A filter ceramic package base

Abstract

The utility model discloses a kind of filter ceramic packaging pedestals, it is related to ceramic pedestal technical field, including pedestal body, filter element is installed on the upper end of pedestal body, further including packaging board, shock-absorbing structure and heat dissipation structure, packaging board is detachably installed on the upper end of pedestal body, filter element is packaged in packaging board, shock-absorbing structure is installed on the lower end of pedestal body, for the shock-absorbing of pedestal body, the upper end of pedestal body is equipped with placing groove, shielding layer and filter element are installed in placing groove, the upper end of shielding layer is in contact with filter element, heat dissipation structure is installed on the lower end of pedestal body, heat dissipation structure is in contact with the lower end of shielding layer, to carry out heat dissipation to filter element, packaging board can ensure the stability of filter element internal structure, and can play certain sealing effect, reduce external dust, moisture and other impurities into the inside of pedestal body, it is favorable to reduce the influence of external environment to filter element.

Description

Technical Field

[0001] This utility model relates to the field of ceramic substrate technology, and in particular to a filter ceramic packaging substrate. Background Technology

[0002] Filters are core components in electronic circuits used to screen and filter signals of specific frequencies. The working principle of filters is to selectively allow or block signals of specific frequency bands from passing through, thereby purifying and optimizing complex electrical signals. Therefore, they are widely used in fields such as communications, radar, and aerospace.

[0003] The performance of a filter directly determines the quality of signal transmission and the stability of system operation. The filter ceramic packaging base, as a key support and protection structure for the filter, undertakes the physical function of fixing and supporting filter components, creating a stable working environment for the filter.

[0004] Traditional ceramic packaging bases for filters have several drawbacks. First, filters generate a lot of heat during high-frequency operation. If this heat cannot be dissipated in time, the components will overheat, accelerating aging and reducing filtering accuracy. Second, in complex applications such as aerospace and automotive electronics, if the base is subjected to high-intensity vibration and impact, internal components of the filter may loosen, solder joints may fall off, or even the structure may be damaged, seriously affecting the reliability and lifespan of the filter. Utility Model Content

[0005] In view of this, the purpose of this utility model is to provide a filter ceramic packaging base to solve the problems mentioned in the background art.

[0006] This utility model provides a ceramic packaging base for a filter, including a base body, a filter element mounted on the upper end of the base body, a packaging plate, a shock-absorbing structure, and a heat dissipation structure. The packaging plate is detachably mounted on the upper end of the base body, and the filter element is packaged within the packaging plate. The shock-absorbing structure is mounted on the lower end of the base body for shock absorption. A placement groove is formed on the upper end of the base body, and a shielding layer and the filter element are installed in the placement groove. The upper end of the shielding layer contacts the filter element. The heat dissipation structure is mounted on the lower end of the base body and contacts the lower end of the shielding layer to dissipate heat from the filter element.

[0007] As a further embodiment of this utility model: slots are provided at the four corners of the upper surface of the base body, and connecting grooves are provided on the side of the base body. Each slot is connected to a connecting groove, and the two are perpendicular to each other. A block is protruding from the lower end of the encapsulation plate. A raised button is movably connected to one side of the block by a spring. The block can be locked in the slot, and the raised button enters the slot and is locked in the connecting groove.

[0008] As a further embodiment of this utility model: the base body has a first mounting plate on both sides, a fixed telescopic belt is connected to the first mounting plate, the fixed telescopic belt has a buttonhole, the encapsulation plate has a fixing plate on both sides, the fixing plate has a fastener, and when the encapsulation plate is connected to the base body, the buttonhole is fitted onto the fastener.

[0009] As a further embodiment of this utility model: the lower end of the encapsulation plate is provided with a pressure block that cooperates with the placement groove, and the outer periphery of the pressure block is provided with a rubber buffer pad.

