Direct type mini led backlight module arrangement structure

By using irregularly shaped ODs and LEDs with different pitches in the MiniLED backlight module, the LED layout is divided into upper and lower rectangular areas. The circuit board is mounted on the convex plane of the small OD area, which solves the problem of the difficulty in reducing the overall thickness of the MiniLED backlight module and achieves a thinner TV design.

CN224536306UActive Publication Date: 2026-07-21SICHUAN CHANGHONG ELECTRIC CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SICHUAN CHANGHONG ELECTRIC CO LTD
Filing Date
2025-07-01
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

The partitioned design of existing MiniLED backlight modules makes it difficult to reduce the overall thickness of the device, and the circuit board occupies a large space, which is not cost-effective.

Method used

The LEDs are arranged with irregular ODs and different pitches, dividing the LED layout into upper and lower rectangular areas. The upper and lower rectangular areas are arranged with large ODs and large pitches and small ODs and small pitches, respectively. The circuit board is mounted on the convex plane, and the space occupied by the circuit board is made up for by the space of the small OD area.

Benefits of technology

It achieves an ultimate wall-hugging effect by reducing the overall thickness of the unit while ensuring the number of partitions and controlling costs.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224536306U_ABST
    Figure CN224536306U_ABST
Patent Text Reader

Abstract

The utility model discloses a kind of direct type MiniLED backlight module arrangement structure, realize the LED arrangement of different Pitch of special OD, comprising: by metal backplate the upper part rectangular region and lower part rectangular region of LED layout division, respectively using big OD big Pitch arrangement or small OD small Pitch arrangement LED;And the lower part rectangular region of metal backplate forms convex plane to the side away from whole machine shell, to install circuit board card between convex plane and the space of whole machine shell. The utility model realizes the LED arrangement of different Pitch of special OD, in liquid crystal television whole machine hardware frame, several important circuit board cards can be made up by the space of small OD region more to compensate the space occupied by other hardware module, to achieve rear cover pure flat, extreme wall, reach the effect of reducing the thickness of whole machine.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This utility model relates to the field of backlight module technology, specifically, a direct-lit MiniLED backlight module layout structure. Background Technology

[0002] Currently, most mainstream MiniLED multi-zone backlit LCD TVs on the market use a uniform and equidistant arrangement of LED beads, and the distance between the upper surface of each lamp lens and the optical film is also equidistant. This optical design of the zone specification makes it impossible to make the distance extremely small. In addition, the circuit boards of various functional modules in the back cover of the TV occupy a certain amount of horizontal front and back space. Under the condition of limited cost, the overall thickness of the TV cannot be made thin enough, which makes it lack highlights among competing products in the industry. Utility Model Content

[0003] The purpose of this invention is to provide a direct-lit MiniLED backlight module layout structure that reduces the overall thickness of the device while ensuring the number of zones and controlling costs.

[0004] The present invention solves the above problems through the following technical solution:

[0005] A direct-lit MiniLED backlight module arrangement structure enables LEDs with irregular OD and different pitches, comprising: an upper rectangular area and a lower rectangular area divided by a metal backplate, wherein LEDs are arranged with large OD and large pitch or small OD and small pitch respectively; and the lower rectangular area of ​​the metal backplate forms an outward convex plane on the side away from the main body housing, so as to install the circuit board in the space between the outward convex plane and the main body housing.

[0006] As a further improvement, the upper rectangular area has a total of a rows and b columns of LEDs, i.e., a*b LEDs, and the lower rectangular area has a total of m rows and n columns of LEDs, i.e., m*n > a*b.

[0007] As a further improvement, m is an integer multiple of a, and n is an integer multiple of b.

[0008] As a further improvement, under the condition that the maximum power supplied to the LED backlight by the power supply of the whole machine is certain, the sum of the current of all LED beads does not exceed the maximum current of the power supply.

[0009] As a further improvement, each LED in the upper rectangular area and the lower rectangular area is a single LED in its own area and the current can be controlled independently.

[0010] As a further improvement, each LED in the upper rectangular area is connected in parallel to LED driver chip I, and each LED in the lower rectangular area is connected in parallel to LED driver chip II. LED driver chip I and LED driver chip II are respectively connected to the control module.

