Lift pin mounting hole alignment tool and semiconductor thin film deposition apparatus

Abstract

The application discloses a lifting pin mounting hole calibration tool and a semiconductor thin film deposition device, and relates to the technical field of semiconductor manufacturing equipment, in particular to a lifting pin mounting hole calibration tool and a semiconductor thin film deposition device. The lifting pin mounting hole calibration tool comprises a base plate, a plurality of cavity positioning members, a plurality of positioning sleeves and a plurality of calibration members. The plurality of cavity positioning members are arranged on the edge of the base plate along the circumferential direction of the base plate with the center of the base plate as a reference. The plurality of positioning sleeves are distributed on the base plate at positions corresponding to the lifting pin mounting holes, and the positioning sleeves axially penetrate the base plate. The plurality of calibration members have a plurality of calibration segments with different diameters along the axial direction, the diameters of the calibration segments match the diameters of the lifting pin mounting holes, and the calibration members are movably arranged in the positioning sleeves. The application realizes quick centering and positioning with the cavity positioning members, and uses the multi-segment calibration members to step by step calibrate the concentricity of the lifting pin mounting holes, effectively solves the mounting deflection problem caused by the misalignment of the layered hole structure, avoids the risk of lifting pin fracture and improves the wafer transmission stability.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a tool for calibrating lifting pin mounting holes and a semiconductor thin film deposition device. Background Technology

[0002] In existing technologies, semiconductor process equipment typically has three sets of lifting pins installed on the heating plate, which use lifting motions to pick up and place wafers and transfer them. To ensure process stability and uniform plating, the heating plate must be concentric and level; simultaneously, the mounting holes of the lifting pins must have uniform reference points, be free of skew, and exhibit good lifting consistency to achieve horizontal coaxiality of wafer lifting and stable wafer transfer. However, in actual installation and debugging, these components are often difficult to install directly, posing a random risk of inconsistency. Specifically, when installing the lifting pins, because the holes corresponding to the three-layer board have a "smaller at the top and larger at the bottom" structure, forward positioning is impossible. Reverse positioning and centering installation are difficult due to the surrounding sealed cavity and lack of operating space, leading to ineffective centering and easy skew of the lifting pins. This can result in wafer misalignment, or even breakage of the lifting pins during the heating plate's lifting process, requiring cavity opening for maintenance, ultimately increasing costs and reducing production output. Utility Model Content

[0003] The present invention provides a tool for calibrating the mounting hole of a lifting pin and a semiconductor thin film deposition equipment, which aims to solve the problem of misalignment of the mounting hole of the existing lifting pin, which leads to lifting pin skewing, wafer misalignment, and even lifting pin breakage.

[0004] In a first aspect, this utility model provides a tool for calibrating the mounting hole of a lifting pin, comprising:

[0005] substrate;

[0006] Multiple cavity positioning elements are spaced apart on the edge of the substrate along the circumferential direction of the substrate, with the center of the substrate as a reference.

[0007] Multiple positioning sleeves are distributed on the substrate at positions corresponding to the lifting pin mounting holes, and the positioning sleeves axially penetrate the substrate;

[0008] Multiple calibration components have multiple calibration segments of different diameters along their axial direction. The diameter of the calibration segment matches the diameter of the lifting pin mounting hole. The calibration component is movably inserted into the positioning sleeve.

[0009] Furthermore, each of the calibration components includes at least two calibration segments connected in sequence with increasing diameter, wherein the calibration component is inserted into the positioning sleeve in order of increasing diameter of the calibration segments.

[0010] Furthermore, the calibration component includes a first calibration segment, a second calibration segment, and a third calibration segment connected in sequence with increasing diameter.

[0011] Furthermore, the calibration component also includes a limiting section coaxial with the calibration segment, the limiting section being connected to the calibration segment with the largest diameter, and the diameter of the limiting section being larger than the diameter of the positioning sleeve.

