Single-disk protection bottom plate and communication single-disk
By designing a mounting area and sub-insulating pads on a single-panel protective base plate, the problem of balancing heat dissipation and insulation under different PCB layouts is solved, thereby improving the versatility and heat dissipation efficiency of the protective base plate.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- FIBERHOME TELECOMMUNICATION TECHNOLOGIES CO LTD
- Filing Date
- 2025-07-31
- Publication Date
- 2026-07-14
AI Technical Summary
Under different PCB layouts, existing technologies require the use of insulating pads of different sizes to balance heat dissipation and insulation requirements, resulting in poor versatility of the protective base plate.
Design a single-disc protective base plate with a bonding area on the side facing the chip. The main insulating pad includes multiple sub-insulating pads with the same size as the bonding area. The size of the bonding area is configured to include the projection of the chip in any layout. By tearing the sub-insulating pads, a hollow groove is formed to adapt to changes in the chip position, achieving both heat dissipation and insulation performance.
It achieves the goal of eliminating the need to replace the insulating pad under different PCB layouts, balancing heat dissipation and insulation performance, improving the versatility of the protective base plate, adapting to changes in chip position, and improving heat dissipation efficiency.
Smart Images
Figure CN224503798U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of single-disc technology for communication equipment, and in particular to a single-disc protective base plate and a communication single-disc. Background Technology
[0002] With the gradual increase in power consumption of single-disk chips in the communications industry in recent years, the heat dissipation bottleneck of single-disk main chips has become prominent.
[0003] The width of the slots on a single communication chip tray is limited, restricting the height of the heatsink on the component side. Increasing the length and width of the heatsink negatively impacts the PCB layout. Generally, to address the heat dissipation bottleneck of the main chip, it is necessary to add an additional heat conduction path for the main chip and improve the heat dissipation efficiency of the main chip on a single tray. Typically, thermal pads can be added to the PCB soldering surface at the chip location, and a larger heat dissipation area on the protective base plate can be used to assist in heat dissipation; however, the following problems exist:
[0004] Due to the PCB layout requirements, the chip position is somewhat uncertain, so different PCB layouts result in different placement positions for thermal pads. In addition, considering the placement and electrical insulation of components on the PCB soldering side (the side near the protective base plate), an insulating pad is usually needed between the PCB and the metal base plate to improve the utilization rate of the PCB area. This means that while ensuring the heat dissipation effect of chips with different PCB layouts, insulating pads of different sizes need to be set to balance heat dissipation and insulation requirements. Summary of the Invention
[0005] This application provides a single-disc protective base plate and a communication single disk to solve the problem in related technologies that, in order to ensure the heat dissipation effect of chips with different PCB layouts, it is necessary to set up insulating pads of different sizes to balance heat dissipation and insulation requirements.
[0006] Firstly, a single-disc protective base plate is provided, comprising:
[0007] The protective base plate has an attachment area on the side facing the chip.
[0008] A main insulating pad, which includes multiple sub-insulating pads; the size of the main insulating pad is equal to the size of the application area, and it is applied to the application area in an overlapping manner.
[0009] The size of the posting area is configured such that the projection of the chip onto the protective substrate in any layout is located within the posting area.
[0010] In some embodiments, both the bonding area and the sub-insulating pad are rectangular;
[0011] The length of the sub-insulating pad is equal to the width of the posting area, and the length of the posting area is N times the width of the sub-insulating pad.
[0012] In some embodiments, the main insulating pad is provided with a plurality of vertically die-cut grooves evenly spaced along its length; the length of the vertically die-cut grooves is equal to the width of the bonding area; the depth of the vertically die-cut grooves is less than the thickness of the main insulating pad.
[0013] In some embodiments, both the bonding area and the sub-insulating pad are rectangular;
[0014] The width of the posting area is N times the length of the sub-insulating pad, and the length of the posting area is N times the width of the sub-insulating pad.
[0015] In some embodiments, the main insulating pad is provided with a plurality of vertically spaced die-cut grooves evenly spaced along its length and transversely spaced die-cut grooves evenly spaced along its width; the vertical and transverse die-cut grooves are arranged perpendicularly and alternately.
