Ceramic package inner and outer electrical interconnect structure

Abstract

This utility model relates to the field of ceramic packaging technology and discloses a ceramic packaging internal and external electrical interconnection structure, including a ceramic substrate, a metal frame, a cover plate, a metal circuit layer, a chip, a metal through-hole, a U-shaped interconnect, an external lead, and an internal lead. The metal through-hole is disposed on the ceramic substrate, and the U-shaped interconnect passes through the metal through-hole. The chip is mounted on the metal circuit layer, and the chip and the metal circuit layer are located inside the metal frame. The metal frame is used to cover the chip and the metal circuit layer and is sealed by the cover plate. In this utility model, the U-shaped interconnect passes through the metal through-hole, and then the internal lead of the metal frame connects to one end of the U-shaped interconnect and the chip, while the other end of the U-shaped interconnect is powered through the external lead. This achieves the effect of internal and external electrical interconnection through the U-shaped structure, solving the problem of traditional ceramic packaging requiring external holes for wiring and improving the integrity of the ceramic packaging.

Description

Technical Field

[0001] This utility model relates to the field of ceramic packaging technology, and in particular to an internal and external electrical interconnection structure for ceramic packaging. Background Technology

[0002] In the field of integrated circuit packaging technology, ceramic packaging is widely used in high-reliability electronic devices due to its excellent hermeticity, insulation, and thermal stability. To ensure stable electrical connections during chip operation, the packaging structure typically needs to achieve reliable electrical interconnection between the internal chip and external circuitry. Therefore, the design and implementation of the internal and external electrical interconnection structure is a key technical aspect of ceramic packaging.

[0003] In existing technologies, ceramic packaging often employs wire bonding, solder pads, or metallized vias to achieve internal and external electrical connections. Typically, metal vias or electrode contact surfaces are machined into the ceramic body, and metal leads or soldered structures are then led out. External connecting wires are then used to connect to power supplies or control circuits, thus completing the internal and external electrical interconnection. While this approach fulfills basic functional requirements, it suffers from structural complexity and manufacturing limitations.

[0004] However, existing ceramic packaging structures typically require additional connection holes or electrode channels on the outside of the package for connecting power supply leads or signal lines. This not only compromises the overall sealing of the ceramic package and reduces its hermeticity, but also increases manufacturing difficulty and process complexity, hindering the achievement of highly integrated monolithic packaging. Therefore, how to achieve an internal and external electrical interconnection structure for ceramic packages that eliminates the need for external openings and enables electrical connections within the package while maintaining overall structural integrity has become a pressing technical problem in this field. Utility Model Content

[0005] To overcome the above shortcomings, this utility model provides an internal and external electrical interconnection structure for ceramic packaging, which aims to improve the problem that traditional ceramic packaging requires external openings for wiring.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a ceramic package internal and external electrical interconnection structure, comprising: a ceramic substrate, a metal frame, a cover plate, a metal circuit layer, a chip, a metal through-hole, a U-shaped interconnect, an external lead, and an internal lead;

[0007] The metal through-hole is disposed on the ceramic substrate, and the U-shaped interconnect is disposed in the metal through-hole;

[0008] The chip is mounted on the metal circuit layer, and the chip and the metal circuit layer are located inside the metal frame;

[0009] The metal frame is used to cover the chip and the metal circuit layer, and is sealed by the cover plate;

[0010] One end of the U-shaped interconnect is located inside the metal frame and is electrically connected to the chip through the inner lead, while the other end is connected to the external circuit through the outer lead, thereby realizing the electrical interconnection between the chip and the external circuit.

[0011] As a further description of the above technical solution:

[0012] The U-shaped interconnect is a metal wire with an inverted U-shaped structure. Its two ends are located on both sides of the metal frame and pass through the metal through hole to form an electrical lead-out path.

[0013] As a further description of the above technical solution:

[0014] The inner lead is a metal bonding wire used to connect the U-shaped interconnect to the chip electrode pin.

