A far-infrared graphene frequency conversion fast-heating ceramic tile

Abstract

This utility model discloses a far-infrared graphene frequency conversion fast-heating ceramic tile, belonging to the field of decorative floor tile technology. It includes a tile surface layer and a tile bottom layer. The key feature is that a heat-conducting layer, a graphene heating chip layer, and a heat-insulating layer are sequentially arranged between the tile surface layer and the tile bottom layer from top to bottom. A conductive connecting plate is fixedly arranged on one side of the graphene heating chip layer, and a conductive connecting groove of the same size as the conductive connecting plate is opened on the other side. The center lines of the conductive connecting plate and the conductive connecting groove are at the same horizontal height. Through the high-efficiency heating characteristics of graphene material and the multi-layer composite structure design, a heating effect of "rapid heating, uniform heat conduction, and low energy consumption" is achieved. Simultaneously, the electrical connection structure during splicing is optimized, and with the cooperation of intelligent control components, the usage requirements of "convenient installation, safe and reliable, and intelligent control" are met, comprehensively improving the practicality and market competitiveness of the heating ceramic tile.

Description

Technical Field

[0001] This invention relates to a far-infrared graphene variable frequency fast-heating ceramic tile, specifically in the field of far-infrared graphene variable frequency fast-heating ceramic tile technology. Background Technology

[0002] Traditional ceramic tiles only serve decorative and floor protection functions, and their limited functionality increasingly fails to meet the complex demands of modern homes for both comfort and functionality. While current heated ceramic tiles on the market provide basic heating, they generally suffer from several key drawbacks: first, they use traditional heating elements, resulting in low heating efficiency and uneven heat distribution, easily leading to localized overheating or heating blind spots; second, the complex electrical connections during tile assembly require additional wiring and have poor sealing, posing safety hazards; third, inadequate insulation design leads to significant heat loss to the floor substrate, resulting in high energy waste; and fourth, the lack of intelligent control components prevents precise temperature control and status monitoring. To address these issues, this invention proposes a far-infrared graphene variable frequency fast-heating ceramic tile that integrates high-efficiency heating, uniform heat conduction, convenient assembly, and intelligent control, thereby overcoming the shortcomings of existing technologies. Utility Model Content

[0003] The technical problem this invention aims to solve is to overcome existing defects and provide a far-infrared graphene variable frequency fast-heating ceramic tile. Through the high-efficiency heating characteristics of graphene material and the multi-layer composite structure design, it achieves a heating effect of "rapid heating, uniform heat conduction, and low energy consumption." At the same time, it optimizes the electrical connection structure during splicing and, in conjunction with intelligent control components, meets the usage requirements of "convenient installation, safety and reliability, and intelligent control," comprehensively improving the practicality and market competitiveness of the heating ceramic tile.

[0004] To achieve the above objectives, this utility model provides the following technical solution: A far-infrared graphene frequency conversion fast-heating ceramic tile includes a ceramic tile surface layer and a ceramic tile bottom layer, characterized in that: a heat-conducting layer, a graphene heating chip layer and a heat-insulating layer are arranged sequentially from top to bottom between the ceramic tile surface layer and the ceramic tile bottom layer; a conductive connecting plate is fixedly arranged on one side of the graphene heating chip layer, and a conductive connecting groove adapted to the size of the conductive connecting plate is opened on the other side, and the center lines of the conductive connecting plate and the conductive connecting groove are at the same horizontal height.

[0005] As a preferred technical solution of this utility model, the heat-conducting layer is a three-layer composite structure, consisting of a first graphene heat-conducting layer, a heat-insulating layer, and a second graphene heat-conducting layer from top to bottom; wherein the upper surface of the first graphene heat-conducting layer is closely attached to the lower surface of the ceramic tile surface layer, and the lower surface of the second graphene heat-conducting layer is seamlessly connected to the upper surface of the graphene heating chip layer.

[0006] As a preferred technical solution of this utility model, it also includes an end filler block for sealing and controlling the end of the tile laying; the end filler block has an integrally formed conductive connecting plate two on the side near the tile, the structural dimensions of the conductive connecting plate two are the same as those of the conductive connecting plate one, and it is used to adapt and connect with the conductive connecting groove one of the graphene heating chip layer of the adjacent tile; the end filler block has a signal processing module, a switch module and a data transmission module embedded inside, and the three modules are electrically connected to the conductive connecting plate two through wires to realize real-time monitoring and frequency conversion control of the heating status of the tile.