[0016] The length of the vertical die-cut groove is equal to the width of the pasting area, and the length of the horizontal die-cut groove is equal to the length of the pasting area; the depth of the vertical die-cut groove is less than the thickness of the main insulating pad.
[0017] In some embodiments, each of the sub-insulating pads is provided with a numbered mark; each chip layout position corresponds to at least two numbered marks.
[0018] In some embodiments, the affixing area is a rectangular groove, the depth of which is less than the thickness of the single-disc protective base plate.
[0019] In some embodiments, the protective base plate is made of any one of aluminum alloy, copper, silver, or gold.
[0020] Secondly, a communication single disk is provided, which includes:
[0021] A single-pane PCBA with a chip on it; a first thermal pad is provided on the back of the single-pane PCBA at the position corresponding to the chip.
[0022] A single-pan protective base plate is connected to the bottom of the single-pan PCBA; the main insulating pad of the single-pan protective base plate has a hollow area corresponding to the position of the first thermal pad;
[0023] The heat sink has a second thermal pad at its bottom, which is in contact with the top surface of the chip.
[0024] Secondly, a communication single disk is provided, which includes:
[0025] A single-disk PCBA containing chips;
[0026] A single-pan protective base plate is connected to the bottom of the single-pan PCBA;
[0027] The heat sink has a second thermal pad at its bottom, which is in contact with the top surface of the chip.
[0028] The beneficial effects of the technical solution provided in this application include:
[0029] This application provides a single-disk protective base plate and a communication single disk. The protective base plate has a mounting area on the side facing the chip. The main insulating pad includes multiple sub-insulating pads. The size of the main insulating pad is equal to the size of the mounting area and overlaps with it. The size of the mounting area is configured such that the projection of the chip onto the protective base plate in any layout is located within the mounting area. Through this configuration, the sub-insulating pads can be torn with corresponding slots according to the chip layout, allowing the first thermal pad to transfer heat to the protective base plate. This eliminates the need for different insulating pads, achieving universality of the protective base plate while also meeting the performance requirements of heat dissipation and insulation. For low-power boards that do not require a protective base plate for heat dissipation, the protective base plate of this application can still be used, without requiring slotting of the insulating pads during single-disk assembly, further improving the versatility of the protective base plate. Attached Figure Description
[0030] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0031] Figure 1 This is a schematic diagram of the overall structure of a communication single disk provided in related technologies;
[0032] Figure 2 An exploded view of a communication disk provided in related technologies;
[0033] Figure 3 An exploded view of a communication disk provided in an embodiment of this application;
[0034] Figure 4 This is a schematic diagram of the state of the single-disc protective base plate before the insulation pad is torn off, as provided in the embodiments of this application.
[0035] Figure 5 A schematic diagram showing the state in which the single-disc protective base plate forms a hollowed-out state after the insulating pad of the tear is removed, as provided in the embodiment of this application.
[0036] Figure 6 This is a comparative schematic diagram of the two arrangements of sub-insulating pads provided in the embodiments of this application.
[0037] In the diagram: 1. Protective base plate; 100. Posting area; 2. Main insulating pad; 200. Sub-insulating pad; 3. Chip; 4. Single-panel PCBA; 5. First thermal pad; 6. Heat sink; 7. Second thermal pad; 8. Panel assembly. Detailed Implementation
[0038] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0039] It should be understood in connection with this application that:
[0040] The width of the slots on a single communication chip tray is limited, restricting the height of the heatsink on the component side. Increasing the length and width of the heatsink also negatively impacts the PCB layout. To address the heat dissipation bottleneck of the main chip, additional heat conduction paths are needed to improve the heat dissipation efficiency of the main chip on a single tray. Typically, thermal pads can be added to the PCB soldering surface at the chip location, and a larger heat dissipation area on the protective base plate can assist in heat dissipation. However, due to PCB layout requirements, the chip location has a degree of uncertainty.