[0012] Furthermore, the lifting pin mounting hole calibration tool also includes multiple vacuum ring positioning components, which are spaced apart on the edge of the substrate along the circumferential direction of the substrate with the center of the substrate as a reference, and each vacuum ring positioning component is adjacent to each cavity positioning component in a one-to-one correspondence.

[0013] Furthermore, it also includes a central bearing housing and a test gauge, wherein the central bearing housing is located at the center of the substrate, and the test gauge is rotatably connected to the central bearing housing via a rotating shaft.

[0014] Secondly, this utility model also provides a semiconductor thin film deposition apparatus, including a cavity and a heating plate disposed in the cavity. The heating plate is provided with multiple lifting pin mounting holes of different diameters along its axial direction. The lifting pin mounting holes are calibrated using the aforementioned lifting pin mounting hole calibration tool.

[0015] Furthermore, the heating plate includes a first layer plate, a second layer plate, and a third layer plate stacked sequentially along the axial direction of the heating plate. The first layer plate has a first lifting pin mounting hole, the second layer plate has a second lifting pin mounting hole, and the third layer plate has a third lifting pin mounting hole. The diameter of the first lifting pin mounting hole is larger than the diameter of the second lifting pin mounting hole, and the diameter of the second lifting pin mounting hole is larger than the diameter of the third lifting pin mounting hole.

[0016] Furthermore, the top of the cavity is provided with a plurality of cavity positioning grooves that cooperate with the cavity positioning component. The plurality of cavity positioning grooves are provided at intervals on the top of the cavity along the circumferential direction of the cavity, with the center of the cavity as the reference.

[0017] Furthermore, the semiconductor thin film deposition apparatus also includes a suction ring, which is disposed at the top of the cavity. The suction ring has a plurality of positioning holes that cooperate with the positioning components of the suction ring. The plurality of positioning holes are spaced apart at the top of the suction ring along the circumferential direction.

[0018] This invention provides a tool for calibrating lifting pin mounting holes and a semiconductor thin film deposition apparatus. The tool includes a substrate, multiple cavity positioning components, multiple positioning sleeves, and multiple calibration components. The cavity positioning components are spaced circumferentially along the edge of the substrate, with the center as a reference, for positioning and engaging with the process cavities. The positioning sleeves are distributed on the substrate at positions corresponding to the lifting pin mounting holes and axially penetrate the substrate. The calibration components have multiple axially oriented calibration segments of different diameters, the diameters of which match the lifting pin mounting holes and are movably inserted into the positioning sleeves. This application achieves rapid alignment and positioning with the cavities through the cavity positioning components and uses multi-segment calibration components to calibrate the concentricity of the lifting pin mounting holes step by step, effectively solving the installation misalignment problem caused by misalignment of the layered hole structure, avoiding the risk of lifting pin breakage, and improving wafer transfer stability. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 A schematic diagram of the lifting pin mounting hole calibration tool according to an embodiment of this utility model is shown;

[0021] Figure 2 Another schematic diagram of the lifting pin mounting hole calibration tool according to an embodiment of this utility model is shown;

[0022] Figure 3 A schematic diagram of the calibration component of the lifting pin mounting hole calibration tool according to an embodiment of this utility model is shown;

[0023] Figure 4 A cross-sectional schematic diagram of the lifting pin mounting hole calibration tool according to an embodiment of the present invention is shown;

[0024] Figure 5 Showing Figure 1 Enlarged schematic diagram of part A;

[0025] Figure 6 Showing Figure 2 Enlarged schematic diagram of part B;

[0026] Figure 7 This illustration shows a schematic diagram of the lifting pin mounting hole calibration tool according to an embodiment of the present invention.

[0027] Figure 8 This illustration shows a schematic diagram of the Heater parallelism test performed by the lifting pin mounting hole calibration tool according to an embodiment of the present invention.

[0028] Figure 9 This illustration shows a schematic diagram of the Heater coaxiality test performed by the lifting pin mounting hole calibration tool according to an embodiment of the present invention.