[0007] As a preferred technical solution of this utility model, it also includes a bottom support block, which is fixedly connected to the lower surface of the end filling block, and the height of the bottom support block is the same as the thickness of the bottom layer of the tile; a conductive connection groove 2 is provided on the side of the bottom support block near the adjacent tile, and the structural dimensions of the conductive connection groove 2 are the same as those of the conductive connection groove 1, and it can be selectively adapted and connected to the conductive connection plate 1 or the conductive connection plate 2 of the adjacent tile.

[0008] As a preferred technical solution of this utility model, the cross-sectional shape of the end filler block is perfectly matched with the cross-sectional shape of the end of the tile, and the material of the end filler block is flame-retardant polyurethane heat insulation material, and its overall thickness has an error of no more than ±.mm compared with the overall thickness of the tile.

[0009] As a preferred technical solution of this utility model, the heat insulation layer is made of high-density ceramic fiber material, with a thickness of 3-5mm, and the edge of the heat insulation layer extends 1-2mm beyond the edge of the bottom layer of the ceramic tile to form a sealed edge.

[0010] As a preferred embodiment of this utility model, both the first and second graphene thermal conductive layers are made of graphene thermal conductive film and glass fiber cloth composite, and both have a thickness of 2-4 mm; the insulation layer is made of closed-cell polyurethane insulation material with a thickness of 5-8 mm, and the insulation layer has uniformly distributed vacuum insulation microspheres with a diameter of 0.1-0.3 mm inside.

[0011] As a preferred embodiment of this utility model, the outer surface of the conductive connecting plate is covered with a 0.1-0.2mm thick silicone rubber insulating layer, and the inner wall of the conductive connecting groove is fitted with a fluororubber sealing layer; the connection between the conductive connecting plate and the conductive connecting groove is filled with a high-temperature resistant insulating sealing strip, which has a temperature resistance range of -40℃ to 200℃ and also has waterproof, insulating and buffering functions.

[0012] As a preferred technical solution of this utility model, the data transmission module supports Bluetooth or WiFi wireless communication protocols and can establish a connection with a mobile terminal or smart home control system; the signal processing module can collect the temperature data of the graphene heating chip layer in real time and feed the data back to the control terminal through the data transmission module, and the control terminal realizes frequency conversion power supply control of the graphene heating chip layer through the switching module.

[0013] Compared with the prior art, the beneficial effects of this utility model are: High-efficiency and energy-saving heating: The core of this utility model adopts a graphene heating chip layer with a heating efficiency of over 95%, saving 30%-40% energy compared to traditional heated ceramic tiles; combined with the rapid heat conduction characteristics of the double-layer graphene heat-conducting layer, the surface temperature of the tile can rise to 30-40℃ within 3-5 minutes after being powered on, and the temperature distribution uniformity error does not exceed ±2℃; the middle insulation layer and the bottom heat insulation layer form a "heat-locking" structure, effectively reducing heat loss to the ground and further improving energy utilization. Convenient and safe splicing: Through the standardized structural design of "conductive connecting plate + adapter connecting groove", no additional wiring is required when splicing tiles. Electrical connection and physical fixation can be completed simply by plugging and unplugging, improving installation efficiency by more than 50%. The multi-layer insulation and sealing design at the connection point can effectively prevent moisture infiltration and leakage risk, meeting the usage needs of humid environments such as bathrooms and kitchens. The cooperation between the bottom support block and the end filler block ensures the structural flatness and electrical connection integrity of the laying end, avoiding the end defects of traditional splicing. Intelligent frequency conversion control: The control module built into the end filler block can achieve precise temperature control (temperature adjustment accuracy ±1℃) and frequency conversion operation of the heated ceramic tile. When the ambient temperature reaches the set value, it automatically switches to low power heat preservation mode to further reduce energy consumption. Through wireless data transmission, users can monitor the temperature and operating status of the ceramic tile in real time via a mobile APP, and remotely control the switch and temperature adjustment, adapting to modern smart home scenarios. Durable and stable structure: The layers are connected by a combination of high-temperature thermally conductive adhesive and mechanical fixation, with an interlayer peel strength of ≥1.5MPa, ensuring that delamination does not occur during long-term use; the core components are made of flame-retardant and high-temperature resistant materials, which meet the GB4706.1-2005 standard "Safety of household and similar electrical appliances - Part 1: General requirements", with a service life of more than 10 years and low daily maintenance costs. Attached Figure Description

