A hanger for gold plating processing of a circuit board

Abstract

The utility model relates to circuit board gold plating technical field discloses a kind of hangers for circuit board gold plating processing, including the bottom plate for supporting upper end component, the center of bottom plate top end is provided with the clamping adjusting mechanism for spacing can be adjusted according to different size circuit board, the inner cavity of clamping adjusting mechanism top end is provided with the positioning assembly for circuit board gold plating processing, and gold plating placement assembly for bearing gold plating is arranged between two groups of symmetrically arranged clamping adjusting mechanism, first fixed column firm support, cylinder drive telescopic rod accurate force transmission, drive movable column along Z shape movement axis smooth sliding, avoid deviation jam. Second fixed column, first connecting plate and second connecting plate linkage, make both sides movable column symmetrical synchronous reverse movement, realize the flexible accurate adjustment of the spacing between different size circuit boards, improve the adaptability and the operation convenience of hanger, lay the processing stable foundation.

Description

Technical Field

[0001] This utility model relates to the field of immersion gold plating technology for circuit boards, specifically, to a fixture for immersion gold plating of circuit boards. Background Technology

[0002] Printed circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. During the production process, printed circuit boards require electroless nickel-gold plating to coat the surface of the circuit board with a layer of nickel-phosphorus alloy, followed by a substitution reaction to coat the nickel surface with gold. After electroplating, a fixture is needed. A fixture is a commonly used tool in the electroplating process, which serves as a carrier to fix the product and complete the electroplating process.

[0003] For example, CN218291166U discloses a chemical electroless nickel-gold plating fixture for printed circuit boards, including a support frame and a drive mechanism mounted on the support frame. A hanging mechanism is installed at the bottom of the drive mechanism. The drive mechanism includes an electric cylinder fixedly connected to the center of the top of the support frame. A drive rod is fixedly connected to the output end of the electric cylinder. A sealing shell is fixedly connected to the bottom of the drive rod. A servo motor is fixedly connected to the bottom of the inner wall of the sealing shell. A drive shaft is fixedly connected to the output shaft of the servo motor. This invention, through the cooperation of the support frame, drive mechanism, and hanging mechanism, realizes a chemical electroless nickel-gold plating fixture for printed circuit boards. It not only facilitates the clamping and fixing of the printed circuit boards to be processed, but also facilitates the lifting, lowering, and circumferential rotation of the clamped circuit boards, thereby ensuring uniform electroplating of the circuit boards immersed in the plating solution and thus guaranteeing the production quality of the printed circuit boards.

[0004] However, in the immersion gold processing of circuit boards, traditional fixtures suffer from limited adaptability, making it difficult to flexibly adjust the clamping spacing according to different circuit board sizes, resulting in insufficient compatibility with diverse circuit board specifications. Furthermore, the positioning structure of traditional fixtures lacks stability, easily causing the circuit board to shift or wobble during processing, affecting the accuracy of the immersion gold processing. Additionally, some positioning components may cause scratch damage to the circuit board surface, failing to meet high-quality processing requirements. Therefore, those skilled in the art provide a fixture for immersion gold processing of circuit boards to solve the problems mentioned in the background art. Utility Model Content

[0005] The purpose of this utility model is to provide a fixture for immersion gold processing of circuit boards, which solves the problem that traditional fixtures have limited adaptability in the immersion gold processing of circuit boards, making it difficult to flexibly adjust the clamping distance according to different sizes of circuit boards, resulting in insufficient compatibility with circuit boards of various specifications.

[0006] This utility model provides the following technical solution: a hanger for immersion gold processing of circuit boards, including a base plate for supporting the upper part, a clamping adjustment mechanism for adjusting the spacing of circuit boards of different sizes is provided at the center of the top of the base plate, a positioning component for immersion gold processing of circuit boards is provided in the inner cavity of the top of the clamping adjustment mechanism, and an immersion gold placement component for carrying immersion gold is provided between two symmetrically arranged clamping adjustment mechanisms.