[0029] Figure label:

[0030] 1. Lifting pin mounting hole calibration tool; 11. Base plate; 12. Cavity positioning component; 13. Positioning sleeve; 14. Calibration component; 141. First calibration section; 142. Second calibration section; 143. Third calibration section; 144. Limiting section; 15. Vacuum ring positioning component; 16. Central bearing seat; 2. Inspection gauge; 3. Heating plate; 31. First layer plate; 311. First lifting pin mounting hole; 32. Second layer plate; 321. Second lifting pin mounting hole; 33. Third layer plate; 331. Third lifting pin mounting hole; 4. Vacuum ring; 5. Cavity. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0032] The directional terms used in this invention, such as "up," "down," "front," "back," "left," "right," "inner," "outer," and "side," are merely for reference to the accompanying drawings. Therefore, the directional terms used are for explanation and understanding of this invention, and not for limiting it. Furthermore, in the accompanying drawings, structures that are similar or identical are indicated by the same reference numerals.

[0033] In semiconductor equipment, the lifting pins must pass sequentially through the mounting holes corresponding to the Plate, Ceramic Plate, and Heater three-layer structure. In existing technologies, due to processing errors or cumulative assembly deviations of the holes in each layer, the holes in the three layers are misaligned, causing the lifting pins to skew during operation. This leads to problems such as wafer transfer position shift and inaccurate chuck positioning. In severe cases, it can even cause the lifting pins to break, requiring cavity opening for maintenance, which affects production efficiency and costs.

[0034] Therefore, this utility model provides a lifting pin mounting hole calibration tool and a semiconductor thin film deposition equipment. The tool achieves reference positioning through a cavity positioning component, and uses the cooperation between the calibration component and the positioning sleeve to accurately calibrate the lifting pin mounting hole, thereby calibrating the concentricity of the lifting pin mounting hole and improving the stability of wafer transfer.

[0035] This utility model embodiment aims to solve the problem of misalignment of the lifting pin mounting holes mentioned above, and the specific approach is as follows:

[0036] First, the rapid positioning of the cavity positioning components with the process cavity reference surface ensures that the installation reference of the calibration tool is consistent with the cavity reference. The distribution of the positioning sleeves corresponds to the mounting holes of the lifting pins, providing a precise guiding reference for the calibration components. The key multi-segment calibration component adopts a stepped shaft design, with the diameter of each segment matching the mounting hole size of different levels. By inserting the positioning sleeves step by step from top to bottom, the first layer of large-hole plates (such as Plate) is accurately positioned and locked with the large-diameter calibration segment, the second layer plate (such as Ceramic Plate) is calibrated with the middle-diameter segment, and finally the third layer of small-hole structures (such as Heater) is calibrated with the small-diameter segment, achieving layered centering adjustment of the three-layer hole positions. This layered progressive calibration method can effectively eliminate the cumulative assembly errors between the layers of plates, ensuring that the lifting pins maintain vertical concentricity when passing through all levels of mounting holes. It fundamentally avoids problems such as lifting pin jamming, wafer transfer misalignment, or breakage caused by hole misalignment. At the same time, the tool-based design achieves repeatability and ease of operation of the calibration process, significantly improving equipment assembly efficiency and reliability.

[0037] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0038] Please see Figures 1-9 This utility model embodiment demonstrates a lifting pin mounting hole calibration tool 1, comprising: a base plate 11, multiple cavity positioning members 12, multiple positioning sleeves 13, and multiple calibration members 14. The multiple cavity positioning members 12 are spaced apart along the circumferential direction of the base plate 11 with the center of the base plate 11 as a reference, on the edge of the base plate 11. The multiple positioning sleeves 13 are distributed on the base plate 11 at positions corresponding to the lifting pin mounting holes, and the positioning sleeves 13 axially penetrate the base plate 11. The multiple calibration members 14 have multiple calibration segments of different diameters along their axial direction, the diameter of the calibration segments matching the diameter of the lifting pin mounting holes, and the calibration members 14 are movably inserted into the positioning sleeves 13.