[0010] As a further embodiment of this utility model: the shielding layer includes a wave-absorbing material layer, a metal mesh structure layer and a soft magnetic material layer distributed sequentially from top to bottom. The wave-absorbing material layer is used to absorb external high-frequency electromagnetic waves, the metal mesh structure layer is used to weaken the intensity of external electromagnetic waves, and the soft magnetic material layer is used to block external electromagnetic interference.

[0011] As a further embodiment of this utility model: the shock-absorbing structure includes a shock-absorbing block, an anti-slip pad, a damping spring, and a slide. The anti-slip pad is located at the lower end of the shock-absorbing block. One end of the damping spring is connected to the lower end of the base body, and the other end is connected to the shock-absorbing block, so that the shock-absorbing block can move relative to the base body. The slide protrudes from the shock-absorbing block and extends in the vertical direction. The base body has a groove that mates with the slide.

[0012] As a further embodiment of this utility model: the heat dissipation structure includes a heat dissipation plate, heat dissipation fins and a heat pipe, the heat pipe is installed on the upper end of the heat dissipation plate for contact with the shielding layer, and the heat dissipation fins protrude from the lower end of the heat dissipation plate.

[0013] As a further embodiment of this utility model: the heat sink is provided with a second mounting plate on both sides, the lower end of the shielding layer is provided with connecting holes on both sides, the second mounting plate is provided with an opening, the opening and the connecting hole are engaged to install the heat sink to the lower end of the shielding layer.

[0014] The beneficial effects of this utility model are as follows:

[0015] 1. During use, first place the filter element on the shielding layer, then align the locking block at the bottom of the encapsulation board with the locking slot of the base body and insert it. The raised button on the locking block pops out under the action of the spring and locks into the connection slot, forming a firm mechanical snap-fit ​​connection. At the same time, the fixing plates on both sides of the encapsulation board are fastened to the fixed telescopic belt on the base body through fasteners, further enhancing the stability of the connection. This double fixing method can effectively prevent relative displacement between the encapsulation board and the base body during the operation of the filter element, ensuring the stability of the internal structure. In addition, the pressure block at the bottom of the encapsulation board is embedded in the placement slot at the top of the base body. The rubber buffer pad on the outside of the pressure block contacts the slot wall and generates elastic compression. This not only buffers the mechanical stress during assembly, but also plays a certain sealing role, reducing the entry of external dust, moisture and other impurities into the base, protecting the filter element from the influence of the external environment.

[0016] 2. The damping block is connected to the bottom of the base body through a damping spring. When the filter element is subjected to external vibration or vibration generated by its own operation, the damping spring will undergo elastic deformation, thereby converting the mechanical energy of the vibration into the elastic potential energy of the spring, thus reducing the transmission of vibration. At the same time, the slides on both sides of the damping block slide in the grooves on the base body. This structure restricts the lateral displacement of the damping block, so that it can only move with the spring in the vertical direction, ensuring the stability of the damping effect. The anti-slip pads increase the friction between the damping block and the mounting surface, preventing the filter element from sliding during vibration, thereby protecting the filter element from vibration damage and enabling it to work stably in complex vibration environments.

[0017] 3. The heat pipes on the top of the heat sink are in close contact with the shielding layer. The heat generated by the filter components during operation is first conducted to the heat pipes through the shielding layer. The heat pipes can quickly transfer the heat from one end to the other, rapidly transferring the heat to the heat sink. The heat dissipation fins at the bottom of the heat sink have a large surface area, so the heat dissipation fins can effectively dissipate the heat into the surrounding air, thereby timely removing the heat generated by the filter components during operation and avoiding performance degradation or damage to the filter components due to excessive temperature.

