UWB position indicator circuit board
By integrating heat dissipation components and using a modularly designed UWB positioning instrument circuit board, the problems of low heat dissipation efficiency and low integration have been solved, improving positioning accuracy and stability and simplifying the maintenance process.
Patent Information
- Application Number
- CN202521426379.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-09
- Publication Date
- 2026-07-17
- Estimated Expiration
- 2035-07-09
AI Technical Summary
Existing UWB positioning devices have low heat dissipation efficiency on their circuit boards, resulting in excessively high chip temperatures that affect positioning accuracy and stability. In addition, the multi-layer circuit board structure has low integration, making disassembly and maintenance difficult.
It adopts an integrated heat dissipation component, including an integrated board, an L-shaped heat sink and heat dissipation fins, combined with a modular circuit board structure, with each functional layer designed independently. Heat conduction and heat dissipation are achieved through thermal vias and limiting blocks, and it is easy to disassemble and maintain.
It improves heat dissipation efficiency, reduces thermal resistance, enhances the structural stability of the circuit board, simplifies the maintenance process, and reduces repair costs.