A communication base station signal amplifier heat dissipation fin
By introducing a combination of heat dissipation and dust removal components into the signal amplifier, and utilizing the phase change process of the phase change fluid and the effect of the capillary layer, the problem of low heat dissipation efficiency of existing signal amplifiers is solved, achieving efficient heat dissipation and dust removal, thereby improving the service life and safety of the equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DONGGUAN TOGE MECHANICAL & ELECTRICAL TECHNOLOGY CO LTD
- Filing Date
- 2025-04-22
- Publication Date
- 2026-07-10
AI Technical Summary
The heat sink structure of existing communication base station signal amplifiers is a solid structure, which has limited heat dissipation efficiency, resulting in the signal amplifier's lifespan and safety being affected by excessive temperature.
It adopts a combined design of heat dissipation components, protection components and dust removal components, including heat dissipation plate, heat dissipation fins, capillary layer and phase change fluid. It achieves efficient heat dissipation through the phase change process of phase change fluid, and removes surface dust through dust removal components to maintain heat dissipation effect.
This improves the heat dissipation efficiency of the signal amplifier, avoiding performance degradation and shortened lifespan due to excessive temperature, and enhancing the safety and reliability of the equipment.
Smart Images

Figure CN224481928U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of communication base station technology, specifically to a heat sink fin for a communication base station signal amplifier. Background Technology
[0002] Communication base stations are critical infrastructure in mobile communication networks, used to provide signal coverage and services in wireless communication systems. They transmit and receive radio signals through antennas to communicate with user equipment and transmit these signals to the core network, enabling functions such as telephone calls, SMS sending, and data transmission. A communication base station signal amplifier is a device used to enhance signal strength, suitable for areas with weak signals. Signal amplifiers generate a certain amount of heat during normal operation; however, if heat dissipation is inadequate or the design is flawed, excessively high temperatures may lead to performance degradation and shortened lifespan, and also pose certain safety hazards.
[0003] Based on the above, the inventors have discovered the following problems: the heat dissipation fins used in current signal amplifiers are usually solid structures that rely on the thermal conductivity of the material itself for heat dissipation, which has limited heat dissipation efficiency and is inconvenient to use.
[0004] Therefore, in view of this, we have studied and improved the existing structure and its shortcomings, and provided a heat dissipation fin for a communication base station signal amplifier, in order to achieve a more practical purpose. Utility Model Content
[0005] The purpose of this invention is to provide a heat sink for a signal amplifier in a communication base station to solve the problems mentioned in the background art.
[0006] A heat sink for a signal amplifier in a communication base station includes a signal amplifier. A heat sink component is fixedly mounted on one side of the signal amplifier, and a protective component is fixedly mounted on the side of the signal amplifier with the heat sink component. The protective component covers the outside of the heat sink component. The heat sink component includes a heat sink plate, which is fixedly connected to the signal amplifier. Heat sink fins are fixedly mounted on the side of the heat sink plate away from the signal amplifier. The heat sink fins and the heat sink plate are filled with a phase change fluid, and a capillary layer is provided on the inner side of the heat sink fins and the heat sink plate. A dust removal component is provided inside the protective component.
[0007] By adopting the above technical solution, the heat dissipation component facilitates the dissipation of heat generated by the signal amplifier, effectively preventing the signal amplifier from being affected by excessive temperature. The protective component, encased outside the heat dissipation component, provides protection. The capillary layer and phase change fluid facilitate the heat dissipation plate to absorb the heat generated by the signal amplifier, causing the internal phase change fluid to vaporize. The vaporized phase change fluid flows into the heat dissipation fins, where it condenses and liquefies. The liquefied phase change fluid is then drawn into the heat dissipation plate by the capillary layer, thereby improving the heat dissipation effect and efficiently cooling the signal amplifier. The protective component also includes a dust removal component, which facilitates the cleaning of the heat dissipation component surface, preventing dust adhering to the surface from affecting the heat dissipation effect.