[0018] 4. The shielding layer adopts a three-layer composite structure to effectively suppress electromagnetic interference. The outermost absorbing material layer uses carbon nanotube composite absorbing material. Carbon nanotubes have unique electrical and optical properties and can interact with electromagnetic waves, converting the energy of electromagnetic waves into heat or other forms of energy and consuming it. It is mainly used to absorb high-frequency electromagnetic waves. The middle metal mesh structure layer uses copper mesh material. Copper has good conductivity. When electromagnetic waves are incident on the copper mesh, an induced current is generated in the copper mesh. The magnetic field generated by the induced current cancels out the magnetic field of the incident electromagnetic wave, thereby reflecting and scattering the electromagnetic wave and further weakening the intensity of the electromagnetic wave. The innermost soft magnetic material layer uses permalloy. Permalloy has high permeability and can guide low-frequency magnetic field lines, so that the low-frequency magnetic field forms a closed loop in the soft magnetic material layer, reducing the leakage of the low-frequency magnetic field. This effectively blocks external electromagnetic interference from entering the filter element and affecting the normal operation of the filter element, and also suppresses the leakage of electromagnetic signals generated inside the filter element, meeting the electromagnetic compatibility requirements of the filter element. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the overall structure of a filter ceramic packaging base.

[0021] Figure 2 This is a schematic diagram of the structure of the packaging plate in a ceramic packaging base for a filter.

[0022] Figure 3 This is a schematic diagram of the structure of the base body in a filter ceramic packaging base.

[0023] Figure 4 This is a schematic diagram of a shock-absorbing structure in a ceramic packaging base for a filter.

[0024] Figure 5 This is a schematic diagram of the internal structure of the shielding layer in a filter ceramic packaging substrate.

[0025] Figure 6 This is a schematic diagram of the heat dissipation structure and the base body in a filter ceramic packaging base.

[0026] In the picture:

[0027] 1. Encapsulation plate; 2. Base body; 3. First mounting plate; 4. Fixed telescopic belt; 5. Eyelet; 6. Fastener; 7. Fixing plate; 8. Shock absorption structure; 81. Shock absorption block; 82. Anti-slip pad; 83. Damping spring; 84. Slide; 9. Heat dissipation structure; 91. Heat dissipation plate; 92. Heat dissipation fins; 93. Screw; 94. Second mounting plate; 95. Heat conduction pipe; 10. Rubber buffer pad; 11. Pressure block; 12. Locking block; 13. Raised button; 14. Shielding layer; 141. Wave absorbing material layer; 142. Metal mesh structure layer; 143. Soft magnetic material layer; 15. Placement slot; 16. Locking slot; 17. Connecting slot; 18. Connecting hole. Detailed Implementation

[0028] The specific embodiments of this utility model will now be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are merely some, not all, of the embodiments of this utility model. Based on the description of this utility model, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this utility model.

[0029] Unless otherwise explicitly specified and limited, the terms "setup," "installation," and "connection" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium. Those skilled in the art can understand the specific meaning of these terms based on the specific circumstances.

[0030] The terms “upper,” “lower,” “left,” “right,” “front,” “back,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of description and simplification, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0031] The terms “first,” “second,” “third,” etc., are used merely to distinguish elements with similar properties, not to indicate or imply relative importance or a specific order.

[0032] The terms “include,” “comprising,” or any other variation thereof are intended to cover non-exclusive inclusion, which includes not only the elements listed but also other elements not expressly listed.

[0033] Combination Figure 1 and Figure 6This utility model provides a filter ceramic packaging base, including a base body 2, a filter element mounted on the upper end of the base body 2, and a packaging plate 1, a shock-absorbing structure 8, and a heat dissipation structure 9. The packaging plate 1 is detachably mounted on the upper end of the base body 2, and the filter element is packaged within the packaging plate 1. The shock-absorbing structure 8 is mounted on the lower end of the base body 2 for shock absorption. Figure 3 The upper end of the base body 2 is provided with a placement groove 15, in which a shielding layer 14 and a filter element are installed. The upper end of the shielding layer 14 is in contact with the filter element, and the lower end of the shielding layer 14 can contact the heat dissipation structure 9. The heat dissipation structure 9 can dissipate heat from the filter element through the shielding layer 14.

