A driving substrate, display backplane and display screen

Abstract

The utility model discloses a kind of driving substrate, display backplate and display screen, the driving substrate includes driving substrate body, multiple pad groups and multiple rows or multiple columns pixel drive chip, the pad group is connected with the pixel drive chip by the driving substrate body, the side of the driving substrate body is provided with multiple pad groups, the other side of the driving substrate body is provided with multiple rows or multiple columns pixel drive chip;Two rows or two columns of the pixel drive chip staggered arrangement are adjacent.The driving substrate of the utility model, by dispersing arrangement multiple heat sources, avoid heat concentration, reduce the working temperature of driving substrate, improve module display effect.

Description

Technical Field

[0001] This utility model relates to the field of display, and in particular to a driving substrate, a display backplate, and a display screen. Background Technology

[0002] Currently, the pixel driver chips used to drive pixels on the driving substrate are usually arranged in an array, see [link to relevant documentation]. Figure 3 Thermal simulation revealed that some strips of heat are concentrated and the temperature is too high, which can easily lead to more severe color decay in the corresponding display areas, reducing the display effect of the module as well as the reliability and lifespan of the system. Utility Model Content

[0003] In view of the shortcomings of the above-mentioned related technologies, the purpose of this utility model is to provide a driving substrate, a display back panel and a display screen, which disperses multiple heat sources to avoid heat concentration, thereby reducing the operating temperature of the driving substrate and improving the display effect of the module.

[0004] This utility model provides a driving substrate, including a driving substrate body, multiple pad groups and multiple rows or columns of pixel driving chips. The pad groups are connected to the pixel driving chips through the driving substrate body. Multiple pad groups are arranged on one side of the driving substrate body, and multiple rows or columns of pixel driving chips are arranged on the other side of the driving substrate body. Adjacent rows or columns of pixel driving chips are staggered.

[0005] Optionally, the driving substrate body is provided with multiple rows or columns of magnetic patches for adsorbing the box, and the pixel driving chips in the same row or column as the magnetic patches are offset from the pixel driving chips in adjacent rows or columns.

[0006] Optionally, each row or column of the pixel driver chip includes multiple pixel driver units, each pixel driver unit including a first pixel driver chip for driving a first light-emitting chip, a second pixel driver chip for driving a second light-emitting chip, and a third pixel driver chip for driving a third light-emitting chip, wherein the first light-emitting chip, the second light-emitting chip, and the third light-emitting chip are of different colors.

[0007] Optionally, the pixel driving chips in the first pixel driving unit in each row or column are arranged in the following order: first pixel driving chip, second pixel driving chip, and third pixel driving chip; and the pixel driving chips in the last pixel driving unit in each row or column are arranged in the following order: third pixel driving chip, second pixel driving chip, and first pixel driving chip; the first pixel driving chip is a red pixel driving chip, the second pixel driving chip is a green pixel driving chip, and the third pixel driving chip is a blue pixel driving chip.

[0008] Optionally, the number of pixel driving units in the same row or column is N, where N is an even number; the arrangement order of the first pixel driving chip, the second pixel driving chip and the third pixel driving chip in one of the pixel driving units in the same row or column is the reverse of the arrangement order of the first pixel driving chip, the second pixel driving chip and the third pixel driving chip in its adjacent pixel driving unit.

[0009] Optionally, the first pixel driver chip in the first pixel driver unit of each row or column and / or the first pixel driver chip in the last pixel driver unit are both disposed close to the edge of the driving substrate body.

[0010] Optionally, a plurality of electronic components are disposed in the middle region of the driving substrate body. The plurality of electronic components include connectors, a plurality of amplifiers, a plurality of scan driving chips and a plurality of electrolytic capacitors. The scan driving chip, the pixel driving chip and the electrolytic capacitor are respectively connected to the connector through the amplifier. The scan driving chip and the pixel driving chip are respectively connected to the pad group through the driving substrate body. The connector is used to output power signals and control signals.

[0011] The pixel driver chips in the same row or column as the electronic component are offset from the pixel driver chips in adjacent rows or columns.

[0012] Optionally, the middle region of the driving substrate body is further provided with an electrolytic capacitor for filtering out power signal noise, and the electrolytic capacitor is connected to the connector.

[0013] This utility model also provides a display backplate, including a plurality of light-emitting chips and the aforementioned driving substrate. The driving substrate includes a driving substrate body and a plurality of pad groups disposed on the driving substrate body, and the light-emitting chips are bonded to the pad groups.

