A multi-chip parallel heat dissipation module with manifold type heat dissipation cold head
By integrating a manifold-type heat sink into a multi-chip module, with a built-in manifold parallel structure, the problems of poor cooling effect and large space occupation are solved, the cooling efficiency and heat dissipation uniformity are improved, the pipeline connection is simplified, and the risk of leakage is reduced.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU JINGYAN THERMAL ENERGY MANAGEMENT CO LTD
- Filing Date
- 2025-09-29
- Publication Date
- 2026-07-21
AI Technical Summary
Existing liquid cooling solutions for multi-chip modules suffer from poor cooling performance and large space requirements. In particular, traditional series cooling methods result in significant temperature differences between chips, excessive system flow resistance, and complex and easily leak-prone external parallel connection methods.
It adopts a multi-chip parallel heat dissipation module with a manifold-type heat dissipation cold head, which integrates the main chip cold head, the sub-chip cold head and the circulation pipe, etc. The manifold function is built into the cold head, which simplifies the pipeline design, reduces flow resistance and evenly distributes coolant. Combined with the extrusion cap and spring structure, it facilitates pipeline connection.
It achieves a balance between reducing system size and improving cooling efficiency and heat dissipation performance, simplifies the piping connection process, and reduces the risk of leakage.
Smart Images
Figure CN224536465U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of multi-chip parallel heat dissipation module technology, specifically a multi-chip parallel heat dissipation module with a manifold-type heat dissipation head. Background Technology
[0002] With the continuous increase in computing density, the heat dissipation requirements of multi-chip modules (such as GPU clusters, AI accelerator cards, and high-performance server motherboards) are becoming increasingly stringent, making liquid cooling technology an inevitable choice due to its high efficiency. Currently, liquid cooling solutions for multi-chip systems mainly adopt two traditional structures: one is a series cooling architecture, where the coolant flows sequentially through each heat sink; the other is a parallel cooling rack based on external manifolds. Traditional series cooling methods cause the coolant temperature of downstream chips to rise, resulting in significant temperature differences between chips. In addition, the series path is long, which can easily lead to excessive system flow resistance, while the external parallel method usually requires manifolds and connecting components, occupying a large space, and the connection pipeline layout is relatively complex, posing a risk of leakage and inconvenience for installation and maintenance. Therefore, improvements to existing technologies are needed. Utility Model Content
[0003] The purpose of this invention is to provide a multi-chip parallel heat dissipation module with a manifold-type heat dissipation head, which solves the problems of poor cooling effect and large space occupation of the current cooling structure.
[0004] To achieve the above objectives, this utility model provides the following technical solution: a multi-chip parallel heat dissipation module with a manifold-type heat dissipation head, comprising a main chip heat dissipation head and a secondary chip heat dissipation head mounted on the outside of the motherboard. The main chip heat dissipation head and the secondary chip heat dissipation head are jointly provided with a module mechanism. An inlet head is installed at the upper end of the secondary chip heat dissipation head, an outlet head is installed at the upper end of the secondary chip heat dissipation head, and a bidirectional head is installed at the upper end of the secondary chip heat dissipation head. A right-angle head is installed at the upper end of the main chip heat dissipation head. Flexible tubes are installed on the outer sides of both the inlet head and the outlet head. A connector is installed inside one end of the flexible tube. A supply tube is fixedly connected to the end of the connector away from the flexible tube. A mounting bracket is fixedly connected to the outer side of the connector. A compression cap is contacted at the upper end of the mounting bracket. An inlet chamber and an outlet chamber are opened inside the secondary chip heat dissipation head.
[0005] Preferably, the main chip cold head is equipped with a leakage sensing line, and the sub-chip cold head is equipped with a leakage sensing line, which can detect leakage.
[0006] Preferably, a circulation pipe is installed between the bidirectional head and the right-angle head, and a toothed base plate is installed at the lower end of the main chip cold head. The circulation pipe can transport coolant.
[0007] Preferably, the lower end of the extrusion cap is fixedly connected to two symmetrically distributed positioning posts, which are slidably connected to the mounting bracket, and the positioning posts can position the extrusion cap.
[0008] Preferably, a reset frame is fixedly connected to the lower end of the compression cap, and a spring is provided on the outer side of the reset frame. The reset frame is in contact with the mounting frame, one end of the spring is fixedly connected to the reset frame, and the other end of the spring is fixedly connected to the mounting frame. The spring can apply pressure to the reset frame through its elastic force.
[0009] Preferably, both the mounting bracket and the compression cap are in contact with the hose, and both the mounting bracket and the compression cap are in contact with the supply pipe. The compression cap can compress and limit the hose and the supply pipe.
[0010] Preferably, the module mechanism includes a main bracket, a main bracket is installed on the upper end of the main chip cold head, a crossbeam is installed on the upper end of the main bracket, a connecting plate is installed on the upper end of the crossbeam, a handle is installed on the upper end of the connecting plate, and a secondary bracket is installed on the lower end of the crossbeam. The secondary bracket is connected to the secondary chip cold head by bolts. The main bracket and the secondary bracket can be used to modularize and connect the cold heads in parallel.