[0034] Since the electromagnetic shielding layer of traditional bases is usually made of only a single layer of metal, it can only reflect electromagnetic waves in a limited frequency band. It is difficult to meet the electromagnetic compatibility requirements of modern electronic equipment with wide bandwidth and high integration. As a result, external electromagnetic interference can easily affect the normal operation of filter components or cause internal signal leakage to interfere with other electronic components, which has certain limitations.

[0035] Therefore, in one alternative solution, such as Figure 5 As shown, the shielding layer 14 includes a wave-absorbing material layer 141, a metal mesh structure layer 142, and a soft magnetic material layer 143 distributed from top to bottom. The wave-absorbing material layer 141 is used to absorb external high-frequency electromagnetic waves, the metal mesh structure layer 142 is used to weaken the intensity of external electromagnetic waves, and the soft magnetic material layer 143 is used to block external electromagnetic interference.

[0036] Optionally, the absorbing material layer 141 is a carbon nanotube composite absorbing element. Because carbon nanotubes have unique electrical and optical properties, they can interact with electromagnetic waves and convert the energy of electromagnetic waves into other forms of energy such as heat energy and consume it. Therefore, they are mainly used to absorb high-frequency electromagnetic waves.

[0037] Optionally, the metal mesh structure layer 142 is made of copper mesh. Since copper has good conductivity, when electromagnetic waves are incident on the copper mesh, an induced current will be generated in the copper mesh. The magnetic field generated by the induced current will cancel out the magnetic field of the incident electromagnetic wave, thereby reflecting and scattering the electromagnetic wave and further weakening the intensity of the electromagnetic wave.

[0038] Optionally, the soft magnetic material layer 143 is made of permalloy. Since permalloy has high permeability, it can guide low-frequency magnetic field lines, so that the low-frequency magnetic field forms a closed loop in the soft magnetic material layer 143. This effectively blocks external electromagnetic interference from entering the filter element and affecting the normal operation of the filter element, and also suppresses the leakage of electromagnetic signals generated inside the filter element, thus meeting the electromagnetic compatibility requirements of the filter element.

[0039] In one of the alternative solutions, such as Figure 3 As shown, slots 16 are provided at the four corners of the upper surface of the base body 2, and connecting grooves 17 are provided on the side of the base body 2. Each slot 16 communicates with a connecting groove 17, and the two are perpendicular to each other. Figure 2 The lower end of the encapsulation plate 1 is provided with a locking block 12. The locking block 12 protrudes from the four corners of the encapsulation plate 1 and cooperates with the slot 16. When the encapsulation plate 1 is installed, the locking block 12 is locked in the slot 16. A raised button 13 is provided on one side of the locking block 12. The raised button 13 is movably connected to one side of the locking block 12 by a spring. The raised button 13 can enter the slot 16 and be locked in the connecting groove 17.

[0040] When installing the encapsulation board 1, first place the filter element on the shielding layer 14, and then insert the locking block 12 at the bottom of the encapsulation board 1 into the slot 16 of the base body 2. At this time, the spring is compressed, and the raised button 13 can enter the slot 16 along with the locking block 12. Then, when the position of the raised button 13 corresponds to the position of the connecting slot 17, the raised button 13 on the locking block 12 pops out under the action of the spring and locks into the connecting slot 17, so that the encapsulation board 1 can be firmly installed on the base body 2.

[0041] In one of the alternative solutions, such as Figure 1 As shown, the base body 2 has a first mounting plate 3 on both sides. A fixed telescopic belt 4 is fixedly connected to one side of the first mounting plate 3. The fixed telescopic belt 4 has a buttonhole 5. The encapsulation plate 1 has a fixed plate 7 on both sides. The fixed plate 7 has a fastener 6. The fastener 6 cooperates with the buttonhole 5. When the encapsulation plate 1 is connected to the base body 2, the fixed telescopic belt 4 is adjusted so that the upper buttonhole 5 of the fixed telescopic belt 4 is fitted onto the fastener 6, thereby enhancing the stability of the connection between the encapsulation plate 1 and the base body 2.