[0014] This utility model also provides a display screen, including a housing and the aforementioned display back panel, wherein the display back panel is disposed on the housing.

[0015] This invention features a driver substrate, display backplane, and display screen with multiple heat sources distributed in a dispersed manner to avoid heat concentration. This reduces the operating temperature of the driver substrate, minimizes color decay under high brightness conditions, improves the module's display effect, reduces after-sales failure rate, and enhances system reliability and lifespan. By placing high-power devices or heat-generating chips near the edge of the driver substrate or in well-ventilated locations, heat dissipation is further improved; if necessary, proximity to the metal casing can be used for auxiliary heat dissipation. Attached Figure Description

[0016] Figure 1A schematic diagram of a pixel driving chip on a driving substrate provided in an embodiment of this utility model;

[0017] Figure 2 Thermal simulation diagram of the pixel driver chip on the driving substrate provided in this embodiment of the utility model;

[0018] Figure 3 This is a thermal simulation diagram of a pixel driver chip on a driving substrate in the prior art.

[0019] Explanation of reference numerals in the attached drawings: 1-Driver substrate body, 2-Pixel driver chip, 2a-Pixel driver unit, 21-First pixel driver chip, 22-Second pixel driver chip, 23-Third pixel driver chip, 3-Connector, 4-Amplifier, 5-Scan driver chip, 6-Electrolytic capacitor, 7-Magnetic adhesive patch. Detailed Implementation

[0020] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. The drawings illustrate preferred embodiments of this utility model. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this utility model.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0022] In the description of this utility model, the terms "first," "second," etc., are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "upper," "lower," "inner," "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0023] It should be noted that the illustrations provided in the embodiments of this utility model are only schematic representations of the basic concept of this utility model. The illustrations only show the components related to this utility model and are not drawn according to the number, shape and size of the components in actual implementation. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0024] The specific embodiments of this utility model will be further described below with reference to the accompanying drawings.

[0025] See Figure 1 and Figure 2 As shown, this utility model discloses a driving substrate, including a driving substrate body 1, multiple pad groups, and multiple rows or columns of pixel driving chips 2. The pad groups are connected to the pixel driving chips 2 through the driving substrate body 1. Multiple pad groups are arranged on one side of the driving substrate body 1, and multiple rows or columns of pixel driving chips 2 are arranged on the other side of the driving substrate body 1. Adjacent rows or columns of pixel driving chips 2 are staggered. Each pad group includes a first pad and a second pad for connecting to the positive and negative electrodes of the light-emitting chip, respectively. This driving substrate of the utility model disperses multiple heat sources, avoiding heat concentration, improving heat dissipation capacity, reducing the operating temperature of the driving substrate, reducing color decay in high-brightness conditions, improving the module display effect, reducing after-sales failure rate, and improving system reliability and lifespan. The staggered arrangement means that each pixel driving chip 2 in the current row or column is located between two adjacent pixel driving chips 2 in the same row or column.

[0026] In this embodiment, the driving substrate body 1 is provided with multiple rows or columns of magnetic adhesive patches 7 for adsorbing the box. A portion of the pixel driving chips 2 in the same row or column as the magnetic adhesive patches 7 are offset from the pixel driving chips 2 in adjacent rows or columns. Offset setting means that a portion of the pixel driving chips 2 in the current row or column, which should originally be aligned with the pixel driving chips 2 in the adjacent row or column, is moved a certain distance to the left, right, or front and back and is not completely aligned. Due to the spatial limitations of the magnetic adhesive patches on the driving substrate body 1, the pixel driving chips 2 in the same row or column as the magnetic adhesive patches 7 cannot all be misaligned with the pixel driving chips 2 in adjacent rows or columns. However, to increase heat dissipation, they are offset by a certain distance, thus improving heat dissipation capacity.

[0027] In this embodiment, each row or column of the pixel driving chip 2 includes a plurality of pixel driving units 2a. The pixel driving unit 2a includes a first pixel driving chip 21 for driving a first light-emitting chip, a second pixel driving chip 22 for driving a second light-emitting chip, and a third pixel driving chip 23 for driving a third light-emitting chip. The first light-emitting chip, the second light-emitting chip, and the third light-emitting chip have different colors.