[0007] As a preferred embodiment of the above technical solution, the clamping and adjusting mechanism includes a first fixed column, which is fixedly connected to the top of the base plate. A cylinder is hinged to one side of the first fixed column, and a telescopic rod is slidably connected to the inner cavity of the cylinder at the end away from the first fixed column. A first connecting column is fixedly connected to the end of the telescopic rod away from the cylinder.

[0008] As a preferred embodiment of the above technical solution, a movable shaft is fixedly connected to the top of the base plate, the two sides of the movable shaft are Z-shaped, a movable column is slidably connected to the outer side of the movable shaft, and the connection between the movable column and the movable shaft is Z-shaped. A second connecting column is fixedly connected to one side of the top of the movable column, and the second connecting column and the first connecting column are hinged. An L-shaped connecting plate is fixedly connected to the center of the top of the movable column, and a positioning groove is provided at the center of the top of the L-shaped connecting plate.

[0009] As a preferred embodiment of the above technical solution, a second fixed column is fixedly connected to the center of the top of the base plate, a first connecting plate is rotatably connected to the center of the top of the second fixed column, a second connecting plate is hinged to the center of both ends of the first connecting plate, a connecting shaft is rotatably connected to the center of the end of the second connecting plate away from the first connecting plate, and the bottom end of the connecting shaft is fixedly connected to the top of the movable column.

[0010] As a preferred embodiment of the above technical solution, the positioning component includes a circular hanging column, which is fixedly connected to the upper side of the inner cavity of the positioning groove. Three sets of circular hanging columns are symmetrically arranged, and all three sets of symmetrically arranged circular hanging columns are fixedly connected to the inner cavity of the positioning groove. A flexible positioning plate is fixedly connected to the lower side of the inner cavity of the positioning groove, and the lengths of the flexible positioning plate and the circular hanging column are slightly longer than the length of the inner cavity of the positioning groove.

[0011] As a preferred embodiment of the above technical solution, the immersion gold placement assembly includes a third fixing column, which is fixedly connected to one side of an L-shaped connecting plate. A telescopic shaft is slidably connected to the inner cavity of the third fixing column away from the L-shaped connecting plate. An immersion gold placement plate is fixedly connected to the end of the telescopic shaft away from the L-shaped connecting plate. The inner cavity of the immersion gold placement plate is provided with a slot for carrying the immersion gold.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] This utility model features a clamping and adjusting mechanism. A stable connection between the first fixed column and the base plate provides the installation foundation. The hinged design between the cylinder and the first fixed column allows for flexible movement. The cylinder drives the telescopic rod to extend and retract, achieving precise power transmission. The hinged connection between the first and second connecting columns drives the movable column to slide along a Z-shaped moving axis. The Z-shaped structure effectively constrains the trajectory of the movable column, preventing deviation and jamming. Simultaneously, the linkage structure formed by the second fixed column, the first connecting plate, and the second connecting plate ensures that the movable columns on both sides move symmetrically and synchronously in opposite directions during adjustment. This enables flexible and precise adjustment of the spacing between circuit boards of different sizes, significantly improving the adaptability and ease of operation of the fixture, and laying the foundation for subsequent positioning and processing stability.

[0014] Based on the aforementioned beneficial effects, this utility model incorporates a positioning component. Three sets of circular hanging posts symmetrically arranged on the upper side of the positioning groove cavity form multi-point limiting of the circuit board from above, effectively preventing upward displacement or shaking of the circuit board during processing. The soft positioning plate on the lower side is flexible, providing stable support when in contact with the bottom of the circuit board while avoiding scratches or damage to the circuit board surface caused by hard contact. Furthermore, the lengths of both the soft positioning plate and the circular hanging posts are slightly longer than the length of the positioning groove cavity, allowing for better adaptation to circuit boards of different widths. This ensures that the circuit board maintains a stable position during immersion gold processing, improving positioning reliability and processing accuracy.