[0008] Furthermore, the protective component includes a protective frame, which is fixedly connected to the signal amplifier and is disposed on the outside of the heat dissipation component.
[0009] By adopting the above technical solution, the protective frame is set on the outside of the heat dissipation component, which facilitates the protection of the heat dissipation component and avoids deformation and damage caused by impact.
[0010] Furthermore, a through groove is provided in the middle of the protective frame, and a guide rod is fixedly installed on the inner side of the protective frame.
[0011] By adopting the above technical solution, a through groove is opened in the middle of the protective frame, and a guide rod is fixedly installed on the inner side of the protective frame, which facilitates the installation of the dust removal component.
[0012] Furthermore, the bottom of the guide rod is provided with a bent portion, and the other end of the bent portion is fixedly connected to the protective frame.
[0013] By adopting the above technical solution and by setting the bending part, it is easy to hang the dust sweeping component on the outside of the bottom of the heat dissipation component after the dust sweeping component has finished cleaning, so that the dust sweeping component will not affect the heat dissipation effect of the heat dissipation component.
[0014] Furthermore, the dust removal assembly includes a brush plate, and a cleaning brush is fixedly installed on one side of the brush plate.
[0015] By adopting the above technical solution, a cleaning brush is fixedly installed on one side of the brush plate, which facilitates the cleaning brush to clean the surface of the heat dissipation component and avoids dust adhering to the surface of the heat dissipation component, thus affecting the heat dissipation effect.
[0016] Furthermore, a handle is fixedly installed on the side of the brush plate away from the cleaning brush, and the handle is located inside the through groove.
[0017] By adopting the above technical solution, the handle is designed to facilitate gripping and moving the dust removal component up and down, making it easier for the cleaning brush to clean the surface of the heat dissipation component.
[0018] Furthermore, the brush plate has guide slip rings fixedly installed at both ends on one side of the handle, and the guide slip rings are slidably connected to the guide rod.
[0019] By adopting the above technical solution, the guide slip ring is slidably connected to the guide rod, which facilitates the guidance and fixation of the up and down movement of the dust sweeping component, so that the dust sweeping component can only slide up and down along the guide rod.
[0020] Compared with the prior art, the beneficial effects of this utility model are as follows: The heat dissipation component facilitates the dissipation of heat generated by the signal amplifier, effectively preventing the amplifier from being affected by overheating. The protective component, encasing the heat dissipation component, provides protection. The capillary layer and phase change fluid facilitate the heat sink's absorption of heat generated by the signal amplifier, causing the internal phase change fluid to vaporize. The vaporized phase change fluid then flows into the heat sink fins, where it condenses and liquefies. The liquefied phase change fluid is then drawn into the heat sink by the capillary layer, thus improving heat dissipation efficiency. The protective component includes a dust removal component, which cleans the surface of the heat sink, preventing dust from affecting heat dissipation. This utility model effectively improves heat dissipation, preventing the signal amplifier from being affected by overheating and thus has high practical value. Attached Figure Description
[0021] Figure 1 This is a three-dimensional structural diagram of the heat dissipation fins of a communication base station signal amplifier according to the present invention.
[0022] Figure 2 This is an exploded view of the heat dissipation fins of a communication base station signal amplifier according to the present invention.
[0023] Figure 3 This is a cross-sectional view of the heat dissipation component of this utility model;
[0024] Figure 4 This is a three-dimensional structural diagram of the protective component of this utility model;
[0025] Figure 5 This is a cross-sectional view of the dust removal component of this utility model.
