Dual axis vibration sensor circuit with redundant signal output
By designing a dual-axis vibration sensor circuit, using two independent power supplies and analog switches, redundant signal output of the sensor is achieved under voltage fluctuations or abnormal conditions. This solves the problems of sensor installation space and power supply stability, ensuring real-time and uninterrupted monitoring of the equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU YIDAO INTELLIGENT ENG CO LTD
- Filing Date
- 2025-06-13
- Publication Date
- 2026-07-17
AI Technical Summary
Existing industrial rotating machinery vibration monitoring sensors require multiple drillings on the equipment for installation, and cannot ensure real-time, uninterrupted monitoring when power supply is abnormal or the environment is harsh, affecting the stable operation of the equipment.
The circuit employs a dual-axis vibration sensor, powered by two independent power supplies. It also uses an analog switch and a voltage detection chip to ensure automatic switching of signal output in the event of voltage fluctuations or abnormalities, thus ensuring redundant signal output from the sensor.
It enables simultaneous monitoring of horizontal and vertical vibrations at the same location, ensuring stable and uninterrupted operation of the sensor during voltage fluctuations or anomalies, avoiding sensor failure due to voltage changes, and guaranteeing real-time monitoring of the equipment.
Smart Images
Figure CN224517935U_ABST
Abstract
Claims
1. A dual axis vibration sensor circuit with redundant signal output, characterized by, The system includes a power supply VCC, a power voltage detection chip U2, an independent power supply U3, an independent power supply U4, a dual-axis vibration chip U5, a dual-axis vibration chip U6, a signal follower IC1, a signal follower IC2, and an analog switch U1. One end of the power supply VCC is connected to the independent power supply U3 and the independent power supply U4 respectively. The output end of the independent power supply U3 is connected to the dual-axis vibration chip U5, the signal follower IC1, and the analog switch U1 in sequence. The output end of the independent power supply U4 is connected to the dual-axis vibration chip U6, the signal follower IC2, and the analog switch U1 in sequence. One end of the analog switch U1 is connected to the power voltage detection chip U2, and the other end of the power voltage detection chip U2 is connected to the power supply VCC. The analog switch U1 outputs an X or Y direction signal. The power supply voltage detection chip U2 includes interfaces OUTA, OUTB, INA, INB, VDD, and GND. Interface OUTA is connected to interfaces IN1 and IN2 of the analog switch U1, and after connection, it is connected to the power supply VCC through resistor R1. The connection line of interface INA is split into two paths. One path is grounded through resistor R3, and the other path is split into two paths, which are connected to interface INB and resistor R2 respectively. The other end of resistor R2 is connected to the power supply VCC. The power supply voltage detection chip U2 is a TPS3701 chip.
2. The dual-axis vibration sensor circuit with redundant signal output of claim 1, wherein, The analog switch U1 has four input channels and two output channels, including interfaces IN1, IN2, D1, D2, S1A, S2A, S1B, and S2B. Interfaces S1A, S2A, S1B, and S2B are input interfaces, and interfaces D1 and D2 are output interfaces. Interfaces S1A and S2A are connected to SIGA-X and SIGA-Y signals, respectively. Interface D1 is connected to the X-direction signal output. Interfaces S1B and S2B are connected to SIGA-X and SIGA-Y signals, respectively. Interface D2 is connected to the Y-direction signal output. Interfaces IN1 and IN2 are electrically connected to the power supply voltage detection chip U2.
3. The dual-axis vibration sensor circuit with redundant signal output of claim 1, wherein, The independent power supplies U3 and U4 are both LT3042 internal power supply modules of the dual-axis vibrator, with independent power outputs and output voltages of VB and VA, respectively.
4. The dual-axis vibration sensor circuit with redundant signal output of claim 1, wherein, Both the dual-axis vibration chip U5 and U6 are MEMS chips with multi-axis vibration output, outputting in either the X or Y direction to monitor vibration along either the X or Y axis. Signal follower IC1 includes operational amplifiers IC1A and IC1B, and signal follower IC2 includes operational amplifiers IC2A and IC2B. Pin 12 (XOUT) of dual-axis vibration chip U5 is connected to the non-inverting input (pin 3) of operational amplifier IC1A, with a filter capacitor C5 connected in parallel to ground. Pins 1 and 2 of IC1A are shorted to output a SIGA-X signal. Pin 10 (YOUT) of dual-axis vibration chip U5 is connected to the non-inverting input (pin 5) of operational amplifier IC1B, with a filter capacitor C6 connected in parallel to ground. Pins 6 and 7 of IC1B are shorted to output a SIGA-Y signal. Pins 14 and 15 (VS interfaces) of dual-axis vibration chip U5 are connected to power supply VA, and pins 1, 3, 5, 6, 7, and 17 of dual-axis vibration chip U5 are connected to... Do not connect to signal ground; pin 4 of operational amplifier IC1A is connected to power supply VA, and pin 11 of operational amplifier IC1A is connected to signal ground; pin 12 (XOUT) of dual-axis oscillator chip U6 is connected to pin 3 (non-inverting input) of operational amplifier IC2A, and a filter capacitor C7 is connected in parallel to ground between the wires; pins 1 and 2 of operational amplifier IC2A are shorted to perform signal following and output the SIBB-X signal; pin 10 (YOUT) of dual-axis oscillator chip U6 is connected to pin 5 (non-inverting input) of operational amplifier IC2B for dual-axis oscillation. A filter capacitor C8 is connected in parallel to ground between pin 10 of chip U6 and operational amplifier IC2B. Pins 6 and 7 of operational amplifier IC2B are shorted to perform signal following and output the SIGB-Y signal. Pins 14 and 15 of the dual-axis vibration chip U6 (VS interface) are connected to the power supply VB, and pins 1, 3, 5, 6, 7, and 17 of the dual-axis vibration chip U6 are connected to signal ground. Pin 4 of operational amplifier IC2A is connected to the power supply VB, and pin 11 of operational amplifier IC2A is connected to signal ground.
5. The dual-axis vibration sensor circuit with redundant signal output of claim 2, wherein, The analog switch U1 is ADG1436YRUZ.