[0015] As a further description of the above technical solution:

[0016] The metal frame is a graphic electroplated metal frame or a Kovar alloy frame, and is sealed and welded to the ceramic substrate to form a closed cavity to accommodate the chip and the metal circuit layer.

[0017] As a further description of the above technical solution:

[0018] The cover plate covers the top of the metal frame and is sealed to it to improve the airtightness and mechanical strength of the overall structure.

[0019] As a further description of the above technical solution:

[0020] The external lead is connected to the exposed end of the U-shaped interconnect to enable the conduction between the external power supply or signal and the chip.

[0021] As a further description of the above technical solution:

[0022] The cover plate is made of metal or ceramic.

[0023] This utility model has the following beneficial effects:

[0024] In this invention, a U-shaped interconnect is first inserted through a metal through-hole. Then, an inner lead is inserted inside the metal frame to connect one end of the U-shaped interconnect to the chip. The other end of the U-shaped interconnect is connected to the chip via an outer lead. This achieves the effect of interconnecting internal and external electrical components through the U-shaped structure, ensuring the integrity of the package. It solves the problem of traditional ceramic packaging requiring external holes for wiring and improves the integrity of the ceramic package. Attached Figure Description

[0025] Figure 1 This is a perspective view of an internal and external electrical interconnection structure for a ceramic package proposed in this utility model;

[0026] Figure 2 This is a schematic diagram of the internal structure of the metal frame of a ceramic encapsulation internal and external electrical interconnection structure proposed in this utility model.

[0027] Figure 3 This is a schematic diagram of the internal structure of a ceramic substrate for an internal and external electrical interconnection structure of ceramic packaging proposed in this utility model;

[0028] Figure 4 This is a plan view of a U-shaped interconnection line in a ceramic package internal and external electrical interconnection structure proposed in this utility model.

[0029] Legend:

[0030] 1. Ceramic substrate; 2. Metal frame; 3. Cover plate; 4. Metal circuit layer; 5. Chip; 6. Metal via; 7. U-shaped interconnect; 8. External lead; 9. Internal lead. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0032] Reference Figures 1-3 The present invention provides an embodiment of a ceramic package internal and external electrical interconnection structure, comprising: a ceramic substrate 1, a metal frame 2, a cover plate 3, a metal circuit layer 4, a chip 5, a metal through hole 6, a U-shaped interconnect 7, an external lead 8, and an internal lead 9.

[0033] The ceramic substrate 1 is used as a base for structural support and packaging. It has good insulation performance and thermal stability and is suitable for high reliability scenarios. The metal through-hole 6 is set on the ceramic substrate 1 to build internal and external electrical connection channels to ensure structural integrity and airtightness when the electrical connection passes through the ceramic substrate 1. The U-shaped interconnect 7 is passed through the metal through-hole 6 to realize the conduction of electrical signals or electrical energy between the two sides of the ceramic substrate 1.

[0034] Chip 5 is mounted on metal circuit layer 4. As a core functional component, chip 5 is used to perform specific signal processing or control functions. Metal circuit layer 4 provides physical support and thermal conductivity for chip 5 and helps stabilize the position of chip 5. Chip 5 and metal circuit layer 4 are located inside metal frame 2 and are protected by encapsulation to avoid interference from the external environment.

[0035] The metal frame 2 is used to cover the chip 5 and the metal circuit layer 4. Its main function is to form a closed protective structure to block external contaminants such as moisture and particles from entering. It is also sealed by the cover plate 3 to further enhance the overall strength and sealing performance of the package and improve the reliability and durability of the device.

[0036] One end of the U-shaped interconnect 7 is located inside the metal frame 2 and is electrically connected to the chip 5 through the inner lead 9, which is used to construct a conductive path from the chip electrode to the inside of the metal via. The other end is connected to the external circuit through the outer lead 8 to realize the transmission of signals or electrical energy from the outside to the chip 5, thereby realizing the electrical interconnection between the chip 5 and the external circuit. The U-shaped interconnect 7 is a metal wire with good conductivity. It has an inverted U-shaped structure, with its two ends located on both sides of the ceramic substrate 1 and passing through the metal via 6 to form an electrical lead-out path, which is used to realize a highly reliable internal and external electrical connection.

