A vc vapor chamber

By integrating the middle plate with the VC heat dissipation plate and utilizing the design of the support structure and capillary structure, the problem of large overall thickness in the existing technology has been solved, achieving overall thinning and improved heat dissipation efficiency.

CN224481958UActive Publication Date: 2026-07-10TRIO METAL (GZ) CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
TRIO METAL (GZ) CO LTD
Filing Date
2025-08-11
Publication Date
2026-07-10

AI Technical Summary

Technical Problem

The existing bonding method between the VC heat spreader and the middle plate results in a relatively large overall thickness, making it difficult to achieve a thinner and lighter design.

Method used

The middle plate is integrated with the VC heat exchange plate, and a vacuum cavity is constructed through the support structure and capillary structure. Efficient heat transfer is achieved by combining the phase change cycle of the cooling medium. The gaps in the support structure ensure unobstructed steam flow channels. The middle plate and the cover plate are designed to be flush to avoid height differences and stress concentration.

Benefits of technology

This reduces the overall thickness of the device, provides greater freedom in the layout of electronic components, avoids local hot spots and stress concentration, and improves structural reliability and heat dissipation efficiency.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224481958U_ABST
    Figure CN224481958U_ABST
Patent Text Reader

Abstract

This utility model relates to the field of vapor chamber design technology, specifically to a VC vapor chamber. It includes: a middle plate with a receiving groove; a cover plate fixed within the receiving groove, forming a vacuum cavity with the bottom of the receiving groove; a support structure disposed between the cover plate and the bottom of the receiving groove, with gaps between adjacent support structures; and a capillary structure arranged on the side of the cover plate facing the vacuum cavity; the vacuum cavity is filled with a cooling medium. In this application, the vacuum cavity, support structure, and capillary structure constitute the physical basis of the VC vapor chamber. Integrating the traditional middle plate into the VC vapor chamber eliminates the thickness accumulation caused by a separate middle plate, thus reducing the overall thickness of the device.
Need to check novelty before this filing date? Find Prior Art