized in that, The board body (110) has a plurality of copper-plated vias (140) at the position corresponding to each of the pad groups (120). The plurality of copper-plated vias (140) are arranged at intervals along the length direction (X), and the plurality of copper-plated vias (140) are connected to the surface pads (121).
9. The battery protection board according to claim 7, characterized in that, The plurality of said pad groups (120) are divided into a positive pad group and a negative pad group; Alternatively, the multiple pad groups (120) may be divided into two positive pad groups and two negative pad groups.
10. A battery, characterized in that, The battery includes a battery protection board as described in any one of claims 1-9, and the battery further includes a cell and an electrical connector (300). The electrical connector (300) includes a head (310) and a side (320) perpendicular to each other. The side (320) is connected to the side pad (122), and the head (310) is connected to the surface pad (121). The tabs led out from the battery cell are connected to the side of the side (320) opposite to the board body (110).