散热的液晶显示模组及液晶显示模组用的散热组件
By employing a composite heat dissipation structure in the LCD module, using graphite foam and fillers to directly conduct heat to the front frame for exhaust, the problem of poor chip heat dissipation is solved, improving heat dissipation efficiency and module stability, and adapting to various structural designs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- KUSN INFOVISION OPTOELECTRONICS
- Filing Date
- 2025-08-12
- Publication Date
- 2026-07-17
AI Technical Summary
In existing LCD display modules, the heat generated by the chip is difficult to dissipate effectively, leading to high temperature problems, which affect chip performance and module stability, and common heat sink solutions are not effective.
A composite heat dissipation structure is adopted, including a foam sheet and a heat dissipation section. The heat dissipation section consists of a graphite foam surface layer and filler. By directly conducting heat to the front frame for dissipation, the heat conduction path is optimized and the heat dissipation efficiency is enhanced.
It achieves faster and more efficient heat dissipation, protects the performance of chips and display panels, simplifies production processes, reduces maintenance costs, and adapts to the structural designs of different models.
Smart Images
Figure CN224519081U_ABST