[0041] Additionally, considering the placement and electrical insulation of components on the PCB soldering side (the side closest to the protective base plate), an insulating pad is usually required between the PCB and the metal base plate to improve the PCB layout area utilization (see reference). Figure 1 and Figure 2 (As shown) Based on the requirement of the new main chip heat conduction path, and considering the electrical insulation and high thermal resistance of the insulating pad, it is necessary to ensure that the corresponding position of the PCBA main chip insulating pad is hollowed out in order to form an efficient heat dissipation channel.
[0042] However, due to differences in PCB layout, changes in chip position will lead to changes in the placement of the thermal pad on the protective base plate. Consequently, the cutout position and size of the corresponding insulating pad will also change, requiring multiple insulating pads, which contradicts the material normalization requirements.
[0043] Therefore, adding a new heat conduction path for the main chip also requires addressing the issue of how to adapt to changes in the chip's position and the impact of the insulating pad. This necessitates an innovative protective baseplate structure to overcome the conflict between the main chip's heat dissipation bottleneck and the standardized design of the protective baseplate.
[0044] Furthermore, the protective baseplate of this technical solution can still be used for low-power boards that do not require auxiliary heat dissipation, which is also an issue that needs to be considered.
[0045] In the above Figure 1 and Figure 2 In the panel assembly 8, the single-panel provides functions such as a locking mechanism, external connection interface, and LED indicator. The locking mechanism facilitates panel insertion and removal, acts as a handle, and provides a locking and securing function after the panel is installed. For communication equipment panels, the external connection interface typically includes fiber optic output and RJ45 network management interface. The LED indicator displays the panel's operating status, such as whether it is working or displaying an alarm. The protective base plate 1 provides bottom protection during panel insertion and removal, protecting the electronic components and connectors on the back of the PCBA from bumps and impacts that could cause malfunctions. In this technical solution, the protective base plate, in addition to its protective function, also provides auxiliary heat dissipation for the main chip, essentially acting as another heat sink on the back of the PCBA. The single-panel PCBA 4 contains the PCB, electronic components, connectors, and some structural components for guidance or positioning; it is the primary carrier for the single-panel's hardware functionality. The second thermal pad 7 is typically installed between the chip and other high-heat-generating components and the heat sink to fill the gap, reduce thermal resistance, and improve heat conduction efficiency.
[0046] Heat sink 6 is placed above the main chip on the front of the PCBA. The heat from the chip is conducted to the heat sink via the thermal pad. Since the aluminum heat sink has high thermal conductivity, most of the heat generated by the main chip during operation can be carried away by airflow on the surface of the heat sink, thus ensuring the long-term reliable operation of the chip.
[0047] This application provides a single-disc protective base plate and a communication single disk to solve the problem in related technologies that, in order to ensure the heat dissipation effect of chips with different PCB layouts, it is necessary to set up insulating pads of different sizes to balance heat dissipation and insulation requirements.
[0048] Please see Figures 3-6 A single-disc protective base plate, comprising:
[0049] The protective base plate 1 has a bonding area 100 on the side facing the chip;
[0050] The main insulating pad 2 includes a plurality of sub-insulating pads 200; the size of the main insulating pad 2 is equal to the size of the application area 100, and it is applied to the application area 100.
[0051] The dimensions of the posting area 100 are configured such that the projection of the chip 3 onto the protective base plate 1 in any layout is located within the posting area 100.
[0052] By setting the sub-insulating pad 200 as described above, corresponding perforations can be torn out according to the layout position of the chip 3, so that the first thermal pad 5 can transfer heat to the protective base plate 1. Thus, it is not necessary to set different insulating pads to achieve the universality of the protective base plate 1, while also meeting the performance requirements of heat dissipation and insulation. For low-power boards that do not require the protective base plate to assist in heat dissipation, the protective base plate of this application can still be used. In the single-disk assembly process, the insulating pads are not perforated, which further improves the universality of the protective base plate 1.
[0053] The above process of tearing the corresponding sub-insulating pad 200 according to the layout position of chip 3 can be used as a reference. Figure 4 and Figure 5 The changing state is shown.