[0011] As a further improvement, the control module outputs four signals, which are respectively connected to LED driver chip I and LED driver chip II. Specifically, line one of the control module is connected to the MOSI input of LED driver chip I to achieve master device data output and slave device data input; line two of the control module is connected to the CS chip select signal of both LED driver chip I and LED driver chip II to achieve shared / cascaded chip select signal enable; line three of the control module is connected to the CLK clock signal of LED driver chip I to achieve synchronous data transmission; line four of the control module is connected to the MISO input of LED driver chip II to achieve data readback; and the MISO output of LED driver chip I is connected to the MOSI input of LED driver chip II to form a data cascade channel.

[0012] Compared with the prior art, this utility model has the following advantages and beneficial effects:

[0013] This invention proposes a direct-lit MiniLED backlight module arrangement structure, which realizes the arrangement of LEDs with irregular OD and different pitches. In the hardware framework of the LCD TV, several important circuit boards such as the power module, backlight control module and motherboard module will always occupy the horizontal space behind the back panel. The above design can use the extra space in the small OD area to make up for the space occupied by other hardware modules, thereby achieving a completely flat back cover, extremely close to the wall, and reducing the overall thickness of the TV. Attached Figure Description

[0014] Figure 1 This is an LED layout diagram of a direct-lit MiniLED backlight module arrangement structure according to this utility model;

[0015] Figure 2 This is a cross-sectional schematic diagram of the layout structure of a direct-lit MiniLED backlight module according to this utility model;

[0016] Figure 3 This is a circuit diagram of a direct-lit MiniLED backlight module layout structure according to the present invention.

[0017] Figure 4 This is a control flowchart of a direct-lit MiniLED backlight module layout structure according to the present invention. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] Example:

[0020] Combined with appendix Figure 1-2 As shown, a direct-lit MiniLED backlight module arrangement structure enables LEDs with irregular OD (Outside Diameter) and different pitches (pixel pitches). The structure includes an upper rectangular region and a lower rectangular region divided by a metal backplate. The LEDs in the upper rectangular region are arranged with a large OD and a large pitch, while the LEDs in the lower rectangular region are arranged with a small OD and a small pitch.

[0021] Specifically, in this embodiment, the upper rectangular area has a rows of b columns of LEDs, i.e., a*b LEDs, and the lower rectangular area has m rows of n columns of LEDs, i.e., m*n LEDs, where m*n > a*b.

[0022] Preferably, since the LEDs in the lower rectangular area are arranged with small OD and small pitch, the lower rectangular area of ​​the metal back plate is made into an outward convex plane away from the main casing. The LEDs with small OD and small pitch are installed through the outward convex plane, so that circuit boards such as control modules, power modules, backlight control modules, and motherboard modules can be installed in the space between the outward convex plane and the main casing, thereby reducing the overall thickness of the machine.

[0023] In one optional embodiment, given a fixed maximum power supply to the LED backlight by the power supply, the total current of all LED beads should not exceed the maximum current of the power supply. Of course, the amount of data sent by the front end may not be equal to the number of LEDs. The back end needs to perform weighted averaging or linear smoothing on the overflowing data and then control the current of the LEDs in different areas to meet the requirements.

[0024] Preferably, each LED in both the upper and lower rectangular areas is a single LED in its own area and the current can be controlled independently.

[0025] In another alternative embodiment, refer to the appendix. Figure 3A direct-lit MiniLED backlight module arrangement structure, wherein each LED in the upper rectangular area is connected in parallel to LED driver chip I, and each LED in the lower rectangular area is connected in parallel to LED driver chip II, and LED driver chip I and LED driver chip II are respectively connected to a control module.

[0026] Specifically, the control module outputs four signals, connected to LED driver chip I and LED driver chip II respectively. Line one of the control module is connected to the MOSI input of LED driver chip I to achieve master device data output and slave device data input. Line two of the control module is connected to the CS chip select signal of both LED driver chip I and LED driver chip II to achieve shared / cascaded chip select signal enable. Line three of the control module is connected to the CLK clock signal of LED driver chip I to achieve synchronous data transmission. Line four of the control module is connected to the MISO input of LED driver chip II to achieve data readback. Furthermore, the MISO output of LED driver chip I is connected to the MOSI input of LED driver chip II, forming a data cascade channel. Through the sharing of the CS chip select signal and the CLK clock signal, all slave devices share the same set of CS and CLK signals, achieving synchronous control.