[0042] In one of the alternative solutions, such as Figure 2 As shown, a pressure block 11 is protruding from the lower center of the encapsulation plate 1, which cooperates with the placement groove 15. A rubber buffer pad 10 is provided on the outer periphery of the pressure block 11. The pressure block 11 at the bottom of the encapsulation plate 1 is embedded in the placement groove 15 at the top of the base body 2. The rubber buffer pad 10 on the outer side of the pressure block 11 contacts the groove wall and generates elastic compression. This can not only buffer the mechanical stress during assembly, but also play a certain sealing role, reducing the entry of external dust, moisture and other impurities into the base, protecting the filter components from the influence of the external environment. In addition, the pressure block 11 can make the filter components contact the shielding layer 14 to ensure the heat dissipation effect of the heat dissipation structure 9.

[0043] In one of the alternative solutions, such as Figure 4As shown, the shock absorption structure 8 includes a shock absorption block 81, an anti-slip pad 82, a damping spring 83, and a slide 84. The anti-slip pad 82 is located at the lower end of the shock absorption block 81. One end of the damping spring 83 is fixedly connected to the lower end of the base body 2, and the other end is connected to the shock absorption block 81. The damping spring 83 enables the shock absorption block 81 to move relative to the base body 2. The slide 84 protrudes from the shock absorption block 81 and extends in the vertical direction. The base body 2 has a groove that cooperates with the slide 84.

[0044] When the filter element is subjected to external vibration or vibration generated by its own operation, the damping spring 83 will undergo elastic deformation, thereby converting the mechanical energy of the vibration into the elastic potential energy of the spring, thus reducing the transmission of vibration. At the same time, during the deformation of the damping spring 83, the slide 84 can slide in the groove on the base body 2. The groove and the slide 84 cooperate to restrict the lateral displacement of the damping block 81, so that it can only move with the spring in the vertical direction, ensuring the stability of the damping effect.

[0045] The anti-slip pads 82 increase the friction between the filter element and the mounting surface, preventing the filter element from sliding during vibration, thus protecting the filter element from vibration damage and enabling it to work stably in complex vibration environments.

[0046] In one of the alternative solutions, such as Figure 6 As shown, the heat dissipation structure 9 includes a heat dissipation plate 91, heat dissipation fins 92 and heat pipes 95. The heat pipes 95 are installed on the upper end of the heat dissipation plate 91 for close contact with the shielding layer 14. The heat dissipation fins 92 protrude from the lower end of the heat dissipation plate 91.

[0047] Optionally, a second mounting plate 94 protrudes from both sides of the heat sink 91. The second mounting plate 94 is used to mount the heat sink 91 onto the base body 2, such as... Figure 6 As shown, connection holes 18 are provided on both sides of the lower end of the shielding layer 14. The connection holes 18 penetrate the shielding layer 14 along the thickness direction of the shielding layer 14. An opening is provided on the second mounting plate 94. The opening cooperates with the connection holes 18 to fix the heat sink 91 to the lower end of the shielding layer 14.

[0048] Furthermore, both the connecting hole 18 and the opening are screw holes, and both the connecting hole 18 and the opening are engaged with screws 93 to fix the heat sink 91 to the shielding layer 14.

[0049] The heat generated when the filter element is working is first conducted to the heat pipe 95 through the shielding layer 14. The heat pipe 95 can quickly transfer the heat from one end of the filter element to the other end away from the filter element, so as to quickly transfer the heat to the heat sink 91. The heat sink fins 92 at the bottom of the heat sink 91 have a large surface area, so the heat sink fins 92 can effectively dissipate the heat into the surrounding air, thereby timely dissipating the heat generated when the filter element is running, and avoiding the performance degradation or damage of the filter element due to excessive temperature.

[0050] Optionally, a number of heat pipes 95 are arranged at equal intervals on the upper end of the heat sink 91.