[0039] Reference Figure 1 and Figure 2Specifically, the substrate 11 can be a circular plate structure, and its material can be a metal such as aluminum alloy or stainless steel, which can provide a stable mounting base for other components. The cavity positioning component 12 can be set to four, which can be positioning pins or positioning blocks, and can cooperate with the positioning groove of the equipment cavity 5 to achieve the reference positioning of the substrate 11; the positioning sleeve 13 can be set to three sets, each set corresponding to a lifting pin mounting hole, which can be a cylindrical sleeve, and can provide guidance for the calibration component 14; the calibration component 14 can be a calibration pin, and its axial multi-segment calibration section can be set to three segments, the diameter of each segment matching the hole diameter of the Plate, Ceramic Plate, and Heater, respectively, and can be inserted into the corresponding hole to achieve calibration. The plurality of cavity positioning elements 12 are evenly spaced along the circumference of the substrate 11, and one end of each element is fixedly connected to the edge of the substrate 11. The plurality of positioning sleeves 13 penetrate the substrate 11 vertically and are fixedly connected to the substrate 11, with their positions corresponding one-to-one with the lifting pin mounting holes. The calibration element 14 can be inserted or removed along the axial direction of the positioning sleeve 13, and the outer circumferential surface of the calibration element 14 is clearance-fitted with the inner circumferential surface of the positioning sleeve 13. During assembly, the calibration element 14 is inserted into the positioning sleeve 13 from top to bottom, first inserted into the large hole of the Plate and positioned and locked, then aligned with the middle hole of the Ceramic Plate, and finally the small hole of the Heater is adjusted to fit with the calibration element 14 and locked. Layered calibration ensures that the holes of the three-layer plate are coaxially aligned, solving the problem of misalignment of the mounting holes.

[0040] With the above structure, the tool can achieve precise positioning with the equipment cavity 5 through the cavity positioning component 12, guide the calibration component 14 using the positioning sleeve 13, and then achieve layered calibration of the hole positions of the three-layer board by having multiple calibration segments of the calibration component 14 cooperate with the holes of Plate, Ceramic Plate and Heater respectively, ensuring the uniformity of the reference of the lifting pin mounting holes, avoiding the lifting pin skew, improving the stability of wafer transfer, and reducing the occurrence of lifting pin breakage.

[0041] Reference Figure 3 In one embodiment, each calibration element 14 includes at least two calibration segments connected sequentially with increasing diameters. The calibration element 14 is inserted into the positioning sleeve 13 in ascending order of the diameters of the calibration segments. Specifically, the at least two calibration segments of each calibration element 14 can be cylindrical, with the connection points of adjacent calibration segments using either a rounded or right-angled transition. The diameters are connected sequentially from smallest to largest. When the calibration element 14 is inserted into the positioning sleeve 13, the smallest diameter calibration segment is inserted first, followed by the larger diameter calibration segments. Layered calibration is achieved through the matching of calibration segments of different diameters with corresponding holes. This method of insertion starting from the smallest diameter ensures smooth movement of the calibration element 14 within the positioning sleeve 13, effectively guiding the calibration element 14 into the positioning sleeve 13 and initiating the positioning process.

[0042] Continue to refer to Figure 3 In this embodiment, the calibration element 14 includes a first calibration segment 141, a second calibration segment 142, and a third calibration segment 143 connected sequentially with increasing diameters. Specifically, a preferred embodiment of the calibration element 14 includes three calibration segments with different diameters: the first calibration segment 141, the second calibration segment 142, and the third calibration segment 143. The first calibration segment 141 has the smallest outer diameter and is located at the foremost end (insertion end) of the calibration element 14; the second calibration segment 142 is connected after the first calibration segment 141 and has a larger outer diameter than the first calibration segment 141; the third calibration segment 143 is connected after the second calibration segment 142, has the largest outer diameter, and is located at the tail end of the calibration element 14. The calibration segments are smoothly connected by transition steps or conical surfaces. The outer diameters of these three calibration sections are designed to precisely match the hole diameter requirements of the small mounting holes of the upper layer plate (such as Heater), the medium mounting holes of the middle layer plate (such as Ceramic Plate), and the large mounting holes of the lower layer plate (such as Plate), respectively, so that the mounting holes of these three layers can be positioned and calibrated layer by layer.