[0014] Figure 1 This is an overall front view of the present invention; Figure 2 This is a schematic diagram illustrating the installation and use of this utility model; Figure 3This is a front view of the end fittings used in conjunction with the end fittings during the laying and application of this utility model. Figure 4 This is a partial enlarged view of end A1 of this utility model; 1-Ceramic tile surface layer; 2-First graphene thermal conductive layer; 3-Insulation layer; 4-Second graphene thermal conductive layer; 5-Graphene heating chip layer; 6-Insulation layer; 7-Ceramic tile bottom layer; 8-Conductive connecting plate one; 9-Conductive connecting groove one; 10-End filling block; 11-Conductive connecting plate two; 12-Bottom support block; 13-Conductive connecting groove two. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0016] Please see Figure 1-4 This utility model provides a technical solution: A far-infrared graphene frequency conversion fast-heating ceramic tile: I. Component Preparation Tile surface layer 1 and tile bottom layer 7 It is made from conventional anti-slip and wear-resistant ceramic raw materials, and is produced through the following processes: batching (by weight, such as 30-40 parts feldspar, 25-35 parts quartz, 20-30 parts clay, etc.), ball milling (8-12 hours to achieve a fineness of 200-300 mesh), molding (using dry pressing process, pressure 3-5 MPa), and sintering (sintering temperature 1200-1300℃, heat preservation for 2-4 hours), ensuring a smooth surface and structural strength that meets the requirements for ground paving.

[0017] Graphene heating chip layer 5 Graphene films are prepared using chemical vapor deposition (CVD) and then composited with a flexible substrate (such as polyimide film). Heating circuit patterns are formed through photolithography and etching processes. The conductive connection plate 8 is made of copper-nickel alloy, with an anti-oxidation layer formed at the connection end through electroplating. It is then machined to fit the design dimensions and fixed to one side of the graphene heating chip layer 5 by welding or conductive adhesive bonding. The conductive connection groove 9 is machined on the other side of the chip layer using CNC milling, with a machining accuracy controlled within ±0.05mm to ensure precise fit with the conductive connection plate 8.

[0018] thermal conductive layer First graphene thermal conductive layer 2 and second graphene thermal conductive layer 4: Graphene thermal conductive film (thickness 0.1-0.2mm) and glass fiber cloth (thickness 0.2-0.3mm) are laminated with high-temperature resistant thermal conductive adhesive (such as silicone thermal conductive adhesive, thermal conductivity ≥0.8W / (m・K)). The lamination is carried out continuously at a speed of 3-5m / min on a laminating machine, and then cut to the required size (to match the surface and bottom layers of the ceramic tile), with the thickness controlled at 2-4mm.

[0019] Insulation layer 3: Closed-cell polyurethane insulation material is selected and prepared through a foaming process. The foaming temperature is controlled at 50-70℃ and the foaming time is 3-5 minutes to form uniformly distributed vacuum insulation microspheres with a diameter of 0.1-0.3mm inside. After preparation, it is cut into corresponding sizes with a thickness of 5-8mm to ensure its insulation performance and structural compatibility.

[0020] Insulation layer 6 Made of high-density ceramic fiber material, it is molded under a pressure of 2-4 MPa and a thickness of 3-5 mm. During the pressing process, the edge dimensions are precisely controlled so that it extends 1-2 mm beyond the edge of the bottom layer of the tile, forming a sealed edge. The edge smoothness can be adjusted later through grinding and other processes.

[0021] End filler block 10 and bottom support block 12 End filler block 10: Made of flame-retardant polyurethane thermal insulation material, manufactured through injection molding. The mold design strictly matches the cross-sectional shape of the tile end. After molding, precision testing is performed, and the overall thickness error with the overall tile thickness is controlled within ±0.5mm. Conductive connection plate 2 11 uses the same material and processing technology as conductive connection plate 1 8, and is integrally molded into the end filler block 10 near the tile side through embedded injection molding. The signal processing module uses a low-power, high-sensitivity temperature sensor (such as DS18B20, temperature range -55℃-125℃, accuracy ±0.5℃), the switching module uses a MOSFET power switch (such as IRF3205, withstand voltage 55V, on-resistance 8.0mΩ), and the data transmission module uses a wireless communication module supporting Bluetooth or WiFi protocols (such as ESP8266, featuring low power consumption and small size). The three modules are mounted on a pre-set circuit board inside the end filler block 10 through SMT surface mount technology, and then reliably electrically connected to conductive connection plate 2 11 via wires.

[0022] Bottom support block 12: Made of the same or compatible high-strength, wear-resistant material (such as ceramic matrix composite material) as the bottom layer of the tile 7, and manufactured by mechanical processing. Its height is the same as the thickness of the bottom layer of the tile 7. The conductive connection groove 2 13 is manufactured in the same way as the conductive connection groove 1 9 to ensure a compatible connection with the conductive connection plate of the adjacent tile.