[0051] Optionally, a number of heat dissipation fins 92 are arranged at equal intervals at the lower end of the heat dissipation plate 91.

[0052] The above description is only a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model.

Claims

1. A filter ceramic packaging base, comprising a base body (2), wherein a filter element is mounted on the upper end of the base body (2), characterized in that, It also includes a packaging plate (1), a shock-absorbing structure (8), and a heat dissipation structure (9). The packaging plate (1) is detachably installed on the upper end of the base body (2). The filter element is encapsulated in the packaging plate (1). The shock-absorbing structure (8) is installed on the lower end of the base body (2) to dampen the base body (2). The upper end of the base body (2) is provided with a placement groove (15). The placement groove (15) is equipped with a shielding layer (14) and the filter element. The upper end of the shielding layer (14) is in contact with the filter element. The heat dissipation structure (9) is installed on the lower end of the base body (2). The heat dissipation structure (9) is in contact with the lower end of the shielding layer (14) to dissipate heat from the filter element.

2. The filter ceramic packaging base according to claim 1, characterized in that, The base body (2) has four corner slots (16) on its upper surface. The base body (2) has a connecting groove (17) on its side. Each slot (16) is connected to a connecting groove (17) and the two are perpendicular. The lower end of the encapsulation plate (1) has a protruding block (12). One side of the block (12) is movably connected to a raised button (13) by a spring. The block (12) can be locked in the slot (16). The raised button (13) enters the slot (16) and is locked in the connecting groove (17).

3. The filter ceramic packaging base according to claim 1 or 2, characterized in that, The base body (2) has a first mounting plate (3) on both sides, and a fixed telescopic belt (4) is connected to the first mounting plate (3). The fixed telescopic belt (4) has a buttonhole (5). The encapsulation plate (1) has a fixing plate (7) on both sides, and a fastener (6) is provided on the fixing plate (7). When the encapsulation plate (1) is connected to the base body (2), the buttonhole (5) is fitted onto the fastener (6).

4. The filter ceramic packaging base according to claim 1, characterized in that, The lower end of the encapsulation plate (1) is provided with a pressure block (11) that cooperates with the placement groove (15), and the outer periphery of the pressure block (11) is provided with a rubber buffer pad (10).

5. The filter ceramic packaging base according to claim 1, characterized in that, The shielding layer (14) includes a wave-absorbing material layer (141), a metal mesh structure layer (142), and a soft magnetic material layer (143) distributed from top to bottom. The wave-absorbing material layer (141) is used to absorb external high-frequency electromagnetic waves, the metal mesh structure layer (142) is used to weaken the intensity of external electromagnetic waves, and the soft magnetic material layer (143) is used to block external electromagnetic interference.

6. The filter ceramic packaging base according to claim 1, characterized in that, The shock-absorbing structure (8) includes a shock-absorbing block (81), an anti-slip pad (82), a damping spring (83), and a slide (84). The anti-slip pad (82) is located at the lower end of the shock-absorbing block (81). One end of the damping spring (83) is connected to the lower end of the base body (2), and the other end is connected to the shock-absorbing block (81) so that the shock-absorbing block (81) can move relative to the base body (2). The slide (84) protrudes from the shock-absorbing block (81) and extends in the vertical direction. The base body (2) has a groove that cooperates with the slide (84).

7. The filter ceramic packaging base according to claim 1, characterized in that, The heat dissipation structure (9) includes a heat dissipation plate (91), heat dissipation fins (92) and a heat pipe (95). The heat pipe (95) is installed on the upper end of the heat dissipation plate (91) for contact with the shielding layer (14). The heat dissipation fins (92) protrude from the lower end of the heat dissipation plate (91).

8. The filter ceramic packaging base according to claim 7, characterized in that, The heat sink (91) has a second mounting plate (94) protruding on both sides. The shielding layer (14) has connection holes (18) on both sides at the lower end. The second mounting plate (94) has an opening that matches the connection hole (18) to install the heat sink (91) to the lower end of the shielding layer (14).

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