[0043] Continue to refer to Figure 3 In this embodiment, the calibration component 14 further includes a limiting segment 144 coaxial with the calibration segment. The limiting segment 144 is connected to the calibration segment with the largest diameter, and the diameter of the limiting segment 144 is larger than the diameter of the positioning sleeve 13. Specifically, at the tail end of the calibration segment with the largest diameter (such as the third calibration segment 143 mentioned above), the calibration component 14 also has a limiting segment 144 connected. This limiting segment 144 is coaxial with all the calibration segments of the calibration component 14. The outer diameter of the limiting segment 144 is designed to be larger than the minimum diameter of the inner hole of the positioning sleeve 13 or larger than the diameter of the positioning sleeve 13 itself. When the calibration piece 14 is inserted into the positioning sleeve 13 from its small diameter end and inserted downwards, the limiting section 144 serves to prevent it from further penetrating the positioning sleeve 13 when its maximum diameter calibration section (third calibration section 143) is fully inserted into or below the positioning sleeve 13. In this way, the limiting section 144 acts as a physical barrier, preventing the calibration piece 14 from accidentally penetrating the positioning sleeve 13 and falling out of the tool under gravity or operational pressure, thus improving operational convenience and tool safety. Simultaneously, the limiting section 144 can also serve as a handhold for the operator.

[0044] Reference Figures 4-6In one embodiment, the lifting pin mounting hole calibration tool 1 further includes a plurality of suction ring positioning members 15, which are spaced apart along the circumferential direction of the substrate 11 with the center of the substrate 11 as a reference, and each suction ring positioning member 15 is adjacent to each cavity positioning member 12 in a one-to-one correspondence. Specifically, the suction ring positioning member 15 can be configured as a positioning pin or a positioning post, and its material can be metal or hard plastic, which can cooperate with the positioning hole of the suction ring 4 of the equipment to achieve positioning; the shape of the suction ring positioning member 15 can be cylindrical or prismatic, and its axial length can be the same as or different from the length of the cavity positioning member 12, mainly used to provide an additional positioning reference for the tool during cavity maintenance. The plurality of suction ring positioning members 15 are distributed circumferentially with the center of the substrate 11 as a reference, and are adjacent to each cavity positioning member 12 in a one-to-one correspondence, that is, each suction ring positioning member 15 is provided next to a corresponding cavity positioning member 12, both of which are fixedly connected to the edge of the substrate 11, and their axial direction is perpendicular to the substrate 11. By setting the vacuum ring positioning component 15, the tool can not only be positioned by the cavity positioning component 12 during assembly, but also by the vacuum ring positioning component 15 cooperating with the vacuum ring 4 during cavity maintenance. This increases the adaptability of positioning scenarios, further ensures the stability of the calibration benchmark, and improves the calibration accuracy.