[0015] Based on the aforementioned beneficial effects, this utility model is equipped with an immersion gold placement component. The fixed connection between the third fixed column and the L-shaped connecting plate provides a stable installation foundation, ensuring that the structure is not easily loosened. The sliding connection between the telescopic shaft and the third fixed column allows the immersion gold placement plate to move flexibly according to the spacing adjustment of the clamping adjustment mechanism, always maintaining the optimal processing position between the two sets of clamping adjustment mechanisms, thus improving overall coordination. The groove in the inner cavity of the immersion gold placement plate is specially designed to support the immersion gold, effectively limiting the immersion gold and preventing it from shifting due to shaking or liquid impact during processing. This ensures the relative position stability of the immersion gold and the circuit board, providing a strong guarantee for the accuracy and reliability of immersion gold processing. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of a mounting fixture for immersion gold plating of circuit boards.

[0017] Figure 2 A schematic diagram showing the connection of the first fixed column of the clamping and adjusting mechanism of a fixture for immersion gold plating of circuit boards;

[0018] Figure 3 A schematic diagram of the L-shaped connecting plate connection of a clamping and adjusting mechanism for a circuit board immersion gold processing fixture;

[0019] Figure 4 A schematic diagram of the circular hanging column connection of a positioning component for a fixture used in immersion gold plating of circuit boards;

[0020] Figure 5 This is a schematic diagram showing the connection of an immersion gold placement plate in a fixture for immersion gold processing of circuit boards.

[0021] In the diagram: 1. Base plate; 2. Clamping and adjusting mechanism; 21. First fixed column; 22. Cylinder; 23. Telescopic rod; 24. First connecting column; 25. Moving shaft; 26. Movable column; 27. Second connecting column; 28. L-shaped connecting plate; 29. ​​Positioning groove; 210. Second fixed column; 211. First connecting plate; 212. Second connecting plate; 213. Connecting shaft; 3. Positioning assembly; 31. Circular hanging column; 32. Flexible positioning plate; 4. Immersion gold placement assembly; 41. Third fixed column; 42. Telescopic shaft; 43. Immersion gold placement plate. Detailed Implementation

[0022] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0023] Please see Figures 1-5 As shown, this utility model provides a technical solution: a hanger for immersion gold processing of circuit boards, including a base plate 1 for supporting the upper part, a clamping adjustment mechanism 2 for adjusting the spacing according to different sizes of circuit boards is provided at the center of the top of the base plate 1, a positioning component 3 for immersion gold processing of circuit boards is provided in the inner cavity of the top of the clamping adjustment mechanism 2, and an immersion gold placement component 4 for carrying immersion gold is provided between two symmetrically arranged clamping adjustment mechanisms 2.

[0024] The base plate 1 serves as the fundamental support component, providing a stable load-bearing platform for the entire fixture and ensuring the secure installation of all components. The clamping adjustment mechanism 2 can flexibly adjust the spacing according to circuit boards of different sizes, breaking the limitation of traditional fixtures' single adaptability and significantly improving the fixture's compatibility with diverse circuit board specifications. The positioning component 3, through its reasonable structural design, precisely positions the circuit board, effectively preventing offset or shaking during processing and providing reliable assurance for the accuracy of immersion gold processing. The immersion gold placement component 4 between the two sets of clamping adjustment mechanisms 2 can flexibly adapt its position according to the adjustment of the clamping spacing; its slot structure provides a stable load-bearing space for the immersion gold, ensuring the material is placed securely during the immersion gold processing.

[0025] As one implementation method in this embodiment, please refer to Figures 1-2 As shown, the clamping adjustment mechanism 2 includes a first fixed column 21, which is fixedly connected to the top of the base plate 1. A cylinder 22 is hinged to one side of the first fixed column 21. A telescopic rod 23 is slidably connected to the inner cavity of the cylinder 22 away from the first fixed column 21. A first connecting column 24 is fixedly connected to the end of the telescopic rod 23 away from the cylinder 22.