[0011] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0012] 1. This utility model integrates cooling components into a compact structure by adding a main chip cold head, a secondary chip cold head, and a circulation pipe to the motherboard. The manifold function is integrated inside the auxiliary cold head, eliminating the need for a separate manifold, redundant connectors, and connecting parts. This significantly reduces the system size and leakage points. Furthermore, the parallel flow path design reduces flow resistance, which helps to distribute the coolant more evenly to each main chip cold head, improving the consistency of overall heat dissipation performance. Thus, cooling efficiency can be guaranteed while reducing the size.
[0013] 2. This utility model adds a connector, a compression cap, and a spring between the hose and the supply pipe. When the hose and the supply pipe are connected, the spring force is applied to the reset frame, and the compression cap can limit the hose and the supply pipe, making it easier to connect the pipeline when installing the cooling structure. Attached Figure Description
[0014] Figure 1 This is a perspective view of the overall structure of this utility model;
[0015] Figure 2 For the present utility model Figure 1 3D exploded view;
[0016] Figure 3 For the present utility model Figure 1A magnified 3D view of the secondary chip cold head;
[0017] Figure 4 For the present utility model Figure 3 3D exploded view;
[0018] Figure 5 For the present utility model Figure 3 frontal section Figure 1 ;
[0019] Figure 6 For the present utility model Figure 3 frontal section Figure 2 ;
[0020] Figure 7 For the present utility model Figure 1 A 3D view of the main chip's cold head;
[0021] Figure 8 For the present utility model Figure 1 A 3D view of the module mechanism;
[0022] Figure 9 For the present utility model Figure 1 Enlarged front sectional view of the extrusion cap;
[0023] Figure 10 For the present utility model Figure 1 Enlarged left sectional view of the squeeze cap;
[0024] Figure 11 This is a diagram illustrating the coolant flow direction of this invention.
[0025] In the diagram: 1. Main chip cold head; 2. Sub-chip cold head; 3. Module mechanism; 4. Inlet head; 5. Outlet head; 6. Bidirectional head; 7. Leakage sensing line; 8. Circulation pipe; 9. Right-angle head; 10. Hose; 11. Connector; 12. Supply pipe; 13. Mounting bracket; 14. Squeeze cap; 15. Positioning post; 16. Reset bracket; 17. Spring; 18. Shovel tooth base plate; 19. Liquid inlet chamber; 20. Liquid outlet chamber; 31. Main bracket; 32. Crossbeam; 33. Connecting plate; 34. Handle; 35. Sub-bracket. Detailed Implementation
[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0027] Please see Figure 1-11A multi-chip parallel heat dissipation module with a manifold-type heat dissipation head includes a main chip heat dissipation head 1 and a secondary chip heat dissipation head 2 installed on the outside of the motherboard. The main chip heat dissipation head 1 and the secondary chip heat dissipation head 2 are jointly provided with a module mechanism 3. An inlet head 4 and an outlet head 5 are installed on the upper end of the secondary chip heat dissipation head 2. A bidirectional head 6 is installed on the upper end of the secondary chip heat dissipation head 2. A right-angle head 9 is installed on the upper end of the main chip heat dissipation head 1. A flexible tube 10 is installed on the outside of both the inlet head 4 and the outlet head 5. A connector head 11 is installed inside one end of the flexible tube 10. A supply tube 12 is fixedly connected to the end of the connector head 11 away from the flexible tube 10. A mounting bracket 13 is fixedly connected to the outside of the connector head 11. A compression cap 14 is contacted at the upper end of the mounting bracket 13. An inlet chamber 19 and an outlet chamber 20 are opened inside the secondary chip heat dissipation head 2.
[0028] Please see Figure 1-11 The main chip cold head 1 and the secondary chip cold head 2 are equipped with leakage sensing wires 7 and 7 respectively. The leakage sensing wires 7 can detect leakage. A circulation pipe 8 is installed between the bidirectional head 6 and the right-angle head 9. A toothed base plate 18 is installed at the lower end of the main chip cold head 1. The circulation pipe 8 can transport coolant. Two symmetrically distributed positioning posts 15 are fixedly connected to the lower end of the extrusion cap 14. The positioning posts 15 are slidably connected to the mounting bracket 13, and the positioning posts 15 can position the extrusion cap 14. A reset frame 16 is fixedly connected to the lower end of the compression cap 14. A spring 17 is provided on the outside of the reset frame 16. The reset frame 16 is in contact with the mounting frame 13. One end of the spring 17 is fixedly connected to the reset frame 16, and the other end of the spring 17 is fixedly connected to the mounting frame 13. The spring 17 can apply pressure to the reset frame 16 through its elastic force. Both the mounting frame 13 and the compression cap 14 are in contact with the hose 10. Both the mounting frame 13 and the compression cap 14 are in contact with the supply pipe 12. The compression cap 14 can squeeze and limit the hose 10 and the supply pipe 12.