[0054] In some preferred embodiments, the relationship between the posting area 100 and the sub-insulating pad 200 is further explained:
[0055] The first approach involves statistically analyzing and planning the layout of the main chip on a single disk, setting the X-axis step size to 16mm and the Y-axis step size to 24mm, to achieve a reference... Figure 6 The protective base plate shown in Figure A has a standardized structure:
[0056] Both the posting area 100 and the sub-insulating pad 200 are rectangular;
[0057] The length of the sub-insulating pad 200 is equal to the width of the posting area 100, and the length of the posting area 100 is N times the width of the sub-insulating pad 200.
[0058] The main insulating pad 2 has multiple vertical die-cut grooves evenly spaced along its length; the length of the vertical die-cut grooves is equal to the width of the application area 100; the depth of the vertical die-cut grooves is less than the thickness of the main insulating pad 2.
[0059] The second form, see reference. Figure 6 B in the middle:
[0060] Both the posting area 100 and the sub-insulating pad 200 are rectangular;
[0061] The width of the posting area 100 is N times the length of the sub-insulating pad 200, and the length of the posting area 100 is N times the width of the sub-insulating pad 200.
[0062] The main insulating pad 2 is provided with multiple vertical die-cutting grooves evenly spaced along its length and horizontal die-cutting grooves evenly spaced along its width; the vertical die-cutting grooves and the horizontal die-cutting grooves are arranged perpendicularly and alternately.
[0063] The length of the vertical die-cut groove is equal to the width of the application area 100, and the length of the horizontal die-cut groove is equal to the length of the application area 100; the depth of the vertical die-cut groove is less than the thickness of the main insulating pad 2.
[0064] In the second approach, when the hollowed-out area of the insulating pad is expanded into a two-dimensional grid structure, the protective base plate can adapt to bidirectional changes in the chip layout in the X or Y direction, further improving the versatility of materials.
[0065] The main insulating pad 2 is usually die-cut from 0.25mm thick PC sheet. After the main insulating pad 2 is cut into a dotted line structure corresponding to the sub-insulating pad 200, the hollow area can be manually removed before the single tray is assembled; the single tray without bottom heat dissipation does not need to be treated with insulating pads.
[0066] Each sub-insulating pad 200 is marked with a number; each chip 3 layout position corresponds to at least two numbered marks; the numbering of the sub-insulating pad 200 distinguishes the corresponding positions of different single disks, which facilitates the tearing and formation of different hollow structures during the single disk assembly process, thereby adapting to the differences in the position of the main chip of different single disks.
[0067] In some preferred embodiments, the affixing area 100 is a rectangular groove, the depth of which is less than the thickness of the single-plate protective base. The rectangular groove facilitates the affixing and positioning of the main insulating pad 2. Of course, the material of the protective base 1 can be any of aluminum alloy, copper, silver, or gold, and can be selected as needed.
[0068] This application also proposes a communication disk, which includes:
[0069] A single-pan PCBA4 has a chip 3 on it; a first thermal pad 5 is provided on the back of the single-pan PCBA4 at the position corresponding to the chip 3.
[0070] A single-pan protective base plate is connected to the bottom of the single-pan PCBA4; the main insulating pad 2 of the single-pan protective base plate has a hollow area corresponding to the position of the first thermal pad 5;
[0071] The heat sink 6 has a second thermal pad 7 at its bottom, which is in contact with the top surface of the chip.
[0072] This application also proposes a communication disk, which includes:
[0073] A single-disk PCBA4 has a chip 3 on it;
[0074] A single-pan protective base plate is attached to the bottom of the single-pan PCBA4;
[0075] The heat sink 6 has a second thermal pad 7 at its bottom, which is in contact with the top surface of the chip.
[0076] The above explains that both the high-power and low-power boards use the same single-disk protection baseplate.
[0077] For high-power boards, thermal pads are added to the chip soldering surfaces of single-board PCBA4 to form a heat dissipation channel between the chip, thermal pad, and protective base plate sheet metal structure, achieving auxiliary heat dissipation for the main chip. By using both main and auxiliary heat dissipation channels, the heat dissipation efficiency of the main chip is improved, overcoming the single-board heat dissipation bottleneck.
