Wafer edge finding positioning mechanism

Abstract

The utility model discloses a wafer edge searching positioning mechanism relates to semiconductor technical field, and this wafer edge searching positioning mechanism includes bearing station, the inside of bearing station is provided with through -hole, the inside installation of through -hole has rotary lever, the top of rotary lever installs the carousel, installs adsorption subassembly on the carousel, the top of bearing station is provided with four groups first recess, first recess is on bearing station and is distributed in cross shape, the inside installation of first recess has first lead screw, one side of first lead screw is installed with third drive motor, and the outer wall screw thread connection of first lead screw has first nut seat, and the scheme has solved the position fixed of light source emission end and light source receiving end in the process of using present wafer edge searching positioning device, cannot use to different size wafer, and the above structure can not carry out the center positioning of wafer, still need other equipment first to carry out the center positioning, cannot quickly search the edge problem.

Claims

1. A wafer edge finding positioning mechanism, comprising a carrier table (1), characterized in that: The bearing platform (1) has a through hole (2) inside, a rotating rod (3) is installed inside the through hole (2), a turntable (4) is installed on the top of the rotating rod (3), an adsorption component is installed on the turntable (4), four sets of first grooves (14) are provided on the top of the bearing platform (1), the first grooves (14) are arranged in a cross shape on the bearing platform (1), a first lead screw (15) is installed inside the first groove (14), a third drive motor (16) is installed on one side of the first lead screw (15), a first nut seat (17) is threaded to the outer wall of the first lead screw (15), a baffle (18) is installed on the top of the first nut seat (17), a rubber pad (19) is installed on the side of the baffle (18) near the turntable (4), both the baffle (18) and the rubber pad (19) are arc-shaped, and a PLC controller (29) is installed at one end of the bearing platform (1).

2. The wafer edge finding positioning mechanism of claim 1, wherein: The adsorption assembly includes a built-in groove (6) located inside the turntable (4). A suction cup (7) is annularly mounted on the top of the turntable (4). The built-in groove (6) is connected to the suction cup (7). A negative pressure pump (8) is installed on one side of the turntable (4). An air supply pipe (9) and an exhaust pipe (10) are respectively installed at both ends of the negative pressure pump (8). The air supply pipe (9) and the exhaust pipe (10) are connected to the built-in groove (6).

3. The wafer edge finding positioning mechanism of claim 1, wherein: A first drive motor (11) is installed at the bottom of the support platform (1). A first gear (12) is installed on the output shaft of the first drive motor (11). A second gear (13) is installed on the lower part of the outer wall of the rotating rod (3). The first gear (12) and the second gear (13) are meshed and connected. The diameter of the first gear (12) is smaller than the diameter of the second gear (13). A bearing (5) is installed at the connection between the rotating rod (3) and the support platform (1).

4. The wafer edge finding positioning mechanism of claim 3, wherein: The top of the support platform (1) is provided with a second groove (20), and a second lead screw (21) is installed inside the second groove (20). A first bevel gear (22) is installed on the side of the outer wall of the second lead screw (21) away from the turntable (4). The lower part of the first bevel gear (22) is meshed with a second bevel gear (24). The bottom of the second bevel gear (24) is installed with a second drive motor (23) through the support platform (1). A second nut seat (25) is threadedly connected to the outer wall of the second lead screw (21).

5. The wafer edge finding positioning mechanism of claim 4, wherein: A U-shaped frame (26) is installed on the top of the second nut seat (25). The opening of the U-shaped frame (26) is close to the turntable (4). A photoelectric transmitter (27) is installed on the inner top of the U-shaped frame (26). A photoelectric receiver (28) is installed on the inner bottom of the U-shaped frame (26). The output end of the photoelectric transmitter (27) is electrically connected to the input end of the photoelectric receiver (28). The output end of the photoelectric receiver (28) is electrically connected to the input end of the PLC controller (29). The output end of the PLC controller (29) is electrically connected to the input end of the first drive motor (11).

6. The wafer edge finding positioning mechanism of claim 1, wherein: The output terminal of the PLC controller (29) is electrically connected to the input terminals of the four sets of the third drive motors (16).

7. The wafer edge finding positioning mechanism of claim 1, wherein: The top of the support platform (1) is provided with an annular groove (30), and a slip ring (31) is slidably connected inside the annular groove (30). The top of the slip ring (31) is fixedly connected to the turntable (4).

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