[0028] In this embodiment, the pixel driving chips 2 in the first pixel driving unit 2a of each row or column are arranged in the following order: first pixel driving chip 21, second pixel driving chip 22, and third pixel driving chip 23. The pixel driving chips 2 in the last pixel driving unit 2a of each row or column are arranged in the following order: third pixel driving chip 23, second pixel driving chip 22, and first pixel driving chip 21. The first pixel driving chip 21 is a red pixel driving chip, the second pixel driving chip 22 is a green pixel driving chip, and the third pixel driving chip 23 is a blue pixel driving chip. The integrated chip control area is optimized. Since the red pixel driving chip has the highest control current and the highest heat dissipation efficiency, heat dissipation is better when high-power devices or chips with large heat generation are placed near the edge of the driving substrate body 1 or in a well-ventilated location. If necessary, heat dissipation can be further aided by placing them near the metal casing.

[0029] In this embodiment, the number of pixel driving units 2a in the same row or column is N, where N is an even number. The arrangement order of the first pixel driving chip 21, the second pixel driving chip 22, and the third pixel driving chip 23 in one pixel driving unit 2a in the same row or column is the reverse of the arrangement order of the first pixel driving chip 21, the second pixel driving chip 22, and the third pixel driving chip 23 in its adjacent pixel driving unit 2a. The integrated chip control area is optimized. Before optimization, the pixel driving chips 2a used an RGB RGB arrangement, and after optimization, an RGBBGR arrangement is used. Since the red pixel driving chip has the largest control current and the highest heat dissipation efficiency, placing the heat-generating devices closer to the edge improves heat dissipation. Optionally, N=2. Thermal simulation is performed on the two driving substrates before and after optimization. It is found that the arrangement before optimization has some strip-shaped heat concentrations, such as... Figure 3 This can easily lead to more severe color decay in the corresponding display area. The optimized heat distribution is evenly distributed from the inside out, as shown in the image. Figure 2 The overall temperature is lower and the heat dissipation is more reasonable, resulting in a better display effect. The highest temperature area has been reduced by about 6°C after optimization. Overall problems have been reduced and color decay in the high brightness state of the module has been weakened, resulting in a better display effect.

[0030] In this embodiment, the first pixel driving chip 21 in the first pixel driving unit 2a of each row or column and / or the first pixel driving chip 21 in the last pixel driving unit 2a are both disposed close to the edge of the driving substrate body 1.

[0031] In this embodiment, a plurality of electronic components are disposed in the middle region of the driving substrate body 1. These components include connectors 3, amplifiers 4, scanning driver chips 5, and electrolytic capacitors 6. The scanning driver chips 5, pixel driver chips 2, and electrolytic capacitors 6 are connected to the connectors 3 via the amplifiers 4. The scanning driver chips 5 and pixel driver chips 2 are connected to the pad group via the driving substrate body 1. The connectors 2 are used to output power signals and control signals. The electrolytic capacitors 6 are used to filter out power signal noise. The connectors 3 output power signals, drive control signals, and scan control signals, which are distributed to each device via traces. The drive control signals and scan control signals are amplified by the amplifiers 4 before being output to the pixel driver chips 2 and scan driver chips 5. The pixel driver chips 2 and scan driver chips 5 then output signals to the two electrodes of the light-emitting chips to illuminate them. Thus, the display effect of the entire light panel can be controlled by controlling the pixel driver chips 2 and scan driver chips 5 through signal input.

[0032] In this embodiment, some of the pixel driver chips 2 in the same row or column as the electronic component are offset from those in adjacent rows or columns. Due to the spatial constraints of the electronic component's placement on the driving substrate body 1, the pixel driver chips 2 in the same row or column as the electronic component cannot all be staggered from those in adjacent rows or columns. However, to increase heat dissipation, they are offset by a certain distance, thus improving heat dissipation capacity. When arranging the electronic component, it is placed in the available area around the pixel driver chips 2 as much as possible. If sufficient available area cannot be guaranteed, the pixel driver chips 2 are reasonably distributed around the electronic component to improve heat dissipation capacity.

[0033] In this embodiment, the driving substrate can be a PCB, array substrate, glass driving substrate, flexible driving substrate, lamp board, semiconductor driving substrate, or other types of driving substrate, and is not specifically limited in this embodiment. The material of the driving substrate can be glass, transparent plastic, acrylic, quartz, sapphire, semiconductor materials, etc., and can be selected according to the actual situation, and is not specifically limited in this embodiment. The driving substrate body 1 is provided with a substrate and circuit layer structure, and the circuit layer structure is used to connect the pad group, pixel driving chip 2, and other electronic components.