[0045] Continue to refer to Figure 4 In one embodiment, the lifting pin mounting hole calibration tool 1 further includes a central bearing seat 16 and a measuring gauge 2. The central bearing seat 16 is located at the center of the substrate 11, and the measuring gauge 2 is rotatably connected to the central bearing seat 16 via a rotating shaft. Specifically, the central bearing seat 16 can be configured as a cylindrical seat or a block structure with a bearing cavity, and its interior can be provided with rolling bearings or sliding bearings to provide rotational support for the rotating shaft. The measuring gauge 2 can be a dial indicator or a micrometer indicator, which has a testing probe and a dial display, and can obtain parameters such as flatness and coaxiality by contacting the surface being measured with the probe. The rotating shaft can be a metal shaft, one end of which can be fixedly connected to the measuring gauge 2, and the other end of which can cooperate with the bearing in the central bearing seat 16. The central bearing seat 16 is fixedly installed at the center of the substrate 11 and remains coaxial with the substrate 11. One end of the rotating shaft is inserted into the bearing of the central bearing seat 16, allowing it to rotate freely relative to the central bearing seat 16. The other end is fixedly connected to the body of the gauge 2, enabling the gauge 2 to rotate around the central bearing seat 16 with the rotating shaft. Through this structure, the tool can inspect the surface parallelism and coaxiality of the Heater by rotating the gauge 2. Combined with the mounting hole calibration function, it achieves comprehensive inspection and calibration of the equipment, further ensuring the Heater installation accuracy and improving the equipment's operational stability.

[0046] Reference Figures 7-9The lifting pin mounting hole calibration tool 1 of this utility model embodiment can not only calibrate the lifting pin mounting hole, but also detect the surface parallelism and coaxiality of the Heater. To facilitate understanding of this application, three usage scenarios of the lifting pin mounting hole calibration tool 1 of this embodiment are described below.

[0047] Reference Figure 7 The first scenario involves calibrating the mounting holes of the lifting pins: First, the calibration piece 14 is movably inserted into the positioning sleeve 13, and the substrate 11 is positioned on the reference surface of the process cavity 5 using the cavity positioning piece 12; then, the lower layer plate (such as Plate) is placed in a predetermined position, so that the large-diameter calibration section of the calibration piece 14 passes through the large mounting hole of this layer, positioning and locking the lower layer plate; then, the middle layer plate (such as Ceramic) is... The middle plate is stacked on top of the lower plate, so that the medium-diameter calibration section of the calibration component 14 passes through the medium mounting hole of the layer for positioning, and the middle plate is locked. Finally, the upper plate (such as Heater) is stacked on top of the middle plate, so that the small-diameter calibration section of the calibration component 14 passes through the small mounting hole of the layer for positioning. The position of the upper plate is adjusted until the calibration section is adapted to it, and then the upper plate is locked. Through the above-mentioned layered and sequential locking assembly method, the calibration component 14 guides and positions the mounting holes of each layer plate with its different diameter sections, forcibly ensuring that the mounting holes of each layer remain coaxial with the guide hole of the positioning sleeve 13 in the final locked state, thereby solving the misalignment problem caused by the cumulative misalignment of the mounting holes of the lifting pins of the multi-layer plate.

[0048] Reference Figure 8 The second application scenario is for measuring the parallelism of the Heater surface: During cavity maintenance, the vacuum ring positioning part 15 of the calibration tool is positioned in conjunction with the positioning hole on the top of the vacuum ring 4 to stabilize and fix the substrate 11. The probe of the measuring instrument 2 is brought into contact with the Heater surface and zeroed. The measuring instrument 2 is held and slowly rotated around the central bearing seat 16 with the rotating shaft. The change in the reading of the measuring instrument 2 during the rotation is observed. The parallelism deviation between the Heater surface and the reference surface is judged by the fluctuation of the reading, thus completing the measurement of the Heater surface parallelism.

[0049] Reference Figure 9 The third application scenario is for detecting the coaxiality of the Heater: The calibration tool is positioned on top of the vacuum ring 4 using the vacuum ring positioning component 15, ensuring that the substrate 11 and the vacuum ring 4 are coaxial. The probe of the measuring gauge 2 is adjusted to contact the side wall of the cavity 5 and an initial reading is set. The measuring gauge 2 is rotated to move the probe along the circumferential direction of the side wall of the cavity 5. The change in the reading of the measuring gauge 2 during the rotation is recorded. The coaxiality between the Heater and the cavity 5 is determined based on the difference in the reading, thus realizing the measurement of the Heater coaxiality.