[0026] The fixed connection between the first fixed column 21 and the base plate 1 provides a stable installation foundation for the entire mechanism, ensuring the stability of the overall structure during adjustment. The cylinder 22 is hinged to the first fixed column 21, providing flexible rotation space for the cylinder 22 and avoiding the movement limitations caused by rigid connections. The cylinder 22 drives the telescopic rod 23 to slide along its inner cavity, transmitting power through the extension and retraction of the telescopic rod 23. This driving method offers rapid response and high adjustment precision, accurately controlling spacing changes. The first connecting column 24 at the end of the telescopic rod 23 serves as a force transmission node, efficiently transmitting the driving force of the cylinder 22 to subsequent connecting components, providing stable power for the sliding adjustment of the movable column 26. This enables flexible and precise adjustment of the clamping spacing for circuit boards of different sizes, improving the adaptability and ease of operation of the hanger.

[0027] As one implementation method in this embodiment, please refer to Figures 1-2 As shown, a movable shaft 25 is fixedly connected to the top of the base plate 1. The two sides of the movable shaft 25 are Z-shaped. A movable column 26 is slidably connected to the outer side of the movable shaft 25. The connection between the movable column 26 and the movable shaft 25 is Z-shaped. A second connecting column 27 is fixedly connected to one side of the top of the movable column 26. The second connecting column 27 and the first connecting column 24 are hinged. An L-shaped connecting plate 28 is fixedly connected to the center of the top of the movable column 26. A positioning groove 29 is provided at the center of the top of the L-shaped connecting plate 28.

[0028] The movable shaft 25, fixed at the top of the base plate 1, provides a stable sliding track for the movable column 26. Its Z-shaped sides, which are matched with the Z-shaped structure at the connection point with the movable column 26, form a precise guide limit, effectively constraining the sliding trajectory of the movable column 26 and preventing deviation, shaking, or jamming during sliding, ensuring the smoothness and accuracy of the movable column 26's movement. The movable column 26 is hinged to the first connecting column 24 of the telescopic rod 23 via the second connecting column 27, efficiently converting the driving force of the cylinder 22 into the sliding power of the movable column 26, achieving flexible transmission of spacing adjustment. The L-shaped connecting plate 28 fixed at the top of the movable column 26 and the positioning groove 29 at the top directly provide a bearing base for the placement of the circuit board, enabling the positioning component 3 to be stably installed and perform its positioning function. The overall structure, through the combination of mechanical linkage and guide limit, ensures the stability of the adjustment process and lays the foundation for the subsequent precise positioning of the circuit board, improving the operational reliability and adaptation accuracy of the hanger.

[0029] As one implementation method in this embodiment, please refer to Figures 1-3As shown, a second fixed post 210 is fixedly connected to the center of the top of the base plate 1. A first connecting plate 211 is rotatably connected to the center of the top of the second fixed post 210. A second connecting plate 212 is hinged to the center of both ends of the first connecting plate 211. A connecting shaft 213 is rotatably connected to the center of the end of the second connecting plate 212 away from the first connecting plate 211, and the bottom end of the connecting shaft 213 is fixedly connected to the top of the movable post 26.

[0030] The second fixed column 210 at the top center of the base plate 1 provides a stable support base for the entire linkage structure. The first connecting plate 211, which is rotatably connected to the top of the first connecting plate 211, can rotate flexibly around the fixed point, serving as a transmission hub to achieve balanced transmission of forces on both sides. The two ends of the first connecting plate 211 are connected to the connecting shaft 213 at the top of the movable column 26 through the hinged second connecting plate 212, forming a symmetrical linkage structure. When one side of the movable column 26 slides under the action of driving force, it will drive the first connecting plate 211 to rotate synchronously through the second connecting plate 212, thereby driving the other side of the movable column 26 to slide symmetrically in the opposite direction.

[0031] As one implementation method in this embodiment, please refer to Figures 1-4 As shown, the positioning component 3 includes a circular hanging post 31, which is fixedly connected to the upper side of the inner cavity of the positioning groove 29. Three sets of circular hanging posts 31 are symmetrically arranged, and all three sets of symmetrically arranged circular hanging posts 31 are fixedly connected to the inner cavity of the positioning groove 29. A flexible positioning plate 32 is fixedly connected to the lower side of the inner cavity of the positioning groove 29, and the lengths of the flexible positioning plate 32 and the circular hanging posts 31 are slightly longer than the length of the inner cavity of the positioning groove 29.