[0034] In this embodiment, the light-emitting chip can be a MiniLED, MicroLED, nano-sized LED, or LED of other sizes. It is not limited here, and the specific selection can be made according to the actual situation.

[0035] This utility model also discloses a display backplate, including multiple light-emitting chips and the aforementioned driving substrate. The driving substrate includes a driving substrate body 1 and multiple pad groups disposed on the driving substrate body 1, and the light-emitting chips are bonded to the pad groups.

[0036] This utility model also discloses a display screen, including a housing and the aforementioned display back panel, wherein the display back panel is disposed on the housing.

[0037] As one implementation method, the display screen can be a television, VR / AR device, smart wearable device, mobile phone, vehicle display, etc.

[0038] The driving substrate, display backplane, and display screen of this invention feature multiple heat sources distributed in a dispersed manner to avoid heat concentration, thereby reducing the operating temperature of the driving substrate, mitigating color decay under high brightness conditions, improving the module display effect, reducing after-sales failure rate, and enhancing system reliability and lifespan. By placing high-power devices or chips that generate significant heat near the edge of the driving substrate body 1 or in well-ventilated locations, heat dissipation is further improved; if necessary, proximity to the metal casing can be used for auxiliary heat dissipation.

[0039] It should be understood that the application of this utility model is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A driving substrate, characterized in that, It includes a driving substrate body, multiple pad groups, and multiple rows or columns of pixel driving chips. The pad groups are connected to the pixel driving chips through the driving substrate body. Multiple pad groups are provided on one side of the driving substrate body, and multiple rows or columns of pixel driving chips are provided on the other side of the driving substrate body. Adjacent rows or columns of pixel driving chips are staggered.

2. The driving substrate as described in claim 1, characterized in that, The driving substrate body is provided with multiple rows or columns of magnetic patches for adsorbing the box, and the pixel driving chips in the same row or column as the magnetic patches are offset from the pixel driving chips in the adjacent row or column.

3. The driving substrate as described in claim 1 or 2, characterized in that, Each row or column of the pixel driver chip includes multiple pixel driver units, each pixel driver unit including a first pixel driver chip for driving a first light-emitting chip, a second pixel driver chip for driving a second light-emitting chip, and a third pixel driver chip for driving a third light-emitting chip, wherein the first light-emitting chip, the second light-emitting chip, and the third light-emitting chip are of different colors.

4. The driving substrate as described in claim 3, characterized in that, The pixel driving chips in the first pixel driving unit in each row or column are arranged in the following order: first pixel driving chip, second pixel driving chip, and third pixel driving chip. The pixel driving chips in the last pixel driving unit in each row or column are arranged in the following order: third pixel driving chip, second pixel driving chip, and first pixel driving chip. The first pixel driving chip is a red pixel driving chip, the second pixel driving chip is a green pixel driving chip, and the third pixel driving chip is a blue pixel driving chip.

5. The driving substrate as described in claim 4, characterized in that, The number of pixel driving units in the same row or column is N, where N is an even number; the arrangement order of the first pixel driving chip, the second pixel driving chip and the third pixel driving chip in one of the pixel driving units in the same row or column is the reverse of the arrangement order of the first pixel driving chip, the second pixel driving chip and the third pixel driving chip in its adjacent pixel driving unit.

6. The driving substrate as described in claim 5, characterized in that, The first pixel driver chip in the first pixel driver unit of each row or column and / or the first pixel driver chip in the last pixel driver unit are both located close to the edge of the driver substrate body.

7. The driving substrate as described in claim 2, 4, 5, or 6, characterized in that, The driving substrate body has a plurality of electronic components in its middle region, including connectors, amplifiers, scanning driver chips, and electrolytic capacitors. The scanning driver chips, pixel driver chips, and electrolytic capacitors are respectively connected to the connectors through the amplifiers. The scanning driver chips and pixel driver chips are respectively connected to the pad group through the driving substrate body. The connectors are used to output power signals and control signals.

8. The driving substrate as described in claim 7, characterized in that, The pixel driver chips in the same row or column as the electronic component are offset from the pixel driver chips in adjacent rows or columns.

9. A display back panel, characterized in that, The device includes a plurality of light-emitting chips and a driving substrate as described in any one of claims 1 to 8, wherein the driving substrate includes a driving substrate body and a plurality of pad groups disposed on the driving substrate body, and the light-emitting chips are bonded to the pad groups.

10. A display screen, characterized in that, It includes a housing and a display back panel as described in claim 9, wherein the display back panel is disposed on the housing.

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