Silicon wafer ejection device and silicon wafer cleaning apparatus

The silicon wafer ejection device, with its support rod and elastic buffer structure, solves the problems of scratches and rubber band aging caused by friction during ultrasonic cleaning, achieving scratch-free cleaning and simplified maintenance.

CN224482041UActive Publication Date: 2026-07-10TRINA SOLAR CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
TRINA SOLAR CO LTD
Filing Date
2025-07-16
Publication Date
2026-07-10

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Abstract

The utility model relates to the technical field of energy storage, and specifically provides a silicon wafer ejection device and a silicon wafer cleaning equipment, aiming at solving the problem that the existing technology installs a rubber band on the bottom rod of a silicon wafer basket in order to avoid scratches on the bottom of the silicon wafer, which leads to the problem that the silicon wafer is easily polluted by residual water and the rubber band is replaced inconveniently due to heat aging failure. For this purpose, the silicon wafer ejection device of the utility model comprises a plurality of support rods and an elastic buffer structure, the support rods are arranged to be connectable to a cleaning tank, and when the silicon wafer basket is installed in the cleaning tank, the height position of the top end of the support rods is higher than the height position of the top end of the bottom rod of the silicon wafer basket for supporting the silicon wafer, so as to lift the silicon wafer on the bottom rod to separate from the bottom rod; the at least top part of the support rods is provided with the elastic buffer structure. The silicon wafer ejection device of the utility model can avoid scratches on the bottom of the silicon wafer, and at the same time, the silicon wafer is not polluted by residual water due to the installation of the rubber band on the bottom rod, and the problem that the rubber band is replaced inconveniently due to heat aging failure is also avoided.
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