[0026] In the diagram: 101, signal amplifier; 102, heat dissipation assembly; 10201, heat sink; 10202, heat dissipation fins; 10203, capillary layer; 103, protective assembly; 10301, protective frame; 10302, through groove; 10303, guide rod; 10304, bending part; 104, dust removal assembly; 10401, brush plate; 10402, guide slip ring; 10403, handle; 10404, cleaning brush. Detailed Implementation
[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0028] Please see Figures 1-5 This utility model provides a technical solution: a heat sink for a signal amplifier in a communication base station, including a signal amplifier 101. A heat sink assembly 102 is fixedly installed on one side of the signal amplifier 101. The heat sink assembly 102 facilitates the dissipation of heat generated by the signal amplifier 101 during operation, effectively preventing the signal amplifier 101 from being affected by excessive temperature. A protective assembly 103 is fixedly installed on the side of the signal amplifier 101 with the heat sink assembly 102, covering the heat sink assembly 102 and providing protection for it. The heat sink assembly 102 includes a heat sink 10201, which is fixedly connected to the signal amplifier 101. Heat sink fins 10202 are fixedly installed on the side of the heat sink 10201 away from the signal amplifier 101. The heat sink 10202 and heat dissipation plate 10201 are filled with phase change fluid, and the heat dissipation fins 10202 and heat dissipation plate 10201 are provided with capillary layer 10203. Through the setting of capillary layer 10203 and phase change fluid, the heat dissipation plate 10201 can absorb the heat generated by the operation of signal amplifier 101, causing the internal phase change fluid to vaporize. The vaporized phase change fluid flows into the heat dissipation fins 10202. The heat dissipation fins 10202 dissipates heat, causing the phase change fluid to condense and liquefy. The liquefied phase change fluid is drawn into the heat dissipation plate 10201 by capillary layer 10203, thereby improving the heat dissipation effect and efficiently dissipating heat from signal amplifier 101. The protective component 103 is provided with dust removal component 104. The dust removal component 104 is provided inside the protective component 103 to facilitate the dust removal component 104 to clean the surface of heat dissipation component 102, avoiding dust adhering to the surface of heat dissipation component 102 from affecting the heat dissipation effect.
[0029] The protective component 103 includes a protective frame 10301, which is fixedly connected to the signal amplifier 101. The protective frame 10301 is disposed on the outside of the heat dissipation component 102. By disposing of the protective frame 10301 on the outside of the heat dissipation component 102, the protective frame 10301 can provide protection for the heat dissipation component 102 and prevent the heat dissipation component 102 from being deformed and damaged by impact.
[0030] The protective frame 10301 has a through groove 10302 in the middle and a guide rod 10303 is fixedly installed on the inner side of the protective frame 10301. The through groove 10302 in the middle of the protective frame 10301 and the guide rod 10303 fixedly installed on the inner side of the protective frame 10301 facilitate the installation of the dust removal component 104.
[0031] The guide rod 10303 has a bent part 10304 at the bottom. The other end of the bent part 10304 is fixedly connected to the protective frame 10301. The bent part 10304 is designed so that the dust sweeping component 104 can be hung on the outside of the bottom of the heat dissipation component 102 after the dust sweeping component 104 has finished cleaning, so that the dust sweeping component 104 will not affect the heat dissipation effect of the heat dissipation component 102.
[0032] The dust removal component 104 includes a brush plate 10401, and a cleaning brush 10404 is fixedly installed on one side of the brush plate 10401. The cleaning brush 10404 is fixedly installed on one side of the brush plate 10401, which facilitates the cleaning brush 10404 to clean the surface of the heat dissipation component 102 and prevents dust from adhering to the surface of the heat dissipation component 102 and affecting the heat dissipation effect.
[0033] A handle 10403 is fixedly installed on the side of the brush plate 10401 away from the cleaning brush 10404. The handle 10403 is located inside the through groove 10302. The handle 10403 makes it easy to hold the handle 10403 to drive the dust removal component 104 to move up and down, so that the cleaning brush 10404 can clean the surface of the heat dissipation component 102.
[0034] Among them, the brush plate 10401 is provided with a handle 10403 and guide slip rings 10402 are fixedly installed at both ends on one side. The guide slip rings 10402 are slidably connected to the guide rod 10303. The slidable connection between the guide slip rings 10402 and the guide rod 10303 facilitates the guidance and fixation of the up and down movement of the dust sweeping assembly 104, so that the dust sweeping assembly 104 can only slide up and down along the guide rod 10303.