[0032] Three sets of circular hanging posts 31, symmetrically arranged on the upper side of the positioning groove 29, provide multi-point positioning for the circuit board placed within the positioning groove 29 from above. This effectively prevents the circuit board from shifting or wobbling upwards due to external forces or liquid flow during immersion gold processing, ensuring precise positioning. The flexible positioning plate 32 on the lower side of the positioning groove 29 is soft and provides flexible support when in contact with the bottom of the circuit board, preventing scratches, indentations, or other damage to the circuit board surface or plating caused by hard contact, thus protecting the integrity of the circuit board. Furthermore, the flexible positioning plate 32 and the circular hanging posts 31 are slightly longer than the inner length of the positioning groove 29, allowing for better adaptation to circuit boards of different widths. Regardless of the circuit board's width, stable positioning can be achieved through the extensions of the hanging posts and positioning plate, further improving the adaptability and positioning reliability of the positioning component 3 for circuit boards of different specifications.

[0033] As one implementation method in this embodiment, please refer to Figures 1-5As shown, the immersion gold placement assembly 4 includes a third fixing post 41, which is fixedly connected to one side of the L-shaped connecting plate 28. A telescopic shaft 42 is slidably connected to the inner cavity of the end of the third fixing post 41 away from the L-shaped connecting plate 28. An immersion gold placement plate 43 is fixedly connected to the end of the telescopic shaft 42 away from the L-shaped connecting plate 28. The inner cavity of the immersion gold placement plate 43 is provided with a slot for carrying the immersion gold.

[0034] The fixed connection between the third fixed post 41 and the L-shaped connecting plate 28 provides a stable installation foundation for the component, ensuring that the overall structure is not easily loosened during processing. The telescopic shaft 42 is slidably connected to the inner cavity of the third fixed post 41, allowing the immersion gold placement plate 43 to flexibly adjust its position as the telescopic shaft 42 slides. When the clamping adjustment mechanism 2 adjusts the spacing according to the circuit board size, the immersion gold placement plate 43 can move synchronously to adapt, always maintaining the optimal processing position between the two sets of clamping adjustment mechanisms 2, thus improving the overall coordination of the fixture. The slot opened in the inner cavity of the immersion gold placement plate 43 is specially designed to support the immersion gold, effectively limiting the immersion gold and preventing displacement due to shaking or liquid impact during processing, ensuring the relative position stability of the immersion gold and the circuit board.

[0035] Working principle: First, the base plate 1 provides stable support for the entire hanger. The clamping and adjusting mechanism 2, as the core adjusting component, starts working: the cylinder 22 on the first fixed column 21 drives the telescopic rod 23 to extend and retract. Through the hinge relationship between the first connecting column 24 and the second connecting column 27 on the movable column 26, the movable column 26 is driven to slide along the Z-shaped moving axis 25. At the same time, the first connecting plate 211 on the second fixed column 210 in the center of the base plate 1 and the second connecting plates 212 on both sides form a linkage structure. When the movable column 26 on one side slides, the rotation of the connecting plate synchronously drives the movable column 26 on the other side to slide symmetrically in the opposite direction, realizing the precise adjustment of the distance between the two sets of movable columns 26 to adapt to circuit boards of different sizes. After the distance adjustment is completed, the circuit board is placed in the positioning groove 29 at the top of the L-shaped connecting plate 28. The three sets of symmetrical circular hanging columns 31 on the upper side of the positioning groove 29 form multi-point limiting from above to prevent the circuit board from moving upward; the lower side The flexible positioning plate 32 provides flexible support to prevent damage to the circuit board surface. The design of the hanging post and positioning plate being slightly longer than the positioning groove 29 further adapts to circuit boards of different widths, ensuring stable positioning during processing. Simultaneously, the immersion gold placement component 4 adjusts synchronously with the clamping adjustment mechanism 2: the third fixing post 41 drives the immersion gold placement plate 43 to move flexibly via the telescopic shaft 42, ensuring the placement plate is always in the optimal position between the two sets of clamping adjustment mechanisms 2. Its inner cavity slot firmly supports the immersion gold, preventing displacement due to shaking or liquid impact during processing. Ultimately, through the flexible spacing adjustment of the clamping adjustment mechanism 2, the precise fixing of the positioning component 3, and the stable support of the immersion gold placement component 4, the three work together to complete the immersion gold processing operation of the circuit board.