[0029] Please see Figure 1-11 The module mechanism 3 includes a main support 31, which is installed on the upper end of the main chip cold head 1. A crossbeam 32 is installed on the upper end of the main support 31, a connecting plate 33 is installed on the upper end of the crossbeam 32, a handle 34 is installed on the upper end of the connecting plate 33, and a secondary support 35 is installed on the lower end of the crossbeam 32. The secondary support 35 is connected to the secondary chip cold head 2 by bolts. The main support 31 and the secondary support 35 can be used to modularize and connect the cold heads in parallel.
[0030] The specific implementation process of this utility model is as follows: In use, the coolant enters the interior of the hose 10 through the supply pipe 12. The hose 10 injects the coolant into the liquid inlet chamber 19 inside the sub-chip cold head 2 through the inlet head 4. Inside the liquid inlet chamber 19, the coolant is injected into the interior of the circulation pipe 8 through the bidirectional head 6. The circulation pipe 8 injects the coolant into the interior of the main chip cold head 1 through the right-angle head 9. After the heat exchange is completed inside the main chip cold head 1, the coolant is injected into the interior of the liquid outlet chamber 20 of the sub-chip cold head 2 through another right-angle head 9 and the circulation pipe 8. The coolant after heat exchange is refluxed through the outlet head 5 for cooling, thereby cooling the chip.
[0031] When it is necessary to connect the hose 10 and the supply pipe 12, pull the compression cap 14. The compression cap 14 compresses the spring 17 through the reset bracket 16. Then, insert the hose 10 and the supply pipe 12 into the outside of the connector 11. After the insertion is completed, release the compression cap 14. The spring 17 returns to its original position. The spring 17 can use its elasticity to push the compression cap 14 to press against the outside of the hose 10 and the supply pipe 12, thus completing the installation of the pipeline.
[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A multi-chip parallel heat dissipation module with a manifold-type heat sink, comprising a main chip heat sink (1) and a secondary chip heat sink (2) mounted on the outside of the motherboard, characterized in that: The main chip cold head (1) and the sub-chip cold head (2) are jointly provided with a module mechanism (3). The upper end of the sub-chip cold head (2) is equipped with an inlet head (4), an outlet head (5), and a bidirectional head (6). The upper end of the main chip cold head (1) is equipped with a right-angle head (9). The outer sides of the inlet head (4) and the outlet head (5) are both equipped with hoses (10). One end of the hose (10) is equipped with a connector (11). The end of the connector (11) away from the hose (10) is fixedly connected to a supply pipe (12). The outer side of the connector (11) is fixedly connected to a mounting bracket (13). The upper end of the mounting bracket (13) is in contact with a compression cap (14). The interior of the sub-chip cold head (2) is provided with an inlet chamber (19) and an outlet chamber (20).
2. The multi-chip parallel heat dissipation module with a manifold-type heat sink as described in claim 1, characterized in that: The main chip cold head (1) is equipped with a leakage sensing line (7), and the sub-chip cold head (2) is equipped with a leakage sensing line (7).
3. A multi-chip parallel heat dissipation module with a manifold-type heat sink as described in claim 1, characterized in that: A circulation tube (8) is installed between the bidirectional head (6) and the right-angle head (9), and a toothed base plate (18) is installed at the lower end of the main chip cold head (1).
4. A multi-chip parallel heat dissipation module with a manifold-type heat sink as described in claim 1, characterized in that: The lower end of the compression cap (14) is fixedly connected to two symmetrically distributed positioning posts (15), and the positioning posts (15) are slidably connected to the mounting bracket (13).
5. A multi-chip parallel heat dissipation module with a manifold-type heat sink as described in claim 1, characterized in that: The lower end of the compression cap (14) is fixedly connected to a reset frame (16), and a spring (17) is provided on the outside of the reset frame (16). The reset frame (16) is in contact with the mounting frame (13). One end of the spring (17) is fixedly connected to the reset frame (16), and the other end of the spring (17) is fixedly connected to the mounting frame (13).
6. A multi-chip parallel heat dissipation module with a manifold-type heat sink according to claim 1, characterized in that: The mounting bracket (13) and the compression cap (14) are both in contact with the hose (10), and the mounting bracket (13) and the compression cap (14) are both in contact with the supply pipe (12).
7. A multi-chip parallel heat dissipation module with a manifold-type heat sink as described in claim 1, characterized in that: The module mechanism (3) includes a main bracket (31), the upper end of the main chip cold head (1) is equipped with the main bracket (31), the upper end of the main bracket (31) is equipped with a crossbeam (32), the upper end of the crossbeam (32) is equipped with a connecting plate (33), the upper end of the connecting plate (33) is equipped with a handle (34), the lower end of the crossbeam (32) is equipped with a sub-branch (35), and the sub-branch (35) is connected to the sub-chip cold head (2) by bolts.