[0035] Specifically, the working principle of this type of heat sink fin for a communication base station signal amplifier is as follows: During use, the heat dissipation component 102 facilitates the dissipation of heat generated by the signal amplifier 101, effectively preventing the signal amplifier 101 from being affected by overheating. The protective component 103 covers the heat dissipation component 102, providing protection. The capillary layer 10203 and phase change fluid facilitate the absorption of heat generated by the signal amplifier 101 by the heat sink 10201. The heat dissipation process causes the internal phase change liquid to vaporize, and the vaporized phase change liquid flows into the heat dissipation fins 10202. The heat dissipation fins 10202 cause the phase change liquid to condense and liquefy. The liquefied phase change liquid is then drawn into the heat sink 10201 by the capillary layer 10203, thereby improving the heat dissipation effect and efficiently cooling the signal amplifier 101. A dust removal component 104 is provided inside the protective component 103 to facilitate the cleaning of the surface of the heat dissipation component 102, preventing dust adhering to the surface of the heat dissipation component 102 from affecting its performance. For improved heat dissipation, a protective frame 10301 is positioned on the outside of the heat dissipation component 102, providing protection and preventing deformation or damage from impacts. A handle 10403 facilitates the movement of the dust removal component 104, allowing the cleaning brush 10404 to clean the surface of the heat dissipation component 102. A cleaning brush 10404 is fixedly mounted on one side of the brush plate 10401, enabling the cleaning brush 10404 to clean the surface of the heat dissipation component 102. 02 The surface is cleaned to prevent dust from adhering to the surface of the heat dissipation component 102 and affecting the heat dissipation effect. The guide ring 10402 is slidably connected to the guide rod 10303 to facilitate the up and down movement of the dust sweeping component 104 and fix it so that the dust sweeping component 104 can only slide up and down along the guide rod 10303. The setting of the bending part 10304 makes it easy to hang the dust sweeping component 104 on the outside of the bottom end of the heat dissipation component 102 after cleaning, so that the dust sweeping component 104 will not affect the heat dissipation effect of the heat dissipation component 102.
[0036] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. A heat sink fin for a communication base station signal amplifier, characterized in that, The system includes a signal amplifier (101), a heat dissipation assembly (102) fixedly mounted on one side of the signal amplifier (101), and a protective assembly (103) fixedly mounted on the side of the signal amplifier (101) with the heat dissipation assembly (102). The protective assembly (103) covers the outside of the heat dissipation assembly (102). The heat dissipation assembly (102) includes a heat sink (10201), which is fixedly connected to the signal amplifier (101). A heat dissipation fin (10202) is fixedly mounted on the side of the heat sink (10201) away from the signal amplifier (101). The heat dissipation fin (10202) and the heat dissipation assembly (10201) are filled with a phase change fluid. The inner side of the heat sink (10202) and the heat sink (10201) is provided with a capillary layer (10203). The protective component (103) is provided with a dust removal component (104). The dust removal component (104) includes a brush plate (10401). A cleaning brush (10404) is fixedly installed on one side of the brush plate (10401). A handle (10403) is fixedly installed on the side of the brush plate (10401) away from the cleaning brush (10404). The handle (10403) is located inside the through groove (10302). Guide slip rings (10402) are fixedly installed at both ends on the side of the brush plate (10401) with the handle (10403). The guide slip rings (10402) are slidably connected to the guide rod (10303).
2. The heat sink fins for a communication base station signal amplifier according to claim 1, characterized in that, The protective component (103) includes a protective frame (10301), which is fixedly connected to the signal amplifier (101) and is disposed on the outside of the heat dissipation component (102).
3. The heat sink fins for a communication base station signal amplifier according to claim 2, characterized in that, The protective frame (10301) has a through groove (10302) in the middle, and a guide rod (10303) is fixedly installed on the inner side of the protective frame (10301).
4. The heat sink fins for a communication base station signal amplifier according to claim 3, characterized in that, The bottom of the guide rod (10303) is provided with a bent part (10304), and the other end of the bent part (10304) is fixedly connected to the protective frame (10301).