[0027] In this embodiment, the communication protocols between the SOC (front end) and the backlight main control MCU (back end) include, but are not limited to, RS232, RS485, SPI, Modbus, CAN bus, Ethernet, etc.

[0028] like Figure 1-4 As shown, each of the upper and lower rectangular areas is a single LED zone with independently controllable current. Based on the large OD and large Pitch of the upper part, the LEDs in the lower m-row n-column area can be divided into several c rows. The column consists of small rectangular regions, where n is an integer multiple of b, and m is an integer multiple of c and a.

[0029] Set the maximum current supplied by the power supply to be Therefore, the maximum current in a single region during full white field (maximum gray level) is obtained as follows: The maximum current of a single lamp in a small area is .

[0030] After the SOC (front-end) and the backlight main control MCU (back-end) successfully establish a communication protocol handshake, within each frame frequency, the front-end sends the brightness information (corresponding lamp current values) of all backlight zones in the current frame to the back-end. However, for the MiniLED layout described above, the SOC can currently only process the screen image into uniformly sized zones based on the backlight; therefore, the amount of data sent by the front-end is... indivual.

[0031] For the lights in the upper area, the number of zones is... The actual number of physical zones formed by the lights in the lower area is As mentioned earlier, all lights can be controlled independently. At this point, the backend receives data from the corresponding lower part of the frontend. After processing a set of data, the backend needs to process each individual data point within that set into... A current value is used to control this c row. The LED lights in the column can be processed using weighted average or linear smoothing algorithms, etc., without limitation here, provided that this is a prerequisite. The sum of all data values ​​is no greater than the single value before processing. .

[0032] Although the present invention has been described herein with reference to illustrative embodiments, the above embodiments are merely preferred embodiments of the present invention, and the implementation of the present invention is not limited to the above embodiments. It should be understood that those skilled in the art can design many other modifications and implementations, which will fall within the scope and spirit of the principles disclosed in this application.

Claims

1. A direct-lit MiniLED backlight module arrangement structure, characterized in that, To achieve LED arrangement with irregular OD and different pitch, the method includes: dividing the LED layout into an upper rectangular area and a lower rectangular area by a metal back plate, and arranging the LEDs with a large OD and large pitch or a small OD and small pitch respectively; and forming an outward convex plane on the side away from the main body housing of the metal back plate so that the circuit board can be installed in the space between the outward convex plane and the main body housing.

2. The direct-lit MiniLED backlight module arrangement structure according to claim 1, characterized in that, The upper rectangular area has a row of a and column of b LEDs, i.e., a*b LEDs, and the lower rectangular area has a row of m and column of n LEDs, i.e., m*n > a*b.

3. The direct-lit MiniLED backlight module arrangement structure according to claim 2, characterized in that, m is an integer multiple of a, and n is an integer multiple of b.

4. The direct-lit MiniLED backlight module arrangement structure according to claim 1, characterized in that, When the maximum power supplied to the LED backlight by the power supply is constant, the total current of all LED beads does not exceed the maximum current of the power supply.

5. The direct-lit MiniLED backlight module arrangement structure according to claim 1, characterized in that, Each LED in both the upper and lower rectangular areas is a single LED in its own area and the current can be controlled independently.

6. The direct-lit MiniLED backlight module arrangement structure according to any one of claims 1-5, characterized in that, The LEDs in the upper rectangular area are connected in parallel to LED driver chip I, and the LEDs in the lower rectangular area are connected in parallel to LED driver chip II. LED driver chip I and LED driver chip II are respectively connected to the control module.

7. The direct-lit MiniLED backlight module arrangement structure according to claim 6, characterized in that, The control module outputs four signals, which are connected to LED driver chip I and LED driver chip II respectively. Line one of the control module is connected to the MOSI input of LED driver chip I to enable master device data output and slave device data input. Line two of the control module is connected to the CS chip select signal of both LED driver chip I and LED driver chip II to enable shared / cascaded chip select signal enable. Line three of the control module is connected to the CLK clock signal of LED driver chip I to enable synchronous data transmission. Line four of the control module is connected to the MISO input of LED driver chip II to enable data readback. Furthermore, the MISO output of LED driver chip I is connected to the MOSI input of LED driver chip II to form a data cascade channel.