[0023] II. Overall Assembly First, the upper surface of the first graphene thermal conductive layer 2 is tightly bonded to the lower surface of the tile surface layer 1 with high-temperature resistant thermal conductive adhesive (coating thickness 0.1-0.2mm), and then placed in a constant temperature drying oven (temperature 60-80℃) for 1-2 hours to ensure a firm bond.

[0024] Thermally conductive adhesive is applied to the lower surface of the first graphene thermally conductive layer 2, and the insulation layer 3 is precisely placed and attached, and then cured in a drying oven. Next, the second graphene thermally conductive layer 4 is attached to the lower surface of the insulation layer 3 with thermally conductive adhesive and cured to form a complete thermally conductive layer structure.

[0025] Thermally conductive adhesive is applied to the lower surface of the second graphene thermally conductive layer 4, and the graphene heating chip layer 5 is seamlessly connected to it. After curing, the heat insulation layer 6 is placed on the upper surface of the tile bottom layer 7, so that the sealing edge of the heat insulation layer 6 is adapted to the edge of the tile bottom layer 7. Then, the assembled upper part (including the tile surface layer, thermally conductive layer, and heating chip layer) is combined with the tile bottom layer 7 and the heat insulation layer 6 by thermally conductive adhesive or mechanical snap-fit ​​method (according to the actual structural design). The whole is then pressurized (pressure 1-3MPa) for curing to ensure the interlayer connection strength and sealing performance.

[0026] For the end and bottom connection components, when the tile is laid to the end, the conductive connection plate 11 of the end filling block 10 is aligned with the conductive connection groove 9 of the graphene heating chip layer 5 of the adjacent tile and smoothly inserted to complete the electrical and physical connection; according to the actual connection requirements, the conductive connection plate 8 of the adjacent tile or the conductive connection plate 11 of the end filling block 10 is inserted into its conductive connection groove 13 to realize bottom support and auxiliary electrical connection, ensuring the structural stability and circuit continuity of the tile laying end.

[0027] III. Performance Testing and Debugging Heat dissipation performance test Connect the power supply and use an infrared thermal imager (such as FLIRE60, with a temperature measurement accuracy of ±2℃) to detect the temperature distribution on the surface of the tile. After 3-5 minutes of power-on, the surface temperature should rise to 30-40℃, and the temperature distribution uniformity error should not exceed ±2℃. Continuously monitor the heating efficiency at different power levels (such as 50W, 100W, 150W, etc.) to verify whether it reaches more than 95%. At the same time, record the heating curve and cooling curve to evaluate the heat preservation performance.

[0028] Electrical safety testing Insulation resistance of each connection point should be tested using an insulation resistance tester (e.g., ZC25B-3, test voltage 500V) and should be ≥2MΩ. Withstand voltage test should be performed using a withstand voltage tester (e.g., YD2673, test voltage 1500V, duration 1min) and there should be no breakdown or flashover. Simulate a humid environment (e.g., place in a 90%RH environment for 24 hours) and retest the insulation performance and electrical safety to ensure reliable use in humid environments.

[0029] Intelligent control test A Bluetooth or WiFi connection is established between the mobile terminal (mobile APP) and the data transmission module of the end filler block 10. Temperature adjustment commands (such as setting 30℃, 35℃, 40℃) are sent. The accuracy of the temperature data collected by the signal processing module and the frequency conversion control effect of the switching module on the power supply of the graphene heating chip layer 5 (such as automatic power switching and start-up of heat preservation mode) are observed. The temperature adjustment accuracy is tested to see if it reaches ±1℃, and the integrity and reliability of the intelligent control function are verified.

[0030] Structural strength test The assembled tiles were subjected to a compressive strength test using a pressure testing machine at a loading rate of 500 N / s. The interlayer peel strength test was conducted using a tensile testing machine at a rate of 50 mm / min to verify that the interlayer peel strength was ≥1.5 MPa. Long-term use was simulated (e.g., through a thermal cycling test, 50 cycles from -10℃ to 40℃) to detect whether there were problems such as delamination, deformation, and performance degradation in each component, and to evaluate the service life and stability.

[0031] After the above tests and debugging, once all performance indicators meet the design requirements, the far-infrared graphene variable frequency fast heating ceramic tile can be put into market application, providing users with an efficient, convenient, and intelligent floor heating solution.

