一种PCIe通讯电路与PCIe光模块

Abstract

本申请提供了一种PCIe通讯电路与PCIe光模块，涉及PCIe通讯技术领域。Retimer芯片分别与PCIe终端、光信号发送模块以及光信号接收模块连接，光信号发送模块、光信号接收模块还与光纤接口连接；Retimer芯片、光信号发送模块以及光信号接收模块集成于一体，并组成PCIe光模块，其中，Retimer芯片用于对PCIe终端发送的PCIe信号进行恢复，并将恢复后信号通过光信号发送模块发出；Retimer芯片还用于对光信号接收模块发送的信号进行恢复，并将恢复后信号发送回PCIe终端。本申请提供的PCIe通讯电路与PCIe光模块具有信号传输距离长、信号损耗小的优点。

Claims

1. A PCIe communication circuit, characterized in that, The PCIe communication circuit includes a PCIe terminal, a Retimer chip, an optical signal transmitting module, an optical signal receiving module, and an optical fiber interface. The Retimer chip is connected to the PCIe terminal, the optical signal transmitting module, and the optical signal receiving module, respectively. The optical signal transmitting module and the optical signal receiving module are also connected to the optical fiber interface. The Retimer chip, the optical signal transmitting module, and the optical signal receiving module are integrated into one unit to form a PCIe optical module. The Retimer chip is used to recover the PCIe signal sent by the PCIe terminal and transmit the recovered signal through the optical signal transmission module. The Retimer chip is also used to recover the signal sent by the optical signal receiving module and send the recovered signal back to the PCIe terminal. 2.The PCIe communication circuit of claim 1, wherein, The PCIe communication circuit also includes an MCU, which is connected to the Retimer chip, the optical signal transmitting module, and the optical signal receiving module. 3.The PCIe communication circuit of claim 1, wherein, The Retimer chip has a size of (10-18)mm*(10-18)mm.

4. The PCIe communication circuit of claim 3, wherein, The Retimer chip measures 14mm x 14mm.

5. The PCIe communication circuit as described in claim 1, characterized in that, The PCIe optical module also includes a structural component with a boss in the structural component. The area of ​​the boss is larger than the area of ​​the Retimer chip, and the Retimer chip is mounted inside the PCIe optical module through the boss.

6. The PCIe communication circuit of claim 5, wherein, The protrusion is disposed above the Retimer chip, and a gap is provided between the protrusion and the Retimer chip, the gap being filled with a heat dissipation material layer.

7. The PCIe communication circuit of claim 1, wherein, The optical signal receiving module includes a transimpedance amplifier and a photodiode, and the Retimer chip, the transimpedance amplifier, the photodiode, and the optical fiber interface are connected in sequence. 8.The PCIe communication circuit of claim 1, wherein, The optical signal transmission module includes an optical modulator, and the Retimer chip, the optical modulator, and the optical fiber interface are connected in sequence; wherein, the differential drive voltage required by the optical modulator is less than or equal to the differential signal output voltage of the Retimer chip.

9. The PCIe communication circuit of claim 1, wherein, The optical signal transmission module includes an optical modulator and a driver, and the Retimer chip, the driver, the optical modulator, and the optical fiber interface are connected in sequence; wherein, the differential drive voltage required by the optical modulator is greater than the differential signal output voltage of the Retimer chip.

10. A PCIe optical module, characterized by, The PCIe optical module is used in the PCIe communication circuit as described in any one of claims 1 to 9. The PCIe optical module includes a Retimer chip, an optical signal transmitting module, an optical signal receiving module, and an optical fiber interface. The Retimer chip is connected to the optical signal transmitting module and the optical signal receiving module, respectively. The optical signal transmitting module and the optical signal receiving module are also connected to the optical fiber interface.

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