A paperboard coating adhesive mixing and stirring machine

Abstract

The utility model discloses a kind of adhesive mixing stirrers for paperboard coating, including stirring tank, the outside of stirring tank is equipped with temperature control component for controlling temperature to adhesive, one end of the temperature control component extends to the inside of stirring tank, the outside of stirring tank is equipped with air-blowing component for air-blowing in stirring tank, one end of the air-blowing component is communicated with one end of temperature control component, the outside of stirring tank is equipped with power component for providing power, one end of the power component extends to the inside of stirring tank, the utility model is by for hot melt adhesive and other temperature sensitive raw materials, system can quickly stabilize temperature to target interval, ensure that adhesive chemical reaction is fully, viscosity is stable, bonding strength and drying speed after coating are all improved, temperature control and stirring collaborative design expand multi-scene application, compatible normal temperature, high temperature, low temperature and multiple types of glue preparation, function applicability is greatly improved compared with traditional equipment.

Description

Technical Field

[0001] This utility model relates to the field of packaging industry technology, specifically to a mixing and stirring machine for adhesives used in cardboard coating. Background Technology

[0002] In paperboard coating processes, the performance of adhesives directly affects coating quality and product reliability. With the packaging industry's increasing demands for paperboard strength, water resistance, and environmental friendliness, adhesive formulations are becoming more diversified, encompassing various types such as starch-based, hot melt adhesives, and acrylates. This significantly increases the requirements for temperature control and mixing uniformity in their preparation processes.

[0003] Chinese Patent No. CN219964628U discloses a mixing device for preparing adhesive for cardboard. The device includes a raw material mixing tank, a material conveying pump on one side of the mixing tank, the mixing tank connected to the input of the material conveying pump via a first pipe, a control box on one side of the material conveying pump, a raw material mixing tank on the left side of the control box, and a second pipe connected to the output of the conveying pump. The mixing tank includes a tank body, an upper cover plate on the upper side of the tank body, a feed inlet on the upper cover plate, a raw material storage tank below the feed inlet, a first conveying pipe below the raw material storage tank, a second valve on the first conveying pipe, a weighing device below the first conveying pipe, a second conveying pipe on one side of the weighing device, a third valve on the second conveying pipe, and a raw material outlet on the lower side of the tank body. The raw material outlet is connected to the input of the conveying pump via the first pipe. This invention achieves fully automated production and reduces labor costs.

[0004] The aforementioned patent also has some defects. The temperature monitoring and control device has significant defects. In winter, the viscosity of the adhesive increases and the stirring resistance is high at low temperatures, which affects efficiency and may damage the motor. For temperature-sensitive adhesives such as hot melt adhesives, it cannot meet the process temperature requirements, which affects the chemical reaction, viscosity and coating performance, and limits its application in multiple scenarios. Therefore, we need to propose a paperboard coating adhesive mixing and stirring machine. Utility Model Content

[0005] The purpose of this invention is to provide a mixing machine for adhesives used in cardboard coating, so as to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a paperboard coating adhesive mixing machine, comprising a mixing tank, wherein a temperature control component for controlling the temperature of the adhesive is installed on the outside of the mixing tank, and one end of the temperature control component extends into the interior of the mixing tank;

[0007] The mixing tank is equipped with an air blowing assembly for blowing air into the mixing tank, and one end of the air blowing assembly is connected to one end of the temperature control assembly.

[0008] The mixing tank is equipped with a power assembly for providing power, one end of which extends into the interior of the mixing tank.

[0009] Preferably, the temperature control component includes a thermoelectric cooler, a first air outlet duct, and a first fixing plate. A cover plate is installed on the top of the mixing tank. The cover plate is hollow. The thermoelectric cooler is installed outside the mixing tank through the first fixing plate. The hot end of the thermoelectric cooler is provided with heat dissipation fins and a fan. The cold end of the thermoelectric cooler is connected to one end of the first air outlet duct. A first valve is installed on the surface of the first air outlet duct.

[0010] Preferably, the hot end of the semiconductor cooler is connected to a first heat dissipation pipe, the middle part of the first heat dissipation pipe is connected to a second heat dissipation pipe, the end of the second heat dissipation pipe away from the first heat dissipation pipe is connected to the middle part of the first air outlet pipe, and a second valve is provided on the surface of the second heat dissipation pipe.

[0011] Preferably, the blowing assembly includes a fan and a second blowing pipe. The air inlet of the fan is connected to the end of the first air outlet pipe away from the cold end of the semiconductor cooler. The air outlet of the fan is connected to one end of the second blowing pipe. The end of the second blowing pipe away from the fan is connected to the top of the cover plate. A plurality of spray heads are evenly installed around the bottom of the cover plate. The top of the spray heads is connected to the bottom of the cover plate.