[0036] The above embodiments are only used to illustrate the technical solution of this utility model, and are not intended to limit it.

Claims

1. A mounting fixture for immersion gold plating of circuit boards, characterized in that: The base plate (1) is used to support the upper part. A clamping adjustment mechanism (2) is provided at the center of the top of the base plate (1) for adjusting the spacing of circuit boards of different sizes. A positioning component (3) for immersion gold processing of circuit boards is provided in the inner cavity of the top of the clamping adjustment mechanism (2). An immersion gold placement component (4) for carrying immersion gold is provided between the two symmetrically arranged clamping adjustment mechanisms (2).

2. The mounting fixture for immersion gold plating of circuit boards according to claim 1, characterized in that: The clamping adjustment mechanism (2) includes a first fixed column (21), which is fixedly connected to the top of the base plate (1). A cylinder (22) is hinged to one side of the first fixed column (21). A telescopic rod (23) is slidably connected to the inner cavity of the cylinder (22) away from the first fixed column (21). A first connecting column (24) is fixedly connected to the end of the telescopic rod (23) away from the cylinder (22).

3. The mounting fixture for immersion gold plating of circuit boards according to claim 2, characterized in that: The top of the base plate (1) is fixedly connected to a movable shaft (25). The two sides of the movable shaft (25) are Z-shaped. A movable column (26) is slidably connected to the outer side of the movable shaft (25). The connection between the movable column (26) and the movable shaft (25) is Z-shaped. A second connecting column (27) is fixedly connected to one side of the top of the movable column (26). The second connecting column (27) and the first connecting column (24) are hinged. An L-shaped connecting plate (28) is fixedly connected to the center of the top of the movable column (26). A positioning groove (29) is provided at the center of the top of the L-shaped connecting plate (28).

4. The mounting fixture for immersion gold plating of circuit boards according to claim 3, characterized in that: A second fixed column (210) is fixedly connected to the center of the top of the base plate (1). A first connecting plate (211) is rotatably connected to the center of the top of the second fixed column (210). A second connecting plate (212) is hinged to the center of both ends of the first connecting plate (211). A connecting shaft (213) is rotatably connected to the center of the end of the second connecting plate (212) away from the first connecting plate (211). The bottom end of the connecting shaft (213) is fixedly connected to the top of the movable column (26).

5. The mounting fixture for immersion gold plating of circuit boards according to claim 1, characterized in that: The positioning component (3) includes a circular hanging post (31), which is fixedly connected to the upper side of the inner cavity of the positioning groove (29). Three sets of circular hanging posts (31) are symmetrically arranged, and all three sets of symmetrically arranged circular hanging posts (31) are fixedly connected to the inner cavity of the positioning groove (29). A flexible positioning plate (32) is fixedly connected to the lower side of the inner cavity of the positioning groove (29), and the lengths of the flexible positioning plate (32) and the circular hanging post (31) are slightly longer than the length of the inner cavity of the positioning groove (29).

6. The mounting fixture for immersion gold plating of circuit boards according to claim 1, characterized in that: The immersion gold placement assembly (4) includes a third fixing post (41), which is fixedly connected to one side of the L-shaped connecting plate (28). The inner cavity of the third fixing post (41) away from the L-shaped connecting plate (28) is slidably connected to a telescopic shaft (42). The end of the telescopic shaft (42) away from the L-shaped connecting plate (28) is fixedly connected to an immersion gold placement plate (43). The inner cavity of the immersion gold placement plate (43) is provided with a slot for carrying immersion gold.

Images