[0050] This utility model embodiment also provides a semiconductor thin film deposition apparatus, including a cavity 5 and a heating plate 3 disposed in the cavity 5. The heating plate 3 has multiple lifting pin mounting holes of different diameters along its axial direction. The lifting pin mounting holes are calibrated using the lifting pin mounting hole calibration tool 1 as described in the above embodiment. The lifting pin mounting hole calibration tool 1 has been described in detail in the above embodiment, and will not be repeated here for the sake of brevity. Specifically, the cavity 5 of this semiconductor thin film deposition apparatus is a closed process space, and the heating plate 3 is horizontally disposed inside the cavity 5 to support the wafer and provide the temperature required for the process. The heating plate 3 has lifting pin mounting holes that extend through its axial direction, and these mounting holes form segments of different diameters from one side closest to the wafer to the other side. During the equipment assembly stage, the lifting pin mounting hole calibration tool 1 of the above embodiment is used to calibrate the lifting pin mounting holes by cooperating with the calibration component 14 and each segment of the holes, ensuring that the holes are coaxial and providing a basis for the stable installation of the lifting pins.

[0051] In one embodiment, the heating plate 3 includes a first layer plate 31, a second layer plate 32, and a third layer plate 33 stacked sequentially along the axial direction of the heating plate 3. The first layer plate 31 has a first lifting pin mounting hole 311, the second layer plate 32 has a second lifting pin mounting hole 321, and the third layer plate 33 has a third lifting pin mounting hole 331. The diameter of the first lifting pin mounting hole 311 is larger than the diameter of the second lifting pin mounting hole 321, and the diameter of the second lifting pin mounting hole 321 is larger than the diameter of the third lifting pin mounting hole 331. Specifically, the heating plate 3 adopts a three-layer composite structure: the first layer plate 31 (e.g., Plate) is located at the bottom and has the largest diameter first lifting pin mounting hole 311; the second layer plate 32 (e.g., Ceramic Plate) is stacked above the first layer plate 31 and has a medium diameter second lifting pin mounting hole 321; the third layer plate 33 (e.g., Heater body) is located at the top and has the smallest diameter third lifting pin mounting hole 331. The diameter of the first lifting pin mounting hole 311 is greater than that of the second lifting pin mounting hole 321, which is greater than that of the third lifting pin mounting hole 331, forming a stepped hole diameter distribution. This calibration structure design allows the lifting pin to be guided and positioned by the larger holes during passage, and then precisely centered through the smaller holes. During calibration, the three-section stepped shaft of the calibration component 14 is forcibly matched with the hole diameters of the three layers, eliminating inter-layer misalignment. After the hole positions of each layer plate are calibrated by the calibration tool, it can be ensured that the lifting pin is inserted without deviation, improving lifting stability.

[0052] In one embodiment, the top of the cavity 5 is provided with a plurality of cavity positioning grooves (not shown in the figure) that cooperate with the cavity positioning member 12. The plurality of cavity positioning grooves are spaced apart on the top of the cavity 5 with the center of the cavity 5 as a reference. Specifically, a plurality of cavity positioning grooves are provided on the inner wall or edge of the top of the cavity 5, the number of which is the same as that of the cavity positioning member 12, and the shape can be adapted to the positioning pin or positioning block or other structures. These cavity positioning grooves are evenly distributed in the circumferential direction with the center of the cavity 5 as the center. When the calibration tool is positioned, the cavity positioning member 12 can be embedded in the positioning groove to achieve circumferential and radial limiting, so that the substrate 11 and the cavity 5 remain coaxial, providing a precise reference for the calibration of the lifting pin mounting hole.

