Packaging structure

By exposing the back of the chip directly to the plastic package, the heat dissipation problem of the package structure is solved, achieving a package structure design that is efficient in heat dissipation, reduces costs, and improves reliability.

CN224482071UActive Publication Date: 2026-07-10SUZHOU FOREX INFORMATION TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SUZHOU FOREX INFORMATION TECH CO LTD
Filing Date
2025-04-08
Publication Date
2026-07-10

AI Technical Summary

Technical Problem

Existing packaging structures cannot meet the heat dissipation requirements of high-power products, affecting product lifespan and operational reliability.

Method used

The back of the chip is directly exposed outside the molded body, and heat is conducted directly to the air through the back of the chip, avoiding conduction through the adhesive layer and the die carrier. It also eliminates the need for DAF and epoxy resin adhesive to bond the chip, and the lead frame does not need to be recessed into the die carrier, simplifying the structure to improve heat dissipation.

Benefits of technology

It improves the heat dissipation of the packaging structure, reduces manufacturing costs, increases the strength and reliability of the chip, simplifies the manufacturing cycle and cost of the lead frame, and supports multi-chip stacking.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a kind of packaging structure.The packaging structure includes chip, lead frame and plastic package, chip has opposite front and back, lead frame includes pin, the pad of the front of chip is electrically connected with the pin by bonding wire, plastic package plastic package chip, lead frame and bonding wire;Wherein, the back of chip is exposed outside plastic package, so that the heat generated by chip can be directly conducted to air and does not need to be conducted by lead frame and plastic package / DAF, help to improve the heat dissipation effect of packaging structure.
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