[0012] Preferably, a temperature sensor is installed at the bottom of the cover plate, and a controller is installed on the outside of the mixing tank, the controller being electrically connected to the temperature sensor.

[0013] Preferably, an inlet pipe is installed on the surface of the cover plate, and the bottom of the inlet pipe penetrates the interior of the cover plate and extends into the interior of the mixing tank.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] 1. This utility model, through the cooperation of temperature control components, air blowing components and power components, and the intelligent linkage between temperature sensors and controllers, regulates the output of hot and cold air from the semiconductor cooler in real time, accurately solving the problem of sudden increase in glue viscosity caused by low winter temperatures, significantly reducing stirring resistance, avoiding motor overload, and improving equipment operating efficiency and stability.

[0016] 2. This utility model, for temperature-sensitive raw materials such as hot melt adhesives, can quickly stabilize the temperature to the target range, ensuring sufficient chemical reaction and stable viscosity of the adhesive. The bonding strength and drying speed after coating are improved. The coordinated design of temperature control and stirring expands the application in multiple scenarios and is compatible with the preparation of various types of adhesives such as room temperature, high temperature and low temperature. Its functional applicability is greatly improved compared with traditional equipment. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of this utility model;

[0018] Figure 2 This is a cross-sectional structural diagram of the mixing tank of this utility model;

[0019] Figure 3 This is a schematic diagram of the power component structure of this utility model;

[0020] Figure 4 This is a schematic diagram of the temperature control component structure of this utility model;

[0021] Figure 5 This utility model Figure 1 Enlarged structural diagram of area A.

[0022] In the diagram: 1. Mixing tank; 2. Semiconductor cooler; 3. First air outlet duct; 4. First fixing plate; 5. Cover plate; 6. Heat dissipation fins; 7. Fan; 8. First valve; 9. Blower; 10. Second air outlet duct; 11. First heat dissipation pipe; 12. Second heat dissipation pipe; 13. Second valve; 14. Motor; 15. Second fixing plate; 16. Mixing blade; 17. Pulley assembly; 18. Connecting shaft; 19. Scraper; 20. Temperature sensor; 21. Controller; 22. Liquid inlet pipe; 23. Mixing shaft; 24. Spray head. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figures 1-5This utility model provides a technical solution: a paperboard coating adhesive mixing machine, including a mixing tank 1. A temperature control component for controlling the temperature of the adhesive is installed on the outside of the mixing tank 1. The mixing tank 1 is used to contain the adhesive and provide a mixing space, and is the main container of the equipment. One end of the temperature control component extends into the interior of the mixing tank 1. The temperature control component includes a semiconductor cooler 2, a first air outlet duct 3, and a first fixing plate 4. The first fixing plate 4 fixes the semiconductor cooler 2, ensuring its stable installation on the outside of the mixing tank 1. A cover plate 5 is installed on the top of the mixing tank 1. The cover plate 5 is hollow, and it closes the top of the mixing tank 1. Its hollow structure can serve as an airflow channel, in conjunction with... The blowing assembly achieves temperature regulation. The semiconductor cooler 2 is installed on the outside of the mixing tank 1 via the first fixing plate 4. The hot end of the semiconductor cooler 2 is equipped with heat dissipation fins 6 and a fan 7. The cold end of the semiconductor cooler 2 is connected to one end of the first air outlet pipe 3. A first valve 8 is installed on the surface of the first air outlet pipe 3. The first valve 8 controls the opening and closing of the first air outlet pipe 3. The semiconductor cooler 2 uses the semiconductor temperature difference effect to generate hot and cold airflow. Its cold end is connected to the first air outlet pipe 3 to output cold energy. The hot end dissipates heat through the heat dissipation fins 6 and the fan 7. The first air outlet pipe 3 transmits the cold airflow generated by the cold end of the semiconductor cooler 2 and delivers the cold energy to the inside of the mixing tank 1 or the blowing assembly.

[0025] The hot end of the semiconductor cooler 2 is connected to a first heat sink 11, and the middle part of the first heat sink 11 is connected to a second heat sink 12. The end of the second heat sink 12 away from the first heat sink 11 is connected to the middle part of the first air outlet 3. A second valve 13 is provided on the surface of the second heat sink 12. The first heat sink 11 guides the hot airflow generated by the hot end of the semiconductor cooler 2, and connects it to the first air outlet 3 through the second heat sink 12. The hot airflow can be mixed into the cold airflow as needed to adjust the temperature.

[0026] The second heat dissipation pipe 12 connects the first heat dissipation pipe 11 and the first air outlet pipe 3. The second valve 13 controls the on / off state and flow rate of the hot airflow to achieve precise temperature regulation.