[0078] The technical solution of this application can improve the heat dissipation efficiency of the chip and solve the heat dissipation bottleneck by using the protective base plate 1 to assist in heat dissipation. At the same time, due to the innovative hollow structure of the insulating pad of the protective base plate 1, it can adapt to the changes in the layout position of the chip 3. For low power boards that do not require the protective base plate to assist in heat dissipation, the protective base plate of this technical solution can still be used. In the single-disk assembly process, the insulating pad hollowing process is not required. Therefore, the protective base plate introduced in this technical solution has strong versatility.
[0079] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.
[0080] It should be noted that in this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0081] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.
Claims
1. A single-disc protective base plate, characterized in that, It includes: The protective base plate (1) has a bonding area (100) on the side facing the chip. The main insulating pad (2) includes a plurality of sub-insulating pads (200); the main insulating pad (2) is equal in size to the bonding area (100) and is bonded to the bonding area (100); The size of the posting area (100) is configured such that the projection of the chip (3) onto the protective base plate (1) in any layout is located within the posting area (100).
2. The single-disc protective base plate as described in claim 1, characterized in that: Both the posting area (100) and the sub-insulating pad (200) are rectangular; The length of the sub-insulating pad (200) is equal to the width of the posting area (100), and the length of the posting area (100) is N times the width of the sub-insulating pad (200).
3. The single-disc protective base plate as described in claim 2, characterized in that: The main insulating pad (2) is provided with a plurality of vertical die-cut grooves evenly spaced along its length; the length of the vertical die-cut grooves is equal to the width of the posting area (100); the depth of the vertical die-cut grooves is less than the thickness of the main insulating pad (2).
4. The single-disc protective base plate as described in claim 1, characterized in that: Both the posting area (100) and the sub-insulating pad (200) are rectangular; The width of the posting area (100) is N times the length of the sub-insulating pad (200), and the length of the posting area (100) is N times the width of the sub-insulating pad (200).
5. The single-disc protective base plate as described in claim 4, characterized in that: The main insulating pad (2) is provided with a plurality of vertical die-cutting grooves evenly spaced along its length and horizontal die-cutting grooves evenly spaced along its width; the vertical die-cutting grooves and the horizontal die-cutting grooves are arranged perpendicularly and alternately. The length of the vertical die-cut groove is equal to the width of the posting area (100), and the length of the horizontal die-cut groove is equal to the length of the posting area (100); the depth of the vertical die-cut groove is less than the thickness of the main insulating pad (2).
6. The single-disc protective base plate as described in claim 2 or 4, characterized in that: Each of the sub-insulating pads (200) is marked with a number; each chip (3) layout position corresponds to at least two number marks.
7. The single-disc protective base plate as described in claim 1, characterized in that: The posting area (100) is a rectangular groove, and the depth of the rectangular groove is less than the thickness of the single-plate protective base plate.
8. The single-disc protective base plate as described in claim 1, characterized in that: The protective base plate (1) is made of any one of aluminum alloy, copper, silver, or gold.
9. A communication single disk, characterized in that, It includes: A single-disk PCBA (4) has a chip (3) on it; a first thermal pad (5) is provided on the back of the single-disk PCBA (4) at the position corresponding to the chip (3); The single-disc protective base plate as described in claim 1 is connected to the bottom of the single-disc PCBA (4); the main insulating pad (2) of the single-disc protective base plate is provided with a hollow area corresponding to the position of the first heat-conducting pad (5); The heat sink (6) has a second thermal pad (7) at its bottom, which is in contact with the top surface of the chip.
10. A communication single disk, characterized in that, It includes: A single-disk PCBA (4) has a chip (3) on it. The single-disc protective base plate as described in claim 1 is connected to the bottom of the single-disc PCBA (4); The heat sink (6) has a second thermal pad (7) at its bottom, which is in contact with the top surface of the chip.