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A far infrared graphene frequency conversion rapid heating ceramic tile, comprising a ceramic tile surface layer (1) and a ceramic tile bottom layer (7), characterized in that: A heat-conducting layer, a graphene heating chip layer (5), and a heat-insulating layer (6) are arranged sequentially from top to bottom between the ceramic tile surface layer (1) and the ceramic tile bottom layer (7). A conductive connecting plate (8) is fixedly arranged on one side of the graphene heating chip layer (5), and a conductive connecting groove (9) adapted to the size of the conductive connecting plate (8) is opened on the other side. The center lines of the conductive connecting plate (8) and the conductive connecting groove (9) are at the same horizontal height.

2. The far infrared graphene frequency conversion rapid heating ceramic tile according to claim 1, characterized in that: The heat-conducting layer is a three-layer composite structure, consisting of a first graphene heat-conducting layer (2), a heat-insulating layer (3), and a second graphene heat-conducting layer (4) from top to bottom; wherein the upper surface of the first graphene heat-conducting layer (2) is closely attached to the lower surface of the ceramic tile surface layer (1), and the lower surface of the second graphene heat-conducting layer (4) is seamlessly connected to the upper surface of the graphene heating chip layer (5).

3. The far infrared graphene frequency conversion rapid heating ceramic tile according to claim 1, characterized in that: It also includes an end filler block (10) for sealing and controlling the end of the tile laying; the end filler block (10) has an integrally formed conductive connecting plate two (11) on the side close to the tile. The structural dimensions of the conductive connecting plate two (11) are the same as those of the conductive connecting plate one (8), and it is used to adapt and connect with the conductive connecting groove one (9) of the graphene heating chip layer (5) of the adjacent tile; the end filler block (10) is embedded with a signal processing module, a switch module and a data transmission module, and the three modules are electrically connected to the conductive connecting plate two (11) through wires to realize real-time monitoring and frequency conversion control of the heating status of the tile.

4. The far infrared graphene frequency conversion rapid heating ceramic tile according to claim 1, characterized in that: It also includes a bottom support block (12), which is fixedly connected to the lower surface of the end filler block (10), and the height of the bottom support block (12) is the same as the thickness of the bottom layer (7) of the tile; the bottom support block (12) has a conductive connection groove two (13) on the side close to the adjacent tile, and the structural dimensions of the conductive connection groove two (13) are the same as those of the conductive connection groove one (9), and it can be selectively adapted and connected to the conductive connection plate one (8) or the conductive connection plate two (11) of the adjacent tile.

5. The far infrared graphene frequency conversion rapid heating ceramic tile according to claim 3, characterized in that: The cross-sectional shape of the end filler block (10) is perfectly matched with the cross-sectional shape of the end of the tile. The end filler block (10) is made of flame-retardant polyurethane thermal insulation material, and its overall thickness is within ±0.5mm of the overall thickness of the tile.

6. The far infrared graphene frequency conversion rapid heating ceramic tile according to claim 1, characterized in that: The heat insulation layer (6) is made of high-density ceramic fiber material and has a thickness of 3-5mm. The edge of the heat insulation layer (6) extends 1-2mm beyond the edge of the bottom layer of the ceramic tile (7) to form a sealed edge.

7. The far infrared graphene frequency conversion rapid heating ceramic tile according to claim 2, characterized in that: The first graphene thermal conductive layer (2) and the second graphene thermal conductive layer (4) are both made of graphene thermal conductive film and glass fiber cloth composite, and both have a thickness of 2-4mm; the insulation layer (3) is made of closed-cell polyurethane insulation material with a thickness of 5-8mm, and the insulation layer (3) has uniformly distributed vacuum insulation microspheres with a diameter of 0.1-0.3mm inside.

8. The far infrared graphene frequency conversion rapid heating ceramic tile according to claim 1, characterized in that: The outer surface of the conductive connecting plate (8) is covered with a silicone rubber insulating layer of 0.1-0.2 mm thickness, and the inner wall of the conductive connecting groove (9) is fitted with a fluororubber sealing layer; the connection between the conductive connecting plate (8) and the conductive connecting groove (9) is filled with a high-temperature resistant insulating sealing strip, which has a temperature resistance range of -40℃ to 200℃ and has waterproof, insulating and buffering functions.

9. The far infrared graphene frequency conversion rapid heating ceramic tile according to claim 3, characterized in that: The data transmission module supports Bluetooth or WiFi wireless communication protocols and can establish a connection with a mobile terminal or smart home control system. The signal processing module can collect the temperature data of the graphene heating chip layer (5) in real time and feed the data back to the control terminal through the data transmission module. The control terminal realizes the frequency conversion power supply control of the graphene heating chip layer (5) through the switch module.

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