[0027] An air blowing assembly for blowing air into the mixing tank 1 is installed on the outside of the mixing tank 1. One end of the air blowing assembly is connected to one end of the temperature control assembly. The air blowing assembly includes a fan 9 and a second air blowing pipe 10. The air inlet end of the fan 9 is connected to the end of the first air outlet pipe 3 away from the cold end of the semiconductor cooler 2. The air outlet end of the fan 9 is connected to one end of the second air blowing pipe 10. The end of the second air blowing pipe 10 away from the fan 9 is connected to the top of the cover plate 5. The fan 9 provides power to draw in and pressurize the airflow from the first air outlet pipe 3, and deliver it to the cover plate 5 through the second air blowing pipe 10, so as to realize the circulation of airflow in the mixing tank 1. The second air blowing pipe 10 transmits the airflow output by the fan 9 and guides it from the top of the cover plate 5 into the interior of the mixing tank 1. Several spray heads 24 are evenly installed around the bottom of the cover plate 5. The top of the spray heads 24 is connected to the bottom of the cover plate 5. When the fan 9 drives the airflow to be delivered to the cover plate 5 through the second air blowing pipe 10, the airflow forms pressure conduction inside the cover plate 5. The spray head 24 utilizes fluid dynamics principles to accelerate and transform the pressurized airflow through its internal nozzle structure, causing the airflow to be ejected from the nozzle in a uniformly dispersed mist, fan shape, or columnar shape. Inside the mixing tank 1, the ejected airflow can dynamically sweep the adhesive surface, and in conjunction with the rotation of the stirring blades 16, enhance the airflow inside the tank, assisting the temperature control components in achieving uniform heat distribution.

[0028] A power assembly for providing power is installed on the outside of the mixing tank 1. One end of the power assembly extends into the interior of the mixing tank 1. The power assembly includes a motor 14, a second fixing plate 15, a stirring blade 16, a pulley set 17, and a stirring shaft 23. The stirring shaft 23 connects the motor 14 and the stirring blade 16, transmitting power to the stirring blade 16 and simultaneously driving the scraper 19 to move along the inner wall of the mixing tank 1. The motor 14 is mounted on the outside of the mixing tank 1 via the second fixing plate 15. The top of the stirring shaft 23 is connected to the output shaft of the motor 14 via the pulley set 17. The stirring shaft 23 rotates through the center of the top of the cover plate 5 and extends into the interior of the mixing tank 1. The stirring blade 16 is located at the end of the stirring shaft 23. At the end of the 3rd section, the adhesive is pushed to flow during rotation, achieving uniform mixing. A connecting shaft 18 is horizontally mounted on the surface of the stirring shaft 23. Scrapers 19 are symmetrically mounted on both sides of the connecting shaft 18. The connecting shaft 18 is horizontally mounted on the surface of the stirring shaft 23 to fix the scrapers 19, so that they rotate with the stirring shaft 23. One side of each scraper 19 is in contact with the inner wall of the mixing tank 1. The stirring shaft 23 and the stirring blades 16 are driven to rotate by the motor 14 and the pulley set 17 to achieve adhesive mixing. The motor 14 serves as a power source, transmitting power to the stirring shaft 23 through the pulley set 17 to drive the stirring assembly to operate. The scrapers 19 are symmetrically mounted on both sides of the connecting shaft 18, rotating in contact with the inner wall of the mixing tank 1 to prevent adhesive from adhering and to assist in scraping off the material from the tank wall.

[0029] A temperature sensor 20 is installed at the bottom of the cover plate 5. A controller 21 is installed on the outside of the mixing tank 1. The controller 21 is electrically connected to the temperature sensor 20. The temperature sensor 20 is installed at the bottom of the cover plate 5 to monitor the temperature of the adhesive in the mixing tank 1 in real time and transmit the data to the controller 21. The controller 21 receives the signal from the temperature sensor 20. The liquid inlet pipe 22 passes through the cover plate 5 and is used to inject liquid raw materials into the mixing tank 1 for easy material addition.

[0030] A liquid inlet pipe 22 is installed on the surface of the cover plate 5. The bottom of the liquid inlet pipe 22 penetrates the interior of the cover plate 5 and extends into the interior of the mixing tank 1. The liquid inlet pipe 22 penetrates the cover plate 5 and is used to inject liquid raw materials into the mixing tank 1 for easy material addition.