[0037] The inner lead 9 is a metal bonding wire used to connect the U-shaped interconnect 7 to the electrode pins of the chip 5, ensuring stable signal transmission and avoiding poor contact caused by thermal expansion and contraction; the metal frame 2 is made of ceramic material, which has excellent insulation and airtight performance, and is sealed to the ceramic substrate 1 to form a closed cavity to accommodate the chip 5 and the metal circuit layer 4, and is used to isolate the influence of the external environment.

[0038] The cover plate 3 covers the top of the metal frame 2 and is sealed to it, which improves the overall airtightness and mechanical strength of the package and helps to ensure the long-term stable working environment of the chip. The external lead 8 is connected to the exposed end of the U-shaped interconnect 7 to form an electrical path from the external circuit to the inside of the package, thereby realizing the conduction between the external power supply or signal and the chip 5, and improving the overall integrity and practicality of the package structure.

[0039] Working principle: When using this ceramic package internal and external electrical interconnection structure, multiple metal through holes 6 are first opened in the ceramic substrate 1. Then, the chip 5 is fixed on the metal circuit layer 4. A metal frame 2 is set on the outer wall of the chip 5 for encapsulation. Then, the top of the metal frame 2 is sealed and protected by a cover plate 3. When the chip 5 needs to be connected to external wires for power supply, a U-shaped interconnect 7 is inserted in the metal through hole 6. Then, the inside of the metal frame 2 is connected to the chip 5 through an inner lead 9 and one end of the U-shaped interconnect 7. The other end of the U-shaped interconnect 7 is connected to the chip 5 through an outer lead 8 for power supply. This achieves the effect of U-shaped structure to realize internal and external electrical interconnection and ensure the integrity of the package.

[0040] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A ceramic package internal and external electrical interconnection structure, characterized in that, include: Ceramic substrate (1), metal frame (2), cover plate (3), metal circuit layer (4), chip (5), metal via (6), U-shaped interconnect (7), external lead (8) and internal lead (9); The metal through hole (6) is disposed on the ceramic substrate (1), and the U-shaped interconnect (7) passes through the metal through hole (6); The chip (5) is mounted on the metal circuit layer (4), and the chip (5) and the metal circuit layer (4) are located inside the metal frame (2); The metal frame (2) is used to cover the chip (5) and the metal circuit layer (4), and is sealed by the cover plate (3); One end of the U-shaped interconnect (7) is located inside the metal frame (2) and is electrically connected to the chip (5) through the inner lead (9); the other end is connected to the external circuit through the outer lead (8), thereby realizing the electrical interconnection between the chip (5) and the external circuit.

2. The ceramic package internal and external electrical interconnection structure according to claim 1, characterized in that: The U-shaped interconnect (7) is a metal connecting line with an inverted U-shaped structure. Its two ends are located on the inner and outer sides of the metal frame (2) respectively, and it passes through the metal through hole (6) to form an electrical lead-out path.

3. The ceramic package internal and external electrical interconnection structure according to claim 1, characterized in that: The inner lead (9) is a metal bonding wire used to realize the electrical connection between the U-shaped interconnect (7) and the electrode pin of the chip (5).

4. The ceramic package internal and external electrical interconnection structure according to claim 1, characterized in that: The metal frame (2) is a graphic electroplated metal frame or a Kovar alloy frame, and is sealed and welded to the ceramic substrate (1) to form a closed cavity to accommodate the chip (5) and the metal circuit layer (4).

5. The internal and external electrical interconnection structure of a ceramic package according to claim 1, characterized in that: The cover plate (3) covers the top of the metal frame (2) and is sealed to it to improve the airtightness and mechanical strength of the overall structure.

6. The ceramic package internal and external electrical interconnection structure according to claim 1, characterized in that: The external lead (8) is connected to the exposed end of the U-shaped interconnect (7) to enable the conduction between the external power supply or signal and the chip (5).

7. The ceramic package internal and external electrical interconnection structure according to claim 1, characterized in that: The cover plate (3) is made of metal or ceramic.

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