[0053] In one embodiment, the semiconductor thin film deposition apparatus further includes a suction ring 4, which is disposed on the top of the cavity 5. The suction ring 4 has multiple positioning holes (not shown in the figure) that mate with the suction ring positioning member 15. These positioning holes are spaced apart along the circumference of the suction ring 4 on its top surface. Specifically, the suction ring 4 is horizontally installed inside the top of the cavity 5 to discharge waste gas generated during the process. Its top surface has multiple positioning holes, the number and position of which correspond to the suction ring positioning member 15. The hole diameter can be adapted to positioning pins or positioning posts. During cavity maintenance, the suction ring positioning member 15 of the calibration tool is inserted into the positioning hole to complete the positioning. At this time, the substrate 11 and the suction ring 4 remain relatively fixed, providing stable support for subsequent measurements of the heater surface parallelism and coaxiality.

[0054] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A tool for calibrating mounting holes for lifting pins, characterized in that, include: substrate; Multiple cavity positioning elements are spaced apart on the edge of the substrate along the circumferential direction of the substrate, with the center of the substrate as a reference. Multiple positioning sleeves are distributed on the substrate at positions corresponding to the lifting pin mounting holes, and the positioning sleeves axially penetrate the substrate; Multiple calibration components have multiple calibration segments of different diameters along their axial direction. The diameter of the calibration segment matches the diameter of the lifting pin mounting hole. The calibration component is movably inserted into the positioning sleeve.

2. The lifting pin mounting hole calibration tool according to claim 1, characterized in that, Each of the calibration components includes at least two calibration segments connected in sequence with increasing diameter, wherein the calibration components are inserted into the positioning sleeve in order of increasing diameter of the calibration segments.

3. The lifting pin mounting hole calibration tool according to claim 2, characterized in that, The calibration component includes a first calibration segment, a second calibration segment, and a third calibration segment connected in sequence with increasing diameter.

4. The lifting pin mounting hole calibration tool according to claim 2, characterized in that, The calibration component also includes a limiting section coaxial with the calibration section, the limiting section being connected to the calibration section with the largest diameter, and the diameter of the limiting section being larger than the diameter of the positioning sleeve.

5. The lifting pin mounting hole calibration tool according to claim 1, characterized in that, It also includes multiple suction ring positioning components, which are spaced apart on the edge of the substrate along the circumferential direction of the substrate with the center of the substrate as a reference, and each suction ring positioning component is adjacent to each cavity positioning component in a one-to-one correspondence.

6. The lifting pin mounting hole calibration tool according to any one of claims 1-5, characterized in that, It also includes a central bearing housing and a test gauge, wherein the central bearing housing is located at the center of the substrate, and the test gauge is rotatably connected to the central bearing housing via a rotating shaft.

7. A semiconductor thin film deposition apparatus, characterized in that, It includes a cavity and a heating plate disposed in the cavity. The heating plate has multiple lifting pin mounting holes of different diameters along its axial direction. The lifting pin mounting holes are calibrated using the lifting pin mounting hole calibration tool as described in any one of claims 1-6.

8. The semiconductor thin film deposition apparatus according to claim 7, characterized in that, The heating plate includes a first plate, a second plate, and a third plate stacked sequentially along the axial direction of the heating plate. The first plate has a first lifting pin mounting hole, the second plate has a second lifting pin mounting hole, and the third plate has a third lifting pin mounting hole. The diameter of the first lifting pin mounting hole is larger than the diameter of the second lifting pin mounting hole, and the diameter of the second lifting pin mounting hole is larger than the diameter of the third lifting pin mounting hole.

9. The semiconductor thin film deposition apparatus according to claim 7, characterized in that, The top of the cavity is provided with multiple cavity positioning grooves that cooperate with the cavity positioning component. The multiple cavity positioning grooves are provided at intervals on the top of the cavity along the circumferential direction of the cavity, with the center of the cavity as the reference.

10. The semiconductor thin film deposition apparatus according to claim 7, characterized in that, It also includes a vacuum ring, which is located at the top of the cavity. The vacuum ring has multiple positioning holes that cooperate with the positioning components of the vacuum ring. The multiple positioning holes are spaced apart at the top of the vacuum ring along the circumferential direction.

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