[0031] The controller 21 is electrically connected to the temperature sensor 20. The temperature sensor 20 monitors the temperature of the adhesive in the mixing tank 1 in real time and transmits the data to the controller 21. The controller 21 determines whether to activate the temperature control component based on a preset temperature threshold. When the temperature is lower than the set value, the controller 21 controls the semiconductor cooler 2 to switch to heating mode and opens the second valve 13. Its hot end is connected to the first air outlet pipe 3 through the first heat dissipation pipe 11 and the second heat dissipation pipe 12. The hot air flows through the fan 9 and the second air blowing pipe 10 into the cover plate 5, and then from the cover plate 5 through the spray head 24 into the mixing tank 1 to raise the temperature. When the temperature exceeds the set value, the controller 21 controls the semiconductor cooler 2 to switch to cooling mode, closes the second valve 13, and opens the first valve 8. The cold air flows through the first air outlet 3, the cold air flows through the fan 9 and the second air blowing pipe 10, enters the cover plate 5, and then enters the mixing tank 1 through the spray head 24 to cool it down. At the same time, the controller 21 synchronously adjusts the speed of the motor 14, drives the stirring shaft 23, stirring blades 16 and scraper 19 to operate through the pulley group 17, and ensures that the adhesive is evenly mixed during the temperature control process. The temperature sensor 20 continuously feeds back data to form a closed-loop control and achieve precise temperature regulation.

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A paperboard coating adhesive mixing machine, comprising a mixing tank (1), characterized in that: The mixing tank (1) is equipped with a temperature control component for controlling the temperature of the adhesive, one end of which extends into the interior of the mixing tank (1). The mixing tank (1) is equipped with a blowing assembly for blowing air into the mixing tank (1) from the outside, and one end of the blowing assembly is connected to one end of the temperature control assembly; The mixing tank (1) is equipped with a power assembly for providing power, one end of which extends into the interior of the mixing tank (1).

2. The adhesive mixing machine for cardboard coating according to claim 1, characterized in that: The temperature control assembly includes a semiconductor cooler (2), a first air outlet pipe (3), and a first fixing plate (4). The top of the mixing tank (1) is equipped with a cover plate (5), which is hollow. The semiconductor cooler (2) is installed outside the mixing tank (1) through the first fixing plate (4). The hot end of the semiconductor cooler (2) is provided with heat dissipation fins (6) and a fan (7). The cold end of the semiconductor cooler (2) is connected to one end of the first air outlet pipe (3). A first valve (8) is installed on the surface of the first air outlet pipe (3).

3. The adhesive mixing and stirring machine for cardboard coating according to claim 2, characterized in that: The hot end of the semiconductor cooler (2) is connected to a first heat sink (11), the middle part of the first heat sink (11) is connected to a second heat sink (12), the end of the second heat sink (12) away from the first heat sink (11) is connected to the middle part of the first air outlet pipe (3), and a second valve (13) is provided on the surface of the second heat sink (12).

4. The adhesive mixing machine for cardboard coating according to claim 2, characterized in that: The blowing assembly includes a fan (9) and a second blowing pipe (10). The air inlet of the fan (9) is connected to the end of the first air outlet pipe (3) away from the cold end of the semiconductor cooler (2). The air outlet of the fan (9) is connected to the end of the second blowing pipe (10). The end of the second blowing pipe (10) away from the fan (9) is connected to the top of the cover plate (5). A plurality of spray heads (24) are evenly installed around the bottom of the cover plate (5). The top of the spray head (24) is connected to the bottom of the cover plate (5).

5. The adhesive mixing and stirring machine for paperboard coating according to claim 4, characterized in that: The power assembly includes a motor (14), a second fixed plate (15), a stirring blade (16), a pulley set (17), and a stirring shaft (23). The motor (14) is mounted on the outside of the mixing tank (1) via the second fixed plate (15). The top of the stirring shaft (23) is connected to the output shaft of the motor (14) via the pulley set (17). The stirring shaft (23) rotates through the center of the top of the cover plate (5) and extends into the interior of the mixing tank (1). The stirring blade (16) is located at the end of the stirring shaft (23). A connecting shaft (18) is installed laterally on the surface of the stirring shaft (23). Scrapers (19) are symmetrically installed on both sides of the connecting shaft (18). One side of each scraper (19) is in contact with the inner wall of the mixing tank (1).

6. The adhesive mixing machine for cardboard coating according to claim 2, characterized in that: A temperature sensor (20) is installed at the bottom of the cover plate (5), and a controller (21) is installed on the outside of the mixing tank (1). The controller (21) is electrically connected to the temperature sensor (20).

7. The adhesive mixing and stirring machine for cardboard coating according to claim 6, characterized in that: The surface of the cover plate (5) is equipped with a liquid inlet pipe (22), the bottom of which penetrates the interior of the cover plate (5) and extends into the interior of the mixing tank (1).

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